CN108666735B - Portable electronic device and back cover assembly thereof - Google Patents
Portable electronic device and back cover assembly thereof Download PDFInfo
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- CN108666735B CN108666735B CN201710198084.8A CN201710198084A CN108666735B CN 108666735 B CN108666735 B CN 108666735B CN 201710198084 A CN201710198084 A CN 201710198084A CN 108666735 B CN108666735 B CN 108666735B
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- 239000000758 substrate Substances 0.000 claims abstract description 304
- 239000002184 metal Substances 0.000 claims abstract description 110
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 102
- 239000011810 insulating material Substances 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
Abstract
The invention discloses a portable electronic device and a back cover assembly thereof. The back cover assembly comprises a substrate structure and a coil structure. The substrate structure comprises a metal substrate and a first nonmetal substrate connected with the metal substrate. The first non-metal substrate and the metal substrate are matched with each other to form a back cover structure assembled on the back of the portable electronic device. The coil structure has a first partial coil and a second partial coil connected to the first partial coil. The first partial coil is located in the range of the upper area of the metal substrate. The second partial coil is located in the range of the upper area of the first nonmetal substrate. The percentage of the first part of the coil structure occupied by the first part of the coil is greater than the percentage of the second part of the coil structure occupied by the second part of the coil. Therefore, the antenna magnetic field generated after the coil structure is matched with an IC chip can directly pass through the first non-metal substrate without being coupled or matched with the metal substrate.
Description
Technical Field
The present invention relates to an electronic device and a back cover assembly thereof, and more particularly, to a portable electronic device and a back cover assembly thereof.
Background
In a conventional antenna device for Near Field Communication (NFC) applied to an intelligent mobile device, such as a Radio Frequency Identification (RFID) antenna, a configuration method of the antenna device applied to the intelligent mobile device generally includes disposing an Integrated Circuit (IC) and a matching component on a circuit board (PCB) Near an inner side of the mobile device, attaching the RFID antenna to an inner edge of a back cover of the mobile device, and electrically connecting the circuit board of the mobile device and the RFID antenna by using a spring.
However, the size of portable electronic devices is required to be thinner and lighter, strength is insufficient due to the thinner and more mobile devices are required to be integrally formed and beautiful, and a metal casing or a metal is additionally plated to form a metalized appearance. Since the near field communication utilizes the principle of electromagnetic induction, the metal of the housing can shield the antenna originally adhered to the inner side of the back cover, and the magnetic field of the antenna is shielded by the metal back cover and cannot be radiated effectively, so that the wireless communication with other electronic devices cannot be performed.
Disclosure of Invention
The present invention provides a portable electronic device and a back cover assembly thereof, which are directed to overcome the disadvantages of the prior art.
In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a back cover assembly, which includes: a substrate structure, an insulation structure and a coil structure. The substrate structure comprises a metal substrate and a first nonmetal substrate connected with the metal substrate. The insulating structure comprises a first insulating layer arranged on the metal substrate and the first nonmetal substrate. The coil structure is arranged on the first insulating layer in a surrounding mode and is electrically connected with an IC chip. The coil structure is provided with a first partial coil and a second partial coil connected to the first partial coil, the first partial coil is arranged on the first insulating layer and located above the metal substrate, the second partial coil is arranged on the first insulating layer and located above the first non-metal substrate, and the percentage of the first partial coil in the coil structure is larger than that of the second partial coil in the coil structure.
Furthermore, the substrate structure has a first through slit connected between the metal substrate and the first non-metal substrate and a first connector filled in the first through slit and connected between the metal substrate and the first non-metal substrate, wherein the first non-metal substrate and the metal substrate are matched with each other to form a back cover structure assembled on the back of a portable electronic device, wherein the insulating structure includes a second insulating layer disposed on the first insulating layer to cover the coil structure, the coil structure has a first feed-in point and a second feed-in point exposed from the second insulating layer and electrically connected to the IC chip, the antenna magnetic field generated after the coil structure and the IC chip are matched with each other can directly pass through the first non-metal substrate without being coupled or matched with the metal substrate.
