CN108666290A - Circuit package - Google Patents
Circuit package Download PDFInfo
- Publication number
- CN108666290A CN108666290A CN201710187491.9A CN201710187491A CN108666290A CN 108666290 A CN108666290 A CN 108666290A CN 201710187491 A CN201710187491 A CN 201710187491A CN 108666290 A CN108666290 A CN 108666290A
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- CN
- China
- Prior art keywords
- high pressure
- pressure pin
- distance
- circuit
- circuit package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
A kind of circuit package includes multiple first high pressure pins and at least one second high pressure pin, the first wherein adjacent high pressure pin between the second high pressure pin at a distance from be greater than or equal to a safety distance, and the distance between adjacent and same-phase multiple first high pressure pins be less than safety distance.Whereby, foregoing circuit packaging part can reduce required encapsulation volume and meet the safety standard of high voltage operation.
Description
【Technical field】
The present invention is a kind of related circuit package, especially a kind of circuit package of small size.
【Background technology】
Fig. 1 is please referred to, the control circuit for being applied to ac fan has multi-group power circuit L1, L2, is by corresponding
Multiple first high-voltage potential pins 20 (such as：Exchange firewire Alternating Current Line, ACL), multiple second
High pressure pin 30 (such as：AC neutral line Alternating Current Neutral, ACN) and multiple 40 (examples of low pressure pin
Such as：Control signal wire) it is constituted, to operate under the high voltage of such as, but not limited to 110 volts or 220 volts.In order to meet method
Rule require, and circuit package integrally needs the safety standard ability practical application by high voltage operation in electric equipment products.
However, when functional circuit 10 shown in FIG. 1 is packaged in same packaging part, the first high-voltage connecting of same electric power loop L1
Foot 20 is disposed adjacent with the second high pressure pin 30, and distance between the two is made to be greater than or equal to a safety distance DS, is then repeated
Aforementioned pin layout type and spacing, even if also the of the second high pressure pin 30 of an electric power loop L1 and another electric power loop L2
Distance between one high pressure pin 20 also has to be larger than or is equal to safety distance DS.Therefore, multiple first in traditional circuit packaging part
Distance between high pressure pin 20 and multiple second high pressure pins 30 is all higher than or is equal to safety distance DS, so that needed for packaging part
Encapsulation volume will increase with the group number of electric power loop and be significantly increased, and cannot achieve the demand of microminiaturization encapsulation.
In conclusion it is the target that current pole need to make great efforts to provide a kind of circuit package of small size.
【Invention content】
The present invention provides a kind of circuit package, shortens first between adjacent and same-phase multiple first high pressure pins
Distance, wherein the first adjacent high pressure pin between the second high pressure pin at a distance from be greater than or equal to a safety distance, and first
Distance is less than safety distance.Whereby, circuit package of the invention can reduce required encapsulation volume and meet high voltage operation
Safety standard.
The circuit package of one embodiment of the invention includes：One functional circuit, multiple first high pressure pins, at least one second
High pressure pin, multiple low pressure pins and a packaging body.Multiple first high pressure pins and functional circuit are electrically connected, and multiple the
One high pressure pin connects a first phase contact of a corresponding operating voltage, and plurality of first high pressure pin is adjacent to be set
It sets, and the distance between multiple first high pressure pins is less than or equal to one first distance.At least one second high pressure pin and function electricity
Road is electrically connected, and the second high pressure pin connects a second phase contact of corresponding operating voltage, and every one first high-voltage connecting
Foot forms an electric power loop with corresponding second high pressure pin, which is characterized in that first phase contact and second phase contact
Operating voltage have a phase difference, the second adjacent high pressure pin between the first high pressure pin at a distance from be greater than or equal to one peace
Rule from, and first distance be less than safety distance.Multiple low pressure pins are electrically connected with functional circuit, and multiple low pressure pin phases
Neighbour setting, wherein adjacent low pressure pin between the first high pressure pin and the second high pressure pin at a distance from be greater than or equal to safety
Distance.Packaging body encapsulation function circuit, and expose multiple first high pressure pins, the second high pressure pin and multiple low pressure pins.
Below by the appended schema elaborate of specific embodiment cooperation, when being easier to understand the purpose of the present invention, skill
Art content, feature and its it is reached the effect of.
