CN108666866A - A kind of device and its working method convenient for semiconductor laser optical fiber plated film and shaping - Google Patents
A kind of device and its working method convenient for semiconductor laser optical fiber plated film and shaping Download PDFInfo
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- CN108666866A CN108666866A CN201710197708.4A CN201710197708A CN108666866A CN 108666866 A CN108666866 A CN 108666866A CN 201710197708 A CN201710197708 A CN 201710197708A CN 108666866 A CN108666866 A CN 108666866A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/146—External cavity lasers using a fiber as external cavity
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention relates to a kind of devices convenient for semiconductor laser optical fiber plated film and shaping, which is characterized in that including：Fiber fixed frame, for fixing optical fiber；And isolation board, positioned at fiber fixed frame in the following, and detachably being connect with fiber fixed frame；Isolation board includes two side connecting plates and several isolating bars being mutually parallel for being fixed between two side connecting plates, and isolating bar is substantially mutually perpendicular to relationship with fixed optical fiber on fiber fixed frame, for supporting optical fiber in shaping.Optical fiber is arranged on fiber fixed frame to the plated film for completing optical fiber, after the completion of plated film, connection isolation board is combined into fiber fixed frame lower part, is used for the shaping of laser beam, avoids the secondary transferring of optical fiber, easy to operate, production efficiency is high.
Description
Technical field
The present invention relates to a kind of device and its working method convenient for semiconductor laser optical fiber plated film and shaping, belong to half
The technical field of conductor laser.
Background technology
Semiconductor laser is excellent due to small, light-weight, high conversion efficiency, the long, energy directly internal modulation of service life etc.
Point is widely used in fields such as medical treatment, display, pumping, industrial processes, as optical-fibre communications, laser ranging, Target indication,
Laser guidance, laser radar, space optical communication etc..
The combination of optical fiber and semiconductor laser more makes semiconductor laser obtain wider application, such as is communicating
How field, make the transmission of more stable, the longer distance of the light energy output of laser, how to make partly to lead in light-pumped solid state laser
The Output optical power of body laser can be more effectively transferred on laser gain medium, to obtain higher pumping efficiency, this
A little coupled problems for being directed to semiconductor laser and optical fiber.The characteristics of due to semiconductor laser itself, the light sent out
Beam is Gaussian beam, the facular model that output beam fast axis divergence angle is much larger than slow axis divergence is formd, if being not added with shaping
It is directly coupled, efficiency is about 29%.So in order to make light that semiconductor laser sends out more effectively coupled into optical fibres,
Must the fast axis direction of noise spectra of semiconductor lasers compressed.Shaping cylindrical mirror is the important method of fast axle compression, but due to shaping
Cylindrical mirror size is larger, limits the use space of semiconductor laser, and shaping cylindrical mirror cost is higher, for dosage in the market compared with
For big middle power semiconductor laser, economic benefit is not considerable.And it is fast to use shaping optical fiber noise spectra of semiconductor lasers to carry out
Axis compression is current most easy, most economical mode.In order to reduce light loss to the greatest extent, need to carry out optics plating to shaping optical fiber
Anti-reflection film is deposited on the side of optical fiber in film.
Chinese patent literature CN103014649A discloses a kind of optical fiber coating process, by using the silicon material of low cost
Fixed plate realizes the clamping to optical fiber, and is protected to the region for not needing plated film on optical fiber with tinfoil paper or aluminium foil, to
Realize the plated film to optical fiber in common coating machine.But since the optical fiber duct in the silicon material fixed plate of use cannot be accomplished very
It is small, plated film can only be carried out to exposed optical fiber, cause the waste to optical fiber, moreover, using tinfoil paper or aluminium foil on optical fiber not
It needs the region of plated film to be protected, since tinfoil paper or aluminium foil cannot be bonded with optical fiber well, can cause near protection zone
Plated film non-uniform phenomenon.
