CN108676543A - The method of metal parts and polysulfone composites, preparation method and application for metal to be adhesively fixed are adhesively fixed - Google Patents
The method of metal parts and polysulfone composites, preparation method and application for metal to be adhesively fixed are adhesively fixed Download PDFInfo
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- CN108676543A CN108676543A CN201810386250.1A CN201810386250A CN108676543A CN 108676543 A CN108676543 A CN 108676543A CN 201810386250 A CN201810386250 A CN 201810386250A CN 108676543 A CN108676543 A CN 108676543A
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 71
- 239000002184 metal Substances 0.000 title claims abstract description 71
- 239000002131 composite material Substances 0.000 title claims abstract description 43
- 229920002492 poly(sulfone) Polymers 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- -1 polyphenylene Polymers 0.000 claims abstract description 32
- 125000001174 sulfone group Chemical group 0.000 claims abstract description 30
- 229920000265 Polyparaphenylene Polymers 0.000 claims abstract description 29
- 229920000491 Polyphenylsulfone Polymers 0.000 claims abstract description 7
- 239000003963 antioxidant agent Substances 0.000 claims description 29
- 230000003078 antioxidant effect Effects 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 22
- 239000004611 light stabiliser Substances 0.000 claims description 19
- 239000000314 lubricant Substances 0.000 claims description 18
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 18
- 239000003365 glass fiber Substances 0.000 claims description 12
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229920013655 poly(bisphenol-A sulfone) Polymers 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- TXQVDVNAKHFQPP-UHFFFAOYSA-N [3-hydroxy-2,2-bis(hydroxymethyl)propyl] octadecanoate Chemical group CCCCCCCCCCCCCCCCCC(=O)OCC(CO)(CO)CO TXQVDVNAKHFQPP-UHFFFAOYSA-N 0.000 claims description 5
- BEIOEBMXPVYLRY-UHFFFAOYSA-N [4-[4-bis(2,4-ditert-butylphenoxy)phosphanylphenyl]phenyl]-bis(2,4-ditert-butylphenoxy)phosphane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(C=1C=CC(=CC=1)C=1C=CC(=CC=1)P(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C BEIOEBMXPVYLRY-UHFFFAOYSA-N 0.000 claims description 5
- 239000012752 auxiliary agent Substances 0.000 claims description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 4
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 3
- 239000005864 Sulphur Substances 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 239000012964 benzotriazole Substances 0.000 claims description 2
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 239000002530 phenolic antioxidant Substances 0.000 claims description 2
- 239000000326 ultraviolet stabilizing agent Substances 0.000 claims description 2
- 239000006096 absorbing agent Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 13
- 235000021393 food security Nutrition 0.000 abstract description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 239000004734 Polyphenylene sulfide Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920006389 polyphenyl polymer Polymers 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920006113 non-polar polymer Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
- C09J181/06—Polysulfones; Polyethersulfones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Polysulfone composites, preparation method and application the present invention provides a kind of method that metal parts is adhesively fixed and for metal to be adhesively fixed use the resin-bonded fixation of polyphenylsulfone.New application the present invention provides polyphenylene sulphone resin as metal bond materials, polyphenylene sulphone resin is commonly used in fields such as food security or medical instruments, and present invention discover that its caking property with excellent metal, it uses it for that metal parts is adhesively fixed, adhesion strength is high, is not easy to peel off or be broken.
Description
Technical field
The invention belongs to field of compound material, it is related to a kind of method that metal parts is adhesively fixed and for gold to be adhesively fixed
The polysulfone composites of category, preparation method and application.
Background technology
In recent years, the diversification with people to electronic product appearance demand, electronic product also constantly convert its appearance
Quality, the single metal of electronic product or plastic rubber case have been unable to meet the polynary diversified market demand, and with metal and modeling
The electronic product enclosure that glue is combined then becomes the new lover of people.The more popular electronic product body in part is just currently on the market
It is the product handled by using aluminum alloy surface with resinous polymer combination technology.But requirement of the electronic product to material is got over
Come higher, especially signal penetrates aspect, is then needed with fissipation factor to the dielectric constant of material lower and lower, and also requires
It is more low with certain anti-flammability and thermal expansivity.
