CN108663487A - A kind of gas sensor - Google Patents
A kind of gas sensor Download PDFInfo
- Publication number
- CN108663487A CN108663487A CN201810607396.4A CN201810607396A CN108663487A CN 108663487 A CN108663487 A CN 108663487A CN 201810607396 A CN201810607396 A CN 201810607396A CN 108663487 A CN108663487 A CN 108663487A
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- shell
- flexible shell
- gas sensor
- substrate
- chip
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Food Science & Technology (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Abstract
The present invention relates to gas sensors, including：Substrate, multiple sensing chips and multiple flexible shells, the multiple sensing chip includes multiple chip units being cascading from bottom to top, bottom chip unit is arranged on the substrate, and other chip units are cascading respectively on the multiple flexible shell；Each flexible shell includes inverted U-shaped structure, and the inverted U-shaped structure has a supporting table, for placing at least one chip unit on it.Scheme according to the present invention, sensing chip and the flexible shell being stacked layer by layer is arranged in the present invention, it is possible thereby to realize in a sensor there is multiple sensing chips, and flexibility can arbitrarily change shape according to the arrangement between the shape and multiple sensing chips of sensing chip, so as to apply in a variety of different scenes and expand the application field of the gas sensor.
Description
Technical field
The present invention relates to sensor device technical field more particularly to a kind of gas sensors.
Background technology
Technology in order to increase sharply, require the ability of capture and processing information to be increasingly enhanced with information age information content is sent out
Exhibition trend is consistent, and the requirements such as accuracy, the reliability and sensitivity of gas sensor are increasingly stringenter, and traditional
Gas sensor volume is big, it is difficult to meet above-mentioned high performance requirements, therefore, they are gradually micro- by various types of high-performance
Type sensor is replaced.
With the development that miniaturization of electronic products is miniaturized, the requirement that electronic product minimizes its internal component is more next
It is higher.Gas sensor is applied to as common sensor in a variety of electronic products, therefore the Miniaturization Design of gas sensor
Also become focal point.In order to ensure the Miniaturization Design of gas sensor, it is based on MEMS (Micro-Electro-
MechanicalSystem, MEMS) gas sensor increasingly paid close attention to by people.
Gas sensor based on MEMS technology, including substrate, are fixed on the shell of the substrate, the substrate with it is described
Shell constitutes the gas sensor outer enclosure structure.It is fixedly installed gas in the outer enclosure structure, on the substrate
Body sensor chip and IC chip, gas sensor chip is with IC chip by way of metal lead wire routing
It is electrically connected, is provided with pad on substrate, gas sensor interior chip is electrically connected by substrate pads with external electronic circuits, together
When, gas sensor is fixed on by pad on external mainboard.The gas sensor of traditional structure, gas sensor chip are direct
It is fixed on substrate, during gas sensor assembly, use, gas sensor chip incudes extraneous air gas concentration,
So that gas sensor is generated error, leads to gas sensor performance issue.
It is therefore desirable to propose a kind of improvement, to overcome traditional structure gas sensor defect.
Invention content
For the above problem of the prior art, the object of the present invention is to provide a kind of gas sensors, including：Substrate,
Multiple sensing chips and multiple flexible shells, the multiple sensing chip include multiple cores being cascading from bottom to top
Blade unit, bottom chip unit are arranged on the substrate, and other chip units are cascading respectively the multiple
On flexible shell；
Each flexible shell includes inverted U-shaped structure, the inverted U-shaped structure have a supporting table, for place on it to
A few chip unit.
Further, the multiple flexible shell includes bottom shell, the top shell and is arranged described most lower
Multiple middle casings between square shell and the top shell；
The multiple flexible shell is each attached on the substrate.
Further, any flexible shell includes bound edge in the multiple flexible shell, and the bound edge is along the inverted U
Structure periphery extends, so that the flexible shell forms the type of falling Ω.
Further, the bound edge is integrally formed with the inverted U-shaped structure.
Further, multiple bound edges of the multiple flexible shell are each attached on the substrate, by the flexible shell
Body is fixed on the substrate.
Further, the size of the multiple flexible shell is sequentially increased from bottom to top；
The size of the top shell is more than the size of the middle casing, and the size of the middle casing is more than described
The size of bottom shell.
Further, there is in the multiple flexible shell between two flexible shells of arbitrary neighborhood supporting rack.
Further, there is sealing element in the bound edge and the fixed side of the substrate, in the flexible shell
It is sealed when fixing on the substrate.
Further, the flexible shell has multiple through-holes.
