CN108666735A - Portable electronic devices and its back-cover component - Google Patents
Portable electronic devices and its back-cover component Download PDFInfo
- Publication number
- CN108666735A CN108666735A CN201710198084.8A CN201710198084A CN108666735A CN 108666735 A CN108666735 A CN 108666735A CN 201710198084 A CN201710198084 A CN 201710198084A CN 108666735 A CN108666735 A CN 108666735A
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- CN
- China
- Prior art keywords
- metal substrate
- base plate
- coil
- loop construction
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 161
- 239000002184 metal Substances 0.000 claims abstract description 140
- 229910052751 metal Inorganic materials 0.000 claims abstract description 140
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 111
- 238000010276 construction Methods 0.000 claims abstract description 97
- 230000008878 coupling Effects 0.000 claims abstract description 19
- 238000010168 coupling process Methods 0.000 claims abstract description 19
- 238000005859 coupling reaction Methods 0.000 claims abstract description 19
- 238000009413 insulation Methods 0.000 claims description 32
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 241000416536 Euproctis pseudoconspersa Species 0.000 claims 2
- 230000005611 electricity Effects 0.000 claims 1
- 150000002843 nonmetals Chemical class 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
- Support Of Aerials (AREA)
- Near-Field Transmission Systems (AREA)
Abstract
The present invention discloses a kind of portable electronic devices and its back-cover component.Back-cover component includes a board structure and a loop construction.Board structure includes a metal substrate and one first non-metal base plate being connected with each other with metal substrate.First non-metal base plate cooperates with metal substrate, to form a back-cover structure at the back side for being assembled in portable electronic devices.Loop construction has first part's coil and is connected to a second part coil of first part's coil.First part's coil is located in the range of the upper area of metal substrate.Second part coil is located in the range of the upper area of the first non-metal base plate.The percentage of first part's coil the line is busy coil structures is more than second part coil the line is busy the percentage of coil structures.Whereby, generated antenna magnetic field can be directly through the first non-metal base plate without coupling or matching with metal substrate generation after loop construction cooperates with an IC chip.
Description
Technical field
The present invention relates to a kind of electronic device and its back-cover components, more particularly to a kind of portable electronic devices and its back of the body
Cap assemblies.
Background technology
The day of the existing near-field communication (Near Field Communication, NFC) applied to intelligent running gear
Line equipment, such as radio frequency identification (Radio frequency identification, RFID) antenna are applied to intelligence
Integrated circuit (IC) and matching component are typically positioned close on the inside of running gear by the configuration mode of type running gear
Under conditions of on circuit board (PCB), RFID antenna is pasted in the back-cover inner edge of running gear, and is electrically connected at using shrapnel
The circuit board and RFID antenna of running gear.
However, the requirement for the size of portable electronic devices now more becomes frivolous, in order to make up caused by slimming
Intensity it is insufficient, and in order to pursue integrated molding with it is beautiful, more and more running gears are using metal shell or another plating
Upper metal is to form the appearance of metallization.Since near-field communication is the principle using electromagnetic induction, the thus metal of shell
Just generate shield effectiveness to being pasted on antenna on the inside of back-cover originally, the magnetic field of antenna shielded by metal back cover and can not be effective
Eradiation, in turn resulting in can not carry out wireless communication with other electronic devices.
Invention content
Technical problem to be solved by the present invention lies in provide a kind of portable electronic devices in view of the deficiencies of the prior art
And its back-cover component.
In order to solve the above technical problems, a wherein technical solution of the present invention is to provide a kind of back cover assembly
Part comprising：One board structure, an insulation system and a loop construction.The board structure include a metal substrate and
One first non-metal base plate being connected with each other with the metal substrate.The insulation system include setting the metal substrate with
The first insulating layer on first non-metal base plate.The loop construction is arranged around ground on first insulating layer, with
It is electrically connected at an IC chip.Wherein, the loop construction has first part's coil and is connected to the first part
One second part coil of coil, first part's coil are arranged on first insulating layer and are located at the metal substrate
Top, the second part coil be arranged on first insulating layer and positioned at first non-metal base plate top,
And first part's coil accounts for the percentage of the loop construction and accounts for the loop construction more than the second part coil
Percentage.
