CN203055906U - 一种高色纯度led - Google Patents

一种高色纯度led Download PDF

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Publication number
CN203055906U
CN203055906U CN2012207414127U CN201220741412U CN203055906U CN 203055906 U CN203055906 U CN 203055906U CN 2012207414127 U CN2012207414127 U CN 2012207414127U CN 201220741412 U CN201220741412 U CN 201220741412U CN 203055906 U CN203055906 U CN 203055906U
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light
led
led chip
color
purity
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张伟
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GUANGZHOU TIANXIN OPTOELECTRONICS CO Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48111Disposition the wire connector extending above another semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

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Abstract

本实用新型公开了一种高色纯度LED,包括支架,支架上设有红光、绿光、蓝光、黄光和波长为440-450nm靛蓝光五颗LED芯片。本实用新型的结构能增强白光的亮度,增大白光色域可调的宽度,也提高了白光的显色指数,并能发出玫瑰红色的光。

Description

一种高色纯度LED
技术领域
本实用新型涉及LED,特别是使用在成像帕灯上的LED。
背景技术
LED帕灯是目前舞台灯的一种。在舞台中,要求LED帕灯能够发出多彩绚丽的光,传统的帕灯是通过在灯珠板上安装不同颜色的灯珠、且各灯珠内对应一个LED芯片实现,当需要一种光色的光斑时,则将相对应颜色的LED芯片点亮,这样,因同一面积内布置了不同颜色的灯珠,则同一光色发光的灯珠数量少,造成亮度低。而目前的多色光都是通过混色形成的。如在专利号为201120342034.0申请日为2011年9月13日授权公告日为2012年5月23日的专利文献中公开了一种提升色彩效果的多色合一LED装置,其具体公开了LED装置中包含了红色、绿色、蓝色和黄色四种光色的LED芯片,它只有四种单色光如需其它颜色的光则需要两种以上的光色LED芯片混合而成,而因上述结构的LED装置混色为物理混色,则会造成混色不均匀的现象,影响了光色的色纯度。另外,现在的白光大部分是通过RGB混合而成,在光谱图中,红光位于光谱图的右下角,蓝光位于光谱图的左下角,绿光位于光谱图的上端,当RGB三色光同时发光时,在光谱图上会形成一三角形的光谱区域,则光谱图中的黑体轨迹的一段会位于上述光谱区域以内,在实际应用中,根据光谱区域和黑体轨迹的位置来调节RGB三色光,使得混出的光更加靠近黑体轨迹,以提高被照射的物体更为真实。上述RGB虽然能实现混色,但是,由于在光谱区域内黑体轨迹所对应的色温段小,一旦调整的色温范围超出了光谱区域,则会造成光色失真;另外,光谱区域内,能够被调整的点只有三点,而黑体轨迹为一条光滑的曲线,因此,通过RGB三色混出来的光谱曲线与黑体曲线相比,一方面曲率的精度低,另一方面难以接近黑体轨迹。与此同时,现有的舞台需要配一种玫瑰红色的光,以增添舞台的询丽色彩,但这一技术问题一直没有得到有效的解决。
实用新型内容
为提高出光的色纯度,并能发出玫瑰红色的光,本实用新型提供了一种高色纯度LED。
为达到上述目的,一种高色纯度LED,包括支架,支架上设有红光、绿光、蓝光、黄光和波长为440-450nm靛蓝光五颗LED芯片。
作为改进,在支架上还设有白光LED芯片。
作为改进,在支架上还设有青色光LED芯片。
本实用新型的有益效果是:由于设置了红光、绿光、蓝光、黄光和波长为440-450nm靛蓝光五颗LED芯片,则LED存在五种基色,通过控制不同颜色的LED芯片,则能得到五种光色的光,其出光不需要混光既能实现,从而提高了出光的色纯度。而且,通过增加一波长为440-450nm靛蓝光的LED芯片,则整个LED出光的波长可以从440nm到630nm,从而使色域更加的宽。同时,由于一个LED中设置了五颗到六颗LED芯片,当需要一种色彩的光斑时,可以使每一个LED都发光,相对于现有技术,相同LED帕灯的灯珠安装面积,利用本实用新型的LED灯珠制作的帕灯的发光面积更大,从而提高了出光亮度。更重要是通过红光LED芯片和波长为440-450nm靛蓝光LED芯片可以混合成玫瑰红色,给帕灯增添了一种色彩。再有,通过红光、绿光和蓝光LED芯片能得到白光,且通过红光LED芯片、靛蓝光LED芯片、黄光LED芯片和青色光LED芯片也可以混合成白光,从而增大了白光的色纯度,也增大了白光的显色指数。另外,在光谱图中,本实用新型的LED灯珠由五或六颗LED芯片会形成五边或六边形的光谱区域,使得光谱图中的黑体轨迹落入到光谱区域的范围更大,即色温区域更大,使得在调整光色过程中,光色不容易失真,且通过多点来调整发光曲线,使得调整的曲线更加接近光谱图黑体轨迹,当发出的光照射到物体上后更加的逼真。