Scheme according to the present invention, the present invention are arranged sensing chip and the flexible shell being stacked layer by layer, thus may be used
To realize having multiple sensing chips in a sensor, and flexible shape that can be according to sensing chip and multiple sensing cores
Arrangement between piece arbitrarily changes shape, so as to apply in a variety of different scenes and expand the gas sensor
Application field.
According to the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will be brighter
The above and other objects, advantages and features of the present invention.
Description of the drawings
It, below will be to required in embodiment or description of the prior art in order to illustrate more clearly of technical scheme of the present invention
The attached drawing used is briefly described.It should be evident that drawings in the following description are only some embodiments of the invention, it is right
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Its attached drawing.
Fig. 1 is the schematic diagram of the gas sensor of one embodiment of the invention.
Drawing reference numeral：
1- substrates, 2- sensing chips, 3- flexible shells, 31- inverted U-shaped structures, 311- supporting tables, 32- bound edges, 4- supports
Frame, 5- sealing elements.
Specific implementation mode
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
Fig. 1 shows the schematic diagram of the gas sensor of one embodiment of the invention.As shown in Figure 1, of the invention
A kind of gas sensor is provided, including：Substrate 1, multiple sensing chips 2 and multiple flexible shells 3, the multiple sensing core
Piece 2 includes multiple chip units being cascading from bottom to top, and bottom chip unit is arranged on the substrate 1,
Its chip unit is cascading respectively on the multiple flexible shell 3；
Each flexible shell 3 includes inverted U-shaped structure 31, and the inverted U-shaped structure 31 has a supporting table 311, at it
It is upper to place at least one chip unit.
Further, the multiple flexible shell 3 includes bottom shell, the top shell and is arranged described most lower
Multiple middle casings between square shell and the top shell；
The multiple flexible shell 3 is each attached on the substrate 1.
Further, any flexible shell 3 includes bound edge 32 in the multiple flexible shell 3, and the bound edge 32 is along institute
The extension of 31 periphery of inverted U-shaped structure is stated, so that the flexible shell 3 forms the type of falling Ω.
Further, the bound edge 32 is integrally formed with the inverted U-shaped structure 31.
Further, multiple bound edges 32 of the multiple flexible shell 3 are each attached on the substrate 1, will be described soft
Property shell 3 is fixed on the substrate 1.
Further, the size of the multiple flexible shell 3 is sequentially increased from bottom to top；
The size of the top shell is more than the size of the middle casing, and the size of the middle casing is more than described
The size of bottom shell.
Further, there is in the multiple flexible shell 3 between two flexible shells 3 of arbitrary neighborhood supporting rack 4.
Further, there is sealing element 5 in the bound edge 32 and 1 fixed side of the substrate, in the flexibility
Shell 3 is sealed when being fixed on the substrate 1.
Further, the flexible shell 3 has multiple through-holes.In one embodiment, which can be arranged in U
In type structure 31.The quantity of through-hole can be set according to actual demand, for example, each flexible shell 3 can be arranged three, five
A, seven, the through-holes such as eight or nine.
Sensing chip 2 and the flexible shell 3 being stacked layer by layer is arranged in scheme according to the present invention, the present invention, thus
It may be implemented have multiple sensing chips 2 in a sensor, and flexible shape that can be according to sensing chip 2 and multiple biographies
Arrangement between sense chip 2 arbitrarily changes shape, so as to apply in a variety of different scenes and expand the gas
The application field of sensor.
Above description has fully disclosed the specific implementation mode of the present invention.It should be pointed out that being familiar with the field
Technical staff is to any change for being done of specific implementation mode of the present invention all without departing from the range of claims of the present invention.
Correspondingly, the scope of the claims of the invention is also not limited only to previous embodiment.
Claims (9)
1. a kind of gas sensor, which is characterized in that including：Substrate, multiple sensing chips and multiple flexible shells are described more
A sensing chip includes multiple chip units being cascading from bottom to top, and bottom chip unit is arranged in the substrate
On, other chip units are cascading respectively on the multiple flexible shell；
Each flexible shell includes inverted U-shaped structure, and the inverted U-shaped structure has a supporting table, for placing at least one on it
A chip unit.
2. gas sensor according to claim 1, which is characterized in that the multiple flexible shell includes bottom shell
Body, the top shell and the multiple middle casings being arranged between the bottom shell and the top shell；
The multiple flexible shell is each attached on the substrate.
3. gas sensor according to claim 2, which is characterized in that any flexible shell in the multiple flexible shell
Including bound edge, the bound edge extends along the inverted U-shaped structure periphery, so that the flexible shell forms the type of falling Ω.