CN102558863A discloses a kind of low-dielectric-property polyphenylene sulphide composite material and preparation method thereof, and the composition is logical
The polytetrafluoroethylene (PTFE) (hereinafter referred to as PTFE) of addition low-dielectric energy is crossed to realize low-dielectric, although it is 2.8 to obtain dielectricity
Polyphenyl thioether composite material, but polyphenylene sulfide fusing point be 280 DEG C, PTFE fusing points be 330 DEG C, and PTFE it is more difficult plus
Work, molding shrinkage are very big (3.0%)；And PTFE is a kind of non-polar polymer, it is ineffective with metal adhesive.
CN103525088A discloses a kind of polyphenyl thioether composite material and preparation method thereof, and the composition is different types of by adding
Polyamide forms alloy with polyphenylene sulfide, improves the processing type of polyphenylene sulfide and reduces cost, although obtaining comprehensive mechanics
Composition of good performance, studies have found that, the addition of polyamide inevitably results in the raising of material water absorption rate, sacrifices
The advantages of polyphenylene sulfide low water absorption, needs the consumption longer time to be used for dried material, and this is compound in injection molding process
The dielectricity of material, the correlated performances such as weatherability are not improved.
It needs to develop one kind at present and metal adhesion strength is high, and the material with lower dielectric properties is to meet application
It is required that.
Invention content
The purpose of the present invention is to provide a kind of method that metal parts is adhesively fixed and for the poly- of metal to be adhesively fixed
Sulfone composite material, preparation method and application.
For this purpose, the present invention uses following technical scheme：
On the one hand, the present invention provides a kind of methods that metal parts is adhesively fixed：It is resin-bonded using polyphenylsulfone
It is fixed.
Polyphenylene sulphone resin is polysulfones resinoid, as unformed thermoplastic resin, has heigh clarity, high hydrolysis
Stability, and other than intensive polar solvent, concentrated nitric acid and sulfuric acid, general acid, alkali, salt etc. are stablized, and rigidity and good toughness,
There is application prospect in fields such as food security, medical instruments.And the present invention chances on polyphenylene sulphone resin with excellent
Metal adhesion, it is good to the bond effect of metal or metal oxide, can be used for being adhesively fixed metal or metal oxide portion
Part.
Because when metal surface forms one layer of metal-oxide film, metal-oxide film can change metal surface
State and performance such as form one layer of aluminum oxide film on the surface of aluminium, can improve its corrosion resistance, enhance its wearability and hard
Degree, and play the role of protecting metal surface, therefore, we can be such that metal surface is formed using electrolysis etc. is any first
The method of sull makes metal surface form sull, then carries out being adhesively fixed for metal parts again.
When fixing metal parts resin-bonded with polyphenylsulfone, method includes：By polyphenylsulfone resin melting, then
It contacts, cure with metal parts to be fixed, realize being adhesively fixed for metal parts.
In the present invention, it is described be cured as it is any polyphenylsulfone resin can be made to become solid method by flowable state,
The modes such as including cooling and shaping.
Preferably, the metal is aluminium alloy and/or stainless steel alloy.
Preferably, when the metal parts to be fixed is the metal parts of electronic product, by the polyphenylene sulphone resin
It is used in mixed way with polysulfones.
When metal parts to be fixed is the metal parts of electronic product, wanted since electronic product penetrates aspect to signal
Ask higher and higher, the dielectric constant and dielectric loss to material require its numerical value more lower better, and polysulfones is with excellent rigid
Meanwhile dielectric constant is relatively low, so being used after polyphenylene sulphone resin is mixed with polysulfones, you can meet and bond requirement, and can
To meet requirement of the electronic product to dielectric properties.
Second aspect, the present invention provides a kind of polysulfone composites for metal to be adhesively fixed, the composite materials
Include following component in parts by weight：
In the present invention, because composite material includes polysulfones resinoid-polyphenylene sulphone resin, so referred to as polysulfones is multiple
Condensation material.
