CN108682647B - Integrated machine for coding, reading and storing lateral surface of wafer and use method thereof - Google Patents
Integrated machine for coding, reading and storing lateral surface of wafer and use method thereof Download PDFInfo
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- CN108682647B CN108682647B CN201810778032.2A CN201810778032A CN108682647B CN 108682647 B CN108682647 B CN 108682647B CN 201810778032 A CN201810778032 A CN 201810778032A CN 108682647 B CN108682647 B CN 108682647B
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- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000001179 sorption measurement Methods 0.000 claims abstract description 26
- 235000012431 wafers Nutrition 0.000 claims description 85
- 238000003860 storage Methods 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 5
- 239000004035 construction material Substances 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
Abstract
The invention provides a chip side face code printing, reading and storing integrated machine and a use method thereof, wherein the chip side face code printing, reading and storing integrated machine comprises a vacuum adsorption platform, a code printing device, a code reading device, a mobile carrier, a position adjusting device and a control device; the code printer is arranged on a mobile carrier, and the mobile carrier comprises a first mobile carrier and a second mobile carrier; the code reader is arranged on the position adjusting device, and the position adjusting device comprises a first position adjusting device and a second position adjusting device; the control device controls the first movable carrier, the second movable carrier, the first position adjusting device and the second position adjusting device to slide; the vacuum adsorption platform is used for placing and fixing the wafer. By the technical scheme, the full-flow quality tracking and monitoring of the wafer preparation and subsequent chip manufacturing processes can be realized.
Description
Technical Field
The invention relates to the field of laser coding, in particular to a chip side coding and code reading storage integrated machine and a use method thereof.
Background
Wafers of monocrystalline silicon, monocrystalline silicon carbide, sapphire and other materials are widely used in the fields of LED substrates, microelectronic devices, semiconductor devices and the like because of good physical, chemical and photoelectric properties. In these applications, a satisfactory wafer is first prepared, and then the designed circuit-forming chips are prepared on the wafer surface. For counting, identifying and quality monitoring of wafers, it is often necessary to code the wafer surface for identification. At present, coding is mainly carried out on the polished surface edge of a wafer, and the coding is used for tracking and monitoring the product quality in the subsequent chip preparation process. In the previous wafer preparation process, the wafer surface needs to undergo processing procedures such as grinding and polishing, so that the wafer surface cannot be coded, and the code patterns of the wafer cannot be managed and stored in a centralized manner.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a wafer side code printing and code reading storage integrated machine and a use method thereof, wherein code printing is carried out on a wafer, code pattern information of a marked wafer is stored, and full-flow quality tracking and monitoring on wafer preparation and subsequent chip manufacturing processes are realized.
In order to solve the technical problems, the invention provides a wafer side coding and code reading storage integrated machine, which comprises a vacuum adsorption platform, a coding device, a code reader, a mobile carrier, a position adjusting device and a control device; the vacuum adsorption platform is arranged on the station the code printing device is arranged between the code printing device and the code reading device; the code printer is arranged on a mobile carrier, and the mobile carrier comprises a first mobile carrier and a second mobile carrier; the first mobile carrier is in sliding connection with the code printer in a first direction, the first mobile carrier is in sliding connection with the second mobile carrier in a second direction, and the second mobile carrier is arranged on the first placing platform and is in sliding connection with the placing platform in a third direction; the first mobile carrier and the second mobile carrier are connected with the control device;
the code reader is arranged on the position adjusting device, and the position adjusting device comprises a first position adjusting device and a second position adjusting device; the first position adjusting device is in sliding connection with the code reader in a first direction, the second position adjusting device is in sliding connection with the first position adjusting device in a second direction, and the second position adjusting device is arranged on the second placing platform and is in sliding connection with the second placing platform in a third direction; the first position adjusting device and the second position adjusting device are connected with the control device;
the vacuum adsorption platform comprises a rotary supporting shaft and a supporting platform; the rotary support shaft is fixedly connected with the support platform coaxially, the rotary support shaft is connected with the control device, and the control device controls the rotary support shaft to rotate;
the control device controls the first movable carrier and the second movable carrier to slide, and the first position adjusting device and the second position adjusting device to slide; the code reader is connected with the control device; the vacuum adsorption platform is used for placing and fixing the wafer.