【Description of the drawings】
Fig. 1 is a schematic diagram, shows known circuit package.
Fig. 2 is a schematic diagram, shows the circuit package of one embodiment of the invention.
Fig. 3 is a schematic diagram, shows the circuit package of another embodiment of the present invention.
Fig. 4 is a schematic diagram, shows the circuit package of further embodiment of this invention.
Fig. 5 is a schematic diagram, shows the circuit package of yet another embodiment of the invention.
【Symbol description】
The first distances of D1
D2 second distances
DS safety distances
L1, L2 electric power loop
S1, S2 circuit switching
10 functional circuits
12 microcontrollers
20 first high pressure pins
30 second high pressure pins
40,40a, 40b, 40c low pressure pin
50 packaging bodies
【Specific implementation mode】
It will be described various embodiments of the present invention below, and coordinate schema as illustration.Other than multiple detailed description,
The present invention also can be widely performed in other embodiments, and the replacement easily of any embodiment, modification, equivalence changes are all
Within the scope of the present invention, and it is subject to claim.In the description of specification, in order to make reader to the present invention
There is more complete understanding, provides many specific details；However, the present invention may be before clipped or whole specific details
It puts, can still implement.Moreover, it is well known that the step of or component be not described in details, to avoid to the present invention formed not
Necessary limitation.Same or similar component will be indicated with same or like symbol in schema.It is specifically intended that schema is only
It is used for signal, not the actual size of proxy component or quantity, some details may not drawn completely, in the hope of the letter of schema
It is clean.
Fig. 2 is please referred to, the circuit package of one embodiment of the invention includes：One functional circuit 10, multiple first high pressures
Pin 20, at least one second high pressure pin 30, multiple low pressure pin 40a and a packaging body 50.In an embodiment, function electricity
Road 10 includes an integrated circuit (IC)；For example, functional circuit is a metal oxide semiconductcor field effect transistor
(MOSFET), but not limited to this.In an embodiment, functional circuit 10 have a microcontroller 12, multi-group power circuit L1,
L2 and circuit switching S1, S2, to control the different function of same external electronic；For example, microcontroller 12 is controllable
Circuit switching S1, S2 processed select a closing, and the slewing rate switching of same electric fan is controlled so that different electric power loop L1, L2 is connected
For high speed or low speed, but not limited to this.In another embodiment, functional circuit 10 has a microcontroller 12, multi-group power
Circuit L1, L2 and circuit switching S1, S2, to control the function of multiple external electronics；For example, different power supplys returns
Road L1, L2 can simultaneously and one fan of independent control and an electric light on off state, but not limited to this.
Multiple first high pressure pins 20 and functional circuit 10 are electrically connected, and multiple first high pressure pins 20 connect it is corresponding
An operating voltage a first phase contact (not being painted).For example, operating voltage is 100 volts, 110 volts, 120 volts
Special or 220 volts, but not limited to this.It is understood that multiple first high pressure pins 20 are all connected to same first phase
Contact can also be connected to different multiple first phase contacts, and only the voltage-phase of multiple first high pressure pins 20 must be phase
With；For example, multiple first high pressure pins 20 are same-phase, and are connected to an exchange firewire (ACL).
It should be noted that the first high pressure pin 20 of different multiple electric power loop L1, L2 is to be disposed adjacent to each other,
Since multiple first high pressure pins 20 are same-phase, the safety standard jump electricity to be avoided will not be led to the problem of, therefore different
The first high pressure pin 20 distance to each other of multiple electric power loop L1, L2 be less than or equal to one first distance D1, wherein the
One distance D1 is less than a safety distance DS, and different from the circuit layout mode of above-mentioned Fig. 1.
At least one second high pressure pin 30 is electrically connected with functional circuit 10, and the second high pressure pin 30 connect it is corresponding
One second phase contact (not being painted) of operating voltage；For example, the second high pressure pin 30 is connected to AC neutral line (ACN).
Multiple low pressure pin 40a are electrically connected with functional circuit 10, and multiple low pressure pin 40a are adjacent set to each other
Set, wherein adjacent low pressure pin 40a between multiple first high pressure pins 20 or the second high pressure pin 30 at a distance from be more than or wait
In safety distance DS.It is understood that each low pressure pin 40a is received and is transmitted an at least external signal to a microcontroller
12, an at least control instruction is generated after being handled via microcontroller 12, functional circuit is made to execute a circuit function, related embodiment
It has been observed that details are not described herein.
