CN108676543B - Method for adhesively fixing metal parts, polysulfone composite material for adhesively fixing metals, preparation method and application - Google Patents
Method for adhesively fixing metal parts, polysulfone composite material for adhesively fixing metals, preparation method and application Download PDFInfo
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- CN108676543B CN108676543B CN201810386250.1A CN201810386250A CN108676543B CN 108676543 B CN108676543 B CN 108676543B CN 201810386250 A CN201810386250 A CN 201810386250A CN 108676543 B CN108676543 B CN 108676543B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
- C09J181/06—Polysulfones; Polyethersulfones
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
The invention provides a method for bonding and fixing metal parts, a polysulfone composite material for bonding and fixing metal, a preparation method and application, wherein polyphenylene sulfone resin is used for bonding and fixing. The present invention provides a novel use of polyphenylene sulfone resin as a metal bonding material, which is generally used in the fields of food safety or medical instruments, etc., and the present invention has found that it has excellent metal adhesion, is used for bonding and fixing metal parts, has high adhesion strength, and is not easily peeled off or broken.
Description
Technical Field
The invention belongs to the field of composite materials, and relates to a method for bonding and fixing metal parts, a polysulfone composite material for bonding and fixing metal, a preparation method and application.
Background
In recent years, with diversification of the appearance requirements of electronic products, the appearance quality of electronic products is continuously changed, and a single metal or plastic casing of the electronic product cannot meet the market requirements of diversification, and the electronic product casing combining metal and plastic becomes a new favorite of people. Some of the more popular electronic product bodies in the market today are products that use aluminum alloy surface treatment in combination with resin polymer technology. However, electronic products are increasingly required to have high material requirements, especially in terms of signal transmission, the dielectric constant and dissipation factor of the material are required to be lower, and certain flame retardancy and low thermal expansion are also required.
CN102558863A discloses a low-dielectric polyphenylene sulfide composite material and a preparation method thereof, the composition realizes low dielectric property by adding polytetrafluoroethylene (hereinafter referred to as PTFE) with low dielectric property, although the polyphenylene sulfide composite material with dielectric property of 2.8 is obtained, the melting point of polyphenylene sulfide is 280 ℃, the melting point of PTFE is 330 ℃, PTFE is difficult to process, and the molding shrinkage is very large (3.0%); and PTFE is a non-polar polymer and has poor adhesion effect with metals. CN103525088A discloses a polyphenylene sulfide composite material and a preparation method thereof, wherein the composite material is alloyed with polyphenylene sulfide by adding different types of polyamide, thereby improving the processing type of polyphenylene sulfide and reducing the cost, and although a composite material with good comprehensive mechanical properties is obtained, researches show that the addition of polyamide inevitably leads to the increase of the water absorption rate of the material, the advantage of low water absorption rate of polyphenylene sulfide is sacrificed, longer time is consumed for drying the material in the injection molding processing process, and the dielectric property, weather resistance and other related properties of the composite material are not effectively improved.
At present, a material with high bonding strength with metal and lower dielectric property needs to be developed to meet the application requirements.
Disclosure of Invention
The invention aims to provide a method for bonding and fixing metal parts, a polysulfone composite material for bonding and fixing metal, a preparation method and application.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides a method of adhesively securing metal parts: and the polyphenylene sulfone resin is used for bonding and fixing.
The polyphenylene sulfone resin is polysulfone resin, is used as amorphous thermoplastic resin, has high transparency and high hydrolytic stability, is stable to common acids, alkalis, salts and the like except strong polar solvent, concentrated nitric acid and sulfuric acid, has good rigidity and toughness, and has application prospect in the fields of food safety, medical appliances and the like. The invention has discovered that the polyphenylene sulfone resin has excellent metal adhesion and good adhesion effect to metal or metal oxide, and can be used for adhering and fixing metal or metal oxide components.
