CN108695303A - 一种高性价比双色cob led - Google Patents

一种高性价比双色cob led Download PDF

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Publication number
CN108695303A
CN108695303A CN201710230500.8A CN201710230500A CN108695303A CN 108695303 A CN108695303 A CN 108695303A CN 201710230500 A CN201710230500 A CN 201710230500A CN 108695303 A CN108695303 A CN 108695303A
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Prior art keywords
cob
red
white
led
chip
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CN201710230500.8A
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马少峰
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

本发明涉及一种高性价比双色COB LED，在一个COB里面由主要发冷白高色温的蓝色芯片覆以黄色或红和和绿色的荧光粉来实现冷白高色温发光。同时在COB中加以红色和绿色LED芯片在同一个回路点亮或分别在不同的回路中点亮起到辅助调节整个COB颜色的作用，使得整个LED发光由冷白的高色温白光转而实现暖白或其他颜色。

Description

一种高性价比双色COB LED
应用领域
COB LED广泛应用于照明及相关显示领域。
背景
业界可以实现不同色温变换的COB LED有多个芯片或多个不同颜色光的芯片构成，但是通常是一半高色温和一半底色温的，需要哪种色温哪种LED亮会高些，而同时另外一半就完全不亮。
发明内容
在COB LED中主要还是以蓝色芯片加荧光粉发冷白的高色温光，另外再辅以绿色和红色芯片，当和蓝色芯片并联的红色和绿色芯片点亮时候，COB发的冷白的高色温变成暖自低色温。也可以分别调节绿色和红色芯片电流实现调节COB颜色。用以发冷白高色温的LED芯片可以排列在COB芯片靠近外侧，而调节色温芯片在内测，这样可以降低COB的光斑颜色差异。
附图说明：
图1是在COB中放入蓝色芯片和绿色和红色的3种芯片。蓝色和红绿芯片并联在不同的电路回路中。可以实现单独控制红绿颜色的芯片和蓝色芯片发光。
图2是举例说明实现蓝光芯片并联红色与绿色芯片的电路图的几种方法。
具体实施方式 如图1所示
在一个COB里面由主要发冷白高色温的蓝色芯片覆以黄色或红和和绿色的荧光粉来实现冷白高色温发光。同时并联在COB中的红色和绿色LED芯片在与蓝光芯片不同回路点亮起到辅助调节整个COB颜色的作用，使得整个LED发光由冷白的高色温白光转而实现暖白或其他颜色。

Claims (2)

1.本发明及一种高性价比双色COB LED，中由蓝色芯片和荧光粉发冷白光，另外由红色或蓝色或红色和蓝色作为辅助配光光源，通过对辅助光源的红色或蓝色或红色和蓝色芯片的电路开启或关闭来实现冷白和暖白或冷白和其他颜色的切换。
2.在COB上有超过2个焊盘，来实现同一个COB中LED芯片不同电路的开启来调整颜色。
CN201710230500.8A 2017-04-05 2017-04-05 一种高性价比双色cob led Pending CN108695303A (zh)

Priority Applications (1)

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CN201710230500.8A CN108695303A (zh) 2017-04-05 2017-04-05 一种高性价比双色cob led

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710230500.8A CN108695303A (zh) 2017-04-05 2017-04-05 一种高性价比双色cob led

Publications (1)

Publication Number Publication Date
CN108695303A true CN108695303A (zh) 2018-10-23

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005142311A (ja) * 2003-11-06 2005-06-02 Tzu-Chi Cheng 発光装置
CN102278621A (zh) * 2011-04-22 2011-12-14 深圳市瑞丰光电子股份有限公司 一种色温可调的白光led模组、照明设备及制作方法
CN202205744U (zh) * 2011-08-16 2012-04-25 易美芯光（北京）科技有限公司 提高多led芯片白光光源显色指数和光通量的封装结构
CN103779347A (zh) * 2013-09-26 2014-05-07 深圳市迈克光电子科技有限公司 高亮度可调光cob光源、射灯及日光灯cob工艺
CN204029858U (zh) * 2014-08-19 2014-12-17 深圳市中唐光电有限公司 一种新型照明用双控三色cob
CN205211748U (zh) * 2015-12-25 2016-05-04 福建吉邦电子有限公司 一种光色参数可调的cob封装光源
CN205878043U (zh) * 2016-08-09 2017-01-11 佛山市威得士灯饰电器有限公司 光源模组及带有光源模组的灯具

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005142311A (ja) * 2003-11-06 2005-06-02 Tzu-Chi Cheng 発光装置
CN102278621A (zh) * 2011-04-22 2011-12-14 深圳市瑞丰光电子股份有限公司 一种色温可调的白光led模组、照明设备及制作方法
CN202205744U (zh) * 2011-08-16 2012-04-25 易美芯光（北京）科技有限公司 提高多led芯片白光光源显色指数和光通量的封装结构
CN103779347A (zh) * 2013-09-26 2014-05-07 深圳市迈克光电子科技有限公司 高亮度可调光cob光源、射灯及日光灯cob工艺
CN204029858U (zh) * 2014-08-19 2014-12-17 深圳市中唐光电有限公司 一种新型照明用双控三色cob
CN205211748U (zh) * 2015-12-25 2016-05-04 福建吉邦电子有限公司 一种光色参数可调的cob封装光源
CN205878043U (zh) * 2016-08-09 2017-01-11 佛山市威得士灯饰电器有限公司 光源模组及带有光源模组的灯具

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