In the present invention, the parts by weight of the polyphenylene sulphone resin are 25-80 parts by weight, such as 30 parts by weight, 35
Parts by weight, 40 parts by weight, 45 parts by weight, 50 parts by weight, 55 parts by weight, 60 parts by weight, 65 parts by weight, 70 parts by weight, 75 weight
Part etc..
In the present invention, the parts by weight of the polysulfones are 0-40 parts by weight, such as 5 parts by weight, 10 parts by weight, 15 weight
Part, 20 parts by weight, 25 parts by weight, 30 parts by weight, 35 parts by weight etc..
Preferably, the parts by weight of the polysulfones are 20-40 parts by weight.
Preferably, the polysulfones is bisphenol-a polysulfone.
In the present invention, the parts by weight of the glass fibre are 0-30 parts by weight, such as 5 parts by weight, 10 parts by weight, 12
Parts by weight, 15 parts by weight, 17 parts by weight, 20 parts by weight, 25 parts by weight etc..
Preferably, the parts by weight of the glass fibre are 1-30 parts by weight.
In the present invention, the parts by weight of the auxiliary agent be 0-2.5 parts by weight, such as 0.2 parts by weight, 0.5 parts by weight,
0.7 parts by weight, 1.0 parts by weight, 1.2 parts by weight, 1.5 parts by weight, 1.7 parts by weight, 2.0 parts by weight, 2.2 parts by weight etc..
Preferably, the auxiliary agent includes following component in parts by weight：
In the present invention, the antioxidant be 0-1 parts by weight, such as 0.1 parts by weight, 0.2 parts by weight, 0.3 parts by weight,
0.4 parts by weight, 0.5 parts by weight, 0.6 parts by weight, 0.7 parts by weight, 0.8 parts by weight, 0.9 parts by weight etc..
Preferably, the parts by weight of the antioxidant are 0.5-1 parts by weight.
In the present invention, the ultra-violet absorber is 0-0.5 parts by weight, such as 0.1 parts by weight, 0.2 parts by weight, 0.3
Parts by weight, 0.4 parts by weight, 0.5 parts by weight.
Preferably, the parts by weight of the ultra-violet absorber are 0.1-0.5 parts by weight.
In the present invention, the light stabilizer is 0-0.5 parts by weight, such as 0.1 parts by weight, 0.2 parts by weight, 0.3 weight
Part, 0.4 parts by weight, 0.5 parts by weight.
Preferably, the parts by weight of the light stabilizer are 0.1-0.5 parts by weight.
In the present invention, the lubricant be 0-0.5 parts by weight, such as 0.1 parts by weight, 0.2 parts by weight, 0.3 parts by weight,
0.4 parts by weight, 0.5 parts by weight.
Preferably, the parts by weight of the lubricant are 0.1-0.5 parts by weight.
Preferably, the antioxidant includes phenolic antioxidant and/or sulphur ester antioxidant, preferably antioxidant 1010, antioxygen
In agent PEPQ and antioxidant 412S any one or at least two combination, more preferable antioxidant 1010, antioxidant PEPQ and
Antioxidant 412S is with mass ratio 1:1:The composition of 1 composition.
Preferably, the ultra-violet absorber is Benzotriazole Ultraviolet Stabilizer, further preferred ultraviolet radiation absorption
Agent UV-234.
Preferably, the light stabilizer is hindered amine light stabilizer, preferably light stabilizer 770D.
Preferably, the lubricant is pentaerythritol stearate.
As optimal technical scheme, the composite material includes following component in parts by weight：
The composite material that optimal technical scheme provided by the invention obtains is high with metal adhesion strength, and with lower
Dielectric properties.
The third aspect, the preparation method for the composite material that the present invention provides a kind of as described in second aspect, the preparation
Method includes the following steps：
(1) by polyphenylene sulphone resin, polysulfones, antioxidant, ultra-violet absorber, light stabilizer and the lubricant of formula ratio
It is uniformly mixed；
(2) screw extruder is added from main spout in the mixture for obtaining step (1), and the glass fibre of formula ratio is from five
Screw extruder is added in the side spout in area, is melted, is squeezed out, and be granulated, obtains the composite material.