Further, the substrate structure includes a second non-metal substrate connected to the metal substrate, and the substrate structure has a first through slit connected between the metal substrate and the first non-metal substrate, a first connector filled in the first through slit and connected between the metal substrate and the first non-metal substrate, a second through slit connected between the metal substrate and the second non-metal substrate, and a second connector filled in the second through slit and connected between the metal substrate and the second non-metal substrate, wherein the first non-metal substrate, the metal substrate, and the second non-metal substrate cooperate with each other to form a back cover structure assembled on the back of a portable electronic device, wherein the insulating structure includes a second insulating layer disposed on the first insulating layer to cover the coil structure, and the coil structure is provided with a first feed-in point and a second feed-in point which are exposed out of the second insulating layer and are electrically connected with the IC chip, wherein antenna magnetic field generated after the coil structure and the IC chip are mutually matched can directly pass through the first non-metal substrate without being coupled or matched with the metal substrate.
Furthermore, the substrate structure has at least one through opening, the at least one through opening penetrates through the metal substrate to expose at least one lens module of a portable electronic device, and the at least one through opening is located below a coil-free area surrounded by the coil structure, wherein the first portion of the coil accounts for 55% -95% of the coil structure, and the second portion of the coil accounts for 5% -45% of the coil structure.
Furthermore, the substrate structure has a first through slit connected between the metal substrate and the first non-metal substrate and a first connector filled in the first through slit and connected between the metal substrate and the first non-metal substrate, wherein the first non-metal substrate and the metal substrate are matched with each other to form a back cover structure assembled on the back of a portable electronic device, wherein the insulating structure includes a second insulating layer disposed on the first insulating layer to cover the coil structure, the coil structure has a first feed-in point and a second feed-in point exposed from the second insulating layer and electrically connected to the IC chip, the antenna magnetic field generated after the coil structure and the IC chip are matched with each other can directly pass through the first non-metal substrate without being coupled or matched with the metal substrate.
Further, the substrate structure includes a second non-metal substrate connected to the metal substrate, and the substrate structure has a first through slit connected between the metal substrate and the first non-metal substrate, a first connector filled in the first through slit and connected between the metal substrate and the first non-metal substrate, a second through slit connected between the metal substrate and the second non-metal substrate, and a second connector filled in the second through slit and connected between the metal substrate and the second non-metal substrate, wherein the first non-metal substrate, the metal substrate, and the second non-metal substrate cooperate with each other to form a back cover structure assembled on the back of a portable electronic device, wherein the insulating structure includes a second insulating layer disposed on the first insulating layer to cover the coil structure, and the coil structure is provided with a first feed-in point and a second feed-in point which are exposed out of the second insulating layer and are electrically connected with the IC chip, wherein antenna magnetic field generated after the coil structure and the IC chip are mutually matched can directly pass through the first non-metal substrate without being coupled or matched with the metal substrate.
In order to solve the above technical problem, another technical solution of the present invention is to provide a portable electronic device, wherein the portable electronic device uses a back cover assembly, and the back cover assembly includes: a substrate structure, an insulation structure and a coil structure. The substrate structure comprises a metal substrate and a first nonmetal substrate connected with the metal substrate. The insulating structure comprises a first insulating layer arranged on the metal substrate and the first nonmetal substrate. The coil structure is arranged on the first insulating layer in a surrounding mode and is electrically connected with an IC chip. The coil structure is provided with a first partial coil and a second partial coil connected to the first partial coil, the first partial coil is arranged on the first insulating layer and located above the metal substrate, the second partial coil is arranged on the first insulating layer and located above the first non-metal substrate, and the percentage of the first partial coil in the coil structure is larger than that of the second partial coil in the coil structure.
