CN108673355A - A kind of resin ground disk - Google Patents
A kind of resin ground disk Download PDFInfo
- Publication number
- CN108673355A CN108673355A CN201810494061.6A CN201810494061A CN108673355A CN 108673355 A CN108673355 A CN 108673355A CN 201810494061 A CN201810494061 A CN 201810494061A CN 108673355 A CN108673355 A CN 108673355A
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- parts
- resin
- abrasive material
- phenol
- resin ground
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/285—Reaction products obtained from aldehydes or ketones
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a kind of resin ground disks, including base layer and abrasive material, the base layer and abrasive material are bonded by binder, and the abrasive material raw material includes 25 35 parts of diamond, 10 15 parts of CBN, 15 35 parts of alumina hollow ball, 9 28 parts of phenol-formaldehyde resin modified, 57 parts of graphite, 24 parts of polytetrafluoroethylene powder, 0.5 3 parts of walnut shell powder, 13 parts of stearic acid, 0.5 1.5 parts of dibutyl phthalate by weight.Self-sharpening of the present invention and heat-resist, grinding efficiency height, and Grain Falling Off probability can be reduced, so that abrasive material is obtained good surface quality.
Description
Technical field
The present invention relates to grinding and polishing technical field more particularly to a kind of resin ground disks.
Background technology
The advantages that sapphire is high with hardness, translucency is good and chemical stabilization is widely used in semiconductor lighting, intelligence wearing
The fields such as device window and precision instrument element.At the same time, the requirement of Surface-micromachining process is also higher and higher.On the one hand,
Sapphire application field is required to it with good surface quality and precision；On the other hand, sapphire has higher hard
Degree, brittleness and chemical stability, belong to difficult-to-machine material.
Currently, single crystal sapphire sheet processing difficulties are mainly grinding and are polishing two procedures.Wherein, process of lapping is not still
Put forward high-precision key, or obtain good whole disk flatness and wafer surface quality, reduce polishing process pressure it is important because
Element, therefore the hot spot for falling over each other to study as field Nei Ge colleges and universities scholar and enterprise technology personnel.
Commonly grinding scheme is typically to carry trip with the load plate (such as copper dish, tin disk, iron pan) of certain matrix at this stage
Single or double grinding is carried out to chip on polyurethane abrasive pad from abrasive material (such as diamond, silicon carbide or boron carbide), but
This scheme tends not to take into account grinding efficiency and surface quality, or is only used for specific products because of high cost.In order in indigo plant
Preferable material removing rate and surface quality are obtained in gem grinding process, researcher attempts to use consolidated diamond abrasive
Sapphire wafer.
Currently, the technique of consolidated diamond abrasive sapphire wafer is not mature enough, main cause is bonded abrasive tool
Poor heat resistance and the diamond abrasive grain to fall off easily cause chip scuffing when grinding, therefore, it is resistance to how to improve consolidated diamond grinding tool
It is hot, and Grain Falling Off probability is reduced, it is important research direction.
Invention content
Based on background technology there are the problem of, the present invention proposes a kind of resin ground disk, self-sharpening and heat-resist,
Grinding efficiency is high, and can reduce Grain Falling Off probability, and abrasive material is made to obtain good surface quality.
The present invention proposes a kind of resin ground disk, including base layer and abrasive material, and the abrasive material raw material is by weight
Including 25-35 parts of diamond, 10-15 parts of CBN, 15-35 parts of alumina hollow ball, 9-28 parts of phenol-formaldehyde resin modified, graphite 5-7
Part, 2-4 parts of polytetrafluoroethylene powder, 0.5-3 parts of walnut shell powder, 1-3 parts of stearic acid, 0.5-1.5 parts of dibutyl phthalate.
Preferably, the base layer and abrasive material are bonded by binder.
Preferably, the grain size of the diamond and CBN are all 10-300um.
Preferably, the grain size of the alumina hollow ball is 100-200um.