50 encapsulation function circuit 10 of packaging body, and expose multiple first high pressure pins 20, the second high pressure pin 30 and more
A low pressure pin 40.
In order to meet the safety standard of high voltage operation, in the circuit package of the present invention, different multiple power supplys return
In road L1, L2 the first adjacent high pressure pin 20 between the second high pressure pin 30 at a distance from be greater than or equal to a safety distance DS.
For example, if the operating voltage of electric power loop L1 is 110V, safety distance DS is 3.5mm；If the work of electric power loop L1
Voltage is 220V, then safety distance DS is 5.0mm.Only it is noted that between adjacent and same-phase multiple first high pressure pins
The first distance D1 and multiple second high pressure pins between second distance D2, respectively less than adjacent and out of phase the first high pressure
Safety distance DS between pin 20 and the second high pressure pin 30, in other words, multiple first high pressure pins 20 and multiple second high
Crimping foot 30 is compact layout, and the first distance D1 and second distance D2 is made to be respectively less than safety distance DS, still meets high-voltage electricity simultaneously
The safety standard on road, to reduce the encapsulation volume needed for circuit package and meet the safety standard of high voltage operation.
It should be noted that there is a phase difference between aforementioned first phase contact and second phase contact, that is, first
The voltage-phase of high pressure pin 20 and the second high pressure pin 30 to each other is different, and the second high pressure pin 30 and corresponding the
One high pressure pin 20 forms electric power loop L1, L2；For example, the phase difference between first phase contact and second phase contact is
180 degree.In an embodiment, electric power loop is ac voltage circuit, then first phase contact is exchange firewire, and second phase
Contact is AC neutral line, therefore phase difference between the two is 180 degree.In another embodiment, electric power loop pushes back for direct current
Road, then first phase contact is considered as High voltage output/input terminal, and second phase contact is considered as low pressure input/output end, therefore two
Phase difference between person also can be considered 180 degree.Tool usually intellectual is not limited thereto when can voluntarily modify transformation.
Fig. 3 is please referred to, in an embodiment, wiring and its control of a functional circuit are designed in order to facilitate user's elasticity
Mode processed, multiple low pressure pin 40a, 40b, 40c can have different wire laying modes；For example, multiple low pressure pin 40a connect
It receives an at least external signal and is transmitted to a microcontroller 12, microcontroller 12 will generate an at least control instruction and via multiple
Low pressure pin 40b is exported to an external circuit, again via multiple low pressure after then above-mentioned control instruction is handled via external circuit
Functional circuit 10 inside pin 40c inputs, makes functional circuit execute a circuit function, related embodiment is it has been observed that herein
It repeats no more.
Fig. 4 is please referred to, in an embodiment, the quantity of the second high pressure pin 30 can be multiple, that is, multiple second high pressures
Pin 30 is disposed adjacent.It is understood that multiple second high pressure pins 30 are all connected to same second phase contact, it can also
Different multiple second phase contacts are connected to, only the voltage-phase of multiple second high pressure pins 30 must be identical；Citing
For, multiple second high pressure pins 30 are same-phase, and are connected to an AC neutral line (ACN).Similarly, different multiple power supplys return
The second high pressure pin 30 of road L1, L2 are to be disposed adjacent to each other, will not since multiple second high pressure pins 30 are same-phase
Lead to the problem of the safety standard jump electricity to be avoided, thus the second high pressure pin 30 of different multiple electric power loop L1, L2 that
Distance around here is less than or equal to a second distance D2, and wherein second distance D2 is less than a safety distance DS, and with above-mentioned Fig. 1's
Circuit layout mode is different.
Please with reference to Fig. 4 and Fig. 5, in an embodiment, the first distance D1 is 1.5mm；In another embodiment, first
Distance D1 is 0.5mm, therefore can shorten the arrangement space needed for multiple first high pressure pins 20, and then reduces circuit package institute
The encapsulation volume needed, and adjacent and same-phase multiple first high pressure pins 20 still conform to the safety standard of high voltage operation.