In a preferred embodiment, a first guide rail is arranged on the first mobile carrier, and the code printer is slidably connected with the first mobile carrier on the first guide rail; the second moving carrier is provided with a second guide rail, and the first moving carrier is connected with the second moving carrier in a sliding way on the second guide rail;
the first position adjusting device is provided with a third guide rail, and the code reader is connected with the first position adjusting device in a sliding way on the third guide rail; the second position adjusting device is provided with a fourth guide rail, and the first position adjusting device is connected with the second position adjusting device in a sliding way on the fourth guide rail.
In a preferred embodiment, the first direction, the second direction and the third direction are perpendicular to each other.
The invention also provides a use method of the wafer side code printing, code reading and storing integrated machine, which adopts the wafer side code printing, code reading and storing integrated machine and comprises the following steps:
step one: the wafer is adsorbed on a vacuum adsorption platform, and the plane of the wafer is parallel to the vacuum adsorption platform;
step two: the control device controls the first moving carrier to move or the second moving carrier to move or the first moving carrier and the second moving carrier to move simultaneously, so that the code printer faces the wafer on the vacuum adsorption platform, and the laser guided out by the code printer is ensured to vertically irradiate on the side surface of the wafer;
step three: setting laser processing parameters according to the construction materials of the wafer and the size of a specific code pattern engraved on the side surface of the wafer; including laser wavelength, repetition rate, laser power, pulse width, laser scan speed;
step four: the control device generates a specific code pattern for marking the wafer; the area of the code pattern is smaller than the side area of the wafer;
step five: the code printer carries out laser code printing or electric corrosion code printing on the wafer; generating a specific code pattern for marking the wafer on the side surface of the wafer;
step six: the control device controls the rotation and movement angle of the rotary supporting shaft to drive the wafers on the supporting platform to rotate together by the same angle, and also controls the first position adjusting device to move or the second position adjusting device to move or the first position adjusting device and the second position adjusting device to move simultaneously, so that the code reader is opposite to the wafers on the vacuum adsorption platform; the code reader reads the code pattern on the side surface of the wafer and sends the data to the control device for storage.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
the invention provides a wafer side face code printing, reading and storing all-in-one machine and a use method thereof, which replace the traditional wafer surface laser code printing method, when a wafer is cut from a crystal bar, if the wafer is directly code printed on the wafer surface, the code printing pattern on the wafer surface is damaged in the subsequent grinding, polishing and other processing procedures, so that the pattern cannot be identified.
Drawings
FIG. 1 is a schematic diagram of a structure of a code printing, code reading and storing integrated machine on a side surface of a wafer in a preferred embodiment of the invention;
FIG. 2 is a schematic diagram of a wafer after printing codes according to a preferred embodiment of the present invention;
fig. 3 is an optical micrograph of a bar code etched on the side of a wafer by a code printer in accordance with a preferred embodiment of the present invention.
Detailed Description
The invention is further described below with reference to the drawings and detailed description.
The wafer side coding and code reading storage integrated machine, referring to fig. 1, comprises a vacuum adsorption platform 2, a coding device 1, a code reader 3, a mobile carrier, a position adjusting device and a control device 6; the vacuum adsorption platform 2 is arranged between the code printer 1 and the code reader 3; the code printer 1 is arranged on a mobile carrier, and the mobile carrier comprises a first mobile carrier 41 and a second mobile carrier 42; the first moving carrier 41 is slidably connected with the code printer 1 in a first direction, the first moving carrier 41 is slidably connected with the second moving carrier 42 in a second direction, and the second moving carrier 42 is arranged on a first placing platform and is slidably connected with the placing platform in a third direction; the first moving carrier 41 and the second moving carrier 42 are connected with the control device 6;
the code reader 3 is arranged on the position adjusting device, and the position adjusting device comprises a first position adjusting device 51 and a second position adjusting device 52; the first position adjusting device 51 is slidably connected with the code reader 3 in a first direction, the second position adjusting device 52 is slidably connected with the first position adjusting device 51 in a second direction, and the second position adjusting device 52 is arranged on a second placing platform and is slidably connected with the second placing platform in a third direction; the first position adjusting device 51 and the second position adjusting device 52 are connected with the control device 6; the first direction, the second direction and the third direction are perpendicular to each other.
