CN108642450A - 一种多层镀金薄膜结构及其在金属表面真空镀金的方法 - Google Patents

一种多层镀金薄膜结构及其在金属表面真空镀金的方法 Download PDF

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CN108642450A
CN108642450A CN201810531221.XA CN201810531221A CN108642450A CN 108642450 A CN108642450 A CN 108642450A CN 201810531221 A CN201810531221 A CN 201810531221A CN 108642450 A CN108642450 A CN 108642450A
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杨富国
陈文静
何凌峰
陈育茹
吴微微
关共凑
张玉红
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Foshan University
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Abstract

本发明公开了一种多层镀金薄膜结构及其在金属表面真空镀金的方法,多层镀金薄膜结构包括金属基体,其表面涂镀有Ti过渡层,Ti过渡层表面涂镀TiC过渡层,TiC过渡层表面涂镀金镀层。在金属表面真空镀金的方法步骤是:S1、前处理;S2、离子清洗;S3、沉积Ti;S4、沉积TiC;S5、沉积金镀层;S6、后处理:关闭金靶和偏压电源、离子源及气体源,保温20‑25min,涂镀结束。本发明所得到的镀金薄膜为多层结构,TiC和Ti过渡层以减小残余应力,增加涂层与金属基体之间的结合强度。该镀金薄膜具有良好的耐磨性,同时与基体具有较高的结合强度。外表为金色,不变色,不含铬,从而提高不锈钢表带、表壳的使用寿命。