In an embodiment, multiple distances between multiple first high pressure pins 20 are identical, that is, multiple first high pressure pins 20 are with solid
The first fixed distance D1 is disposed adjacent.It is understood that multiple first high pressure pins 20 can also be disposed adjacent for Unequal distance, but
It is not limited.
Similarly, in an embodiment, second distance D2 is 1.5mm；In another embodiment, second distance D2 is 0.5mm,
Therefore it can shorten the arrangement space needed for multiple second high pressure pins 30, and then reduce the encapsulation volume needed for circuit package,
And adjacent and same-phase multiple second high pressure pins 30 still conform to the safety standard of high voltage operation.In an embodiment,
Multiple distances between multiple second high pressure pins 30 are identical, that is, multiple second high pressure pins 30 are with fixed second distance D2
It is disposed adjacent.It is understood that multiple second high pressure pins 30 can also be disposed adjacent for Unequal distance, but not limited to this.
It is understood that in an embodiment, the first distance D1 is identical with second distance D2.For example, multiple
Multiple distances between first high pressure pin 20 are 0.5mm, and multiple distances between multiple second high pressure pins 30 are
0.5mm to shorten the arrangement space needed for multiple first high pressure pins 20 and multiple second high pressure pins 30 simultaneously, and then reduces
Encapsulation volume needed for circuit package.
Please continue to refer to Fig. 4, in an embodiment, multiple first high pressure pins of different multiple electric power loop L1, L2
20 are set to the same side of circuit package with multiple second high pressure pins 30, and but not limited to this.Fig. 5 is please referred to, in another
In embodiment, multiple first high pressure pins 20 and the multiple second high pressure pins 30 of different multiple electric power loop L1, L2 are arranged
In the phase heteropleural of circuit package, the condition that above-mentioned first distance D1 and second distance D2 is more than safety distance DS is still conformed to,
To reduce the encapsulation volume needed for circuit package and meet the safety standard of high voltage operation.Tool usually intellectual works as can be certainly
Row modification transformation, is not limited thereto.
The person of should be noted, the single row direct insert that the encapsulation volume of traditional single row direct insert packaging part (SIP) is huger and single seal
The permitted pin count of piece installing is limited, it is therefore desirable to be realized using multiple single row direct insert packaging parts on same circuit board
The circuit design of more pins, and lead to that piece is costly, production cost is expensive, integrated circuit arrangement space is huge.
In order to reduce the encapsulation volume needed for circuit package and meet the safety standard of high voltage operation, circuit package of the invention
Can be adhesive surface packaging part (SMD package), ball bar array package (BGA package), thin compact package part
(TSOP) or similar micromation packaging part, with multiple high pressure pins and multiple low pressure pins, and reduction can be realized
Encapsulation volume and meet high voltage operation safety standard purpose.Tool usually intellectual is when can voluntarily modify transformation, not
As limit.
In summary, circuit package of the invention shortens adjacent and same-phase multiple in different multiple electric power loops
The first distance between first high pressure pin, wherein the first adjacent high pressure pin between the second high pressure pin at a distance from be more than or wait
In a safety distance, and the first distance is less than safety distance.Whereby, circuit package of the invention can reduce required encapsulation volume
And meet the safety standard of high voltage operation.
Embodiment described above is only technological thought and feature to illustrate the invention, and purpose makes to be familiar with this skill
The personage of skill can understand the content of the present invention and implement according to this, when cannot with restriction the present invention the scope of the claims, i.e., generally
According to equivalent change or modification made by disclosed spirit, should cover in the scope of the claims of the present invention.
Claims (14)
1. a kind of circuit package, which is characterized in that include：
One functional circuit；
Multiple first high pressure pins are electrically connected with the functional circuit, and multiple first high pressure pin connection corresponding one
One first phase contact of operating voltage, wherein multiple first high pressure pin is disposed adjacent, and multiple first high pressure pin
Between distance be less than or equal to one first distance；
At least one second high pressure pin is electrically connected with the functional circuit, which connects the corresponding work
One second phase contact of voltage, and each first high pressure pin forms a power supply with the corresponding second high pressure pin and returns
The operating voltage of road, wherein the first phase contact and the second phase contact has a phase difference, and adjacent this second is high
Crimp foot between the first high pressure pin at a distance from be greater than or equal to a safety distance, and this first distance be less than the safety away from
From；
Multiple low pressure pins are electrically connected with the functional circuit, and multiple low pressure pin is disposed adjacent, wherein this adjacent is low
Crimp foot between the first high pressure pin and the second high pressure pin at a distance from be greater than or equal to the safety distance；And
One packaging body, to encapsulate the functional circuit, and expose multiple first high pressure pin, at least the second high pressure pin and
Multiple low pressure pin.