Because the metal oxide film can change the state and performance of the metal surface when the metal oxide film is formed on the metal surface, for example, the aluminum oxide film can be formed on the surface of the aluminum to improve the corrosion resistance, enhance the wear resistance and hardness and protect the metal surface, therefore, the metal surface can be firstly formed with the oxide film by any method which can form the oxide film on the metal surface, such as electrolysis, and then the metal part is bonded and fixed.
When a metal member is adhesively fixed with a polyphenylene sulfone resin, the method comprises: and melting the polyphenylene sulfone resin, then contacting and solidifying the polyphenylene sulfone resin with the metal part to be fixed, and realizing the bonding and fixing of the metal part.
In the present invention, the curing is any method that can change the polyphenylene sulfone resin from a fluid state to a solid state, including cooling and setting.
Preferably, the metal is an aluminum alloy and/or a stainless steel alloy.
Preferably, when the metal part to be fixed is a metal part of an electronic product, the polyphenylene sulfone resin is used in combination with polysulfone.
When the metal part to be fixed is a metal part of an electronic product, the electronic product has higher and higher requirements on signal penetration, the lower the dielectric constant and dielectric loss of the material is, the better the numerical value is, and the polysulfone has excellent rigidity and lower dielectric constant, so that the polyphenylene sulfone resin and the polysulfone are mixed for use, the bonding requirement can be met, and the requirement of the electronic product on dielectric property can also be met.
In a second aspect, the invention provides a polysulfone composite material for bonding and fixing metals, which comprises the following components in parts by weight:
in the present invention, the composite material is referred to as a polysulfone composite material because the composite material includes a polysulfone-based resin, namely, a polyphenylene sulfone resin.
In the present invention, the polyphenylene sulfone resin is present in an amount of 25 to 80 parts by weight, for example, 30 parts by weight, 35 parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, 60 parts by weight, 65 parts by weight, 70 parts by weight, 75 parts by weight, and the like.
In the present invention, the polysulfone is present in an amount of 0 to 40 parts by weight, for example 5 parts by weight, 10 parts by weight, 15 parts by weight, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight, etc.
Preferably, the polysulfone is in an amount of 20 to 40 parts by weight.
Preferably, the polysulfone is a bisphenol a polysulfone.
In the present invention, the glass fiber is present in an amount of 0 to 30 parts by weight, for example, 5 parts by weight, 10 parts by weight, 12 parts by weight, 15 parts by weight, 17 parts by weight, 20 parts by weight, 25 parts by weight, and the like.
Preferably, the weight part of the glass fiber is 1 to 30 parts.
In the present invention, the weight part of the auxiliary is 0 to 2.5 parts by weight, for example, 0.2 part by weight, 0.5 part by weight, 0.7 part by weight, 1.0 part by weight, 1.2 parts by weight, 1.5 parts by weight, 1.7 parts by weight, 2.0 parts by weight, 2.2 parts by weight, and the like.
Preferably, the auxiliary agent comprises the following components in parts by weight:
in the present invention, the antioxidant is 0 to 1 part by weight, for example, 0.1 part by weight, 0.2 part by weight, 0.3 part by weight, 0.4 part by weight, 0.5 part by weight, 0.6 part by weight, 0.7 part by weight, 0.8 part by weight, 0.9 part by weight or the like.
Preferably, the weight part of the antioxidant is 0.5-1 part.
In the present invention, the ultraviolet absorber is 0 to 0.5 parts by weight, for example, 0.1 parts by weight, 0.2 parts by weight, 0.3 parts by weight, 0.4 parts by weight, 0.5 parts by weight.
Preferably, the weight part of the ultraviolet absorber is 0.1 to 0.5 parts.
In the present invention, the light stabilizer is 0 to 0.5 parts by weight, for example, 0.1 parts by weight, 0.2 parts by weight, 0.3 parts by weight, 0.4 parts by weight, 0.5 parts by weight.
Preferably, the light stabilizer is 0.1 to 0.5 parts by weight.
