CN108654492A - A kind of molding powder bonding device - Google Patents
A kind of molding powder bonding device Download PDFInfo
- Publication number
- CN108654492A CN108654492A CN201810428613.3A CN201810428613A CN108654492A CN 108654492 A CN108654492 A CN 108654492A CN 201810428613 A CN201810428613 A CN 201810428613A CN 108654492 A CN108654492 A CN 108654492A
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- China
- Prior art keywords
- bonding
- cylinder
- chamber
- molding powder
- nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 title claims abstract description 73
- 238000000465 moulding Methods 0.000 title claims abstract description 47
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 90
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 45
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 239000007789 gas Substances 0.000 claims abstract description 10
- XKMRRTOUMJRJIA-UHFFFAOYSA-N ammonia nh3 Chemical compound N.N XKMRRTOUMJRJIA-UHFFFAOYSA-N 0.000 claims abstract description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000001681 protective effect Effects 0.000 abstract description 5
- 238000003756 stirring Methods 0.000 abstract description 4
- 239000000049 pigment Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000007590 electrostatic spraying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
- B01F31/29—Mixing by periodically deforming flexible tubular members through which the material is flowing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F33/00—Other mixers; Mixing plants; Combinations of mixers
- B01F33/40—Mixers using gas or liquid agitation, e.g. with air supply tubes
- B01F33/406—Mixers using gas or liquid agitation, e.g. with air supply tubes in receptacles with gas supply only at the bottom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/90—Heating or cooling systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/90—Heating or cooling systems
- B01F2035/99—Heating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
The present invention is difficult to the drawback that strictly control bonding temperature causes bonding effect difference for molding powder bonding equipment in the prior art, a kind of molding powder bonding device is provided, including bonding cylinder, two pieces of microwell plates are provided in the bonding cylinder, microwell plate is equipped with multiple through-holes through microwell plate upper and lower ends face, bonding cylinder is divided into outlet chamber by two pieces of microwell plates from top to bottom, three chambers of bonding chamber and inlet chamber, the bonding cylinder is equipped with the escape pipe being connected to outlet chamber, the feed inlet and outlet that can be closed being connected to bonding chamber, be provided with outside the bonding cylinder can into inlet chamber supplying nitrogen nitrogen supply (NS) device, it can be the heating device for transferring to the nitrogen of inlet chamber and heating that nitrogen supply (NS) device, which is equipped with,.The present invention uses nitrogen as protective gas, while also using nitrogen that can more be accurately controlled molding powder bonding temperature as the medium of heating, stirring, promotes the quality of molding powder bonding.
Description
Technical field
The invention belongs to molding powder production equipment technical fields, and in particular to a kind of molding powder bonding device.
Background technology
Molding powder is the material of workmanship of spraying plastics, is exactly that plastic powders pass through compressed air after high-temperature heating in simple terms
The wind (passing through electrostatic spraying) given is sprayed onto material surface.Molding powder binding is that toner base-material is heated to slightly below resin softening
The temperature of point, at this time working condition should be in toner base-material surface and melt, and still in solid inside toner base-material
State allows the resin powder particles of pigment powder particle and softening to cohere at this time, then cools down finished product rapidly again.Existing modeling
Powder bound device is employed nitrogen as mostly as protective gas, is realized in such a way that agitating device is stirred raw material powder
Heating to molding powder needs strictly to control the temperature-rise period of molding powder in bonding, and binding temperature is too low, toner base-material table
Thawing is not enough by layer, and pigment powder is caused to be tied on toner base-material not secured enough and be not enough；If bonding
Temperature is higher than critical-temperature, and may result in entire toner matrix, to melt bonding agglomerating, cannot achieve bonding.Meanwhile in nation
Ensure that raw material powder uniformity in the reactor and mobility can just obtain preferable bonding effect during fixed, is otherwise easy
Product cut size is caused to increase, mobility declines, in order to ensure the uniformity and mobility of raw material powder in the reactor, so needing
Agitating device is wanted constantly to be stirred to raw material powder, and agitating device is constantly stirred raw material powder and inevitably results in original
The rising for expecting powder temperature, causes bonding effect poor.
Invention content
The present invention is difficult to strictly control bonding temperature for molding powder bonding equipment in the prior art and causes bonding effect difference
Drawback provides a kind of molding powder bonding device, which uses nitrogen as protective gas, while nitrogen conduct also being used to heat,
The medium of stirring can more be accurately controlled molding powder bonding temperature, promote the quality of molding powder bonding.