Further, the board structure has and is connected between the metal substrate and first non-metal base plate
One first through slit and be filled in described first in the slit and be connected to the metal substrate and described first non-
One first connector between metal substrate, wherein first non-metal base plate cooperates with the metal substrate, with shape
It is mounted in a back-cover structure at the back side of a portable electronic devices in groups, wherein the insulation system includes setting described the
To cover a second insulating layer of the loop construction on one insulating layer, and the loop construction has from the second insulating layer
One first load point and one second load point exposed and that go out and be electrically connected at the IC chip, wherein the coil knot
After structure and the IC chip cooperate generated antenna magnetic field can directly through first non-metal base plate without with institute
It states metal substrate and generates coupling or matching.
Further, the board structure includes one second non-metal base plate being connected with each other with the metal substrate,
And the board structure have be connected between the metal substrate and first non-metal base plate one first through slit,
Described first is filled in slit and is connected between the metal substrate and first non-metal base plate one first
Connector, one second be connected between the metal substrate and second non-metal base plate through slit and are filled in institute
One second connector that second is stated in slit and is connected between the metal substrate and second non-metal base plate,
In, first non-metal base plate, the metal substrate and second non-metal base plate cooperate, and are assembled in being formed
The one back-cover structure at the back side of one portable electronic devices, wherein the insulation system includes being arranged in first insulating layer
On to cover a second insulating layer of the loop construction, and the loop construction has exposed from the second insulating layer and goes out
And be electrically connected at one first load point and one second load point of the IC chip, wherein the loop construction with it is described
IC chip cooperate after generated antenna magnetic field can directly through first non-metal base plate without with the Metal Substrate
Plate generates coupling or matching.
Further, the board structure has at least one through opening, and at least one opening that runs through is through described
Metal substrate is for an at least camera lens module for an exposed portable electronic devices, and at least one described is located at quilt through opening
The lower section for the wireless collar region that the loop construction is surrounded, wherein first part's coil accounts for the loop construction
Percentage is 55%~95%, and it is 5%~45% that the second part coil, which accounts for the percentage of the loop construction,.
Further, the board structure has and is connected between the metal substrate and first non-metal base plate
One first through slit and be filled in described first in the slit and be connected to the metal substrate and described first non-
One first connector between metal substrate, wherein first non-metal base plate cooperates with the metal substrate, with shape
It is mounted in a back-cover structure at the back side of a portable electronic devices in groups, wherein the insulation system includes setting described the
To cover a second insulating layer of the loop construction on one insulating layer, and the loop construction has from the second insulating layer
One first load point and one second load point exposed and that go out and be electrically connected at the IC chip, wherein the coil knot
After structure and the IC chip cooperate generated antenna magnetic field can directly through first non-metal base plate without with institute
It states metal substrate and generates coupling or matching.
Further, the board structure includes one second non-metal base plate being connected with each other with the metal substrate,
And the board structure have be connected between the metal substrate and first non-metal base plate one first through slit,
Described first is filled in slit and is connected between the metal substrate and first non-metal base plate one first
Connector, one second be connected between the metal substrate and second non-metal base plate through slit and are filled in institute
One second connector that second is stated in slit and is connected between the metal substrate and second non-metal base plate,
In, first non-metal base plate, the metal substrate and second non-metal base plate cooperate, and are assembled in being formed
The one back-cover structure at the back side of one portable electronic devices, wherein the insulation system includes being arranged in first insulating layer
On to cover a second insulating layer of the loop construction, and the loop construction has exposed from the second insulating layer and goes out
And be electrically connected at one first load point and one second load point of the IC chip, wherein the loop construction with it is described
IC chip cooperate after generated antenna magnetic field can directly through first non-metal base plate without with the Metal Substrate
Plate generates coupling or matching.
In order to solve the above technical problems, an other technical solution of the present invention is to provide a kind of portable
Electronic device, the portable electronic devices use a back-cover component, which is characterized in that the back-cover component includes：One substrate
Structure, an insulation system and a loop construction.The board structure include a metal substrate and with the metal substrate that
This one first connected non-metal base plate.The insulation system includes being arranged in the metal substrate and first non-metal base
The first insulating layer on plate.The loop construction is arranged around ground on first insulating layer, to be electrically connected at an IC cores
Piece.Wherein, the loop construction has first part's coil and is connected to a second part of first part's coil
Coil, first part's coil be arranged on first insulating layer and positioned at the metal substrate top, described second
Coil sections are arranged on first insulating layer and are located at the top of first non-metal base plate, and first part's line
The percentage for enclosing the loop construction is more than the percentage that the second part coil accounts for the loop construction.