Furthermore, the substrate structure has a first through slit connected between the metal substrate and the first non-metal substrate and a first connector filled in the first through slit and connected between the metal substrate and the first non-metal substrate, wherein the first non-metal substrate and the metal substrate are matched with each other to form a back cover structure assembled on the back of the portable electronic device, wherein the insulating structure includes a second insulating layer disposed on the first insulating layer to cover the coil structure, the coil structure has a first feed-in point and a second feed-in point exposed from the second insulating layer and electrically connected to the IC chip, the antenna magnetic field generated after the coil structure and the IC chip are matched with each other can directly pass through the first non-metal substrate without being coupled or matched with the metal substrate.
Further, the substrate structure includes a second non-metal substrate connected to the metal substrate, and the substrate structure has a first through slit connected between the metal substrate and the first non-metal substrate, a first connector filled in the first through slit and connected between the metal substrate and the first non-metal substrate, a second through slit connected between the metal substrate and the second non-metal substrate, and a second connector filled in the second through slit and connected between the metal substrate and the second non-metal substrate, wherein the first non-metal substrate, the metal substrate, and the second non-metal substrate cooperate with each other to form a back cover structure assembled on the back of the portable electronic device, wherein the insulating structure includes a second insulating layer disposed on the first insulating layer to cover the coil structure, and the coil structure is provided with a first feed-in point and a second feed-in point which are exposed out of the second insulating layer and are electrically connected with the IC chip, wherein antenna magnetic field generated after the coil structure and the IC chip are mutually matched can directly pass through the first non-metal substrate without being coupled or matched with the metal substrate.
In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a back cover assembly, including: a substrate structure and a coil structure. The substrate structure comprises a metal substrate and a first nonmetal substrate connected with the metal substrate, wherein the first nonmetal substrate and the metal substrate are matched with each other to form a back cover structure assembled on the back of a portable electronic device. The antenna magnetic field generated after the coil structure is matched with an IC chip can directly pass through the first non-metal substrate without being coupled or matched with the metal substrate. The coil structure is provided with a first partial coil and a second partial coil connected to the first partial coil, the first partial coil is located in the range of the upper area of the metal substrate, the second partial coil is located in the range of the upper area of the first nonmetal substrate, and the percentage of the first partial coil in the coil structure is larger than that of the second partial coil in the coil structure.
One of the advantages of the present invention is that the portable electronic device and the back cover assembly thereof provided by the technical solution of the present invention can be realized by "the substrate structure comprises a metal substrate and a first non-metal substrate connected to the metal substrate" and "the coil structure has a first partial coil and a second partial coil connected to the first partial coil, the first partial coil is positioned in the range of the upper area of the metal substrate, the second partial coil is positioned in the range of the upper area of the first nonmetal substrate, and the percentage of the first part of coils in the coil structure is greater than the percentage of the second part of coils in the coil structure, so that the antenna magnetic field generated after the coil structure is matched with an IC chip can directly pass through the first non-metal substrate without being coupled or matched with the metal substrate.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
Fig. 1 is a perspective view illustrating a substrate structure of a back cover assembly according to a first embodiment of the invention.
Fig. 2 is a partial cross-sectional view of a substrate structure of a back cover assembly according to a first embodiment of the invention.
Fig. 3 is a schematic perspective view illustrating the insulating structure and the coil structure of the back cover assembly disposed on the substrate structure according to the first embodiment of the present invention.
Fig. 4 is an exploded perspective view of the portable electronic device according to the first embodiment of the invention.
Fig. 5 is a perspective view of a back cover assembly according to a second embodiment of the present invention.
Fig. 6 is a perspective view of a portable electronic device according to a second embodiment of the invention.
Fig. 7 is an exploded perspective view of a portable electronic device according to a third embodiment of the invention.
Fig. 8 is a partial cross-sectional view of a substrate structure of a back cover assembly according to a third embodiment of the invention.
Fig. 9 is a perspective view of a back cover assembly according to a fourth embodiment of the present invention.