Preferably, being blended in homogenizer described in step (1) carries out.
Preferably, in step (1), first the antioxidant of formula ratio and lubricant are pre-mixed, and by formula ratio
Ultra-violet absorber and light stabilizer are pre-mixed, and are then uniformly mixed all components in homogenizer.
In the present invention, first antioxidant and lubricant can be pre-mixed, ultra-violet absorber and light stabilizer premixing,
Then by after premixing mixture and polyphenylene sulphone resin, polysulfones be added in high-speed mixer and mix again together.
Preferably, step (2) melting and extrusion carry out in screw extruder.
Preferably, the running parameter of the screw extruder is：Screw slenderness ratio is 40:1；One area is 265-275 DEG C of (example
Such as 266 DEG C, 268 DEG C, 270 DEG C, 272 DEG C, 274 DEG C), two area's temperature be 275-285 DEG C (such as 276 DEG C, 278 DEG C, 280 DEG C,
282 DEG C, 284 DEG C etc.), three area's temperature are 275-285 DEG C (such as 276 DEG C, 278 DEG C, 280 DEG C, 282 DEG C, 284 DEG C etc.), 4th area
Temperature be 275-285 DEG C (such as 276 DEG C, 278 DEG C, 280 DEG C, 282 DEG C, 284 DEG C etc.), five area's temperature be 275-285 DEG C (such as
276 DEG C, 278 DEG C, 280 DEG C, 282 DEG C, 284 DEG C etc.), six area's temperature be 275-285 DEG C (such as 276 DEG C, 278 DEG C, 280 DEG C,
282 DEG C, 284 DEG C etc.), seven area's temperature are 265-275 DEG C (such as 266 DEG C, 268 DEG C, 270 DEG C, 272 DEG C, 274 DEG C etc.), 8th area
Temperature be 265-275 DEG C (such as 266 DEG C, 268 DEG C, 270 DEG C, 272 DEG C, 274 DEG C etc.), nine area's temperature be 275-285 DEG C (such as
276 DEG C, 278 DEG C, 280 DEG C, 282 DEG C, 284 DEG C etc.), ten area's temperature be 275-285 DEG C (such as 276 DEG C, 278 DEG C, 280 DEG C,
282 DEG C, 284 DEG C etc.), 315-325 DEG C of head temperature (such as 316 DEG C, 318 DEG C, 320 DEG C, 322 DEG C, 324 DEG C etc.).
Fourth aspect, the present invention provides a kind of electronic product, at least one metal parts of the electronic product is fixed
Part includes polyphenylene sulphone resin.
Preferably, at least one metal parts fixing piece is the composite material described in second aspect.
Preferably, the preparation method of the backboard of the electronic product includes the following steps：
(1) metal parts is heated, is then placed within mould inside；
(2) it by injection mold after the composite material melting described in second aspect, then cools and solidifies, is tentatively produced
Product；
(3) preliminary product that step (2) obtains is processed, obtains the backboard of the electronic product.
Preferably, step (1) it is described be heated to be heated to 130-150 DEG C, such as 132 DEG C, 135 DEG C, 137 DEG C, 140 DEG C,
142 DEG C, 145 DEG C, 147 DEG C etc..
Preferably, step (3) working process is processed for CNC.
Compared with the existing technology, the invention has the advantages that：
(1) new application the present invention provides polyphenylene sulphone resin as metal bond materials, polyphenylene sulphone resin
Commonly used in fields such as food security or medical instruments, and present invention discover that its caking property with excellent metal, is used
In metal parts is adhesively fixed, adhesion strength is high, is not easy to peel off or be broken；
(2) the present invention provides a kind of composite materials for metal to be adhesively fixed comprising polyphenylene sulphone resin, because
This has caking property to metal；
(3) electronic product provided by the invention comprising polyphenylene sulphone resin, therefore bonded with excellent metal
Property, when composite material includes polysulfones, there is lower dielectric constant and preferably metal adhesion strength, therefore be prepared into
It is not easy to crack between metal and plastics while the electronic product arrived has preferable low-dielectric energy；
(4) backboard of electronic product provided by the invention can be combined by metal material with composite material provided by the invention
It uses, meets the diversified market demand.