The goal of the invention of the present invention is achieved through the following technical solutions：A kind of molding powder bonding device, including bonding cylinder,
It is provided with two pieces of microwell plates in the bonding cylinder, microwell plate is equipped with multiple through-holes through microwell plate upper and lower ends face, two pieces
Bonding cylinder is divided into three outlet chamber, bonding chamber and inlet chamber chambers by microwell plate from top to bottom, and the bonding cylinder is equipped with
The escape pipe being connected to outlet chamber, the feed inlet and outlet that can be closed being connected to bonding chamber, be provided with outside the bonding cylinder can into
The nitrogen supply (NS) device of supplying nitrogen in air cavity, it can be the heating for transferring to the nitrogen of inlet chamber and heating that nitrogen supply (NS) device, which is equipped with,
Device.
In said program, molding powder and pigment powder are poured into bonding intracavitary by feed inlet and outlet, nitrogen supply (NS) device into
It is passed through in air cavity by the nitrogen after heating devices heat, the nitrogen in inlet chamber is using the micropore between inlet chamber and bonding chamber
Through-hole on plate enters bonding intracavitary, and the molding powder in inlet chamber can be blown afloat by nitrogen with pigment powder at this time, make molding powder and face
It can be stirred evenly between feed powder end, nitrogen can be by logical on the microwell plate between bonding chamber and outlet chamber after bonding chamber
Hole enters in outlet chamber, then is discharged into the external world by escape pipe, and in actually manufacturing, the through-hole diameter on microwell plate is less than molding powder
With the diameter of pigment powder, so nitrogen can enter outlet chamber by through-hole, and molding powder can be blocked with pigment powder by microwell plate
It cuts and is blocked in bonding intracavitary.Because nitrogen enters the heating of heated device before bonding intracavitary, nitrogen is made to reach suitable bonding
Temperature can heat molding powder and pigment powder, make molding powder and pigment when nitrogen again stirs molding powder and pigment powder at this time
Powder reach bonding temperature carry out bonding effect, heating of the device by nitrogen to molding powder and pigment powder, can play compared with
For stable heating effect, and it molding powder and pigment powder are stirred by nitrogen can realize preferable mixing effect, because
It is not provided with the agitating device of mechanical structure, so heating up to molding powder and pigment powder when being avoided that stirring, is avoided warm in bonding cylinder
Height is spent, the temperature in bonding cylinder can be made relatively stable, promotes bonding quality.
Preferably, two pieces of microwell plates are parallel to each other, the microwell plate between bonding chamber and outlet chamber and bonding
It is provided with elastic seal ring between cylinder, is also associated on the microwell plate between bonding chamber and outlet chamber and drives microwell plate shake
Dynamic shaking device.Shaking device can drive the microwell plate between bonding chamber and outlet chamber to shake, and avoid on the microwell plate
Through-hole is blocked by molding powder or pigment powder, the setting of elastic seal ring, and microwell plate is made not go out between bonding cylinder in vibrations
Existing gap.
Preferably, the shaking device is vibration motor.
Preferably, the Nitrogen Control Units include nitrogen machine, the output end of nitrogen machine is connected by pipeline and inlet chamber
It is logical, flow valve equipped with gas flow in control pipeline in pipeline and the flowmeter that gas in pipelines flow can be monitored, flow
The control device of flow valve can be controlled by being connected on valve, and the heating device is arranged in pipeline, the flowmeter, heating device
It is connect respectively with the control device.The flow by nitrogen in pipeline can be monitored by flowmeter, and passes through flow valve energy
Enough control passes through the flow of the nitrogen of pipeline, to control the nitrogen amount for entering bonding intracavitary in the unit interval.
Preferably, the bonding intracavitary is equipped with barometer, thermometer, temperature control meter, the barometer, thermometer, temperature control
Meter is connect with control device respectively.The barometer of setting is used to detect the air pressure of bonding intracavitary, when control device passes through barometer
When detecting that the air pressure of bonding intracavitary is excessively high, control device can control the nitrogen flow entered in inlet chamber by flow valve, from
And the nitrogen amount into bonding intracavitary is controlled, avoid bonding intracavitary air pressure excessively high.The thermometer of setting is for detecting bonding intracavitary
Temperature, when temperature be more than set temperature when, control device can control heating of the heater stop to nitrogen, and temperature is opposite
Lower nitrogen is passed through bonding chamber, to reduce the temperature of bonding intracavitary, when the temperature of bonding intracavitary is less than the bonding temperature set
When spending, control device can control heating device work again, to make the temperature of bonding intracavitary maintain the bonding temperature of setting,
Promote bonding effect.The temperature control meter of setting can play a protective role, when the temperature of bonding intracavitary cannot be controlled effectively
When, the breaking-up of equipment in order to prevent can also be continued to run with by the function of tripping come arrestment, and the damage of the equipment is avoided.