Further, the board structure has and is connected between the metal substrate and first non-metal base plate
One first through slit and be filled in described first in the slit and be connected to the metal substrate and described first non-
One first connector between metal substrate, wherein first non-metal base plate cooperates with the metal substrate, with shape
It is mounted in a back-cover structure at the back side of the portable electronic devices in groups, wherein the insulation system includes being arranged described
To cover a second insulating layer of the loop construction on first insulating layer, and the loop construction has from second insulation
Layer one first load point and one second load point exposed and that go out and be electrically connected at the IC chip, wherein the coil
After structure and the IC chip cooperate generated antenna magnetic field can directly through first non-metal base plate without with
The metal substrate generates coupling or matching.
Further, the board structure includes one second non-metal base plate being connected with each other with the metal substrate,
And the board structure have be connected between the metal substrate and first non-metal base plate one first through slit,
Described first is filled in slit and is connected between the metal substrate and first non-metal base plate one first
Connector, one second be connected between the metal substrate and second non-metal base plate through slit and are filled in institute
One second connector that second is stated in slit and is connected between the metal substrate and second non-metal base plate,
In, first non-metal base plate, the metal substrate and second non-metal base plate cooperate, and are assembled in being formed
The one back-cover structure at the back side of the portable electronic devices, wherein the insulation system includes setting in first insulation
To cover a second insulating layer of the loop construction on layer, and the loop construction have it is exposed from the second insulating layer and
Go out and be electrically connected at one first load point and one second load point of the IC chip, wherein the loop construction and institute
State IC chip cooperate after generated antenna magnetic field can directly through first non-metal base plate without with the metal
Substrate generates coupling or matching.
In order to solve the above technical problems, other yet another aspect of the present invention is to provide a kind of back-cover
Component comprising：One board structure and a loop construction.The board structure include a metal substrate and with the metal
One first non-metal base plate that substrate is connected with each other, wherein first non-metal base plate cooperates with the metal substrate,
To form a back-cover structure at the back side for being assembled in a portable electronic devices.The loop construction and an IC chip cooperate
Afterwards generated antenna magnetic field can directly through first non-metal base plate without with the metal substrate generation couple or
Matching.Wherein, the loop construction has first part's coil and is connected to one second of first part's coil
Sub-coil, first part's coil are located in the range of the upper area of the metal substrate, second part coil position
In the range of the upper area of first non-metal base plate, and first part's coil accounts for the percentage of the loop construction
Than the percentage for accounting for the loop construction more than the second part coil.
The present invention a wherein advantageous effect be, the portable electronic devices and its back of the body that technical solution of the present invention is provided
Cap assemblies can be by the way that " board structure includes a metal substrate and one first non-gold being connected with each other with the metal substrate
Belong to substrate " and " loop construction has first part's coil and is connected to the one second of first part's coil
Coil sections, first part's coil are located in the range of the upper area of the metal substrate, the second part coil
In the range of the upper area of first non-metal base plate, and first part's coil accounts for the hundred of the loop construction
Point account for the percentage of the loop construction than being more than the second part coil " technical characteristic so that the loop construction
With an IC chip cooperate after generated antenna magnetic field can directly through first non-metal base plate without with the gold
Belong to substrate and generates coupling or matching.
For the enabled feature and technology contents for being further understood that the present invention, please refer to below in connection with the present invention specifically
Bright and attached drawing, however the attached drawing provided is merely provided for reference and description, is not intended to limit the present invention.
Description of the drawings
Fig. 1 is the stereoscopic schematic diagram of the board structure of the back-cover component of first embodiment of the invention.
Fig. 2 is the partial cutaway schematic of the board structure of the back-cover component of first embodiment of the invention.
Fig. 3 is that the insulation system of the back-cover component of first embodiment of the invention and loop construction are arranged on board structure
Stereoscopic schematic diagram.