Specific implementation mode
The technical solution further illustrated the present invention below by specific implementation mode.Those skilled in the art should be bright
, the embodiment, which is only to aid in, understands the present invention, should not be regarded as a specific limitation of the invention.
Embodiment 1
It is a kind of for the composite material of metal is adhesively fixed to include following component：
Wherein, polysulfones is bisphenol-a polysulfone；Antioxidant is antioxidant 1010, antioxidant PEPQ and antioxidant 412S with matter
Measure ratio 1:1:The composition of 1 composition；Ultra-violet absorber is UV-234；Light stabilizer is 770D；Lubricant is that pentaerythrite is hard
Resin acid ester.
Preparation method is as follows：
(1) antioxidant of formula ratio and lubricant are pre-mixed, the ultraviolet absorber of formula ratio and light stabilizer is premixed
It closes, then the mixture after premixing is added together with the polyphenylene sulphone resin and polysulfones of formula ratio in high-speed mixer and is mixed
It closes uniform；
(2) screw extruder, the glass fibre of formula ratio is added from main spout in step (1) finally obtained mixture
Screw extruder is added from the side spout in 5th area, melted, squeezed out, and be granulated, obtain composite material；Wherein, screw rod is long
Diameter ratio is 40:1；One area is 270 DEG C, and two area's temperature are 280 DEG C, and three area's temperature are 280 DEG C, and four area's temperature are 280 DEG C, five area's temperature
Degree be 280 DEG C, six area's temperature be 280 DEG C, seven area's temperature be 270 DEG C, eight area's temperature be 270 DEG C, nine area's temperature be 280 DEG C, ten
Area's temperature is 280 DEG C, 320 DEG C of head temperature.
Embodiment 2
A kind of composite material for metal to be adhesively fixed, including following component：
Wherein, polysulfones is bisphenol-a polysulfone；Antioxidant is antioxidant 1010；Ultra-violet absorber is UV-234；Light is stablized
Agent is 770D；Lubricant is pentaerythritol stearate.
Preparation method is as follows：
(1) antioxidant of formula ratio and lubricant are pre-mixed, the ultraviolet absorber of formula ratio and light stabilizer is premixed
It closes, then the mixture after premixing is added together with the polyphenylene sulphone resin and polysulfones of formula ratio in high-speed mixer and is mixed
It closes uniform；
(2) screw extruder, the glass fibre of formula ratio is added from main spout in step (1) finally obtained mixture
Screw extruder is added from the side spout in 5th area, melted, squeezed out, and be granulated, obtain composite material；Wherein, screw rod is long
Diameter ratio is 40:1；One area is 270 DEG C, and two area's temperature are 280 DEG C, and three area's temperature are 280 DEG C, and four area's temperature are 280 DEG C, five area's temperature
Degree be 280 DEG C, six area's temperature be 280 DEG C, seven area's temperature be 270 DEG C, eight area's temperature be 270 DEG C, nine area's temperature be 280 DEG C, ten
Area's temperature is 280 DEG C, 320 DEG C of head temperature.
Embodiment 3
A kind of composite material for metal to be adhesively fixed, including following component：
Wherein, polysulfones is bisphenol-a polysulfone；Antioxidant is antioxidant 1010；Ultra-violet absorber is UV-234；Light is stablized
Agent is 770D；Lubricant is pentaerythritol stearate.