Preferably, the phenol-formaldehyde resin modified is prepared by following technique：
S1, phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid are mixed, stirs 40-60min, be warming up to 98-105 DEG C, heat preservation is anti-
Answer 2.5-3.5h；185-195 DEG C is then heated to, insulation reaction 2-4h obtains cured product a；
S2, by Nano-meter SiO_22It is scattered in absolute ethyl alcohol, addition Silane coupling agent KH550, supersonic oscillations 70-90min,
Then cured product a and NaOH is added, is warming up to 60-70 DEG C, insulation reaction 40-60min；90-100 DEG C is then heated to, is protected
Temperature reaction 2-4h, is evaporated in vacuo out ethyl alcohol, obtains phenol-formaldehyde resin modified.
Preferably, in S1, the mass ratio of phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid is 50-70:2-4:3-4.
Preferably, in S2, Nano-meter SiO_22Grain size between 1-100nm.
Preferably, in S2, Nano-meter SiO_22, cured product a, NaOH and silane coupling agent KH55 mass ratio be 1-5:80-
100:1-6：0.5-2.
The present invention fills alumina hollow ball using diamond and CBN as abrasive material, causes the densification degree of concretion abrasive
It reduces, is also greatly lowered abrasive disk flexural strength, meanwhile, alumina hollow ball can be evenly distributed on phenol-formaldehyde resin modified
In, good appearance bits, chip removal ability are provided for abrasive disk grinding, a small amount of graphite is added in cooperation, is ensureing that it is strong that abrasive disk combines
It maximizes the abrasive disk porosity while spending, further to provide good appearance bits, chip removal ability for abrasive disk grinding, improves
The surface quality of material removing rate and abrasive material；The present invention is with phosphoric acid and Nano-meter SiO_22Double-modification phenolic resin, will as bonding agent
Abrasive grain is held in grinding tool securely, and can be bonded on matrix securely, has not only made abrasive material be not easy to fall off too early, but also prevent from tying
Mixture is detached with matrix, and can be improved the bond strength of abrasive disk and thermal stability and be ensured production safety；This is because nanometer
SiO2Particle size is small, large specific surface area, and surface energy is high, serious coordination deficiency in surface etc., it is made easily to be risen with the oxygen in resin
Bonding action improves intermolecular bonding force；After phosphoric acid modification, bond energy higher P-O-C and P is introduced in phenolic resin molecule
=O keys make phenolic resin form the higher heterocycle structure of thermal stability and improve the armaticity of resin, reduce resin and exist
Decomposition amount under high temperature, to make its heat resistance and mechanical property be improved, while Nano-meter SiO_22Small-size effect and macro
See quantum tunneling effect make its generate become silted up the effect of oozing, can be deep near the unsaturated bond of resin, and with the electricity of unsaturated bond
Sub- cloud is had an effect, and then so that the macromolecular of resin is combined with each other as solid netted, to increase substantially the intensity of resin
And thermal stability, and then the bond strength for improving abrasive disk reduces Grain Falling Off probability and enhances thermal stability and ensures production peace
Entirely.
Specific implementation mode
In the following, technical scheme of the present invention is described in detail by specific embodiment.
Embodiment 1
A kind of resin ground disk, including base layer and abrasive material, the base layer and abrasive material are bonded by binder, institute
It includes 25 parts of diamond, 15 parts of CBN, 15 parts of alumina hollow ball, phenol-formaldehyde resin modified 28 to state abrasive material raw material by weight
Part, 5 parts of graphite, 4 parts of polytetrafluoroethylene powder, 0.5 part of walnut shell powder, 3 parts of stearic acid, 0.5 part of dibutyl phthalate；
The preparation of phenol-formaldehyde resin modified：
S1, phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid are mixed, stirs 40min, is warming up to 105 DEG C, insulation reaction
2.5h；195 DEG C are then heated to, insulation reaction 2h obtains cured product a；The phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid
Mass ratio is 70:2:4；
S2, by Nano-meter SiO_22It is scattered in absolute ethyl alcohol, addition Silane coupling agent KH550, supersonic oscillations 70min, so
Cured product a and NaOH are added afterwards, is warming up to 70 DEG C, insulation reaction 40min；100 DEG C, insulation reaction 2h are then heated to, very
Sky distills out ethyl alcohol, obtains phenol-formaldehyde resin modified；The Nano-meter SiO_22Grain size between 1-100nm；The Nano-meter SiO_22, it is solid
The mass ratio for changing product a, NaOH and silane coupling agent KH55 is 1:100:1：2.
