CN108666403A - A kind of high efficiency LED fluorescent powder coating processes and production equipment - Google Patents
A kind of high efficiency LED fluorescent powder coating processes and production equipment Download PDFInfo
- Publication number
- CN108666403A CN108666403A CN201710218860.6A CN201710218860A CN108666403A CN 108666403 A CN108666403 A CN 108666403A CN 201710218860 A CN201710218860 A CN 201710218860A CN 108666403 A CN108666403 A CN 108666403A
- Authority
- CN
- China
- Prior art keywords
- fluorescent powder
- multistage
- powder coating
- equipment
- spraying apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 26
- 238000000576 coating method Methods 0.000 title claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 title abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000005507 spraying Methods 0.000 claims abstract description 8
- 238000004321 preservation Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 1
- 238000011084 recovery Methods 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 6
- 239000011265 semifinished product Substances 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005070 sampling Methods 0.000 abstract description 3
- 239000000969 carrier Substances 0.000 abstract description 2
- 238000010924 continuous production Methods 0.000 abstract description 2
- 238000010410 dusting Methods 0.000 abstract description 2
- 239000011368 organic material Substances 0.000 abstract description 2
- 239000007921 spray Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001141 propulsive effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
Abstract
More dust nozzle multistage temperature control continuous tunnel furnace fairing fluorescent powder coating equipments, multiple dust nozzles simultaneously or alternately work in equipment so that equipment continuous production reduces downtime.And entire technical process is completed in a multi-temperature zone tunnel oven.It saves the process time and so that production capacity maximizes.Embodiment 1 is coated with before fluorescent powder aluminum LED semi-finished product microscope carriers being put in push-in multistage oven after thermal station preheats.The conveyer belt carrying LED semi-finished product of 2 adjustable-speeds pass sequentially through the spray equipment area of one or more than one.3 powder spraying apparatus can not stopped using guarantee producing line in turn.4 inspect by random samples in observation window sampling to adjust line speed or powder spraying apparatus ability come to effect progress management and control of dusting.5 multistage ovens make organic material volatilize as early as possible or realize that it chemically or physically changes.
Description
Application field
LED encapsulates manufacturing field and illumination application field.
Background
LED is widely used in every field at present, and encapsulation white light LEDs technique is mostly silica gel or epoxy or other transparent materials
Material is mixed with yellow or green and red fluorescence powder and generates white light.Part phosphor suspension is in transparent material simultaneously, in blue light
Excitation yellow fluorescent powder emits white light while generating very much many heats.But these transparent silica gel or epoxy or other transparent materials
Mostly it is the non-conductor of heat.And these materials can accelerate under heat and shortwave blue light or ultraviolet collective effect cracking without
It is transparent.Even if having partial encapsulation factory that can silver-colored light powder be deposited in chip surface as possible, or as shown in Figure 1, with deposition side of dusting
Formula makes fluorescent powder be attached to chip surface, but since the mechanical equipment that dusts at present all only has 1 nozzle and is not on automatic
Blanking efficiency is too low, is not suitable for producing in enormous quantities.
Invention content
As shown in Fig. 2, more dust nozzle multistage temperature control continuous tunnel furnace fairing fluorescent powder coating equipments, allow and cover luminescence chip
Fluorescent powder is close to luminescence chip or encapsulation base material, and excitated fluorescent powder generates heat simultaneously, heat will not it is quiet in silica gel or epoxy or
In other encapsulating materials, but most of heat is led rapidly via the holder or substrate of metal or ceramics by the way of passing to
The technique for going out LED can be with high volume applications in Packaging Industry, and since production capacity is promoted, which can even apply and COB or DOB
Encapsulation and production.Multiple dust nozzles simultaneously or alternately work in equipment so that equipment continuous production reduces downtime.And
This technical process is completed in a multi-temperature zone tunnel oven.It saves the process time and so that production capacity maximizes.
Description of the drawings：
Fig. 1 is that the blue chip on COB shows the figure coated with fluorescent powder.
Fig. 2 be processed blue chip substrate be placed on aluminum heat preservation microscope carrier on prepare coating fluorescent powder.
Fig. 3 is the structure chart of high efficiency LED fluorescent powder coating equipment.
Specific implementation mode is as shown in Figure 3
The aluminum microscope carrier equipped with LED semi-finished product is put in thermal station before 1 coating fluorescent powder and is preheating to required temperature.
LED semi-finished product microscope carriers are pushed into multisection type continuous tunnel furnace oven and push to conveyer belt by 2 charging propulsive mechanisms.
The conveyer belt of 3 adjustable-speeds carries the glue-spraying device that first LED semi-finished product passes sequentially through one or more than one
It is coated.And detection sensor device can be installed below each head of glue spraying, without adding in dust nozzle working range
Work material, the dust nozzle can not work.
4 powder spraying apparatus can use in turn, be produced so that whole producing line is ceaselessly smooth.
5 can sample sampling observation at any time in observation sampling window comes to adjust line speed or powder spraying apparatus ability to spray
Powder effect carries out management and control.
6 multisection type ovens can make the organic material for being mixed with spraying powder volatilize as early as possible or realize gamma transition etc. other
Chemically or physically change, to cure fluorescent powder.
7 discharging propulsion devices release semi-finished product microscope carrier.
Claims (6)
1. using or installing more than 1 fluorescent powder nozzle operation in 1 of LED fluorescent powder coating processes or 1 complete equipment.
Regulate and control 2. automatic streamline charging and technical process speed can penetrate line speed.
3. a nozzle can use in turn more than, can ceaselessly pipeline system produce.
4. preferably ensureing technological temperature equipped with heat preservation plummer.
5. realizing the technique in multi-segment type temperature control tunnel oven.
6. pair powder spraying apparatus reserves fluorescent powder cleaning and recovery area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710218860.6A CN108666403A (en) | 2017-03-31 | 2017-03-31 | A kind of high efficiency LED fluorescent powder coating processes and production equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710218860.6A CN108666403A (en) | 2017-03-31 | 2017-03-31 | A kind of high efficiency LED fluorescent powder coating processes and production equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108666403A true CN108666403A (en) | 2018-10-16 |
Family
ID=63784525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710218860.6A Pending CN108666403A (en) | 2017-03-31 | 2017-03-31 | A kind of high efficiency LED fluorescent powder coating processes and production equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108666403A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202290496U (en) * | 2011-11-01 | 2012-07-04 | 厦门煜明光电有限公司 | Spraying equipment for light-emitting diode (LED) packaging |
| CN103128041A (en) * | 2013-02-07 | 2013-06-05 | 华南理工大学 | Full automatic fluorescent powder coating process and device |
-
2017
- 2017-03-31 CN CN201710218860.6A patent/CN108666403A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202290496U (en) * | 2011-11-01 | 2012-07-04 | 厦门煜明光电有限公司 | Spraying equipment for light-emitting diode (LED) packaging |
| CN103128041A (en) * | 2013-02-07 | 2013-06-05 | 华南理工大学 | Full automatic fluorescent powder coating process and device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181016 |
|
| WD01 | Invention patent application deemed withdrawn after publication |