In the present invention, the lubricant is 0 to 0.5 parts by weight, for example, 0.1 parts by weight, 0.2 parts by weight, 0.3 parts by weight, 0.4 parts by weight, 0.5 parts by weight.
Preferably, the lubricant is present in an amount of 0.1 to 0.5 parts by weight.
Preferably, the antioxidant comprises a phenolic antioxidant and/or a thioester antioxidant, preferably any one or a combination of at least two of the antioxidant 1010, the antioxidant PEPQ and the antioxidant 412S, and more preferably a composition consisting of the antioxidant 1010, the antioxidant PEPQ and the antioxidant 412S in a mass ratio of 1:1: 1.
Preferably, the ultraviolet absorber is a benzotriazole-based ultraviolet absorber, and more preferably an ultraviolet absorber UV-234.
Preferably, the light stabilizer is a hindered amine light stabilizer, preferably light stabilizer 770D.
Preferably, the lubricant is pentaerythritol stearate.
As a preferred technical scheme, the composite material comprises the following components in parts by weight:
the composite material obtained by the preferred technical scheme provided by the invention has high bonding strength with metal and has lower dielectric property.
In a third aspect, the present invention provides a method for preparing a composite material according to the second aspect, the method comprising the steps of:
(1) uniformly mixing polyphenylene sulfone resin, polysulfone, an antioxidant, an ultraviolet absorbent, a light stabilizer and a lubricant according to the formula ratio;
(2) and (2) adding the mixture obtained in the step (1) into a screw extruder from a main feeding port, adding glass fibers with the formula amount into the screw extruder from side feeding ports of five zones, melting, extruding and granulating to obtain the composite material.
Preferably, the mixing of step (1) is carried out in a high speed mixer.
Preferably, in step (1), the antioxidant and the lubricant in the formulated amounts are premixed, and the ultraviolet absorber and the light stabilizer in the formulated amounts are premixed, and then all the components are uniformly mixed in a high-speed mixer.
In the present invention, the antioxidant and the lubricant may be premixed, the ultraviolet absorber and the light stabilizer may be premixed, and then the premixed mixture may be mixed again with the polyphenylene sulfone resin and the polysulfone in the high-speed mixer.
Preferably, said melting and extruding of step (2) is carried out in a screw extruder.
Preferably, the operating parameters of the screw extruder are: the length-diameter ratio of the screw is 40: 1; the first zone is 265 ℃ 275 ℃ (e.g., 266 ℃, 268 ℃, 270 ℃, 272 ℃, 274 ℃, etc.), the second zone is 275 ℃ 285 ℃ (e.g., 276 ℃, 278 ℃, 280 ℃, 282 ℃, 284 ℃, etc.), the third zone is 275 ℃ 285 ℃ (e.g., 276 ℃, 278 ℃, 280 ℃, 282 ℃, 284 ℃, etc.), the fourth zone is 275 ℃ 285 ℃ (e.g., 276 ℃, 278 ℃, 280 ℃, 282 ℃, 284 ℃, etc.), the fifth zone is 275 ℃ 285 ℃ (e.g., 276 ℃, 278 ℃, 280 ℃, 282 ℃, 284 ℃, etc.), the sixth zone is 275 ℃ 285 ℃ (e.g., 276 ℃, 278 ℃, 280 ℃, 282 ℃, 284 ℃, etc.), the seventh zone is 265 ℃ 275 ℃ (e.g., 266 ℃, 268 ℃, 270 ℃, 272 ℃, 274 ℃, etc.), the eighth zone is 265 ℃ 275 ℃ (e.g., 266 ℃, 268 ℃, 272 ℃, 274 ℃, etc.), and the ninth zone is 275 ℃ 285 (e.g., 276 ℃,), 278 ℃, 280 ℃, 282 ℃, 284 ℃ and the like), the temperature of the ten zones is 275-.
In a fourth aspect, the present invention provides an electronic product, wherein at least one metal part holder of the electronic product comprises a polyphenylene sulfone resin.
Preferably, the at least one metal part holder is a composite material according to the second aspect.