2. circuit package as described in claim 1, which is characterized in that the second high pressure pin is multiple second high-voltage connectings
Foot, multiple second high pressure pin are disposed adjacent, and the distance between multiple second high pressure pin be less than or equal to one second away from
From wherein the second distance is less than the safety distance.
3. circuit package as claimed in claim 2, which is characterized in that multiple distances between multiple second high pressure pin are
It is identical.
4. circuit package as described in claim 1, which is characterized in that multiple distances between multiple first high pressure pin are
It is identical.
5. circuit package as described in claim 1, which is characterized in that between the first phase contact and the second phase contact
The phase difference be 180 degree.
6. circuit package as described in claim 1, which is characterized in that each first high pressure pin with it is corresponding this
It is an ac voltage circuit that two high pressure pins, which are formed by the electric power loop,.
7. circuit package as described in claim 1, which is characterized in that the operating voltage be 100 volts, 110 volts, 120
Volt or 220 volts.
8. circuit package as described in claim 1, which is characterized in that multiple first high pressure pin and multiple second high
Crimping foot is set to the same side of the circuit package.
9. circuit package as described in claim 1, which is characterized in that safety distance is 3.5mm or 5.0mm.
10. circuit package as described in claim 1, which is characterized in that first distance and the second distance are at least within
One of be 1.5mm.
11. circuit package as described in claim 1, which is characterized in that first distance and the second distance are at least within
One of be 0.5mm.
12. circuit package as described in claim 1, which is characterized in that the functional circuit includes an integrated circuit (IC).
13. circuit package as described in claim 1, which is characterized in that the functional circuit is partly led comprising a metal oxide
Body field-effect transistor (MOSFET).
14. circuit package as described in claim 1, which is characterized in that it includes adhesive surface packaging part (SMD
Package), ball bar array package (BGA package) or thin compact package part (TSOP).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710187491.9A CN108666290B (en) | 2017-03-27 | 2017-03-27 | Circuit packaging piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710187491.9A CN108666290B (en) | 2017-03-27 | 2017-03-27 | Circuit packaging piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108666290A true CN108666290A (en) | 2018-10-16 |
| CN108666290B CN108666290B (en) | 2020-04-28 |
Family
ID=63785309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710187491.9A Active CN108666290B (en) | 2017-03-27 | 2017-03-27 | Circuit packaging piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108666290B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080061408A1 (en) * | 2006-09-08 | 2008-03-13 | National Semiconductor Corporation | Integrated circuit package |
| US20110180942A1 (en) * | 2010-01-28 | 2011-07-28 | Renesas Electronics Corporation | Interconnection structure |
| CN103296187A (en) * | 2013-06-06 | 2013-09-11 | 东莞博用电子科技有限公司 | Packaging structure for LED alternating-current driving high-voltage chip |
| CN106449517A (en) * | 2016-11-22 | 2017-02-22 | 华蓥旗邦微电子有限公司 | Stack type single base island SIP (System in Package) packaging process |
-
2017
- 2017-03-27 CN CN201710187491.9A patent/CN108666290B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080061408A1 (en) * | 2006-09-08 | 2008-03-13 | National Semiconductor Corporation | Integrated circuit package |
| US20110180942A1 (en) * | 2010-01-28 | 2011-07-28 | Renesas Electronics Corporation | Interconnection structure |
| CN103296187A (en) * | 2013-06-06 | 2013-09-11 | 东莞博用电子科技有限公司 | Packaging structure for LED alternating-current driving high-voltage chip |
| CN106449517A (en) * | 2016-11-22 | 2017-02-22 | 华蓥旗邦微电子有限公司 | Stack type single base island SIP (System in Package) packaging process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108666290B (en) | 2020-04-28 |
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