Chinese patent literature CN102082393A discloses a kind of method for shaping optical fiber with double film-plated cambered surfaces of semiconductor laser,
The optical fiber both ends for removing coat are bonded on I-shaped rollover stand, then carry out optical coating, needed after the completion of plated film by
The optical fiber both ends severing being fixed on I-shaped rollover stand is removed, and then the optical fiber for having plated film is fixed on adjusting bracket again and is used for
The shaping of semiconductor laser.Since directly by the I-shaped rollover stand of fiber matrix to coating machine, on the one hand operation is not square
Just, the shaping that semiconductor laser could be used for optical fiber progress secondary transferring is on the other hand needed, while wasting time also
Optical fiber can be caused to waste, moreover, optical fiber is in flexuosity on I-shaped rollover stand, and optical fiber linear state when shaping,
Having plated the optical fiber of film becomes linear state from flexuosity and can cause the uneven of optics membrane stress, and part film is caused to fall off, from
And influence the power of the semiconductor laser after shaping.
Chinese patent literature CN106319472A discloses a kind of optical fiber arc surface coating clamp and application method, belongs to half
Conductor laser technical field.The present invention includes rotating mechanism and fiber securing mechanism, and rotating mechanism includes power plate, fixed tooth
Disk and multiple rotating gears, power plate are located at the top of fixed gear plate, and power plate is overlapped with the center line of fixed gear plate, power plate
Upper end and coating machine rotary part connection can be rotated under the action of rotary part, plated film is fixed in the lower end of fixed gear plate
Room, multiple rotating gears engage between power plate and fixed gear plate, and with fixed gear plate, and rotating gear is rotatably installed in it
On central shaft, one end and the power plate of central shaft are fixed, and the other end fixes fiber securing mechanism.But optical fiber quilt in the fixture
Groove and optical fiber briquetting are fixed, and stress is larger and easily there are the non-uniform situation of optic fibre force, can influence coating quality.Moreover,
Optical fiber after the fixture plated film need to be taken off again, fixed to being used further to shaping on other fixtures, secondary transferring waste time and
It can pollute or damage optical fiber.
Chinese patent literature CN203021647U discloses a kind of coating clamp of fixed optical fiber.Including three parts, respectively
It is master, part block and press strip.It is directly loadable into part block and is screwed after optical fiber is cleaned, first-class all optical fiber
Part block is put into master, is fixed with press strip.Finally optical fiber cable is put in order and is sticked to the master back side using high temperature gummed tape and is allowed to
Fixation does not knot, and is packed into coating machine.But if shaping, also need optical fiber secondary transfer after plated film carrying out shaping,
It is complicated for operation, also make shaping effect bad.And the fixture, when being used for optical fiber plated film, optical fiber is in flexuosity, by curved when shaping
Curved state becomes linear state, can cause the uneven of optics membrane stress, part film is caused to fall off, to influence half after shaping
The power of conductor laser.
In the prior art, only facilitate the self-contained unit of optical fiber plated film, when shaping needs, by secondary transferring, shadow in this way
Ring production efficiency.
Invention content
In view of the deficiencies of the prior art, the present invention provides a kind of dress convenient for semiconductor laser optical fiber plated film and shaping
It sets；
The present invention also provides a kind of working methods of above-mentioned semiconductor laser optical fiber plated film and apparatus for shaping.
Term is explained：
Shaping, i.e. beam shaping improve the utilization rate of light to improve focusing performance, and semiconductor laser is needed to send out
The light beam penetrated is focused into certain shape, such as rectangle, rectangular etc..
The technical scheme is that：
A kind of device convenient for semiconductor laser optical fiber plated film and shaping, including：
Fiber fixed frame, for fixing optical fiber；With
Isolation board, positioned at the fiber fixed frame in the following, and detachably being connect with the fiber fixed frame；
The isolation board includes two side connecting plates and several isolation being mutually parallel for being fixed between two side connecting plates
Item, the isolating bar is substantially mutually perpendicular to relationship with fixed optical fiber on the fiber fixed frame, for being supported in shaping
Optical fiber.