Preferably, the bonding cylinder includes cylinder body and the cylinder cap that can close the cylinder lid of bonding cylinder, cylinder mouth is located at cylinder
Above body, cylinder mouth is as the feed inlet and outlet.The setting of cylinder cap can facilitate by molding powder and pigment powder pour into bonding cylinder with
And convenient for taking out the molding powder after bonding.
Preferably, the cylinder cap is equipped with the cylinder edge of the loop configuration extended downwardly, cylinder mouth of the cylinder along lower end and cylinder body
Rim seal connects, and the madial wall on the cylinder edge is equipped with annular groove, the outside of the microwell plate between bonding chamber and outlet chamber
Wall stretches into annular groove, and the elastic seal ring is located between the lateral wall and annular groove of the microwell plate, be located at bonding chamber with into
Microwell plate between air cavity is arranged in cylinder body, which is fixedly mounted in cylinder body and the lateral wall and cylinder body of the microwell plate
It is formed and is tightly connected between madial wall.
Preferably, being provided with the groove of loop configuration on the madial wall of the elastic seal ring, it is located at bonding chamber and outlet
The lateral wall of microwell plate between chamber is embedded in the groove.Elastic seal ring is by the groove of setting by the outer end of microwell plate
Package enables microwell plate when shaking device driving microwell plate vibrations to be shaken between up and down, enhances vibration amplitude, so as to
The through-hole on microwell plate is enough avoided to be blocked by molding powder and pigment powder.
Preferably, hinged between the cylinder body and cylinder cap, cylinder can be locked at by cylinder cap by being additionally provided between cylinder body and cylinder cap
Tight locking button on body.Such setting can make the opening of cylinder cap more convenient.
Preferably, the control device is PLC controller.
Compared with prior art, the invention has the advantages that：The present invention is by nitrogen to molding powder and pigment powder
It is heated and is stirred, can more be accurately controlled molding powder bonding temperature and molding powder is uniformly stirred with pigment
It mixes, the quality of molding powder bonding can be obviously improved, while nitrogen can also be used as protective gas, ensure the safety of bonding process
Energy.
Description of the drawings
Fig. 1 is schematic structural view of the invention；
Fig. 2 is enlarged drawing at A in Fig. 1；
It is marked in figure：1, bonding cylinder, 2, microwell plate, 3, outlet chamber, 4, bonding chamber, 5, inlet chamber, 6, escape pipe, 7, nitrogen supply (NS)
Device, 8, heating device, 9, elastic seal ring, 10, shaking device, 11, nitrogen machine, 12, pipeline, 13, flow valve, 14, flow
Meter, 15, control device, 16, barometer, 17, thermometer, 18, temperature control meter, 19, cylinder body, 20, cylinder mouth, 21, cylinder cap, 22, cylinder edge,
23, annular groove, 24, groove, 25, tight locking button.
Specific implementation mode
The invention will be further described for represented embodiment below in conjunction with the accompanying drawings：
Embodiment 1
As shown in Figure 1 and Figure 2, a kind of molding powder bonding device, including bonding cylinder 1 are provided with two pieces of microwell plates in the bonding cylinder 1
2, microwell plate 2 is equipped with multiple through-holes through 2 upper and lower ends face of microwell plate, and two pieces of microwell plates 2 divide bonding cylinder 1 from top to bottom
5 three outlet chamber 3, bonding chamber 4 and inlet chamber chambers are divided into, the bonding cylinder 1 is equipped with the escape pipe being connected to outlet chamber 3
6, the feed inlet and outlet that can be closed being connected to bonding chamber 4, be provided with outside the bonding cylinder 1 can into inlet chamber 5 supplying nitrogen
Nitrogen supply (NS) device 7, the Nitrogen Control Units 15 include nitrogen machine 11, and the output end of nitrogen machine 11 passes through pipeline 12 and air inlet
Chamber 5 is connected to, and the flow valve 13 of gas flow in control pipeline 12 is equipped in pipeline 12 and can monitor gas flow in pipeline 12
Flowmeter 14, the control device 15 that can control flow valve 13 is connected on flow valve 13, the control device 15 is PLC controls
Device, be additionally provided in the pipeline 12 can be the nitrogen heating for transferring to inlet chamber 5 heating device 8.The flowmeter 14, heating dress
8 are set to connect with the control device 15 respectively.Barometer, thermometer, temperature control meter 18, the air pressure are equipped in the bonding chamber 4
Meter, thermometer, temperature control meter 18 are connect with control device 15 respectively.