Description

一种多层镀金薄膜结构及其在金属表面真空镀金的方法
技术领域
本发明涉及真空镀膜技术领域,尤其涉及一种多层镀金薄膜结构及其在金属表面真空镀金的方法。
背景技术
对金属部件的表面进行镀金,目前人们普遍采用水湿镀金方法来实现,但是水湿镀金耐磨性能差,因此其镀金表面不久会出现脱金现象而影响整个金属部件的外观,从而降低了金属部件的使用寿命。人们为了提高其寿命,只能靠增加镀金层厚度的方法,金价居高不下,镀金成本非常之高,从而势必会大大提高生产成本。另外,现有技术的水湿镀金方法同时还存在如下的一些缺点:1、常规电镀工艺中会产生大量含有强酸、强碱、重金属铬的电镀废水,对工人身体伤害很大,而且容易污染地表水和地下水,属于重污染行业。2、常规电镀容易导致涂层厚度不均匀,影响外观效果。
发明内容
本发明目的是解决上述问题,提供一种多层镀金薄膜结构及其在金属表面真空镀金的方法,采用本方法所得到的镀层具有良好的耐磨性能,且与基体具有较高的结合强度,外观为金色,不变色,从而提高了不锈钢表带、表壳的使用寿命。
为了实现上述目的,本发明的技术方案是:
一种多层镀金薄膜结构,包括金属基体,该金属基体表面涂镀有Ti过渡层,该Ti过渡层的表面涂镀有TiC过渡层,在该TiC过渡层的表面涂镀有金镀层。
作为对上述技术方案的改进,所述金属基体为不锈钢。
一种在金属表面真空镀金的方法,该方法的步骤是:
S1、前处理:将金属基体材料打磨抛光,然后依次放入酒精和丙酮中超声清洗各10-15min,去除表面油渍等污染物,采用真空干燥箱充分干燥后迅速放入镀膜机的真空室,加热至230℃,保温时间20-30min;
S2、离子清洗:通入Ar气,其压力为0.3Pa,开启偏压电源,电压250V,占空比74.4,辉光放电清洗20-30min;偏压降低至200V,开启离子源离子清洗20-30min,开启电弧源Ti靶,偏压200-300V,靶电流70A,离子轰击Ti靶3-4min;
S3、沉积Ti:调整Ar气压至0.36-0.39Pa,偏压降低至50-60V,电弧镀Ti3-5min;
S4、沉积TiC:调整工作气压为0.32-0.36Pa,偏压68V,Ti靶电流50-60A;开启C2H2,调整C2H2流量为120-150sccm,沉积温度为150-230℃,中频磁控溅射沉积TiC15-20min;
S5、沉积金镀层:关闭Ti靶材,关闭C2H2;调整Ar气压至0.9-1.8Pa,偏压至120-210V,开启金靶电源,电流调制4-6A,中频磁控溅射沉积玫瑰金60-80min;
S6、后处理:关闭金靶,关闭偏压电源、离子源及气体源,保温20-25min,涂镀结束。
作为对上述技术方案的改进,所述真空室本底真空度为8.0×10-3Pa。
与现有技术相比,本发明具有的优点和积极效果是:
本发明的在金属表面真空镀金的方法,所得到的镀金薄膜为多层结构,金属基体的表面为金镀层,金镀层与基体之间有TiC和Ti过渡层,以减小残余应力,增加涂层与金属基体之间的结合强度。该镀金薄膜具有良好的耐磨性,同时与基体具有较高的结合强度。外表为金色,不变色,不含铬,从而提高不锈钢表带、表壳的使用寿命。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1为本发明的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
如图1所示,本发明的多层镀金薄膜结构,包括金属基体1,该金属基体1表面涂镀有Ti过渡层2,该Ti过渡层2的表面涂镀有TiC过渡层3,在该TiC过渡层3的表面涂镀有金镀层4。所述金属基体1为不锈钢。
本发明并提供了在金属表面真空镀金的方法,该方法的步骤是:
S1、前处理:将金属基体材料打磨抛光,然后依次放入酒精和丙酮中超声清洗各10-15min,去除表面油渍等污染物,采用真空干燥箱充分干燥后迅速放入镀膜机的真空室,所述真空室本底真空度为8.0×10-3Pa,加热至230℃,保温时间20-30min;
S2、离子清洗:通入Ar气,其压力为0.3Pa,开启偏压电源,电压250V,占空比74.4,辉光放电清洗20-30min;偏压降低至200V,开启离子源离子清洗20-30min,开启电弧源Ti靶,偏压200-300V,靶电流70A,离子轰击Ti靶3-4min;
S3、沉积Ti:调整Ar气压至0.36-0.39Pa,偏压降低至50-60V,电弧镀Ti3-5min;
S4、沉积TiC:调整工作气压为0.32-0.36Pa,偏压68V,Ti靶电流50-60A;开启C2H2,调整C2H2流量为120-150sccm,沉积温度为150-230℃,中频磁控溅射沉积TiC15-20min;
S5、沉积金镀层:关闭Ti靶材,关闭C2H2;调整Ar气压至0.9-1.8Pa,偏压至120-210V,开启金靶电源,电流调制4-6A,中频磁控溅射沉积玫瑰金60-80min;
S6、后处理:关闭金靶,关闭偏压电源、离子源及气体源,保温20-25min,涂镀结束。
实施例一:
(1)前处理:将金属基体材料打磨抛光,依次放入酒精和丙酮中超声清洗各10min,去除表面油渍等污染物,采用真空干燥箱充分干燥后迅速放入镀膜机真空室,真空室本底真空为8.0×10-3Pa,加热至230℃,保温时间20min;
(2)离子清洗:通入Ar气,其压力为0.3Pa,开启偏压电源,电压250V,占空比74.4,辉光放电清洗20min;偏压降低至200V,开启离子源离子清洗20min,开启电弧源Ti靶,偏压200V,靶电流70A,离子轰击Ti靶3min;
(3)沉积Ti:调整Ar气压至0.36Pa,偏压降低至50V,电弧镀Ti3min;
(4)沉积TiC:调整工作气压为0.32Pa,偏压58V,Ti靶电流68A;开启C2H2,调整C2H2流量为120sccm,沉积温度为150℃,中频磁控溅射沉积TiC15min;
(5)镀金层:关闭Ti靶材,关闭C2H2;调整Ar气压至0.9Pa,偏压至120V,开启金靶电源,电流调制4A,中频磁控溅射沉积玫瑰金60min;
(6)后处理:关闭金靶,关闭偏压电源、离子源及气体源,保温20min,镀层结束。
实施例二:
(1)前处理:将金属基体材料打磨抛光,依次放入酒精和丙酮中超声清洗各15min,去除表面油渍等污染物,采用真空干燥箱充分干燥后迅速放入镀膜机真空室,真空室本底真空为8.0×10-3Pa,加热至230℃,保温时间30min;
(2)离子清洗:通入Ar气,其压力为0.3Pa,开启偏压电源,电压250V,占空比74.4,辉光放电清洗30min;偏压降低至200V,开启离子源离子清洗30min,开启电弧源Ti靶,偏压300V,靶电流70A,离子轰击Ti靶4min;
(3)沉积Ti:调整Ar气压至0.39Pa,偏压降低至60V,电弧镀Ti5min;
(4)沉积TiC:调整工作气压为0.36Pa,偏压68V,Ti靶电流60A;开启C2H2,调整C2H2流量为150sccm,沉积温度为230℃,中频磁控溅射沉积TiC20min;
(5)沉积玫瑰金镀层:关闭Ti靶材,关闭C2H2;调整Ar气压至1.8Pa,偏压至210V,开启金靶电源,电流调制6A,中频磁控溅射沉积玫瑰金80min;
(6)后处理:关闭金靶,关闭偏压电源、离子源及气体源,保温25min,镀层结束。
本发明的在金属表面真空镀金的方法,所得到的镀金薄膜为多层结构,金属基体的表面为金镀层,金镀层与基体之间有TiC和Ti过渡层,以减小残余应力,增加涂层与金属基体之间的结合强度。该镀金薄膜具有良好的耐磨性,同时与基体具有较高的结合强度。外表为金色,不变色,不含铬,从而提高不锈钢表带、表壳的使用寿命。