According to currently preferred, the fiber fixed frame is a hollow frame.The advantage designed herein is, works as optical fiber
It is arranged when on fiber fixed frame, increases the exposed area of optical fiber, increase utilization rate, saves fiber optic materials.Further
Preferably, the fiber fixed frame is a hollow rectangular frame.
According to currently preferred, the material of the fiber fixed frame and the isolation board is that hardness is less than 187HB
Stainless steel.Fiber fixed frame and isolation board is avoided to be deformed in coating machine high temperature.
According to currently preferred, the frame of the fiber fixed frame is equipped with two-sided High temperature-resistanadhesive adhesive tape, and the optical fiber is logical
The two-sided High temperature-resistanadhesive adhesive tape is crossed to be fixed on the fiber fixed frame.Two-sided High temperature-resistanadhesive adhesive tape fixes optical fiber and can guarantee that optical fiber exists
Suffered stress is smaller and easy to operate while fixed.
It is further preferred that the fiber fixed frame is hollow rectangular frame, it is stained on two long side frame surfaces
Two-sided High temperature-resistanadhesive adhesive tape, the both ends of the optical fiber are sticked to two-sided on two long side frame surfaces of the fiber fixed frame respectively
On high-temperature plastic band, in this manner, several optical fiber are uniformly arranged on the fiber fixed frame.Fiber fixed frame selects square
Shape frame, optical fiber are uniformly sticked on fiber fixed frame, and rectangular frame can guarantee optical fiber linear state and can be according to required optical fiber
Length and quantity adjustment rectangular frame length and width.
According to currently preferred, the distance between adjacent two described optical fiber is 2-10mm.It can on fiber fixed frame
Setting optical fiber as much as possible is, it can be achieved that the batch plated film of optical fiber and shaping.
According to currently preferred, the both sides frame of the fiber fixed frame corresponding with two side connecting plate of the isolation board
Lower surface is equipped with groove, and two side connecting plate of the isolation board is blocked by the groove.
According to currently preferred, several described isolating bars are uniformly arranged between two side connecting plate of the isolation board,
The upper surface of the isolating bar is stained with the two-sided High temperature-resistanadhesive adhesive tape, and the optical fiber is pasted onto the institute of the upper surface of the isolating bar
It states on two-sided high-temperature plastic band.
According to currently preferred, the width of the upper surface of the isolating bar is 1-3mm.The advantage designed herein is,
Fiber loss is reduced as far as possible.It is further preferred that the width of the upper surface of the isolating bar is 1mm.
According to currently preferred, the distance between two neighboring isolating bar is more than shaping size.To be convenient to optical fiber
Cutting.
According to currently preferred, optical fiber is arranged on fiber fixed frame to the plated film for completing optical fiber, it, will after the completion of plated film
Fiber fixed frame lower part combination connection isolation board, is used for the shaping of laser beam.The secondary transferring of optical fiber is avoided, optical fiber
Secondary transferring can not only influence production efficiency, can also optical fiber be polluted or be damaged.Isolating bar removes and is used to support light when shaping
Shaping efficiency can be improved without retightening optical fiber after being finished one section of optical fiber in fibre.Apparatus of the present invention are easy to operate, production effect
Rate is high.
The method for carrying out semiconductor laser optical fiber plated film and shaping using above-mentioned apparatus, specific steps include：
(1) optical fiber is cut into the short fiber of same size with the fiber fixed frame by the coat for removing optical fiber surface；
(2) optical fiber cut short is cleaned；
(3) it is stained with two-sided High temperature-resistanadhesive adhesive tape on the opposite both sides of fiber fixed frame upper surface；
(4) optical fiber after cleaning step (2) equably adheres to the opposite both sides of fiber fixed frame upper surface successively
On two-sided high-temperature plastic band；
(5) will be glued by step (4) optical fiber fiber fixed frame be fixed to automatic turning holder function coating machine in into
Row plated film；
(6) fiber fixed frame for having plated film is taken out, two-sided High temperature-resistanadhesive adhesive tape is stained in the upper surface of isolating bar, it will with screw
Fiber fixed frame is fixed together with isolation board, forms a reshaping frame；
(7) it will be fixed on five times regualting frame by reshaping frame made of step (6), semiconductor laser is fixed to five dimensions and adjusts
It saves immediately below frame, optical fiber is parallel with the light-emitting surface of semiconductor laser；
(8) it connects with the mains for semiconductor laser, light is observed when adjusting the relative position of optical fiber and semiconductor laser
Shape of spot, until hot spot becomes required shape；
(9) optical fiber is fixed to semiconductor laser thermal sediment both ends with uv-curable glue, with cutter by heat sink both ends
Optical fiber is cut away, and completes the shaping of a semiconductor laser.