Fig. 4 is the perspective exploded view of the portable electronic devices of first embodiment of the invention.
Fig. 5 is the stereoscopic schematic diagram of the back-cover component of second embodiment of the invention.
Fig. 6 is the stereoscopic schematic diagram of the portable electronic devices of second embodiment of the invention.
Fig. 7 is the perspective exploded view of the portable electronic devices of third embodiment of the invention.
Fig. 8 is the partial cutaway schematic of the board structure of the back-cover component of third embodiment of the invention.
Fig. 9 is the stereoscopic schematic diagram of the back-cover component of fourth embodiment of the invention.
Figure 10 is the stereoscopic schematic diagram of the portable electronic devices of fourth embodiment of the invention.
Specific implementation mode
It is to illustrate presently disclosed related " portable electronic devices and its back of the body by particular specific embodiment below
The embodiment of cap assemblies ", those skilled in the art can understand advantages of the present invention and effect by content disclosed in this specification
Fruit.The present invention can be implemented or be applied by other different specific embodiments, and the various details in this specification also can base
In different viewpoints and application, in the lower various modifications of progress without departing from the spirit and change.In addition, the attached drawing of the present invention is only
To be simple schematically illustrate, not according to the description of actual size, state in advance.This will be explained in further detail in the following embodiments and the accompanying drawings
The relevant technologies content of invention, but disclosure of that is not to limit the scope of the invention.
First embodiment
Shown in please referring to Fig.1 to Fig.4, first embodiment of the invention provides a kind of back-cover component S and a kind of using back-cover
The portable electronic devices P of component S, wherein back-cover component S includes a board structure 1, an insulation system 2 and a coil knot
Structure 3.
First, shown in cooperation Fig. 1 and Fig. 2, board structure 1 include a metal substrate 10 and with the phase each other of metal substrate 10
One first non-metal base plate 11 even.More specifically, as shown in Fig. 2, board structure 1 have be connected to metal substrate 10 with
One first between first non-metal base plate 11 runs through slit 101 and is filled in first in slit 101 and is connected to gold
Belong to one first connector 102 between substrate 10 and the first non-metal base plate 11.For example, the first non-metal base plate 11 is one
By the first insulating substrate made by insulating materials, and the first connector 102 is one exhausted by first made by insulating materials
Edge colloid.
Furthermore coordinate shown in Fig. 1 to Fig. 3, insulation system 2 includes being arranged in metal substrate 10 and the first non-metal base plate 11
On the first insulating layer 21, and loop construction 3 around ground be arranged on the first insulating layer 21 so that loop construction 3 with gold
It is insulated from each other to belong to substrate 10.More specifically, loop construction 3 can be laid out institute by conductive material to be a kind of according to a scheduled circuit
The antenna structure (such as can be RFID antenna) of formation, and loop construction 3 has first part's coil 31 and connection
In a second part coil 32 of first part's coil 31.In addition, first part's coil 31 be arranged on the first insulating layer 21 and
Positioned at the top of metal substrate 10, and second part coil 32 is arranged on the first insulating layer 21 and is located at the first non-metal base
The top of plate 11.It is worth noting that, the percentage of the line is busy the coil structures 3 of first part's coil 31 can be more than second part coil 32
The percentage of the line is busy coil structures 3.For example, the percentage of the line is busy the coil structures 3 of first part's coil 31 be about 55%~
95% (optimization can be 85%~95%), and the percentage of the line is busy the coil structures 3 of second part coil 32 is about 5%~45%
(optimization can be 5%~15%).That is, the percentage of the line is busy the coil structures 3 of first part's coil 31 is more than second part line
Between the percentage about 70~90 of 32 the line is busy coil structures 3 of circle.But first part's coil 31 of the invention and second part coil
32 percentage is not limited with above-mentioned institute's illustrated example.
