CN102082393A - Method for shaping optical fiber with double film-plated cambered surfaces of semiconductor laser - Google Patents
Method for shaping optical fiber with double film-plated cambered surfaces of semiconductor laser Download PDFInfo
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- CN102082393A CN102082393A CN 201010551806 CN201010551806A CN102082393A CN 102082393 A CN102082393 A CN 102082393A CN 201010551806 CN201010551806 CN 201010551806 CN 201010551806 A CN201010551806 A CN 201010551806A CN 102082393 A CN102082393 A CN 102082393A
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Abstract
The invention provides a method for shaping an optical fiber with double film-plated cambered surfaces of a semiconductor laser, comprising the following steps of: (1) removing a coating layer on the surface of the optical fiber; (2) bonding two ends of the optical fiber on an I-shaped roll-over stand; (3) plating a film layer with two cambered surfaces; (4) cutting the optical fiber; (5) fixing the optical fiber in a clamping groove of a 180-degree precision adjusting frame; (6) fixing the laser on a five-dimensional adjusting frame; (7) observing light spots to determine an optimum opposite position of the laser and the optical fiber, and observing reading of a power meter to guarantee that light beams pass through two anti-reflection film layers; and (8) fixing the optical fiber on a laser heat sink, and cutting the optical fiber. In the method, the light beams of the semiconductor laser are guaranteed to pass through the two cambered surfaces with optical fiber film plating, meanwhile, the needed compression strength is obtained, the loss in the compression process is reduced, and the condition of two peaks or multiple peaks of wavelength spectrum lines due to an external cavity is eliminated.
Description
Technical field
The present invention relates to the method for high power laser diode beam shaping, belong to the technology of laser diode beam shaping field.
Background technology
The sixties, along with the appearance of laser, laser technology is widely used in every field.Wherein semiconductor laser has that volume is little, in light weight, efficient is high, the life-span is long, is easy to modulation and advantage such as cheap, obtained using widely in industry, medical science and military field, as materials processing, optical-fibre communications, laser ranging, target indication, laser guidance, laser radar, space optical communication etc.
Because semiconductor laser itself has formed the facular model of the fast axle of the output beam angle of divergence much larger than the slow axis angle of divergence, needs to do fast axial compression and contract in application process.Shaping post mirror is the important method that fast axial compression is contracted, and this post mirror is thrown the flat string plane that forms being parallel to have on the direction of optical transmission, so that distinguish two faces of post mirror plated film.Adopt optical fiber to replace the post mirror also can reach the purpose that fast axial compression is contracted, and optical fiber has very large advantage on price, the fast axial compression that is well suited for being used for less demanding semiconductor laser is contracted.But the optical fiber side plated film is a very big problem, and whole side plated film needs optical fiber constantly rotation in evaporate process, and the uniformity of plated film is difficult to guarantee; Be coated with the sidewall that two light pass through, form two cambered surface plated films, the evaporation ratio is easier to, but needs to guarantee that light beam is just by two plated film faces in the shaping process.
Summary of the invention
The present invention is directed to existing semiconductor laser optical fiber and can't find problem such as plated film position what fast axle compressed that shaping technique exists, the two cambered surface coated optical fibre shaping methods of a kind of semiconductor laser are proposed, this method can make light beam pass through two two cambered surfaces of optical fiber plated film just, thereby eliminate exocoel resonance, avoid because the laser wave spectrum that causes of fiber reflection is bimodal or the formation of multimodal, effectively reduce the spectrum width after the shaping.
The two cambered surface coated optical fibre shaping methods of semiconductor laser of the present invention may further comprise the steps:
(1) coat with the silica fiber surface removes, and soaks ultrasonic waves for cleaning half an hour with acetone, thoroughly removes coat and other dirt on silica fiber surface;
(2) optical fiber around bent and be adhesively fixed on rollover stand with automatic translation frame function coating machine;
(3) rollover stand that will be stained with optical fiber is fixed in the coating machine, carries out the two sides at optical fiber on the helicoid that forms behind the song and is coated with the anti-reflection film system of required wavelength, forms two cambered surface plated films;
(4) take off optical fiber, cut out the part (this part plated film is blocked) that the end is used to be bonded in the I shape rollover stand, be cut into the fiber segment that length is 1cm-3cm;
(5) end of one section optical fiber is fixed on the angular adjustment frame that the amplitude of accommodation that has the optical fiber draw-in groove is 180 degree, guarantees that optical fiber is vertical with the end face of angular adjustment frame, and this adjusting bracket is fixed on the optical table;
(6) semiconductor laser is fixed on the optical table five times regualting frame, adjusts the relative position of five times regualting frame and angular adjustment frame, guarantee that optical fiber can reach the laser tube core position, connect constant-current source, open laser;
(7) with the power before the power meter probe observation semiconductor laser shaping, regulate the relative position of laser and optical fiber then, form needed hot spot, the adjusting angle adjusting bracket makes the power meter registration reach maximum; And find the desired compression degree;
(8) bonding fiber is fixed on the semiconductor laser thermal sediment, cuts off optical fiber, finish the shaping process.