Embodiment 2
A kind of resin ground disk, including base layer and abrasive material, the base layer and abrasive material are bonded by binder, institute
State abrasive material raw material by weight include 35 parts of diamond, 10 parts of CBN, 35 parts of alumina hollow ball, 9 parts of phenol-formaldehyde resin modified,
7 parts of graphite, 2 parts of polytetrafluoroethylene powder, 3 parts of walnut shell powder, 1 part of stearic acid, 1.5 parts of dibutyl phthalate；
The preparation of phenol-formaldehyde resin modified：
S1, phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid are mixed, stirs 60min, is warming up to 98 DEG C, insulation reaction 3.5h；
185 DEG C are then heated to, insulation reaction 4h obtains cured product a；The quality of the phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid
Than being 50:4:3；
S2, by Nano-meter SiO_22It is scattered in absolute ethyl alcohol, addition Silane coupling agent KH550, supersonic oscillations 90min, so
Cured product a and NaOH are added afterwards, is warming up to 60 DEG C, insulation reaction 60min；90 DEG C, insulation reaction 4h are then heated to, vacuum
Ethyl alcohol is distilled out, phenol-formaldehyde resin modified is obtained；The Nano-meter SiO_22Grain size between 1-100nm；The Nano-meter SiO_22, solidification
The mass ratio of product a, NaOH and silane coupling agent KH55 are 5:80:6：0.5.
Embodiment 3
A kind of resin ground disk, including base layer and abrasive material, the base layer and abrasive material are bonded by binder, institute
It includes 28 parts of diamond, 13 parts of CBN, 17 parts of alumina hollow ball, phenol-formaldehyde resin modified 25 to state abrasive material raw material by weight
Part, 5 parts of graphite, 4 parts of polytetrafluoroethylene powder, 1 part of walnut shell powder, 1.2 parts of stearic acid, 0.7 part of dibutyl phthalate；
The preparation of phenol-formaldehyde resin modified：
S1, phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid are mixed, stirs 45min, is warming up to 100 DEG C, insulation reaction
2.7h；187 DEG C are then heated to, insulation reaction 2.3h obtains cured product a；The phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid
Mass ratio be 55:2:3；
S2, by Nano-meter SiO_22It is scattered in absolute ethyl alcohol, addition Silane coupling agent KH550, supersonic oscillations 75min, so
Cured product a and NaOH are added afterwards, is warming up to 61 DEG C, insulation reaction 43min；93 DEG C, insulation reaction 2h are then heated to, vacuum
Ethyl alcohol is distilled out, phenol-formaldehyde resin modified is obtained；The Nano-meter SiO_22Grain size between 1-100nm；The Nano-meter SiO_22, solidification
The mass ratio of product a, NaOH and silane coupling agent KH55 are 12:84：2：0.8.
Embodiment 4
A kind of resin ground disk, including base layer and abrasive material, the base layer and abrasive material are bonded by binder, institute
It includes 33 parts of diamond, 11 parts of CBN, 30 parts of alumina hollow ball, phenol-formaldehyde resin modified 10 to state abrasive material raw material by weight
Part, 7 parts of graphite, 2 parts of polytetrafluoroethylene powder, 2 parts of walnut shell powder, 2.2 parts of stearic acid, 1.2 parts of dibutyl phthalate；
The preparation of phenol-formaldehyde resin modified：
S1, phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid are mixed, stirs 54min, is warming up to 102 DEG C, insulation reaction
3.2h；192 DEG C are then heated to, insulation reaction 3h obtains cured product a；The phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid
Mass ratio is 64:3:4；
S2, by Nano-meter SiO_22It is scattered in absolute ethyl alcohol, addition Silane coupling agent KH550, supersonic oscillations 86min, so
Cured product a and NaOH are added afterwards, is warming up to 68 DEG C, insulation reaction 56min；97 DEG C, insulation reaction 3h are then heated to, vacuum
Ethyl alcohol is distilled out, phenol-formaldehyde resin modified is obtained；The Nano-meter SiO_22Grain size between 1-100nm；The Nano-meter SiO_22, solidification
The mass ratio of product a, NaOH and silane coupling agent KH55 are 3:90:4：1.4.