More specifically, shown in cooperation Fig. 3 and Fig. 4, insulation system 2, which still further comprises, to be arranged in the first insulating layer 21
On to cover a second insulating layer 22 of loop construction 3 (that is, loop construction 3 will be covered by the first insulating layer 21
Between second insulating layer 22), and loop construction 3 has one first load point 301 that is exposed from second insulating layer 22 and going out
And one second load point 302.It is worth noting that, the first non-metal base plate 11 can cooperate with metal substrate 10, with
Form a back-cover structure at the back side for being assembled in a portable electronic devices P.When board structure 1 (back-cover structure) is assembled in and can take
When the back side of formula electronic device P, the first load point 301 and the second load point 302 of loop construction 3 will contact IC chip respectively
4 one first conductive junction point 401 and one second conductive junction point 402, to allow loop construction 3 that can be electrically connected at IC chip 4.
In conclusion shown in cooperation Fig. 1 and Fig. 4, a kind of back-cover component S that first embodiment of the invention provides, packet
It includes：One board structure 1 and a loop construction 3.Board structure 1 include a metal substrate 10 and with the phase each other of metal substrate 10
One first non-metal base plate 11 even.First non-metal base plate 11 can cooperate with metal substrate 10, and one is assembled in be formed
The one back-cover structure at the back side of portable electronic devices P.Generated antenna after loop construction 3 and an IC chip 4 cooperate
Magnetic field energy is directly through the first non-metal base plate 11 without coupling or matching with the generation of metal substrate 10.Loop construction 3 has
One first part's coil 31 and the second part coil 32 for being connected to first part's coil 31.First part's coil 31 is located at
In the range of the upper area of metal substrate 10, second part coil 32 is located at the model of the upper area of the first non-metal base plate 11
In enclosing, and the percentage of the line is busy the coil structures 3 of first part's coil 31 can be more than second part coil 32 the line is busy the hundred of coil structures 3
Divide ratio.
Whereby, generated antenna magnetic field can be nonmetallic directly through first after loop construction 3 cooperates with IC chip 4
Substrate 11, and antenna magnetic field can be by the shielding of metal substrate 10 without coupling or matching with the generation of metal substrate 10.Cause
This, generated antenna magnetic field can pass through the first non-metal base plate 11 and concentrate on after loop construction 3 cooperates with IC chip 4
The front region of metal substrate 10, without the screening effect by metal substrate 10.
Second embodiment
It please refers to shown in Fig. 5 and Fig. 6, second embodiment of the invention provides a kind of back-cover component S and a kind of use is carried on the back
The portable electronic devices P of cap assemblies S, wherein back-cover component S includes a board structure 1, an insulation system 2 and a coil
Structure 3.By the comparison of Fig. 5 and Fig. 4 it is found that second embodiment of the invention and first embodiment it is maximum the difference is that：Coordinate Fig. 5
Shown in Fig. 6, in a second embodiment, board structure 1 has at least one can be passed through through opening 100 through opening 100, at least one
Metal substrate 10 is worn for an at least camera lens module C of exposed portable electronic devices P, and at least one runs through opening
100 are located at the lower section of the wireless collar region surrounded by loop construction 3.Certainly, an at least camera lens module C is also alternatively at finger
Line recognizes module or other electronic module, or at least one through opening 100 can be used for exposed one simultaneously portable
Multiple electronic modules of electronic device P, such as camera lens module and identification of fingerprint module.However, the present invention is not with above-mentioned lifted
Example is limited.
3rd embodiment
It please refers to shown in Fig. 7, third embodiment of the invention provides a kind of a kind of back-cover component S and use back-cover component S
Portable electronic devices P, wherein back-cover component S include a board structure 1, an insulation system 2 and a loop construction 3.By
The comparison of Fig. 7 and Fig. 4 it is found that third embodiment of the invention it is maximum with first embodiment the difference is that：
As shown in fig. 7, in the third embodiment, board structure 1 include be connected with each other with metal substrate 10 it is one first non-
Metal substrate 11 and one second non-metal base plate 12 being connected with each other with metal substrate 10.In addition, board structure 1 has connection
One first between metal substrate 10 and the first non-metal base plate 11 runs through slit 101, is filled in first in slit 101
And be connected to one first connector 102 between metal substrate 10 and the first non-metal base plate 11, be connected to metal substrate 10 with
One second between second non-metal base plate 12 runs through slit 103 and is filled in second in slit 103 and is connected to gold
Belong to one second connector 104 between substrate 10 and the second non-metal base plate 12.For example, the first non-metal base plate 11 is one
By the first insulating substrate made by insulating materials, and the second non-metal base plate 12 is one by second made by insulating materials
Insulating substrate.In addition, the first connector 102 is one by the first insulation colloid made by insulating materials, and the second connector
104 for one by made by insulating materials second insulation colloid.