Preparation method is as follows：
(1) antioxidant of formula ratio and lubricant are pre-mixed, the ultraviolet absorber of formula ratio and light stabilizer is premixed
It closes, then the mixture after premixing is added together with the polyphenylene sulphone resin and polysulfones of formula ratio in high-speed mixer and is mixed
It closes uniform；
(2) screw extruder, the glass fibre of formula ratio is added from main spout in step (1) finally obtained mixture
Screw extruder is added from the side spout in 5th area, melted, squeezed out, and be granulated, obtain composite material；Wherein, screw rod is long
Diameter ratio is 40:1；One area is 270 DEG C, and two area's temperature are 280 DEG C, and three area's temperature are 280 DEG C, and four area's temperature are 280 DEG C, five area's temperature
Degree be 280 DEG C, six area's temperature be 280 DEG C, seven area's temperature be 270 DEG C, eight area's temperature be 270 DEG C, nine area's temperature be 280 DEG C, ten
Area's temperature is 280 DEG C, 320 DEG C of head temperature.
Embodiment 4
A kind of composite material for metal to be adhesively fixed, including following component：
Wherein, polysulfones is bisphenol-a polysulfone；Antioxidant is antioxidant 1010；Ultra-violet absorber is UV-326；Light is stablized
Agent is GW-480；Lubricant is pentaerythritol stearate.
Preparation method is as follows：
(1) polyphenylene sulphone resin, polysulfones, antioxidant, ultraviolet absorber, light stabilizer and the lubricant of formula ratio are added
Enter in high-speed mixer and is uniformly mixed；
(2) screw extruder, the glass fibre of formula ratio is added from main spout in step (1) finally obtained mixture
Screw extruder is added from the side spout in 5th area, melted, squeezed out, and be granulated, obtain composite material；Wherein, screw rod is long
Diameter ratio is 40:1；One area is 265 DEG C, and two area's temperature are 275 DEG C, and three area's temperature are 275 DEG C, and four area's temperature are 275 DEG C, five area's temperature
Degree be 275 DEG C, six area's temperature be 275 DEG C, seven area's temperature be 265 DEG C, eight area's temperature be 265 DEG C, nine area's temperature be 275 DEG C, ten
Area's temperature is 275 DEG C, 315 DEG C of head temperature.
Embodiment 5
A kind of composite material for metal to be adhesively fixed, including following component：
Wherein, auxiliary agent is antioxidant 412S.
Preparation method is as follows：
(1) the polyphenylene sulphone resin of formula ratio, polysulfones and auxiliary agent are added in high-speed mixer and are uniformly mixed；
(2) screw extruder, the glass fibre of formula ratio is added from main spout in step (1) finally obtained mixture
Screw extruder is added from the side spout in 5th area, melted, squeezed out, and be granulated, obtain composite material；Wherein, screw rod is long
Diameter ratio is 40:1；One area is 275 DEG C, and two area's temperature are 285 DEG C, and three area's temperature are 285 DEG C, and four area's temperature are 285 DEG C, five area's temperature
Degree be 285 DEG C, six area's temperature be 285 DEG C, seven area's temperature be 275 DEG C, eight area's temperature be 275 DEG C, nine area's temperature be 285 DEG C, ten
Area's temperature is 285 DEG C, 325 DEG C of head temperature.
Embodiment 6
With differing only in for embodiment 1, the present embodiment only includes following component：
60 parts by weight of polyphenylene sulphone resin；
20 parts by weight of polysulfones；
20 parts by weight of glass fibre.
Embodiment 7
With differing only in for embodiment 1, the present embodiment only includes following component：
60 parts by weight of polyphenylene sulphone resin；
40 parts by weight of polysulfones.
Embodiment 8
With differing only in for embodiment 1, the present embodiment only includes following component：
50 parts by weight of polyphenylene sulphone resin.
Performance test：
The embodiment 1-8 composite materials provided are tested for the property, test method is as follows：
(1) proportion：It is tested by ASTM D792/ (GB/T1033) standard；
(2) notch impact strength：It is tested by ASTM D256/ (GB/T1843) standard；
(3) flame retardant property：It is tested by UL-94/ (GB/T2408) standard；
(4) dielectric constant, dielectric loss：By IEC60250, tested under the conditions of 2GHz；
(5) linear expansion coefficient：It is tested by ASTMD-696 (GB/T2572) standard；
(6) metal adhesion strength：It is tested by GB/T13936 standards, wherein metal is 5 line aluminium alloys；
(7) mechanical property：It is tested by ASTM D638/ (GB/T1040) standard.