4. gas sensor according to claim 3, which is characterized in that the bound edge and the inverted U-shaped structure one at
Type.
5. gas sensor according to claim 3, which is characterized in that multiple bound edges of the multiple flexible shell are solid
Determine that on the substrate, the flexible shell is fixed on the substrate.
6. gas sensor according to claim 3, which is characterized in that the size of the multiple flexible shell is from bottom to top
It is sequentially increased；
The size of the top shell is more than the size of the middle casing, and the size of the middle casing is most lower more than described
The size of square shell.
7. gas sensor according to claim 6, which is characterized in that arbitrary neighborhood two in the multiple flexible shell
There is supporting rack between flexible shell.
8. gas sensor according to claim 3, which is characterized in that in the bound edge and the fixed side of the substrate
With sealing element, for being sealed when the flexible shell is fixed on the substrate.
9. according to the gas sensor described in any one of claim 1-8, which is characterized in that the flexible shell has multiple
Through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810607396.4A CN108663487A (en) | 2018-06-13 | 2018-06-13 | A kind of gas sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810607396.4A CN108663487A (en) | 2018-06-13 | 2018-06-13 | A kind of gas sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108663487A true CN108663487A (en) | 2018-10-16 |
Family
ID=63774660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810607396.4A Pending CN108663487A (en) | 2018-06-13 | 2018-06-13 | A kind of gas sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108663487A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111103331A (en) * | 2019-12-27 | 2020-05-05 | 安徽芯淮电子有限公司 | Full-flexible heatable gas sensor and manufacturing method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202601616U (en) * | 2012-05-31 | 2012-12-12 | 苏州晶方半导体科技股份有限公司 | Infrared sensor packaging structure |
| CN103449353A (en) * | 2012-05-31 | 2013-12-18 | 罗伯特·博世有限公司 | Sensor module |
| CN203719796U (en) * | 2014-02-28 | 2014-07-16 | 厦门乃尔电子有限公司 | Pressure sensor flexible package structure for multipoint measurement |
| KR101510597B1 (en) * | 2013-12-24 | 2015-04-08 | 전북대학교산학협력단 | Flexible micro gas sensor using nanostructure array and manufacturing method for the same |
| CN103650651B (en) * | 2011-07-05 | 2016-08-17 | 株式会社村田制作所 | flexible multilayer substrate |
| CN106365105A (en) * | 2016-09-24 | 2017-02-01 | 苏州捷研芯纳米科技有限公司 | MEMS technology based gas sensor package and batch processing method thereof |
| CN104132658B (en) * | 2013-04-30 | 2018-01-16 | 大西洋惯性系统有限公司 | Mems sensor |
| CN107870225A (en) * | 2017-11-06 | 2018-04-03 | 余帝乾 | A kind of flexible stereo encapsulates gas sensor |
-
2018
- 2018-06-13 CN CN201810607396.4A patent/CN108663487A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103650651B (en) * | 2011-07-05 | 2016-08-17 | 株式会社村田制作所 | flexible multilayer substrate |
| CN202601616U (en) * | 2012-05-31 | 2012-12-12 | 苏州晶方半导体科技股份有限公司 | Infrared sensor packaging structure |
| CN103449353A (en) * | 2012-05-31 | 2013-12-18 | 罗伯特·博世有限公司 | Sensor module |
| CN104132658B (en) * | 2013-04-30 | 2018-01-16 | 大西洋惯性系统有限公司 | Mems sensor |
| KR101510597B1 (en) * | 2013-12-24 | 2015-04-08 | 전북대학교산학협력단 | Flexible micro gas sensor using nanostructure array and manufacturing method for the same |
| CN203719796U (en) * | 2014-02-28 | 2014-07-16 | 厦门乃尔电子有限公司 | Pressure sensor flexible package structure for multipoint measurement |
| CN106365105A (en) * | 2016-09-24 | 2017-02-01 | 苏州捷研芯纳米科技有限公司 | MEMS technology based gas sensor package and batch processing method thereof |
| CN107870225A (en) * | 2017-11-06 | 2018-04-03 | 余帝乾 | A kind of flexible stereo encapsulates gas sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111103331A (en) * | 2019-12-27 | 2020-05-05 | 安徽芯淮电子有限公司 | Full-flexible heatable gas sensor and manufacturing method thereof |
| CN111103331B (en) * | 2019-12-27 | 2021-05-25 | 安徽芯淮电子有限公司 | Full-flexible heatable gas sensor and manufacturing method thereof |
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Application publication date: 20181016 |