Preferably, the preparation method of the back plate of the electronic product comprises the following steps:
(1) heating the metal part, and then placing the metal part inside a mold;
(2) melting the composite material of the second aspect, injecting the molten composite material into a mold, and cooling and solidifying the molten composite material to obtain a primary product;
(3) and (3) processing the primary product obtained in the step (2) to obtain the backboard of the electronic product.
Preferably, the heating in step (1) is performed to 130-150 ℃, such as 132 ℃, 135 ℃, 137 ℃, 140 ℃, 142 ℃, 145 ℃, 147 ℃ and the like.
Preferably, the machining process of step (3) is CNC machining.
Compared with the prior art, the invention has the following beneficial effects:
(1) the present invention provides a novel use of polyphenylene sulfone resin as a metal binding material, which is generally used in the fields of food safety or medical instruments, etc., and the present invention has found that it has excellent metal binding property, is used for binding and fixing metal parts, has high binding strength, and is not easily peeled off or broken;
(2) the present invention provides a composite material for adhesively fixing metals, which comprises a polyphenylene sulfone resin and thus has adhesion to metals;
(3) the electronic product provided by the invention comprises polyphenylene sulfone resin, so that the electronic product has excellent metal adhesion, and when the composite material comprises polysulfone, the composite material has lower dielectric constant and better metal adhesion strength, so that the prepared electronic product has better low dielectric property and is not easy to crack between metal and plastic;
(4) the backboard of the electronic product provided by the invention can be used by combining a metal material and the composite material provided by the invention, thereby meeting diversified market demands.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
A composite material for bonding and fixing metals comprises the following components:
wherein the polysulfone is bisphenol A polysulfone; the antioxidant is a composition consisting of an antioxidant 1010, an antioxidant PEPQ and an antioxidant 412S in a mass ratio of 1:1: 1; the ultraviolet absorbent is UV-234; the light stabilizer is 770D; the lubricant is pentaerythritol stearate.
The preparation method comprises the following steps:
(1) premixing antioxidant and lubricant according to the formula amount, premixing ultraviolet absorbent and light stabilizer according to the formula amount, and then adding the premixed mixture, polyphenylene sulfone resin and polysulfone according to the formula amount into a high-speed mixer to be uniformly mixed;
(2) adding the mixture finally obtained in the step (1) into a screw extruder from a main feeding port, adding glass fibers with a formula amount into the screw extruder from side feeding ports of five zones, melting, extruding and granulating to obtain a composite material; wherein the length-diameter ratio of the screw is 40: 1; the first zone is 270 ℃, the second zone is 280 ℃, the third zone is 280 ℃, the fourth zone is 280 ℃, the fifth zone is 280 ℃, the sixth zone is 280 ℃, the seventh zone is 270 ℃, the eighth zone is 270 ℃, the ninth zone is 280 ℃, the tenth zone is 280 ℃ and the head is 320 ℃.
Example 2
A composite material for bonding and fixing metals comprises the following components:
wherein the polysulfone is bisphenol A polysulfone; the antioxidant is antioxidant 1010; the ultraviolet absorbent is UV-234; the light stabilizer is 770D; the lubricant is pentaerythritol stearate.
The preparation method comprises the following steps:
(1) premixing antioxidant and lubricant according to the formula amount, premixing ultraviolet absorbent and light stabilizer according to the formula amount, and then adding the premixed mixture, polyphenylene sulfone resin and polysulfone according to the formula amount into a high-speed mixer to be uniformly mixed;
(2) adding the mixture finally obtained in the step (1) into a screw extruder from a main feeding port, adding glass fibers with a formula amount into the screw extruder from side feeding ports of five zones, melting, extruding and granulating to obtain a composite material; wherein the length-diameter ratio of the screw is 40: 1; the first zone is 270 ℃, the second zone is 280 ℃, the third zone is 280 ℃, the fourth zone is 280 ℃, the fifth zone is 280 ℃, the sixth zone is 280 ℃, the seventh zone is 270 ℃, the eighth zone is 270 ℃, the ninth zone is 280 ℃, the tenth zone is 280 ℃ and the head is 320 ℃.