(10) next semiconductor laser is installed, carries out shaping until all optical fiber on reshaping frame are finished.
It is referred to above to coating machine, five times regualting frame, semiconductor laser, semiconductor laser thermal sediment etc. be existing
There is technology.It is clearly to limit by the prior art in above method.
Beneficial effects of the present invention are：
1, the present invention completes the plated film of optical fiber by the way of fiber fixed frame, and fiber fixed frame can be placed directly after plated film
It is used for the shaping of laser on adjusting bracket, avoids the secondary transferring of optical fiber, easy to operate, production efficiency is high.
2, the device of the present invention convenient for semiconductor laser optical fiber plated film and shaping, number of fibers can be according to production need
It adheres on fiber fixed frame, it is suitable for mass production.
3, the device of the present invention convenient for semiconductor laser optical fiber plated film and shaping, isolation board be equipped with it is tiny every
From item, that is, the shaping efficiency of laser is improved, the loss of optical fiber is in turn avoided.
Description of the drawings
Fig. 1 be described in embodiment 1 convenient in the device of semiconductor laser optical fiber plated film and shaping fiber fixed frame and
The structural schematic diagram of isolation board；
Fig. 2 is described in embodiment 1 convenient for the structural schematic diagram of semiconductor laser optical fiber plated film and the device of shaping；
Fig. 3 is that the light of semiconductor laser passes through the schematic diagram in the optical fiber center of circle；
1, optical fiber；2, fiber fixed frame；3, two-sided High temperature-resistanadhesive adhesive tape；4, groove；5, connecting plate；6, isolating bar；7, screw
Hole；8, screw；9, semiconductor laser chip.
Specific implementation mode
With reference to embodiment and Figure of description, the present invention will be further described；But not limited to this.
Embodiment 1
A kind of device convenient for semiconductor laser optical fiber plated film and shaping, as shown in Figure 1, including：
Fiber fixed frame 2, for fixing optical fiber 1；With
Isolation board, positioned at fiber fixed frame 2 in the following, and detachably being connect with fiber fixed frame 2；
Isolation board includes two side connecting plates 5 and several isolating bars 6 being mutually parallel for being fixed between two side connecting plates 5,
Isolating bar 6 is substantially mutually perpendicular to relationship with fixed optical fiber 1 on fiber fixed frame 2, for supporting optical fiber 1 in shaping.
The material of fiber fixed frame 2 and isolation board is the stainless steel that hardness is less than 187HB.Avoid fiber fixed frame 2 and
Isolation board is deformed in coating machine high temperature.
Fiber fixed frame 2 is hollow rectangular frame, and two-sided High temperature-resistanadhesive adhesive tape 3 is stained on two long side frame surfaces,
The both ends of optical fiber 1 are sticked to respectively in the two-sided High temperature-resistanadhesive adhesive tape 3 on two long side frame surfaces of fiber fixed frame 2, according to this
Mode, several optical fiber 1 are uniformly arranged on fiber fixed frame 2.Fiber fixed frame 2 selects rectangular frame, optical fiber 1 to be uniformly sticked to
On fiber fixed frame 2, rectangular frame can guarantee 1 linear state of optical fiber and can be adjusted according to the length and quantity of required optical fiber 1
The length and width of rectangular frame.
The distance between adjacent two optical fiber 1 is 2-10mm.On fiber fixed frame 2 can setting optical fiber 1 as much as possible,
Batch plated film and the shaping of optical fiber 1 can be achieved.
