CN108698813B - Mems器件及电子设备 - Google Patents

Mems器件及电子设备 Download PDF

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Publication number
CN108698813B
CN108698813B CN201680078846.4A CN201680078846A CN108698813B CN 108698813 B CN108698813 B CN 108698813B CN 201680078846 A CN201680078846 A CN 201680078846A CN 108698813 B CN108698813 B CN 108698813B
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CN
China
Prior art keywords
mems device
micro
light emitting
emitting diode
movable component
Prior art date
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Active
Application number
CN201680078846.4A
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English (en)
Chinese (zh)
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CN108698813A (zh
Inventor
邹泉波
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Goertek Inc
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Goertek Inc
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Publication of CN108698813A publication Critical patent/CN108698813A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/093—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by photoelectric pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B5/00—Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G01P3/36—Devices characterised by the use of optical means, e.g. using infrared, visible, or ultraviolet light

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
CN201680078846.4A 2016-06-02 2016-06-02 Mems器件及电子设备 Active CN108698813B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/084544 WO2017206149A1 (fr) 2016-06-02 2016-06-02 Dispositif mems et appareil électronique

Publications (2)

Publication Number Publication Date
CN108698813A CN108698813A (zh) 2018-10-23
CN108698813B true CN108698813B (zh) 2023-01-20

Family

ID=60478314

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680078846.4A Active CN108698813B (zh) 2016-06-02 2016-06-02 Mems器件及电子设备

Country Status (3)

Country Link
US (1) US11262376B2 (fr)
CN (1) CN108698813B (fr)
WO (1) WO2017206149A1 (fr)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5689107A (en) * 1995-09-01 1997-11-18 Hughes Aircraft Company Displacement-based opto-electronic accelerometer and pressure sensor
WO2000071981A1 (fr) * 1999-05-19 2000-11-30 Ramot University Authority For Applied Research & Industrial Development Ltd. Capteurs de deplacements et actionneurs micro-usines
CN1740753A (zh) * 2004-08-26 2006-03-01 约翰尼斯海登海恩博士股份有限公司 用于光学编码器的检测器阵列
CN2844881Y (zh) * 2005-03-15 2006-12-06 陆轻锂 高灵敏度振动检测器
CN101533740A (zh) * 2007-12-20 2009-09-16 通用电气公司 具有导电机械停止器的mems微开关
CN101971028A (zh) * 2007-10-22 2011-02-09 高等科研理事会 检测样品中选定类型的分子的方法和系统
CN102130109A (zh) * 2009-12-21 2011-07-20 Lg伊诺特有限公司 发光器件和使用发光器件的灯单元
CN104054167A (zh) * 2011-11-18 2014-09-17 勒克斯维科技公司 微器件传送头
CN104851753A (zh) * 2014-02-18 2015-08-19 亚德诺半导体集团 具有恒定电容的mems器件
CN105493298A (zh) * 2015-07-14 2016-04-13 歌尔声学股份有限公司 微发光二极管的转移方法、制造方法、装置和电子设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6494095B1 (en) * 2000-03-28 2002-12-17 Opticnet, Inc. Micro electromechanical switch for detecting acceleration or decelaration
KR100815440B1 (ko) 2006-07-28 2008-03-20 주식회사 나노브릭 마이크로-전자기계 시스템 기반의 광 프로젝션 엔진과 그제조 방법
US7990539B2 (en) * 2008-01-03 2011-08-02 Chian Chiu Li Sensor and method utilizing multiple optical interferometers
US8794501B2 (en) * 2011-11-18 2014-08-05 LuxVue Technology Corporation Method of transferring a light emitting diode
US8791530B2 (en) 2012-09-06 2014-07-29 LuxVue Technology Corporation Compliant micro device transfer head with integrated electrode leads
US9391042B2 (en) 2012-12-14 2016-07-12 Apple Inc. Micro device transfer system with pivot mount
US9087764B2 (en) 2013-07-26 2015-07-21 LuxVue Technology Corporation Adhesive wafer bonding with controlled thickness variation
FR3021309A1 (fr) * 2014-05-26 2015-11-27 Commissariat Energie Atomique Dispositif microelectronique et/ou nanoelectronique capacitif a compacite augmentee
US20160140685A1 (en) * 2014-11-17 2016-05-19 Pixtronix, Inc. Display including sensors
US10553540B2 (en) * 2015-08-20 2020-02-04 Apple Inc. Fabric-based items with electrical component arrays

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5689107A (en) * 1995-09-01 1997-11-18 Hughes Aircraft Company Displacement-based opto-electronic accelerometer and pressure sensor
WO2000071981A1 (fr) * 1999-05-19 2000-11-30 Ramot University Authority For Applied Research & Industrial Development Ltd. Capteurs de deplacements et actionneurs micro-usines
CN1740753A (zh) * 2004-08-26 2006-03-01 约翰尼斯海登海恩博士股份有限公司 用于光学编码器的检测器阵列
CN2844881Y (zh) * 2005-03-15 2006-12-06 陆轻锂 高灵敏度振动检测器
CN101971028A (zh) * 2007-10-22 2011-02-09 高等科研理事会 检测样品中选定类型的分子的方法和系统
CN101533740A (zh) * 2007-12-20 2009-09-16 通用电气公司 具有导电机械停止器的mems微开关
CN102130109A (zh) * 2009-12-21 2011-07-20 Lg伊诺特有限公司 发光器件和使用发光器件的灯单元
CN104054167A (zh) * 2011-11-18 2014-09-17 勒克斯维科技公司 微器件传送头
CN104851753A (zh) * 2014-02-18 2015-08-19 亚德诺半导体集团 具有恒定电容的mems器件
CN105493298A (zh) * 2015-07-14 2016-04-13 歌尔声学股份有限公司 微发光二极管的转移方法、制造方法、装置和电子设备

Also Published As

Publication number Publication date
US20190079110A1 (en) 2019-03-14
CN108698813A (zh) 2018-10-23
US11262376B2 (en) 2022-03-01
WO2017206149A1 (fr) 2017-12-07

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