The present invention by coating machine to the two cambered surface plated films of optical fiber, two cambered surfaces of semiconductor laser beam have been guaranteed through the optical fiber plated film, obtain the desired compression degree simultaneously, reduced the loss in the compression process, eliminated because the bimodal or multimodal situation of the wavelength spectral line that exocoel causes, improved and adopted the technical merit of cheap optical fiber, solved pumping Nd:YAG because the spectrum width that exocoel causes is widened problem as the compression lens.
Description of drawings
Fig. 1 is with the schematic diagram of bonding fiber to the I shape rollover stand.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the schematic diagram that optical fiber is installed to the angular adjustment frame.
Fig. 4 is the schematic diagram of the beam center chief ray of semiconductor laser by the optical fiber center of circle.
Among the figure: 1, optical fiber, 2, the I shape rollover stand, 3, high temperature resistant single face glue, 4, high temperature resistant double faced adhesive tape, 5, the angular adjustment frame, 6, the optical fiber draw-in groove, 7, coatings, 8, chief ray.
Embodiment
Describe the concrete steps of the two cambered surface coated optical fibre shaping methods of semiconductor laser of the present invention in detail below in conjunction with accompanying drawing.
(1) coat with the silica fiber surface removes, and soaks ultrasonic waves for cleaning half an hour with acetone, thoroughly removes coat and other dirt on silica fiber surface.
(2) take off the I shape rollover stand 2 that has automatic translation frame function coating machine, optical fiber 1 is become as shown in Figure 1 spirality around song, be fixed on the I shape rollover stand 2 with high temperature resistant double faced adhesive tape 4, concrete fixing means as shown in Figure 2, high temperature resistant double faced adhesive tape 4 one sides are with bonding around bent optical fiber 1, and one side is bonding with I shape rollover stand 2.Further fixing by high temperature resistant single face glue 3.
(3) will be set by step (2) I shape rollover stand 2 that is stained with optical fiber 1 of handling well be fixed in the coating machine, on the helicoid that forms around bent optical fiber 1, carry out the two sides and be coated with the anti-reflection film system of required wavelength, form two cambered surface plated films.
(4) take off optical fiber 1 behind the plated film, cut out the part (this part plated film is blocked) that is fixed in I shape rollover stand 2 by high temperature resistant double faced adhesive tape 4, being cut into length is that 1cm is to 3cm fiber segment.
(5) as shown in Figure 3, one end of one section optical fiber that step (4) is handled well is fixed on the angular adjustment framves 5 that the amplitude of accommodation that has optical fiber draw-in groove 6 is 180 degree, need to guarantee that optical fiber is vertical with the end face of angular adjustment frame 5, and this angular adjustment frame 5 is fixed on the optical table.
(6) semiconductor laser is fixed on the five times regualting frame of optical table, adjusts the relative position of five times regualting frame and angular adjustment frame 5, guarantee that optical fiber can reach the laser tube core position, connect constant-current source, open semiconductor laser;
(7) with the power before the power meter probe observation semiconductor laser shaping, regulate the relative position of semiconductor laser and optical fiber then, form needed hot spot, adjusting angle adjusting bracket 5, and observe the power meter registration, maximizing, this moment semiconductor laser beam center chief ray 8 center of circle by optical fiber 1, penetrate by coatings 7, pass through anti-reflection film twice, and find the desired compression degree, as shown in Figure 4.
(8) use ultra-violet curing glue, point solidifies ultraviolet glue with ultraviolet curing lamp between optical fiber and semiconductor laser thermal sediment, optical fiber is fixed on the laser thermal sediment, cuts off optical fiber, promptly finishes whole shaping process.