Two pieces of microwell plates 2 are parallel to each other, the microwell plate 2 between bonding chamber 4 and outlet chamber 3 and bonding cylinder 1 it
Between be provided with elastic seal ring 9, be also associated on the microwell plate 2 between bonding chamber 4 and outlet chamber 3 drive the microwell plate 2
The shaking device 10 of vibrations.The shaking device 10 is vibration motor.
The bonding cylinder 1 includes cylinder body 19 and can the cylinder mouth 20 of bonding cylinder 1 be covered the cylinder cap 21 closed, and cylinder mouth 20 is located at cylinder
19 top of body, cylinder mouth 20 are used as the feed inlet and outlet.The cylinder cap 21 is equipped with the cylinder of loop configuration that extends downwardly along 22, cylinder
It is connect with 20 rim seal of cylinder mouth of cylinder body 19 along 22 lower ends, the cylinder is equipped with annular groove 23 along 22 madial wall, is located at bonding
The lateral wall of microwell plate 2 between chamber 4 and outlet chamber 3 stretches into annular groove 23, and the elastic seal ring 9 is located at the microwell plate 2
Lateral wall and annular groove 23 between, microwell plate 2 between bonding chamber 4 and inlet chamber 5 is arranged in cylinder body 19, the micropore
Plate 2 is fixedly mounted in cylinder body 19 and is formed between 19 madial wall of lateral wall and cylinder body of the microwell plate 2 and is tightly connected.
The groove 24 of loop configuration is provided on the madial wall of the elastic seal ring 9, be located at bonding chamber 4 and outlet chamber 3 it
Between the lateral wall of microwell plate 2 be embedded in the groove 24.It is hinged between the cylinder body 19 and cylinder cap 21, cylinder body 19 and cylinder cap 21
Between be additionally provided with the tight locking button 25 that cylinder cap 21 can be locked on cylinder body 19.
Specific embodiments are merely illustrative of the spirit of the present invention described in text.The technical field of the invention
Technical staff can make various modifications or additions to the described embodiments or substitute by a similar method,
However, it does not deviate from the spirit of the invention or beyond the scope of the appended claims.
Claims (10)
1. a kind of molding powder bonding device, which is characterized in that including bonding cylinder（1）, two pieces of microwell plates are provided in the bonding cylinder
（2）, microwell plate is equipped with multiple through-holes through microwell plate upper and lower ends face, and two pieces of microwell plates separate bonding cylinder from top to bottom
For outlet chamber（3）, bonding chamber（4）And inlet chamber（5）Three chambers, the bonding cylinder are equipped with the outlet being connected to outlet chamber
Pipe（6）, the feed inlet and outlet that can be closed that is connected to bonding chamber, be provided with outside the bonding cylinder can into inlet chamber supplying nitrogen
Nitrogen supply (NS) device（7）, it can be the heating device for transferring to the nitrogen of inlet chamber and heating that nitrogen supply (NS) device, which is equipped with,（8）.
2. a kind of molding powder bonding device according to claim 1, which is characterized in that two pieces of microwell plates are parallel to each other,
It is provided with elastic seal ring between microwell plate between bonding chamber and outlet chamber and bonding cylinder（9）, positioned at bonding chamber with go out
The shaking device for driving microwell plate vibrations is also associated on microwell plate between air cavity（10）.
3. a kind of molding powder bonding device according to claim 2, which is characterized in that the shaking device is vibration motor.
4. a kind of molding powder bonding device according to claim 1, which is characterized in that the Nitrogen Control Units include nitrogen
Machine（11）, the output end of nitrogen machine passes through pipeline（12）It is connected to inlet chamber, equipped with gas flow in control pipeline in pipeline
Flow valve（13）And the flowmeter of gas in pipelines flow can be monitored（14）, the control that can control flow valve is connected on flow valve
Device processed（15）, in pipeline, the flowmeter, heating device connect with the control device respectively for the heating device setting
It connects.
5. a kind of molding powder bonding device according to claim 4, which is characterized in that the bonding intracavitary is equipped with barometer
（16）, thermometer（17）, temperature control meter（18）, the barometer, thermometer, temperature control meter are connect with control device respectively.
6. a kind of molding powder bonding device according to claim 2, which is characterized in that the bonding cylinder includes cylinder body（19）With
And it can be by the cylinder mouth of bonding cylinder（20）Cover the cylinder cap closed（21）, cylinder mouth is located above cylinder body, and cylinder mouth is as the feed inlet and outlet.