Example 3
A composite material for bonding and fixing metals comprises the following components:
wherein the polysulfone is bisphenol A polysulfone; the antioxidant is antioxidant 1010; the ultraviolet absorbent is UV-234; the light stabilizer is 770D; the lubricant is pentaerythritol stearate.
The preparation method comprises the following steps:
(1) premixing antioxidant and lubricant according to the formula amount, premixing ultraviolet absorbent and light stabilizer according to the formula amount, and then adding the premixed mixture, polyphenylene sulfone resin and polysulfone according to the formula amount into a high-speed mixer to be uniformly mixed;
(2) adding the mixture finally obtained in the step (1) into a screw extruder from a main feeding port, adding glass fibers with a formula amount into the screw extruder from side feeding ports of five zones, melting, extruding and granulating to obtain a composite material; wherein the length-diameter ratio of the screw is 40: 1; the first zone is 270 ℃, the second zone is 280 ℃, the third zone is 280 ℃, the fourth zone is 280 ℃, the fifth zone is 280 ℃, the sixth zone is 280 ℃, the seventh zone is 270 ℃, the eighth zone is 270 ℃, the ninth zone is 280 ℃, the tenth zone is 280 ℃ and the head is 320 ℃.
Example 4
A composite material for bonding and fixing metals comprises the following components:
wherein the polysulfone is bisphenol A polysulfone; the antioxidant is antioxidant 1010; the ultraviolet absorbent is UV-326; the light stabilizer is GW-480; the lubricant is pentaerythritol stearate.
The preparation method comprises the following steps:
(1) adding polyphenylene sulfone resin, polysulfone, an antioxidant, an ultraviolet absorbent, a light stabilizer and a lubricant in formula amounts into a high-speed mixer, and uniformly mixing;
(2) adding the mixture finally obtained in the step (1) into a screw extruder from a main feeding port, adding glass fibers with a formula amount into the screw extruder from side feeding ports of five zones, melting, extruding and granulating to obtain a composite material; wherein the length-diameter ratio of the screw is 40: 1; the first zone was 265 deg.C, the second zone temperature was 275 deg.C, the third zone temperature was 275 deg.C, the fourth zone temperature was 275 deg.C, the fifth zone temperature was 275 deg.C, the sixth zone temperature was 275 deg.C, the seventh zone temperature was 265 deg.C, the eighth zone temperature was 265 deg.C, the ninth zone temperature was 275 deg.C, the tenth zone temperature was 275 deg.C, and the head temperature was 315 deg.C.
Example 5
A composite material for bonding and fixing metals comprises the following components:
wherein the auxiliary agent is antioxidant 412S.
The preparation method comprises the following steps:
(1) adding polyphenylene sulfone resin, polysulfone and an auxiliary agent in a formula amount into a high-speed mixer, and uniformly mixing;
(2) adding the mixture finally obtained in the step (1) into a screw extruder from a main feeding port, adding glass fibers with a formula amount into the screw extruder from side feeding ports of five zones, melting, extruding and granulating to obtain a composite material; wherein the length-diameter ratio of the screw is 40: 1; the temperature of the first zone is 275 ℃, the temperature of the second zone is 285 ℃, the temperature of the third zone is 285 ℃, the temperature of the fourth zone is 285 ℃, the temperature of the fifth zone is 285 ℃, the temperature of the sixth zone is 285 ℃, the temperature of the seventh zone is 275 ℃, the temperature of the eighth zone is 275 ℃, the temperature of the ninth zone is 285 ℃, the temperature of the tenth zone is 285 ℃ and the temperature of the head is 325 ℃.
Example 6
The only difference from example 1 is that this example only comprises the following components:
60 parts by weight of polyphenylene sulfone resin;
20 parts of polysulfone;
20 parts of glass fiber.