Claims (1)
1. the two cambered surface coated optical fibre shaping methods of semiconductor laser is characterized in that, may further comprise the steps:
(1) coat with the silica fiber surface removes, and soaks ultrasonic waves for cleaning half an hour with acetone, thoroughly removes coat and other dirt on silica fiber surface;
(2) optical fiber around bent and be adhesively fixed on rollover stand with automatic translation frame function coating machine;
(3) rollover stand that will be stained with optical fiber is fixed in the coating machine, carries out the two sides at optical fiber on the helicoid that forms behind the song and is coated with the anti-reflection film system of required wavelength, forms two cambered surface plated films;
(4) take off optical fiber, cut out the part that the end is used to be bonded in the I shape rollover stand, be cut into the fiber segment that length is 1cm-3cm;
(5) end of one section optical fiber is fixed on the angular adjustment frame that the amplitude of accommodation that has the optical fiber draw-in groove is 180 degree, guarantees that optical fiber is vertical with the end face of angular adjustment frame, and this adjusting bracket is fixed on the optical table;
(6) semiconductor laser is fixed on the optical table five times regualting frame, adjusts the relative position of five times regualting frame and angular adjustment frame, guarantee that optical fiber can reach the laser tube core position, connect constant-current source, open laser;
(7) with the power before the power meter probe observation semiconductor laser shaping, regulate the relative position of laser and optical fiber then, form needed hot spot, the adjusting angle adjusting bracket makes the power meter registration reach maximum, and finds the desired compression degree;
(8) bonding fiber is fixed on the semiconductor laser thermal sediment, cuts off optical fiber, finish the shaping process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201010551806A CN102082393B (en) | 2010-11-22 | 2010-11-22 | Method for shaping optical fiber with double film-plated cambered surfaces of semiconductor laser |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010551806A CN102082393B (en) | 2010-11-22 | 2010-11-22 | Method for shaping optical fiber with double film-plated cambered surfaces of semiconductor laser |
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| CN102082393A true CN102082393A (en) | 2011-06-01 |
| CN102082393B CN102082393B (en) | 2011-12-28 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108666866A (en) * | 2017-03-29 | 2018-10-16 | 山东华光光电子股份有限公司 | A kind of device and its working method convenient for semiconductor laser optical fiber plated film and shaping |
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| US5825803A (en) * | 1995-12-14 | 1998-10-20 | Institut National D'optique | Multiple emitter laser diode assembly with graded-index fiber microlens |
| US5946140A (en) * | 1998-03-06 | 1999-08-31 | Lucent Technologies Inc. | Fiber lens for use with a confocal lens system |
| CN1544971A (en) * | 2003-11-19 | 2004-11-10 | 清华大学 | Linear light beam reshaper |
| CN201017150Y (en) * | 2006-11-21 | 2008-02-06 | 北京工业大学 | Coupling device for realizing high power laser diode pile light beam combination |
| US20080192803A1 (en) * | 2006-10-24 | 2008-08-14 | Nabeel Agha Riza | Extreme Temperature Optical Sensor Designs And Signal Processing |
| US20080219619A1 (en) * | 2007-03-08 | 2008-09-11 | Xuehua Wu | Fiber lens assembly for optical device |
| CN101662125A (en) * | 2008-08-27 | 2010-03-03 | 中国科学院半导体研究所 | Method for carrying out beam fast axis compression of array device |
| CN101825749A (en) * | 2010-05-17 | 2010-09-08 | 西安炬光科技有限公司 | Semiconductor laser mini bar-based optical fiber coupling module |
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2010
- 2010-11-22 CN CN201010551806A patent/CN102082393B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5825803A (en) * | 1995-12-14 | 1998-10-20 | Institut National D'optique | Multiple emitter laser diode assembly with graded-index fiber microlens |
| US5946140A (en) * | 1998-03-06 | 1999-08-31 | Lucent Technologies Inc. | Fiber lens for use with a confocal lens system |
| CN1544971A (en) * | 2003-11-19 | 2004-11-10 | 清华大学 | Linear light beam reshaper |
| US20080192803A1 (en) * | 2006-10-24 | 2008-08-14 | Nabeel Agha Riza | Extreme Temperature Optical Sensor Designs And Signal Processing |
| CN201017150Y (en) * | 2006-11-21 | 2008-02-06 | 北京工业大学 | Coupling device for realizing high power laser diode pile light beam combination |
| US20080219619A1 (en) * | 2007-03-08 | 2008-09-11 | Xuehua Wu | Fiber lens assembly for optical device |
| CN101662125A (en) * | 2008-08-27 | 2010-03-03 | 中国科学院半导体研究所 | Method for carrying out beam fast axis compression of array device |
| CN101825749A (en) * | 2010-05-17 | 2010-09-08 | 西安炬光科技有限公司 | Semiconductor laser mini bar-based optical fiber coupling module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108666866A (en) * | 2017-03-29 | 2018-10-16 | 山东华光光电子股份有限公司 | A kind of device and its working method convenient for semiconductor laser optical fiber plated film and shaping |
| CN108666866B (en) * | 2017-03-29 | 2020-01-10 | 山东华光光电子股份有限公司 | Device convenient for coating and shaping semiconductor laser optical fiber and working method thereof |
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| CN102082393B (en) | 2011-12-28 |
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Address after: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee after: SHANDONG HUAGUANG OPTOELECTRONICS CO., LTD. Address before: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Patentee before: Shandong Huaguang Photoelectronic Co., Ltd. |
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