It is worth noting that, as shown in fig. 7, the first non-metal base plate 11, metal substrate 10 and the second non-metal base plate
12 can cooperate, to form a back-cover structure at the back side for being assembled in a portable electronic devices P.When (the back of the body of board structure 1
Lid structure) when being assembled in the back side of portable electronic devices P, the first load point 301 and the second load point 302 of loop construction 3
One first conductive junction point 401 and one second conductive junction point 402 that IC chip 4 will be contacted respectively, to allow loop construction 3 can be electrically
It is connected to IC chip 4.
Whereby, generated antenna magnetic field can be nonmetallic directly through first after loop construction 3 cooperates with IC chip 4
Substrate 11, and antenna magnetic field can be by the shielding of metal substrate 10 without coupling or matching with the generation of metal substrate 10.Cause
This, generated antenna magnetic field can pass through the first non-metal base plate 11 and concentrate on after loop construction 3 cooperates with IC chip 4
The front region of metal substrate 10, without the screening effect by metal substrate 10.
Fourth embodiment
It please refers to shown in Fig. 9 and Figure 10, fourth embodiment of the invention provides a kind of back-cover component S and a kind of use is carried on the back
The portable electronic devices P of cap assemblies S, wherein back-cover component S includes a board structure 1, an insulation system 2 and a coil
Structure 3.By the comparison of Fig. 9 and Fig. 7 it is found that fourth embodiment of the invention and 3rd embodiment it is maximum the difference is that：Coordinate Fig. 8
Shown in Fig. 9, in the fourth embodiment, board structure 1 has at least one can be passed through through opening 100 through opening 100, at least one
Metal substrate 10 is worn for an at least camera lens module C of exposed portable electronic devices P, and at least one runs through opening
100 are located at the lower section of the wireless collar region surrounded by loop construction 3.
The advantageous effect of embodiment
The wherein advantageous effect of the present invention is, portable electronic devices P that technical solution of the present invention is provided and its
Back-cover component S can be by the way that " board structure 1 includes a metal substrate 10 and one first non-gold being connected with each other with metal substrate 10
Belong to substrate 11 " and " loop construction 3 has first part's coil 31 and is connected to one second of first part's coil 31
Sub-coil 32, first part's coil 31 are located in the range of the upper area of metal substrate 10, and second part coil 32 is located at the
In the range of the upper area of one non-metal base plate 11, and the percentage of the line is busy the coil structures 3 of first part's coil 31 is more than second
The technical characteristic of the percentage of the line is busy the coil structures 3 of coil sections 32 ", so that after loop construction 3 and an IC chip 4 cooperate
Generated antenna magnetic field can be directly through the first non-metal base plate 11 without coupling or matching with the generation of metal substrate 10.
Content disclosed above is only the preferred possible embodiments of the present invention, and the right for not thereby limiting to the present invention is wanted
The protection domain of book is sought, so every equivalence techniques variation done with description of the invention and accompanying drawing content, is both contained in
In the protection domain of claims of the present invention.
Claims (10)
1. a kind of back-cover component, which is characterized in that the back-cover component includes：
One board structure, the board structure include a metal substrate and are connected with each other with the metal substrate one first non-
Metal substrate；
One insulation system, the insulation system include first be arranged on the metal substrate and first non-metal base plate
Insulating layer；And
One loop construction, the loop construction is arranged around ground on first insulating layer, to be electrically connected at an IC chip；
Wherein, the loop construction has first part's coil and is connected to a second part of first part's coil
Coil, first part's coil be arranged on first insulating layer and positioned at the metal substrate top, described second
Coil sections are arranged on first insulating layer and are located at the top of first non-metal base plate, and first part's line
The percentage for enclosing the loop construction is more than the percentage that the second part coil accounts for the loop construction.