Embodiment 5
A kind of resin ground disk, including base layer and abrasive material, the abrasive material raw material include diamond 25- by weight
35 parts, 10-15 parts of CBN, 15-35 parts of alumina hollow ball, 9-28 parts of phenol-formaldehyde resin modified, 5-7 parts of graphite, polytetrafluoroethylene (PTFE)
2-4 parts of powder, 0.5-3 parts of walnut shell powder, 1-3 parts of stearic acid, 0.5-1.5 parts of dibutyl phthalate.
Experimental example 1
As a result the heat resistance for detecting resin ground disk prepared by embodiment 1-5 shows that resin prepared by embodiment 1-5 is ground
The heat decomposition temperature of mill is more than 400 DEG C, Good Heat-resistance.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (8)
1. a kind of resin ground disk, including base layer and abrasive material, which is characterized in that the abrasive material raw material includes by weight
25-35 parts of diamond, 15-35 parts of alumina hollow ball, 9-28 parts of phenol-formaldehyde resin modified, 5-7 parts of graphite, gathers 10-15 parts of CBN
2-4 parts of tetrafluoroethene powder, 0.5-3 parts of walnut shell powder, 1-3 parts of stearic acid, 0.5-1.5 parts of dibutyl phthalate.
2. resin ground disk according to claim 1, which is characterized in that the base layer and abrasive material are viscous by binder
It connects.
3. resin ground disk according to claim 1 or 2, which is characterized in that the grain size of the diamond and CBN is
10-300um。
4. according to claim 1-3 any one of them resin ground disks, which is characterized in that the grain size of the alumina hollow ball
For 100-200um.
5. according to claim 1-4 any one of them resin ground disks, which is characterized in that the phenol-formaldehyde resin modified is by as follows
It is prepared by technique：
S1, phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid are mixed, stirs 40-60min, is warming up to 98-105 DEG C, insulation reaction
2.5-3.5h；185-195 DEG C is then heated to, insulation reaction 2-4h obtains cured product a；
S2, by Nano-meter SiO_22It is scattered in absolute ethyl alcohol, addition Silane coupling agent KH550, supersonic oscillations 70-90min, then
Cured product a and NaOH is added, is warming up to 60-70 DEG C, insulation reaction 40-60min；90-100 DEG C is then heated to, heat preservation is anti-
2-4h is answered, ethyl alcohol is evaporated in vacuo out, obtains phenol-formaldehyde resin modified.
6. resin ground disk according to claim 5, which is characterized in that in S1, phenolic resin, p-methyl benzenesulfonic acid and phosphoric acid
Mass ratio be 50-70:2-4:3-4.
7. resin ground disk according to claim 5, which is characterized in that in S2, Nano-meter SiO_22Grain size 1-100nm it
Between.
8. resin ground disk according to claim 5, which is characterized in that in S2, Nano-meter SiO_22, cured product a, NaOH and
The mass ratio of silane coupling agent KH55 is 1-5:80-100:1-6：0.5-2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810494061.6A CN108673355A (en) | 2018-05-22 | 2018-05-22 | A kind of resin ground disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810494061.6A CN108673355A (en) | 2018-05-22 | 2018-05-22 | A kind of resin ground disk |
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| Publication Number | Publication Date |
|---|---|
| CN108673355A true CN108673355A (en) | 2018-10-19 |
Family
ID=63807308
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810494061.6A Pending CN108673355A (en) | 2018-05-22 | 2018-05-22 | A kind of resin ground disk |
Country Status (1)
| Country | Link |
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| CN (1) | CN108673355A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110744465A (en) * | 2019-10-17 | 2020-02-04 | 江苏吉星新材料有限公司 | Preparation method of sapphire grinding disc |
| CN111592276A (en) * | 2020-05-12 | 2020-08-28 | 苏州兮然工业设备有限公司 | Wear-resisting antibiotic abrasive disc |
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| CN104308755A (en) * | 2014-10-21 | 2015-01-28 | 苏州赛力精密工具有限公司 | Resin CBN (cubic boron nitride) grinding wheel for machining saw blade base body |
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| CN111592276A (en) * | 2020-05-12 | 2020-08-28 | 苏州兮然工业设备有限公司 | Wear-resisting antibiotic abrasive disc |
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