Example 7
The only difference from example 1 is that this example only comprises the following components:
60 parts by weight of polyphenylene sulfone resin;
40 parts of polysulfone.
Example 8
The only difference from example 1 is that this example only comprises the following components:
50 parts by weight of polyphenylene sulfone resin.
And (3) performance testing:
the composites provided in examples 1-8 were tested for performance by the following methods:
(1) specific gravity: testing according to ASTM D792/(GB/T1033) standard;
(2) notched impact strength: testing according to the ASTM D256/(GB/T1843) standard;
(3) flame retardant property: testing according to the UL-94/(GB/T2408) standard;
(4) dielectric constant, dielectric loss: testing under IEC60250, 2GHz conditions;
(5) coefficient of linear expansion: testing according to the standard of ASTM D-696 (GB/T2572);
(6) metal bonding strength: testing according to GB/T13936 standard, wherein the metal is 5 series aluminum alloy;
(7) mechanical properties: the test was carried out according to ASTM D638/(GB/T1040) standard.
The test results are shown in table 1:
TABLE 1
Experiments and tests show that the composite material provided by the invention has high bonding strength (the bonding strength is 208 kgf/cm)2Above) and has a low dielectric constant (3.7 or less) and low dielectric loss (6.6 × e)-3Below) and has better flame retardant properties (V0) and a lower coefficient of thermal expansion; from examples 1 to 4, it can be seen that when polysulfone, glass fiber and an additive in the range of claim are added to polyphenylene sulfone resin, the obtained composite material has a dielectric constant of 3.4 or less and a dielectric loss of 5.5 × e-3The adhesive strength with the metal material was 216kgf/cm2The requirements for bonding and fixing the metal parts of the electronic products can be met; from examples 7 and 8, it can be seen that when polyphenylene sulfone resin is mixed with polysulfone, the dielectric constant of the obtained material is significantly reduced from 3.7 to 3.3, and the obtained material can be used for bonding and fixing metal parts of electronic products.
The polyphenylene sulfone resin provided in example 8 was tested for its adhesive strength (kgf/cm) to various metals according to GB/T13936 standard2) The test results are shown in table 2:
TABLE 2
As can be seen from the data, the polyphenylene sulfone resin has a high adhesive strength to aluminum alloy and stainless steel alloy at 189kgf/cm2The above can be used for bonding and fixing metal members.
The applicant states that the present invention is illustrated by the above examples of the method for adhesively fixing metal parts and the polysulfone composite material for adhesively fixing metals, the preparation method and the application of the present invention, but the present invention is not limited to the above examples, that is, it does not mean that the present invention must be implemented by the above examples. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (12)
1. A method for bonding and fixing metal parts is characterized in that polyphenylene sulfone resin is melted and mixed with polysulfone to prepare polysulfone composite material, and the polysulfone composite material is contacted with metal parts to be fixed and solidified to realize bonding and fixing of the metal parts, wherein the metal parts to be fixed are metal parts of electronic products;
the polysulfone composite material comprises the following components in parts by weight:
25-80 parts by weight of polyphenylene sulfone resin;
20-40 parts of polysulfone;
1-30 parts of glass fiber;
0.2-2.5 parts of auxiliary agent;
the metal of the metal part is an aluminum alloy and/or a stainless steel alloy;
the auxiliary agent comprises the following components in parts by weight:
0.5-1 part of antioxidant;
0.1-0.5 part by weight of ultraviolet absorbent;
0.1-0.5 part by weight of light stabilizer;
0.1-0.5 parts by weight of lubricant;
the antioxidant comprises a phenolic antioxidant and/or a thioester antioxidant; the ultraviolet absorbent is an ultraviolet absorbent UV-234;
the light stabilizer is light stabilizer 770D;
the lubricant is pentaerythritol stearate.
2. The method of claim 1, wherein the polysulfone is a bisphenol a polysulfone.
3. The method as claimed in claim 1, wherein the antioxidant is a composition of antioxidant 1010, antioxidant PEPQ and antioxidant 412S in a mass ratio of 1:1: 1.