7. a kind of molding powder bonding device according to claim 6, which is characterized in that the cylinder cap is equipped with and extends downwardly
The cylinder edge of loop configuration（22）, cylinder is along the connection of the cylinder mouth rim seal of lower end and cylinder body, and the madial wall on the cylinder edge is equipped with annular
Slot（23）, the lateral wall of the microwell plate between bonding chamber and outlet chamber stretches into annular groove, and the elastic seal ring is located at
Between the lateral wall and annular groove of the microwell plate, the microwell plate between bonding chamber and inlet chamber is arranged in cylinder body, this is micro-
Orifice plate is fixedly mounted in cylinder body and is formed between the lateral wall and cylinder body madial wall of the microwell plate and is tightly connected.
8. a kind of molding powder bonding device according to claim 7, which is characterized in that on the madial wall of the elastic seal ring
It is provided with the groove of loop configuration（24）, the lateral wall of the microwell plate between bonding chamber and outlet chamber is embedded in the groove.
9. a kind of molding powder bonding device according to claim 6, which is characterized in that it is hinged between the cylinder body and cylinder cap,
The tight locking button that cylinder cap can be locked on cylinder body is additionally provided between cylinder body and cylinder cap（25）.
10. a kind of molding powder bonding device according to claim 4 or 5, which is characterized in that the control device is controlled for PLC
Device processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810428613.3A CN108654492B (en) | 2018-05-07 | 2018-05-07 | Plastic powder bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810428613.3A CN108654492B (en) | 2018-05-07 | 2018-05-07 | Plastic powder bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108654492A true CN108654492A (en) | 2018-10-16 |
| CN108654492B CN108654492B (en) | 2024-03-26 |
Family
ID=63778658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810428613.3A Active CN108654492B (en) | 2018-05-07 | 2018-05-07 | Plastic powder bonding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108654492B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1234031A (en) * | 1967-07-28 | 1971-06-03 | ||
| US5132142A (en) * | 1991-03-19 | 1992-07-21 | Glatt Gmbh | Apparatus and method for producing pellets by layering power onto particles |
| US5272008A (en) * | 1992-03-16 | 1993-12-21 | General Motors Corporation | Encapsulated oxidation-resistant iron-neodymium-boron permanent magnet |
| JP2000117156A (en) * | 1998-10-09 | 2000-04-25 | Sumitomo Corp | Powder coating equipment and coating method thereof |
| US6464737B1 (en) * | 1997-05-28 | 2002-10-15 | Kyowa Hakko Kogyo Co., Ltd. | Production method and system for granulating powdered material |
| CN1640953A (en) * | 2004-11-29 | 2005-07-20 | 王树波 | Production process of powder coating bonding |
| JP2006116432A (en) * | 2004-10-21 | 2006-05-11 | Pauretsuku:Kk | Fluidized bed apparatus and method for treating granular substance |
| CN103551070A (en) * | 2013-11-11 | 2014-02-05 | 烟台市三立工业有限公司 | Metal powder bonding and mixing equipment |
| CN208526500U (en) * | 2018-05-07 | 2019-02-22 | 浙江超浪新材料有限公司 | A kind of molding powder bonding device |
-
2018
- 2018-05-07 CN CN201810428613.3A patent/CN108654492B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1234031A (en) * | 1967-07-28 | 1971-06-03 | ||
| US5132142A (en) * | 1991-03-19 | 1992-07-21 | Glatt Gmbh | Apparatus and method for producing pellets by layering power onto particles |
| US5272008A (en) * | 1992-03-16 | 1993-12-21 | General Motors Corporation | Encapsulated oxidation-resistant iron-neodymium-boron permanent magnet |
| US6464737B1 (en) * | 1997-05-28 | 2002-10-15 | Kyowa Hakko Kogyo Co., Ltd. | Production method and system for granulating powdered material |
| JP2000117156A (en) * | 1998-10-09 | 2000-04-25 | Sumitomo Corp | Powder coating equipment and coating method thereof |
| JP2006116432A (en) * | 2004-10-21 | 2006-05-11 | Pauretsuku:Kk | Fluidized bed apparatus and method for treating granular substance |
| CN1640953A (en) * | 2004-11-29 | 2005-07-20 | 王树波 | Production process of powder coating bonding |
| CN103551070A (en) * | 2013-11-11 | 2014-02-05 | 烟台市三立工业有限公司 | Metal powder bonding and mixing equipment |
| CN208526500U (en) * | 2018-05-07 | 2019-02-22 | 浙江超浪新材料有限公司 | A kind of molding powder bonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108654492B (en) | 2024-03-26 |
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