The both sides frame lower surface of fiber fixed frame corresponding with two side connecting plates 5 of isolation board 2 is equipped with groove 4, passes through
Groove 4 blocks two side connecting plates 5 of isolation board.
Several isolating bars 6 are uniformly arranged between two side connecting plates 5 of isolation board, and the upper surface of isolating bar 6 is stained with double
Face High temperature-resistanadhesive adhesive tape 3, optical fiber 1 are pasted onto in the two-sided High temperature-resistanadhesive adhesive tape 3 of the upper surface of isolating bar 6.
The width of the upper surface of isolating bar 6 is 1mm.The advantage designed herein is, reduces optical fiber 1 as far as possible and loses.
The distance between two neighboring isolating bar 6 is more than shaping size.To be convenient to the cutting of optical fiber 1.
Optical fiber 1 is arranged on fiber fixed frame 2 to the plated film for completing optical fiber 1, it, will be under fiber fixed frame 2 after the completion of plated film
Portion's combination connection isolation board 5, is used for the shaping of laser beam.Avoid the secondary transferring of optical fiber 1, the secondary transferring of optical fiber 1
Production efficiency can be not only influenced, optical fiber 1 can also be polluted or be damaged.Isolating bar 6 is except optical fiber 1 is used to support when shaping, no
With optical fiber 1 is retightened after being finished one section of optical fiber 1, shaping efficiency can be improved.Apparatus of the present invention are easy to operate, production efficiency
It is high.1 utilization rate of optical fiber improves 95% or more, and easy to operate, production efficiency improves 1 times or more.
Embodiment 2
The method for carrying out semiconductor laser optical fiber plated film and shaping using 1 described device of embodiment, specific steps include：
(1) optical fiber 1 is cut into the short light of same size with the fiber fixed frame 2 by the coat for removing 1 surface of optical fiber
It is fine；
(2) optical fiber 1 cut short is placed in glass container, with acetone soak ultrasonic cleaning half an hour；
(3) it is stained with two-sided High temperature-resistanadhesive adhesive tape 3 on the opposite both sides of 2 upper surface of fiber fixed frame；
(4) optical fiber 1 after cleaning step (2) equably adheres to the opposite both sides of 2 upper surface of fiber fixed frame successively
Two-sided High temperature-resistanadhesive adhesive tape 3 on, optical fiber 1 is parallel with 2 width direction of fiber fixed frame；
(5) fiber fixed frame 2 that optical fiber 1 will be glued by step (4) is fixed to the coating machine (type with automatic turning holder function
Number be EVA800) in carry out plated film；The anti-reflection film vapor deposition on about 1 two surface of optical fiber is respectively completed in coating machine；
(6) fiber fixed frame 2 for having plated film is taken out, two-sided high-temperature plastic is stained in the upper surface of the isolating bar 6 of isolation board
Fiber fixed frame 2 with the optical fiber 1 for having plated film is fixed together by band 3 with screw 8 with isolation board, two-sided on isolating bar 6
The upper surface of High temperature-resistanadhesive adhesive tape 3 just adheres to optical fiber 1, and fiber fixed frame 2 forms a reshaping frame with isolation board；
(7) it will be fixed on five times regualting frame by reshaping frame made of step (6), semiconductor laser is fixed to five dimensions and adjusts
It saves immediately below frame, optical fiber 1 is parallel with the light-emitting surface of semiconductor laser；
(8) it connects with the mains for semiconductor laser, light is observed when adjusting the relative position of optical fiber 1 and semiconductor laser
Shape of spot, until hot spot becomes required shape, as shown in Figure 3；
(9) optical fiber 1 is fixed to semiconductor laser thermal sediment both ends with uv-curable glue, with ultra violet lamp ultra-violet curing
Glue 10s is cut away the optical fiber 1 at heat sink both ends with cutter after uv-curable glue fixation, one semiconductor laser of completion
Shaping；
(10) next semiconductor laser is installed, reshaping frame is translated by adjusting bracket, make on reshaping frame it is next every
It is located near semiconductor laser light-emitting surface from the optical fiber 1 between item 6, semiconductor laser is completed according to step (8) and step (9)
The shaping of device, and so on, up to the optical fiber 1 between all isolating bars 6 on reshaping frame is finished.