The vacuum adsorption platform 2 comprises a rotary supporting shaft 21 and a supporting platform 22; the rotary support shaft 21 is fixedly connected with the support platform 22 coaxially, the rotary support shaft 21 is connected with the control device 6, and the control device 6 controls the rotary support shaft 21 to rotate;
the control device 6 controls the first moving carrier 41 and the second moving carrier 42 to slide, and controls the first position adjusting device 51 and the second position adjusting device 52 to slide; the code reader 3 is connected with the control device 6; the vacuum chuck table 2 is used to hold and secure a wafer 22.
Specifically, the first moving carrier 41 is provided with a first guide rail 411, and the code printer 1 is slidably connected to the first moving carrier 41 on the first guide rail 411; the second moving carrier 42 is provided with a second guide rail 421, and the first moving carrier 41 is slidably connected with the second moving carrier 42 on the second guide rail 421; the first position adjusting device 51 is provided with a third guide rail 511, and the code reader 3 is slidably connected with the first position adjusting device 51 on the third guide rail 511; the second position adjusting device 52 is provided with a fourth rail 521, and the first position adjusting device 51 is slidably connected to the second position adjusting device 52 on the fourth rail 521. The moving distances of the first moving carrier 41, the second moving carrier 42, the first position adjusting device 51 and the second position adjusting device 52 are precisely controlled by the control device 6, so that precise coding is realized.
The following describes a method for using the integrated machine for coding, reading and storing a code on a side surface of a wafer, in this embodiment, the wafer 22 is a four-inch sapphire wafer, which specifically includes the following steps:
step one: the wafer 22 is adsorbed on the vacuum adsorption platform 2, and the plane of the wafer 22 is parallel to the vacuum adsorption platform 2.
Step two: the control device 6 controls the first moving carrier 41 or the second moving carrier 42 to move or the first moving carrier 41 and the second moving carrier 42 to move simultaneously, so that the code printer 1 faces the wafer 22 on the vacuum adsorption platform 2, and the laser guided by the code printer 1 is ensured to vertically irradiate on the side surface of the wafer 22.
Step three: setting laser processing parameters according to the construction materials of the wafer 22 and the size of a specific code pattern engraved on the side surface of the wafer 22; including laser wavelength, repetition rate, laser power, pulse width, laser scan speed; in the embodiment, the laser wavelength is 355nm, the repetition frequency is 20kHz, the laser power is 3W, the pulse width is 15ns, and the laser scanning speed is 30mm/s; other parameters may be used and are not intended to limit the scope of the invention.
Step four: control device 6 generates a specific code pattern that marks wafer 22; the area of the code pattern is smaller than the side area of the wafer 22; in the present embodiment, the side length and height of the wafer 22 are 30.7mm and 648.5 μm, respectively, so the dimensions of the code pattern are set to 26mm×0.65mm.
Step five: the code printer 1 carries out laser code printing or electric corrosion code printing on the wafer 22; the sides of the wafer 22 create a specific code pattern that marks the wafer 22, as shown in fig. 2-3;
step six: the control device 6 controls the rotation and movement angle of the rotation support shaft 21 to drive the wafers 22 on the support platform 22 to rotate together by the same angle, and the control device 6 also controls the first position adjusting device 51 to move or the second position adjusting device 52 to move or the first position adjusting device 51 and the second position adjusting device 52 to move simultaneously, so that the code reader 3 faces the wafers 22 on the vacuum adsorption platform 2; the code reader 3 reads the code pattern on the side of the wafer 22 and sends the data to the control device 6 for storage.
Specifically, the material of the wafer can be monocrystalline silicon, monocrystalline silicon carbide, sapphire and other wafer materials, the scope of the invention is not limited in this respect.
The foregoing is only a preferred embodiment of the present invention, but the design concept of the present invention is not limited thereto, and any person skilled in the art will be able to make insubstantial modifications of the present invention within the scope of the present invention disclosed herein by this concept, which falls within the actions of invading the protection scope of the present invention.