Claims (4)

1.一种多层镀金薄膜结构,包括金属基体,其特征在于:该金属基体表面涂镀有Ti过渡层,该Ti过渡层的表面涂镀有TiC过渡层,在该TiC过渡层的表面涂镀有金镀层。
2.如权利要求1所述的多层镀金薄膜结构,其特征在于:所述金属基体为不锈钢。
3.一种在金属表面真空镀金的方法,其特征在于:该方法的步骤是:
S1、前处理:将金属基体材料打磨抛光,然后依次放入酒精和丙酮中超声清洗各10-15min,去除表面油渍等污染物,采用真空干燥箱充分干燥后迅速放入镀膜机的真空室,加热至230℃,保温时间20-30min;
S2、离子清洗:通入Ar气,其压力为0.3Pa,开启偏压电源,电压250V,占空比74.4,辉光放电清洗20-30min;偏压降低至200V,开启离子源离子清洗20-30min,开启电弧源Ti靶,偏压200-300V,靶电流70A,离子轰击Ti靶3-4min;
S3、沉积Ti:调整Ar气压至0.36-0.39Pa,偏压降低至50-60V,电弧镀Ti3-5min;
S4、沉积TiC:调整工作气压为0.32-0.36Pa,偏压68V,Ti靶电流50-60A;开启C2H2,调整C2H2流量为120-150sccm,沉积温度为150-230℃,中频磁控溅射沉积TiC15-20min;
S5、沉积金镀层:关闭Ti靶材,关闭C2H2;调整Ar气压至0.9-1.8Pa,偏压至120-210V,开启金靶电源,电流调制4-6A,中频磁控溅射沉积金60-80min;
S6、后处理:关闭金靶,关闭偏压电源、离子源及气体源,保温20-25min,涂镀结束。
4.如权利要求3所述的在金属表面真空镀金的方法,其特征在于:所述真空室本底真空度为8.0×10-3Pa。
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