附图说明
图1为本实用新型第一实施方式的结构示意图。
图2为本实用新型第二实施方式的结构示意图。
具体实施方式
下面结合附图和具体实施方式对本实用新型进行进一步详细说明。
第一实施方式。
如图1所示,一种高色纯度LED包括支架1、铜座2、LED芯片3、金线(未示出)、透镜(未示出)及引脚4。
在支架1上设有焊盘,铜座2安装在支架1内,LED芯片3安装在铜座2上,便于散热,金线将LED芯片与焊盘电性连接起来,透镜设在支架上,引脚4的一端嵌入在支架内并与焊盘电性连接。
如图1所示,在铜座上安装有五颗LED芯片,具体为红光、绿光、蓝光、黄光和波长为440-450nm靛蓝光五颗LED芯片。
在实际的使用过程中,将本实施方式的LED安装到帕灯的灯珠板上。
在本实施方式中,由于设置了红光、绿光、蓝光、黄光和波长为440-450nm靛蓝光五颗LED芯片,则LED存在五种基色,通过控制不同颜色的LED芯片,则能得到五种光色的光,其出光不需要混光既能实现,从而提高了出光的色纯度。而且,通过增加一波长为440-450nm靛蓝光的LED芯片,则整个LED出光的波长可以从440nm到630nm,从而使色域更加的宽。同时,由于一个LED中设置了五颗到六颗LED芯片,当需要一种色彩的光斑时,可以使每一个LED都发光,相对于现有技术,相同LED帕灯的灯珠安装面积,利用本实用新型的LED灯珠制作的帕灯的发光面积更大,从而提高了出光亮度。更重要是通过红光LED芯片和波长为440-450nm靛蓝光LED芯片可以混合成玫瑰红色,给帕灯增添了一种色彩。再有,通过红光、绿光和蓝光LED芯片能得到白光,且通过红光LED芯片、靛蓝光LED芯片、黄光LED芯片和青色光LED芯片也可以混合成白光,从而增强了白光的亮度,增大了白光色域可调的宽度,也提高了白光的显色指数。另外,在光谱图中,本实用新型的LED灯珠由六颗LED芯片会形成五边形的光谱区域,使得光谱图中的黑体轨迹落入到光谱区域的范围更大,即色温区域更大,使得在调整光色过程中,光色不容易失真,且通过多点来调整发光曲线,使得调整的曲线更加接近光谱图黑体轨迹,当发出的光照射到物体上后更加的逼真。
第二实施方式。
如图2所示,一种高色纯度LED包括支架1、铜座2、LED芯片3、金线5、透镜(未示出)及引脚4。
在支架1上设有焊盘,铜座2安装在支架1内,LED芯片3安装在铜座2上,便于散热,金线将LED芯片与焊盘电性连接起来,透镜设在支架上,引脚4的一端嵌入在支架内并与焊盘电性连接。
如图2所示,在铜座上安装有六颗LED芯片,具体为红光、绿光、蓝光、黄光、青色光和波长为440-450nm靛蓝光六颗LED芯片,当然,青色光也可以由白光代替。
在实际的使用过程中,将本实施方式的LED安装到帕灯的灯珠板上。
在本实施方式中,由于设置了红光、绿光、蓝光、黄光、青色光和波长为440-450nm靛蓝光六颗LED芯片,则LED灯珠内具有六种基色,通过控制不同颜色的LED芯片,则能得到六种光色的光,其出光不需要混光既能实现,从而提高了出光的色纯度。而且,通过增加一波长为440-450nm靛蓝光的LED芯片,则整个LED出光的波长可以从440nm到630nm,从而使色域更加的宽。同时,由于一个LED中设置了六颗LED芯片,当需要一种色彩的光斑时,可以使每一个LED灯珠都发光,相对于现有技术,相同LED帕灯的灯珠安装面积,利用本发明的LED灯珠制作的帕灯的发光面积更大,从而提高了出光亮度。更重要是通过红光LED芯片和波长为440-450nm靛蓝光LED芯片可以混合成玫瑰红色,给帕灯增添了一种色彩。再有,通过红光、绿光和蓝光LED芯片能得到白光,且通过红光LED芯片、靛蓝光LED芯片、黄光LED芯片和青色光LED芯片也可以混合成白光,从而增强了白光的亮度,增大了白光色域可调的宽度,也提高了白光的显色指数。另外,在光谱图中,本发明的LED灯珠由六颗LED芯片会形成六边形的光谱区域,使得光谱图中的黑体轨迹落入到光谱区域的范围更大,即色温区域更大,使得在调整光色过程中,光色不容易失真,且通过多点来调整发光曲线,使得调整的曲线更加接近光谱图黑体轨迹,当发出的光照射到物体上后更加的逼真。

Claims (3)

1.一种高色纯度LED,包括支架,其特征在于:支架上设有红光、绿光、蓝光、黄光和波长为440-450nm靛蓝光五颗LED芯片。
2.根据权利要求1所述的高色纯度LED,其特征在于:在支架上还设有白光LED芯片。
3.根据权利要求1所述的高色纯度LED,其特征在于:在支架上还设有青色光LED芯片。
CN2012207414127U 2012-12-29 2012-12-29 一种高色纯度led Expired - Lifetime CN203055906U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106229312A (zh) * 2016-08-30 2016-12-14 厦门华联电子有限公司 一种全光谱csp封装光源及其制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106229312A (zh) * 2016-08-30 2016-12-14 厦门华联电子有限公司 一种全光谱csp封装光源及其制造方法
CN106229312B (zh) * 2016-08-30 2018-10-12 厦门华联电子股份有限公司 一种全光谱csp封装光源及其制造方法

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