Claims (3)
1. The integrated machine for coding, reading and storing the side surface of the wafer is characterized by comprising a vacuum adsorption platform, a coding device, a code reader, a movable carrier, a position adjusting device and a control device; the vacuum adsorption platform is arranged between the code printing device and the code reading device; the code printer is arranged on a mobile carrier, and the mobile carrier comprises a first mobile carrier and a second mobile carrier; the first mobile carrier is in sliding connection with the code printer in a first direction, the first mobile carrier is in sliding connection with the second mobile carrier in a second direction, and the second mobile carrier is arranged on the first placing platform and is in sliding connection with the placing platform in a third direction; the first mobile carrier and the second mobile carrier are connected with the control device;
the code reader is arranged on the position adjusting device, and the position adjusting device comprises a first position adjusting device and a second position adjusting device; the first position adjusting device is in sliding connection with the code reader in a first direction, the second position adjusting device is in sliding connection with the first position adjusting device in a second direction, and the second position adjusting device is arranged on the second placing platform and is in sliding connection with the second placing platform in a third direction; the first position adjusting device and the second position adjusting device are connected with the control device;
the vacuum adsorption platform comprises a rotary supporting shaft and a supporting platform; the rotary support shaft is fixedly connected with the support platform coaxially, the rotary support shaft is connected with the control device, and the control device controls the rotary support shaft to rotate;
the control device controls the first movable carrier, the second movable carrier, the first position adjusting device and the second position adjusting device to slide; the code reader is connected with the control device; the vacuum adsorption platform is used for placing and fixing the wafer;
the first direction, the second direction and the third direction are perpendicular to each other in pairs;
the control device is used for controlling the first movable carrier to move or the second movable carrier to move or the first movable carrier and the second movable carrier to move simultaneously, so that the code printer is opposite to the wafer on the vacuum adsorption platform, and the laser guided out by the code printer is ensured to vertically irradiate on the side surface of the wafer.
2. The wafer side code printing, reading and storing all-in-one machine according to claim 1, wherein a first guide rail is arranged on the first movable carrier, and the code printer is connected with the first movable carrier in a sliding manner on the first guide rail; the second moving carrier is provided with a second guide rail, and the first moving carrier is connected with the second moving carrier in a sliding way on the second guide rail;
the first position adjusting device is provided with a third guide rail, and the code reader is connected with the first position adjusting device in a sliding way on the third guide rail; the second position adjusting device is provided with a fourth guide rail, and the first position adjusting device is connected with the second position adjusting device in a sliding way on the fourth guide rail.
3. The use method of the integrated machine for coding and reading codes on the side face of the wafer is characterized by adopting the integrated machine for coding and reading codes on the side face of the wafer as claimed in claim 2, and comprises the following steps:
step one: the wafer is adsorbed on a vacuum adsorption platform, and the plane of the wafer is parallel to the vacuum adsorption platform;
step two: the control device controls the first moving carrier to move or the second moving carrier to move or the first moving carrier and the second moving carrier to move simultaneously, so that the code printer faces the wafer on the vacuum adsorption platform, and the laser guided out by the code printer is ensured to vertically irradiate on the side surface of the wafer;
### Setting laser processing parameters according to the construction materials of the wafer and the size of a specific code pattern engraved on the side surface of the wafer; including laser wavelength, repetition rate, laser power, pulse width, laser scan speed;
step four: the control device generates a specific code pattern for marking the wafer; the area of the code pattern is smaller than the side area of the wafer;
step five: the code printer carries out laser code printing or electric corrosion code printing on the wafer; generating a specific code pattern for marking the wafer on the side surface of the wafer;
step six: the control device controls the rotation and movement angle of the rotary supporting shaft to drive the wafers on the supporting platform to rotate together by the same angle, and also controls the first position adjusting device to move or the second position adjusting device to move or the first position adjusting device and the second position adjusting device to move simultaneously, so that the code reader is opposite to the wafers on the vacuum adsorption platform; the code reader reads the code pattern on the side surface of the wafer and sends the data to the control device for storage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810778032.2A CN108682647B (en) | 2018-07-16 | 2018-07-16 | Integrated machine for coding, reading and storing lateral surface of wafer and use method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810778032.2A CN108682647B (en) | 2018-07-16 | 2018-07-16 | Integrated machine for coding, reading and storing lateral surface of wafer and use method thereof |
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| Publication Number | Publication Date |
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| CN108682647A CN108682647A (en) | 2018-10-19 |
| CN108682647B true CN108682647B (en) | 2024-02-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810778032.2A Active CN108682647B (en) | 2018-07-16 | 2018-07-16 | Integrated machine for coding, reading and storing lateral surface of wafer and use method thereof |
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| CN (1) | CN108682647B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111430333B (en) * | 2020-05-14 | 2023-06-09 | 上海果纳半导体技术有限公司 | Wafer mark and forming method thereof |
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| CN108682647A (en) | 2018-10-19 |
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