Fig. 10 is a perspective view of a portable electronic device according to a fourth embodiment of the invention.
Detailed Description
The following description is provided for the embodiments of the present disclosure related to the portable electronic device and the back cover assembly thereof, and those skilled in the art will understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
First embodiment
Referring to fig. 1 to 4, a first embodiment of the present invention provides a back cover assembly S and a portable electronic device P using the back cover assembly S, wherein the back cover assembly S includes a substrate structure 1, an insulating structure 2 and a coil structure 3.
First, referring to fig. 1 and fig. 2, the substrate structure 1 includes a metal substrate 10 and a first non-metal substrate 11 connected to the metal substrate 10. More specifically, as shown in fig. 2, the substrate structure 1 has a first through slit 101 connected between the metal substrate 10 and the first non-metal substrate 11, and a first connecting body 102 filled in the first through slit 101 and connected between the metal substrate 10 and the first non-metal substrate 11. For example, the first non-metal substrate 11 is a first insulating substrate made of an insulating material, and the first connector 102 is a first insulating colloid made of an insulating material.
Furthermore, as shown in fig. 1 to fig. 3, the insulating structure 2 includes a first insulating layer 21 disposed on the metal substrate 10 and the first non-metal substrate 11, and the coil structure 3 is disposed on the first insulating layer 21 in a surrounding manner, so that the coil structure 3 and the metal substrate 10 are insulated from each other. Furthermore, the coil structure 3 may be an antenna structure (for example, an RFID antenna) formed by conductive materials according to a predetermined circuit layout, and the coil structure 3 has a first partial coil 31 and a second partial coil 32 connected to the first partial coil 31. In addition, the first partial coil 31 is disposed on the first insulating layer 21 and above the metal substrate 10, and the second partial coil 32 is disposed on the first insulating layer 21 and above the first nonmetal substrate 11. It is to be noted that the percentage of the first partial coil 31 in the coil configuration 3 is greater than the percentage of the second partial coil 32 in the coil configuration 3. For example, the percentage of the first partial coil 31 occupying the coil structure 3 may be about 55% to 95% (preferably 85% to 95%), and the percentage of the second partial coil 32 occupying the coil structure 3 may be about 5% to 45% (preferably 5% to 15%). That is, the percentage of the first partial coil 31 occupying the coil structure 3 is between about 70 and 90% greater than the percentage of the second partial coil 32 occupying the coil structure 3. However, the percentages of the first partial coil 31 and the second partial coil 32 are not limited to the above examples.
More specifically, referring to fig. 3 and 4, the insulating structure 2 further includes a second insulating layer 22 disposed on the first insulating layer 21 to cover the coil structure 3 (i.e., the coil structure 3 is wrapped between the first insulating layer 21 and the second insulating layer 22), and the coil structure 3 has a first feeding point 301 and a second feeding point 302 exposed from the second insulating layer 22. It should be noted that the first non-metal substrate 11 and the metal substrate 10 can cooperate with each other to form a back cover structure assembled on the back of a portable electronic device P. When the substrate structure 1 (back cover structure) is assembled on the back of the portable electronic device P, the first feeding point 301 and the second feeding point 302 of the coil structure 3 respectively contact a first conductive contact 401 and a second conductive contact 402 of the IC chip 4, so that the coil structure 3 can be electrically connected to the IC chip 4.
In summary, with reference to fig. 1 and fig. 4, a back cover assembly S according to a first embodiment of the present invention includes: a substrate structure 1 and a coil structure 3. The substrate structure 1 includes a metal substrate 10 and a first non-metal substrate 11 connected to the metal substrate 10. The first non-metal substrate 11 and the metal substrate 10 are mutually matched to form a back cover structure assembled on the back of a portable electronic device P. The antenna magnetic field generated by the coil structure 3 and an IC chip 4 can directly pass through the first non-metallic substrate 11 without coupling or matching with the metallic substrate 10. The coil structure 3 has a first partial coil 31 and a second partial coil 32 connected to the first partial coil 31. The first partial coil 31 is located in the upper area of the metal substrate 10, the second partial coil 32 is located in the upper area of the first non-metal substrate 11, and the percentage of the first partial coil 31 in the coil structure 3 is larger than the percentage of the second partial coil 32 in the coil structure 3.