2. back-cover component according to claim 1, which is characterized in that the board structure, which has, is connected to the Metal Substrate
One first between plate and first non-metal base plate runs through slit and is filled in described first in slit and connects
One first connector between the metal substrate and first non-metal base plate, wherein first non-metal base plate
It cooperates with the metal substrate, to form a back-cover structure at the back side for being assembled in a portable electronic devices, wherein institute
It includes being arranged on first insulating layer to cover a second insulating layer of the loop construction, and the line to state insulation system
Coil structures have exposed from the second insulating layer and go out and be electrically connected at one first load point and one of the IC chip
Second load point, wherein generated antenna magnetic field can be directly through after the loop construction and the IC chip cooperate
First non-metal base plate is without coupling or matching with metal substrate generation.
3. back-cover component according to claim 1, which is characterized in that the board structure include with the metal substrate that
This one second connected non-metal base plate, and the board structure has and is connected to the metal substrate and described first nonmetallic
Between substrate one first through slit, be filled in described first in the slit and be connected to the metal substrate and described the
One first connector between one non-metal base plate, one be connected between the metal substrate and second non-metal base plate
Second through slit and is filled in described second in the slit and is connected to the metal substrate and described second nonmetallic
One second connector between substrate, wherein first non-metal base plate, the metal substrate and described second nonmetallic
Substrate cooperates, to form a back-cover structure at the back side for being assembled in a portable electronic devices, wherein the insulation system
Including being arranged to cover a second insulating layer of the loop construction on first insulating layer, and the loop construction has
It is exposed from the second insulating layer and go out and be electrically connected at one first load point and one second load point of the IC chip,
Wherein, generated antenna magnetic field can be directly through the described first non-gold after the loop construction cooperates with the IC chip
Belong to substrate without coupling or matching with metal substrate generation.
4. back-cover component according to claim 1, which is characterized in that the board structure has at least one to run through opening,
At least one at least camera lens module for running through opening through the metal substrate for an exposed portable electronic devices,
And at least one lower section for being located at the wireless collar region surrounded by the loop construction through opening, wherein described the
The percentage that a part of coil accounts for the loop construction is 55%~95%, and the second part coil accounts for the loop construction
Percentage be 5%~45%.
5. back-cover component according to claim 4, which is characterized in that the board structure, which has, is connected to the Metal Substrate
One first between plate and first non-metal base plate runs through slit and is filled in described first in slit and connects
One first connector between the metal substrate and first non-metal base plate, wherein first non-metal base plate
It cooperates with the metal substrate, to form a back-cover structure at the back side for being assembled in a portable electronic devices, wherein institute
It includes being arranged on first insulating layer to cover a second insulating layer of the loop construction, and the line to state insulation system
Coil structures have exposed from the second insulating layer and go out and be electrically connected at one first load point and one of the IC chip
Second load point, wherein generated antenna magnetic field can be directly through after the loop construction and the IC chip cooperate
First non-metal base plate is without coupling or matching with metal substrate generation.
6. back-cover component according to claim 4, which is characterized in that the board structure include with the metal substrate that
This one second connected non-metal base plate, and the board structure has and is connected to the metal substrate and described first nonmetallic
Between substrate one first through slit, be filled in described first in the slit and be connected to the metal substrate and described the
One first connector between one non-metal base plate, one be connected between the metal substrate and second non-metal base plate
Second through slit and is filled in described second in the slit and is connected to the metal substrate and described second nonmetallic
One second connector between substrate, wherein first non-metal base plate, the metal substrate and described second nonmetallic
Substrate cooperates, to form a back-cover structure at the back side for being assembled in a portable electronic devices, wherein the insulation system
Including being arranged to cover a second insulating layer of the loop construction on first insulating layer, and the loop construction has
It is exposed from the second insulating layer and go out and be electrically connected at one first load point and one second load point of the IC chip,
Wherein, generated antenna magnetic field can be directly through the described first non-gold after the loop construction cooperates with the IC chip
Belong to substrate without coupling or matching with metal substrate generation.
7. a kind of portable electronic devices, the portable electronic devices use a back-cover component, which is characterized in that the back-cover
Component includes：
One board structure, the board structure include a metal substrate and are connected with each other with the metal substrate one first non-
Metal substrate；
One insulation system, the insulation system include first be arranged on the metal substrate and first non-metal base plate
Insulating layer；And
One loop construction, the loop construction is arranged around ground on first insulating layer, to be electrically connected at an IC chip；
Wherein, the loop construction has first part's coil and is connected to a second part of first part's coil
Coil, first part's coil be arranged on first insulating layer and positioned at the metal substrate top, described second
Coil sections are arranged on first insulating layer and are located at the top of first non-metal base plate, and first part's line
The percentage for enclosing the loop construction is more than the percentage that the second part coil accounts for the loop construction.