Test result is shown in Table 1：
Table 1
By testing and testing discovery, (adhesion strength exists composite material provided by the invention with metal adhesion strength height
208kg/mm2More than), and there is lower dielectric constant (3.7 or less) and lower dielectric loss (6.6 × e-3With
Under), and there is preferable flame retardant property (V0) and lower coefficient of thermal expansion；By embodiment 1-4 it is found that when in poly- sub- benzene
When the polysulfones of right, glass fibre and additive being added in base sulphone resin, obtained composite material dielectric constant
3.4 hereinafter, dielectric loss is in 5.5 × e-3Hereinafter, with the adhesion strength of metal material in 216kg/mm2More than, it can meet
The requirement of electronic product metal parts is adhesively fixed；By embodiment 7 and embodiment 8 it is found that working as polyphenylene sulphone resin and polysulfones
When mixing, the dielectric constant of obtained material is substantially reduced, and 3.3 are down to by 3.7, can be used for being adhesively fixed electronic product metal portion
Part.
To embodiment 8 provide polyphenylene sulphone resin according to its bonding to different metal of GB/T13936 standard testings
Intensity (kg/mm2), test result is shown in Table 2：
Table 2
By data it is found that polyphenylene sulphone resin has higher adhesion strength to aluminium alloy and stainless steel alloy,
189kg/mm2More than, can be used for that metal parts is adhesively fixed.
Applicant state, the present invention by above-described embodiment come illustrate the present invention be adhesively fixed metal parts method and
Polysulfone composites, preparation method and application for metal to be adhesively fixed, but the invention is not limited in above-described embodiments, i.e.,
Do not mean that the present invention has to rely on above-described embodiment and could implement.Person of ordinary skill in the field is it will be clearly understood that this
Any improvement of invention, the addition of equivalence replacement and auxiliary element to each raw material of product of the present invention, the selection etc. of concrete mode,
It all falls within protection scope of the present invention and the open scope.
Claims (10)
1. a kind of method that metal parts is adhesively fixed, which is characterized in that use the resin-bonded fixation of polyphenylsulfone.
2. according to the method described in claim 1, it is characterized in that, the method includes：By polyphenylsulfone resin melting, so
It contacts and cures with metal parts to be fixed afterwards, realize being adhesively fixed for metal parts；
Preferably, the metal is aluminium alloy and/or stainless steel alloy.
3. according to the method described in claim 2, it is characterized in that, the metal parts to be fixed is the metal portion of electronic product
When part, the polyphenylene sulphone resin is used in mixed way with polysulfones.
4. a kind of polysulfone composites for metal to be adhesively fixed, which is characterized in that the composite material wraps in parts by weight
Include following component：
5. composite material according to claim 4, which is characterized in that the polysulfones is bisphenol-a polysulfone；
Preferably, the parts by weight of the polysulfones are 20-40 parts by weight；
Preferably, the parts by weight of the glass fibre are 1-30 parts by weight；
Preferably, the auxiliary agent includes following component in parts by weight：
Preferably, the parts by weight of the antioxidant are 0.5-1 parts by weight；
Preferably, the parts by weight of the ultra-violet absorber are 0.1-0.5 parts by weight；
Preferably, the parts by weight of the light stabilizer are 0.1-0.5 parts by weight；
Preferably, the parts by weight of the lubricant are 0.1-0.5 parts by weight；
Preferably, the antioxidant includes phenolic antioxidant and/or sulphur ester antioxidant, preferably antioxidant 1010, antioxidant
In PEPQ and antioxidant 412S any one or at least two combination, more preferable antioxidant 1010, antioxidant PEPQ and anti-
Oxygen agent 412S is with mass ratio 1:1:The composition of 1 composition；
Preferably, the ultra-violet absorber is Benzotriazole Ultraviolet Stabilizer, further preferred ultra-violet absorber UV-
234；
Preferably, the light stabilizer is hindered amine light stabilizer, preferably light stabilizer 770D；
Preferably, the lubricant is pentaerythritol stearate.