Claims (10)
1. a kind of device convenient for semiconductor laser optical fiber plated film and shaping, which is characterized in that including：
Fiber fixed frame, for fixing optical fiber；With
Isolation board, positioned at the fiber fixed frame in the following, and detachably being connect with the fiber fixed frame；
The isolation board includes two side connecting plates and several isolating bars being mutually parallel for being fixed between two side connecting plates, institute
It states isolating bar and is substantially mutually perpendicular to relationship with fixed optical fiber on the fiber fixed frame, for supporting optical fiber in shaping.
2. a kind of device convenient for semiconductor laser optical fiber plated film and shaping according to claim 1, which is characterized in that
The fiber fixed frame is a hollow frame；
It is further preferred that the fiber fixed frame is a hollow rectangular frame.
3. a kind of device convenient for semiconductor laser optical fiber plated film and shaping according to claim 1, which is characterized in that
The material of the fiber fixed frame and the isolation board is the stainless steel that hardness is less than 187HB.
4. a kind of device convenient for semiconductor laser optical fiber plated film and shaping according to claim 2, which is characterized in that
The frame of the fiber fixed frame is equipped with two-sided High temperature-resistanadhesive adhesive tape, and the optical fiber is fixed on by the two-sided High temperature-resistanadhesive adhesive tape
On the fiber fixed frame；
It is further preferred that being stained with two-sided High temperature-resistanadhesive adhesive tape on two long side frame surfaces, the both ends of the optical fiber are glued respectively
On two-sided high-temperature plastic band on two long side frame surfaces of the fiber fixed frame, in this manner, several optical fiber
It is uniformly arranged on the fiber fixed frame.
5. a kind of device convenient for semiconductor laser optical fiber plated film and shaping according to claim 4, which is characterized in that
The distance between adjacent two described optical fiber is 2-10mm.
6. a kind of device convenient for semiconductor laser optical fiber plated film and shaping according to claim 1, which is characterized in that
The both sides frame lower surface of the fiber fixed frame corresponding with two side connecting plates of the isolation board is equipped with groove, by described
Groove blocks two side connecting plates of the isolation board.
7. a kind of device convenient for semiconductor laser optical fiber plated film and shaping according to claim 1, which is characterized in that
Several described isolating bars are uniformly arranged between two side connecting plates of the isolation board, and the upper surface of the isolating bar is stained with institute
Two-sided High temperature-resistanadhesive adhesive tape is stated, the optical fiber is pasted onto on the two-sided high-temperature plastic band of the upper surface of the isolating bar.
8. a kind of device convenient for semiconductor laser optical fiber plated film and shaping according to claim 1, which is characterized in that
The width of the upper surface of the isolating bar is 1-3mm, and the distance between two neighboring isolating bar is more than shaping size；
It is further preferred that the width of the upper surface of the isolating bar is 1mm.
9. a kind of device convenient for semiconductor laser optical fiber plated film and shaping according to claim 1, which is characterized in that
Optical fiber is arranged on fiber fixed frame to the plated film for completing optical fiber, after the completion of plated film, by the combination connection of fiber fixed frame lower part every
From plate, it to be used for the shaping of laser beam.