8. portable electronic devices according to claim 7, which is characterized in that the board structure is described with being connected to
One first between metal substrate and first non-metal base plate runs through slit and is filled in described first in slit
And it is connected to one first connector between the metal substrate and first non-metal base plate, wherein the first non-gold
Belong to substrate to cooperate with the metal substrate, to form a back-cover knot at the back side for being assembled in the portable electronic devices
Structure, wherein the insulation system includes one second insulation being arranged on first insulating layer to cover the loop construction
Layer, and the loop construction has one first feedback that is exposed from the second insulating layer and going out and be electrically connected at the IC chip
Access point and one second load point, wherein generated antenna magnetic field after the loop construction cooperates with the IC chip
It can be directly through first non-metal base plate without coupling or matching with metal substrate generation.
9. portable electronic devices according to claim 7, which is characterized in that the board structure includes and the metal
One second non-metal base plate that substrate is connected with each other, and the board structure have be connected to the metal substrate and described first
Between non-metal base plate one first through slit, be filled in described first in the slit and be connected to the metal substrate with
One first connector between first non-metal base plate, be connected to the metal substrate and second non-metal base plate it
Between one second through slit and be filled in described second in the slit and be connected to the metal substrate and described second
One second connector between non-metal base plate, wherein first non-metal base plate, the metal substrate and described second
Non-metal base plate cooperates, to form a back-cover structure at the back side for being assembled in the portable electronic devices, wherein described
Insulation system includes being arranged on first insulating layer to cover a second insulating layer of the loop construction, and the coil
Structure has one first load point and one that is exposed from the second insulating layer and going out and be electrically connected at the IC chip
Two load points, wherein generated antenna magnetic field can be directly through institute after the loop construction cooperates with the IC chip
The first non-metal base plate is stated without coupling or matching with metal substrate generation.
10. a kind of back-cover component, which is characterized in that the back-cover component includes：
One board structure, the board structure include a metal substrate and are connected with each other with the metal substrate one first non-
Metal substrate, wherein first non-metal base plate cooperates with the metal substrate, and a portable electricity is assembled in be formed
The one back-cover structure at the back side of sub-device；And
One loop construction, generated antenna magnetic field can be directly through described after the loop construction cooperates with an IC chip
First non-metal base plate is without coupling or matching with metal substrate generation；
Wherein, the loop construction has first part's coil and is connected to a second part of first part's coil
Coil, first part's coil are located in the range of the upper area of the metal substrate, and the second part coil is located at
In the range of the upper area of first non-metal base plate, and first part's coil accounts for the percentage of the loop construction
More than the percentage that the second part coil accounts for the loop construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710198084.8A CN108666735B (en) | 2017-03-29 | 2017-03-29 | Portable electronic device and back cover assembly thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710198084.8A CN108666735B (en) | 2017-03-29 | 2017-03-29 | Portable electronic device and back cover assembly thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108666735A true CN108666735A (en) | 2018-10-16 |
| CN108666735B CN108666735B (en) | 2020-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710198084.8A Active CN108666735B (en) | 2017-03-29 | 2017-03-29 | Portable electronic device and back cover assembly thereof |
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| US20160164178A1 (en) * | 2014-12-04 | 2016-06-09 | Tdk Corporation | Antenna device and portable electronic device using the same |
| CN106532307A (en) * | 2015-09-11 | 2017-03-22 | 三星电机株式会社 | Conductive plate and electronic device having the same |
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| CN104377424A (en) * | 2013-08-14 | 2015-02-25 | 三星电机株式会社 | Cover for electronic device, antenna assembly, electronic device, and method for manufacturing the same |
| CN104682005A (en) * | 2013-11-29 | 2015-06-03 | 佳邦科技股份有限公司 | Antenna structure |
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| Publication number | Publication date |
|---|---|
| CN108666735B (en) | 2020-04-03 |
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