4. The method of claim 1, wherein the polysulfone composite is prepared by a process comprising the steps of:
(1) uniformly mixing polyphenylene sulfone resin, polysulfone, an antioxidant, an ultraviolet absorbent, a light stabilizer and a lubricant according to the formula ratio;
(2) and (2) adding the mixture obtained in the step (1) into a screw extruder from a main feeding port, adding glass fibers with the formula amount into the screw extruder from side feeding ports of five zones, melting, extruding and granulating to obtain the composite material.
5. The method of claim 4, wherein the mixing of step (1) is performed in a high speed blender.
6. The method according to claim 4, wherein in step (1), the antioxidant and the lubricant are premixed in the amount of the formula, and the ultraviolet absorber and the light stabilizer are premixed in the amount of the formula, and then all the components are mixed uniformly in a high-speed mixer.
7. The method of claim 4, wherein said melting and extruding of step (2) is performed in a screw extruder.
8. The method according to claim 7, wherein the operating parameters of the screw extruder are: the length-diameter ratio of the screw is 40: 1; the first zone is 265-275 ℃, the second zone is 275-285 ℃, the third zone is 275-285 ℃, the fourth zone is 275-285 ℃, the fifth zone is 275-285 ℃, the sixth zone is 275-285 ℃, the seventh zone is 265-275 ℃, the eighth zone is 265-275 ℃, the ninth zone is 275-285 ℃, the tenth zone is 275-285 ℃ and the head is 315-325 ℃.
9. An electronic product, characterized in that at least one metal part holder of the electronic product is a composite material as claimed in any one of claims 1-3.
10. A method for preparing a back plate of an electronic product according to claim 9, comprising the steps of:
(1) heating the metal part, and then placing the metal part inside a mold;
(2) injecting the composite material as claimed in any one of claims 1-2 after melting into a mold, and then cooling and solidifying to obtain a preliminary product;
(3) and (3) processing the primary product obtained in the step (2) to obtain the backboard of the electronic product.
11. The method as claimed in claim 10, wherein the heating in step (1) is performed to a temperature of 130-150 ℃.
12. The method of claim 10, wherein the machining process of step (3) is a CNC machining.
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| CN111518511B (en) * | 2020-05-11 | 2021-09-28 | 四川川环科技股份有限公司 | Heat-resistant adhesive and aluminum alloy bonding method |
| WO2021227377A1 (en) * | 2020-05-11 | 2021-11-18 | 四川川环科技股份有限公司 | Heat resistant adhesive, preparation method therefor, and bonding method for aluminum alloy |
| CN111500250B (en) * | 2020-05-11 | 2021-08-17 | 四川川环科技股份有限公司 | Preparation method of heat-resistant adhesive |
| CN114196206A (en) * | 2021-12-29 | 2022-03-18 | 苏州建发塑料制品有限公司 | PPSU high-temperature-resistant squirrel cage and preparation method thereof |
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| US10519277B2 (en) * | 2014-12-12 | 2019-12-31 | Solvay Specialty Polymers Usa, Llc | Poly(aryl ether) compositions for polymer-metal junctions and polymer-metal junctions and corresponding fabrication methods |
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| DE3924484A1 (en) * | 1989-07-25 | 1991-01-31 | Basf Ag | Adhesive film for bonding thermoplastic moulded parts - consists of thermoplastic polymer film contg. liq. which swells but does not dissolve polymer and lowers its Tg by more than 20 deg. C |
| EP0513488A1 (en) * | 1991-03-30 | 1992-11-19 | BASF Aktiengesellschaft | Thermoplastic moulding compositions based on modified polyarylether |
| CN103694947A (en) * | 2013-12-18 | 2014-04-02 | 中国航天科技集团公司第六研究院第十一研究所 | Bonding agent used for binding terminal-sensing ammunition polysulfone antenna |
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