6. composite material according to claim 4 or 5, which is characterized in that the composite material includes such as in parts by weight
Lower component：
7. the preparation method of the composite material according to any one of claim 4-6, which is characterized in that the preparation side
Method includes the following steps：
(1) by polyphenylene sulphone resin, polysulfones, antioxidant, ultra-violet absorber, light stabilizer and the mix lubricant of formula ratio
Uniformly；
(2) screw extruder is added from main spout in the mixture for obtaining step (1), and the glass fibre of formula ratio is from 5th area
Screw extruder is added in side spout, is melted, is squeezed out, and be granulated, obtains the composite material.
8. preparation method according to claim 7, which is characterized in that being blended in homogenizer described in step (1)
It carries out；
Preferably, in step (1), first the antioxidant of formula ratio and lubricant are pre-mixed, and by the ultraviolet of formula ratio
Light absorbers and light stabilizer are pre-mixed, and are then uniformly mixed all components in homogenizer.
9. preparation method according to claim 7 or 8, which is characterized in that step (2) melting and extrusion are squeezed in screw rod
Go out in machine and carries out；
Preferably, the running parameter of the screw extruder is：Screw slenderness ratio is 40:1；One area is 265-275 DEG C, two area's temperature
Degree be 275-285 DEG C, three area's temperature be 275-285 DEG C, four area's temperature be 275-285 DEG C, five area's temperature be 275-285 DEG C, six
Area's temperature is 275-285 DEG C, and seven area's temperature are 265-275 DEG C, and eight area's temperature are 265-275 DEG C, and nine area's temperature are 275-285
DEG C, ten area's temperature are 275-285 DEG C, 315-325 DEG C of head temperature.
10. a kind of electronic product, which is characterized in that at least one metal parts fixing piece of the electronic product includes poly- sub- benzene
Base sulphone resin；
Preferably, at least one metal parts fixing piece is the composite material described in any one of claim 4-6；
Preferably, the preparation method of the backboard of the electronic product includes the following steps：
(1) metal parts is heated, is then placed within mould inside；
(2) it by injection mold after the composite material melting described in any one of claim 4-6, then cools and solidifies, obtains
To preliminary product；
(3) preliminary product that step (2) obtains is processed, obtains the backboard of the electronic product；
Preferably, it is heated to be described in step (1) and is heated to 130-150 DEG C；
Preferably, step (3) working process is processed for CNC.
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| CN111500250A (en) * | 2020-05-11 | 2020-08-07 | 四川川环科技股份有限公司 | Preparation method of heat-resistant adhesive |
| CN111518511A (en) * | 2020-05-11 | 2020-08-11 | 四川川环科技股份有限公司 | Heat-resistant adhesive and aluminum alloy bonding method |
| WO2021227377A1 (en) * | 2020-05-11 | 2021-11-18 | 四川川环科技股份有限公司 | Heat resistant adhesive, preparation method therefor, and bonding method for aluminum alloy |
| CN114196206A (en) * | 2021-12-29 | 2022-03-18 | 苏州建发塑料制品有限公司 | PPSU high-temperature-resistant squirrel cage and preparation method thereof |
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| CN111518511A (en) * | 2020-05-11 | 2020-08-11 | 四川川环科技股份有限公司 | Heat-resistant adhesive and aluminum alloy bonding method |
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| CN111518511B (en) * | 2020-05-11 | 2021-09-28 | 四川川环科技股份有限公司 | Heat-resistant adhesive and aluminum alloy bonding method |
| WO2021227377A1 (en) * | 2020-05-11 | 2021-11-18 | 四川川环科技股份有限公司 | Heat resistant adhesive, preparation method therefor, and bonding method for aluminum alloy |
| CN114196206A (en) * | 2021-12-29 | 2022-03-18 | 苏州建发塑料制品有限公司 | PPSU high-temperature-resistant squirrel cage and preparation method thereof |
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