Therefore, the antenna magnetic field generated after the coil structure 3 and the IC chip 4 are matched with each other can directly pass through the first non-metal substrate 11, and the antenna magnetic field is shielded by the metal substrate 10 and is not coupled or matched with the metal substrate 10. Therefore, the antenna magnetic field generated by the coil structure 3 and the IC chip 4 after being matched with each other passes through the first non-metal substrate 11 and is concentrated in the front area of the metal substrate 10 without being influenced by the shielding of the metal substrate 10.
Second embodiment
Referring to fig. 5 and fig. 6, a back cover assembly S and a portable electronic device P using the back cover assembly S are provided in a second embodiment of the present invention, wherein the back cover assembly S includes a substrate structure 1, an insulating structure 2 and a coil structure 3. As can be seen from a comparison between fig. 5 and fig. 4, the greatest difference between the second embodiment of the present invention and the first embodiment is: in the second embodiment, as shown in fig. 5 and fig. 6, the substrate structure 1 has at least one through opening 100, the at least one through opening 100 penetrates the metal substrate 10 to expose at least one lens module C of a portable electronic device P, and the at least one through opening 100 is located below a no-coil area surrounded by the coil structure 3. Of course, at least one lens module C may be replaced by a fingerprint recognition module or other electronic modules, or at least one through opening 100 may be used to expose a plurality of electronic modules of a portable electronic device P, such as a lens module and a fingerprint recognition module. However, the present invention is not limited to the above-mentioned examples.
Third embodiment
Referring to fig. 7, a third embodiment of the invention provides a back cover assembly S and a portable electronic device P using the back cover assembly S, wherein the back cover assembly S includes a substrate structure 1, an insulating structure 2 and a coil structure 3. As can be seen from a comparison between fig. 7 and fig. 4, the greatest difference between the third embodiment of the present invention and the first embodiment is:
as shown in fig. 7, in the third embodiment, the substrate structure 1 includes a first non-metal substrate 11 connected to the metal substrate 10 and a second non-metal substrate 12 connected to the metal substrate 10. In addition, the substrate structure 1 has a first through slit 101 connected between the metal substrate 10 and the first non-metal substrate 11, a first connecting body 102 filled in the first through slit 101 and connected between the metal substrate 10 and the first non-metal substrate 11, a second through slit 103 connected between the metal substrate 10 and the second non-metal substrate 12, and a second connecting body 104 filled in the second through slit 103 and connected between the metal substrate 10 and the second non-metal substrate 12. For example, the first non-metal substrate 11 is a first insulating substrate made of an insulating material, and the second non-metal substrate 12 is a second insulating substrate made of an insulating material. In addition, the first connecting body 102 is a first insulating colloid made of an insulating material, and the second connecting body 104 is a second insulating colloid made of an insulating material.
It should be noted that, as shown in fig. 7, the first non-metal substrate 11, the metal substrate 10 and the second non-metal substrate 12 can cooperate with each other to form a back cover structure assembled on the back of a portable electronic device P. When the substrate structure 1 (back cover structure) is assembled on the back of the portable electronic device P, the first feeding point 301 and the second feeding point 302 of the coil structure 3 respectively contact a first conductive contact 401 and a second conductive contact 402 of the IC chip 4, so that the coil structure 3 can be electrically connected to the IC chip 4.
Therefore, the antenna magnetic field generated after the coil structure 3 and the IC chip 4 are matched with each other can directly pass through the first non-metal substrate 11, and the antenna magnetic field is shielded by the metal substrate 10 and is not coupled or matched with the metal substrate 10. Therefore, the antenna magnetic field generated by the coil structure 3 and the IC chip 4 after being matched with each other passes through the first non-metal substrate 11 and is concentrated in the front area of the metal substrate 10 without being influenced by the shielding of the metal substrate 10.