10. the working method convenient for semiconductor laser optical fiber plated film and the device of shaping described in claim 1-9, feature
It is, specific steps include：
(1) optical fiber is cut into the short fiber of same size with the fiber fixed frame by the coat for removing optical fiber surface；
(2) optical fiber cut short is cleaned；
(3) it is stained with two-sided High temperature-resistanadhesive adhesive tape on the opposite both sides of fiber fixed frame upper surface；
(4) optical fiber after cleaning step (2) equably adheres to the two-sided of the opposite both sides of fiber fixed frame upper surface successively
On high-temperature plastic band；
(5) fiber fixed frame for gluing optical fiber by step (4) is fixed in the coating machine with automatic turning holder function and is plated
Film；
(6) it takes out and has plated the fiber fixed frame of film, two-sided High temperature-resistanadhesive adhesive tape is stained in the upper surface of isolating bar, with screw by optical fiber
Fixed frame is fixed together with isolation board, forms a reshaping frame；
(7) it will be fixed on five times regualting frame by reshaping frame made of step (6), semiconductor laser is fixed to five times regualting frame
Underface, optical fiber are parallel with the light-emitting surface of semiconductor laser；
(8) it connects with the mains for semiconductor laser, hot spot shape is observed when adjusting the relative position of optical fiber and semiconductor laser
Shape, until hot spot becomes required shape；
(9) optical fiber is fixed to semiconductor laser thermal sediment both ends with uv-curable glue, with cutter by the optical fiber at heat sink both ends
It cuts away, completes the shaping of a semiconductor laser；
(10) next semiconductor laser is installed, carries out shaping until all optical fiber on reshaping frame are finished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710197708.4A CN108666866B (en) | 2017-03-29 | 2017-03-29 | Device convenient for coating and shaping semiconductor laser optical fiber and working method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710197708.4A CN108666866B (en) | 2017-03-29 | 2017-03-29 | Device convenient for coating and shaping semiconductor laser optical fiber and working method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108666866A true CN108666866A (en) | 2018-10-16 |
| CN108666866B CN108666866B (en) | 2020-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710197708.4A Active CN108666866B (en) | 2017-03-29 | 2017-03-29 | Device convenient for coating and shaping semiconductor laser optical fiber and working method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3676320A (en) * | 1969-03-17 | 1972-07-11 | Disa Elektronik As | Method for depositing thin films on thin elongated electrically insulating substrates |
| US6219484B1 (en) * | 1997-08-27 | 2001-04-17 | Samsung Electronics Co., Ltd. | Metal coated optical fiber array module |
| CN102082393A (en) * | 2010-11-22 | 2011-06-01 | 山东华光光电子有限公司 | Method for shaping optical fiber with double film-plated cambered surfaces of semiconductor laser |
| CN103014649A (en) * | 2012-12-21 | 2013-04-03 | 中国电子科技集团公司第四十四研究所 | Optical fiber coating technology |
| CN203021647U (en) * | 2012-12-21 | 2013-06-26 | 中国科学院大连化学物理研究所 | Film-plating fixture for fixing optical fibers |
| CN203429243U (en) * | 2013-08-06 | 2014-02-12 | 美德瑞光电科技（上海）有限公司 | Coated clamp for fixing head of optical fiber |
| CN105154828A (en) * | 2015-09-22 | 2015-12-16 | 河南省鑫宇光实业有限公司 | Optical vacuum coating process |
-
2017
- 2017-03-29 CN CN201710197708.4A patent/CN108666866B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3676320A (en) * | 1969-03-17 | 1972-07-11 | Disa Elektronik As | Method for depositing thin films on thin elongated electrically insulating substrates |
| US6219484B1 (en) * | 1997-08-27 | 2001-04-17 | Samsung Electronics Co., Ltd. | Metal coated optical fiber array module |
| CN102082393A (en) * | 2010-11-22 | 2011-06-01 | 山东华光光电子有限公司 | Method for shaping optical fiber with double film-plated cambered surfaces of semiconductor laser |
| CN103014649A (en) * | 2012-12-21 | 2013-04-03 | 中国电子科技集团公司第四十四研究所 | Optical fiber coating technology |
| CN203021647U (en) * | 2012-12-21 | 2013-06-26 | 中国科学院大连化学物理研究所 | Film-plating fixture for fixing optical fibers |
| CN203429243U (en) * | 2013-08-06 | 2014-02-12 | 美德瑞光电科技（上海）有限公司 | Coated clamp for fixing head of optical fiber |
| CN105154828A (en) * | 2015-09-22 | 2015-12-16 | 河南省鑫宇光实业有限公司 | Optical vacuum coating process |
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| Publication number | Publication date |
|---|---|
| CN108666866B (en) | 2020-01-10 |
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