Fourth embodiment
Referring to fig. 9 and 10, a back cover assembly S and a portable electronic device P using the back cover assembly S are provided in a fourth embodiment of the present invention, wherein the back cover assembly S includes a substrate structure 1, an insulating structure 2 and a coil structure 3. As can be seen from a comparison between fig. 9 and fig. 7, the greatest difference between the fourth embodiment and the third embodiment of the present invention is: in the fourth embodiment, as shown in fig. 8 and fig. 9, the substrate structure 1 has at least one through opening 100, the at least one through opening 100 penetrates the metal substrate 10 to expose at least one lens module C of a portable electronic device P, and the at least one through opening 100 is located below a no-coil area surrounded by the coil structure 3.
Advantageous effects of the embodiments
One of the advantages of the present invention is that the portable electronic device P and the back cover assembly S thereof provided by the present invention can be obtained by "the substrate structure 1 includes a metal substrate 10 and a first non-metal substrate 11 connected to the metal substrate 10", and "the coil structure 3 has a first partial coil 31 and a second partial coil 32 connected to the first partial coil 31, the first partial coil 31 is located in the range of the upper region of the metal substrate 10, the second partial coil 32 is located in the range of the upper region of the first non-metal substrate 11, and the percentage of the first partial coil 31 occupying the coil structure 3 is greater than the percentage of the second partial coil 32 occupying the coil structure 3 ", so that the antenna magnetic field generated by the coil structure 3 and an IC chip 4 can directly pass through the first non-metallic substrate 11 without coupling or matching with the metallic substrate 10.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.
Claims (9)
1. A back cover assembly, comprising:
the substrate structure comprises a metal substrate and a first nonmetal substrate connected with the metal substrate;
an insulating structure comprising a first insulating layer disposed on the metal substrate and the first non-metal substrate; and
the coil structure is arranged on the first insulating layer in a surrounding manner so as to be electrically connected with an IC chip;
the coil structure is provided with a first partial coil and a second partial coil connected to the first partial coil, the first partial coil is arranged on the first insulating layer and located above the metal substrate, the second partial coil is arranged on the first insulating layer and located above the first non-metal substrate, and the percentage of the first partial coil in the coil structure is larger than that of the second partial coil in the coil structure;
the insulating structure comprises a second insulating layer arranged on the first insulating layer to cover the coil structure, the coil structure is provided with a first feed-in point and a second feed-in point which are exposed out of the second insulating layer and are electrically connected with the IC chip, and the first feed-in point and the second feed-in point are both arranged on the first insulating layer and are positioned above the first nonmetal substrate.
2. The back cover assembly according to claim 1, wherein the substrate structure has a first through slit connected between the metal substrate and the first non-metal substrate and a first connecting body filled in the first through slit and connected between the metal substrate and the first non-metal substrate, wherein the first non-metal substrate and the metal substrate are matched with each other to form a back cover structure assembled on a back surface of a portable electronic device, and an antenna magnetic field generated by the coil structure and the IC chip after being matched with each other can directly pass through the first non-metal substrate.
3. The back cover assembly of claim 1, wherein the substrate structure comprises a second non-metallic substrate connected to the metallic substrate, and the substrate structure has a first through slit connected between the metallic substrate and the first non-metallic substrate, a first connector filled in the first through slit and connected between the metallic substrate and the first non-metallic substrate, a second through slit connected between the metallic substrate and the second non-metallic substrate, and a second connector filled in the second through slit and connected between the metallic substrate and the second non-metallic substrate, wherein the first non-metallic substrate, the metallic substrate, and the second non-metallic substrate cooperate with each other to form a back cover structure assembled on a back surface of a portable electronic device, and the antenna magnetic field generated after the coil structure and the IC chip are matched with each other can directly penetrate through the first non-metal substrate.
4. The back cover assembly according to claim 1, wherein the substrate structure has at least one through opening, at least one through opening penetrates the metal substrate for exposing at least one lens module of a portable electronic device, and at least one through opening is located below a coil-free region surrounded by the coil structure, wherein the first portion of the coil accounts for 55% to 95% of the coil structure, and the second portion of the coil accounts for 5% to 45% of the coil structure.
5. The back cover assembly according to claim 4, wherein the substrate structure has a first through slit connected between the metal substrate and the first non-metal substrate and a first connecting body filled in the first through slit and connected between the metal substrate and the first non-metal substrate, wherein the first non-metal substrate and the metal substrate are matched with each other to form a back cover structure assembled on a back surface of a portable electronic device, and an antenna magnetic field generated by the coil structure and the IC chip after being matched with each other can directly pass through the first non-metal substrate.
6. The back cover assembly according to claim 4, wherein the substrate structure comprises a second non-metallic substrate connected to the metallic substrate, and the substrate structure has a first through slit connected between the metallic substrate and the first non-metallic substrate, a first connecting body filled in the first through slit and connected between the metallic substrate and the first non-metallic substrate, a second through slit connected between the metallic substrate and the second non-metallic substrate, and a second connecting body filled in the second through slit and connected between the metallic substrate and the second non-metallic substrate, wherein the first non-metallic substrate, the metallic substrate, and the second non-metallic substrate cooperate with each other to form a back cover structure assembled on the back of a portable electronic device, and the antenna magnetic field generated after the coil structure and the IC chip are matched with each other can directly penetrate through the first non-metal substrate.
7. A portable electronic device using a back cover assembly, the back cover assembly comprising:
the substrate structure comprises a metal substrate and a first nonmetal substrate connected with the metal substrate;
an insulating structure comprising a first insulating layer disposed on the metal substrate and the first non-metal substrate; and
the coil structure is arranged on the first insulating layer in a surrounding manner so as to be electrically connected with an IC chip;
the coil structure is provided with a first partial coil and a second partial coil connected to the first partial coil, the first partial coil is arranged on the first insulating layer and located above the metal substrate, the second partial coil is arranged on the first insulating layer and located above the first non-metal substrate, and the percentage of the first partial coil in the coil structure is larger than that of the second partial coil in the coil structure;
the insulating structure comprises a second insulating layer arranged on the first insulating layer to cover the coil structure, the coil structure is provided with a first feed-in point and a second feed-in point which are exposed out of the second insulating layer and are electrically connected with the IC chip, and the first feed-in point and the second feed-in point are both arranged on the first insulating layer and are positioned above the first nonmetal substrate.
8. The portable electronic device of claim 7, wherein the substrate structure has a first through slit connected between the metal substrate and the first non-metal substrate and a first connecting body filled in the first through slit and connected between the metal substrate and the first non-metal substrate, wherein the first non-metal substrate and the metal substrate are matched with each other to form a back cover structure assembled on the back surface of the portable electronic device, and an antenna magnetic field generated by the coil structure and the IC chip after being matched with each other can directly pass through the first non-metal substrate.
9. The portable electronic device of claim 7, wherein the substrate structure comprises a second non-metallic substrate connected to the metallic substrate, and the substrate structure has a first through slit connected between the metallic substrate and the first non-metallic substrate, a first connector filled in the first through slit and connected between the metallic substrate and the first non-metallic substrate, a second through slit connected between the metallic substrate and the second non-metallic substrate, and a second connector filled in the second through slit and connected between the metallic substrate and the second non-metallic substrate, wherein the first non-metallic substrate, the metallic substrate, and the second non-metallic substrate cooperate with each other to form a back cover structure assembled on the back of the portable electronic device, and the antenna magnetic field generated after the coil structure and the IC chip are matched with each other can directly penetrate through the first non-metal substrate.
Priority Applications (1)
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| CN108666735A (en) | 2018-10-16 |
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