CN108636687B - A kind of diode lead sealing processing system - Google Patents
A kind of diode lead sealing processing system Download PDFInfo
- Publication number
- CN108636687B CN108636687B CN201810491366.1A CN201810491366A CN108636687B CN 108636687 B CN108636687 B CN 108636687B CN 201810491366 A CN201810491366 A CN 201810491366A CN 108636687 B CN108636687 B CN 108636687B
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- China
- Prior art keywords
- diode
- liquid guide
- flow pipe
- guide flow
- fixed frame
- Prior art date
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Links
- 238000007789 sealing Methods 0.000 title claims abstract description 32
- 239000007788 liquid Substances 0.000 claims abstract description 66
- 239000003292 glue Substances 0.000 claims abstract description 65
- 238000001035 drying Methods 0.000 claims abstract description 38
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 22
- 238000005086 pumping Methods 0.000 claims abstract description 6
- 239000012528 membrane Substances 0.000 claims description 14
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 241000826860 Trapezium Species 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000008676 import Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 2
- 229920000715 Mucilage Polymers 0.000 claims 1
- 239000012945 sealing adhesive Substances 0.000 abstract description 9
- 230000009471 action Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
- B05C1/06—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length by rubbing contact, e.g. by brushes, by pads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Abstract
The present invention relates to electronic element processing equipment fields, more particularly to a kind of diode lead sealing processing system, sealing adhesive device includes fixed bracket, feed device, glue stations, liquid guide flow pipe, gas diversion tube, drying unit, circulator and takes out Negative pressure machine；The feed device is located at fixed internal stent, and feed device is used for the conveying of diode；The glue stations is located on the right side of fixed bracket, and glue stations is for giving diode lead gluing；The liquid guide flow pipe is located on the right side of fixed bracket, and liquid guide flow pipe is equipped with gum-injecting port；The gas diversion tube is located on the right side of liquid guide flow pipe；The drying unit is located at fixed frame bottom, and drying unit is used to dry the diode lead after gluing；The circulator is located in the middle part of liquid guide flow pipe；The pumping Negative pressure machine is located on gas diversion tube；The present apparatus is suitable for the gluing of large batch of diode lead, is conducive to improve productivity.
Description
Technical field
The present invention relates to electronic element processing equipment fields, and in particular to a kind of diode lead sealing processing system.
Background technique
The lead of diode needs to carry out sealing processing, so that it is prepared into complete diode.Existing sealing adhesive process
Often through repeatedly contact of the lead between multiple sealing teeth on sealing rack gear, so that being located at the glue pair on sealing tooth
Lead realizes gluing processing.However, lead can also be generated between sealing tooth while gluing and be rubbed in above-mentioned sealing adhesive process
It wipes, so that lead may be bent；Simultaneously as the glue distribution evenness on sealing tooth is difficult to be guaranteed, lead
Gluing evenness be also difficult to be controlled.And traditional sealing adhesive process production efficiency is low, it is difficult to meet the market demand.
Also occur a kind of technical solution of diode lead sealing in the prior art, such as application No. is
201510348183.0 a Chinese patent in disclose a kind of sealing adhesive device.The diode lead sealing adhesive device includes support
Platform is provided with the conveyor chain for being used for transmission diode on support platform；The sizer of diode lead sealing adhesive device
Include the sealing groove being set on support platform, multiple sealing holes extended along the vertical direction are provided in sealing groove；Two
It is provided with lead in the sizer of pole pipe lead sealing adhesive device and puts end block, is provided with multiple leads parallel to each other and sets
Discharge hole；Lead is put and is provided with multiple hydraulic cylinders for prolonging vertical direction and being gone up and down between end block and conveyor chain；Sealing hole with
Lead holding hole corresponds；The sizer of diode lead sealing adhesive device by adopting the above technical scheme, can be vertical
The sealing processing of complete paired lead on direction, and the sealing position of lead is only in contact with glue during sealing,
To avoid, lead may there is a phenomenon where bend.Although the technology solves the equal of diode lead gluing to a certain extent
Evenness and bending problem, but production efficiency is low, and glue may be dripped in diode lead congregate plastic, while diode draws
Line may touch sealing hole, to fracture.
In consideration of it, a kind of diode lead sealing processing system of the present invention, can not only effectively improve sealing
Speed accelerates production efficiency, while can guarantee the uniformity of diode lead sealing, guarantees that diode lead will not be rolled over
It is curved.
Summary of the invention
In order to make up for the deficiencies of the prior art, the invention proposes a kind of diode lead sealing processing system, the present invention
It is mainly used for realizing the gluing of large batch of diode lead, while can guarantees the uniformity of diode lead gluing, guarantees
Diode lead will not be bent over.The present apparatus passes through fixed frame, feed device, glue stations, liquid guide flow pipe, gas flow guiding
Pipe, drying unit, circulator and the mutual cooperation for taking out Negative pressure machine, can accelerate the efficiency of diode gluing, guarantee that gluing is equal
Evenness avoids diode lead from being damaged during gluing.
The technical solution adopted by the present invention to solve the technical problems is: a kind of diode lead sealing of the present invention
Processing system, including fixed frame, feed device, glue stations, liquid guide flow pipe, gas diversion tube, drying unit, circulator
With pumping Negative pressure machine；The feed device is located inside fixed frame, and feed device is used for the input and output of diode；The painting
Adhesive dispenser is located on the right side of fixed frame, and glue stations is for giving diode lead gluing；The liquid guide flow pipe is located at the fixed frame right side
Side, liquid guide flow pipe one end are connected with fixed frame top, and the liquid guide flow pipe other end is connected with fixed frame bottom, and liquid is led
Flow tube is used to glue being transported to fixed frame top from fixed frame bottom；Liquid guide flow pipe is equipped with gum-injecting port, the gum-injecting port
For glue to be injected liquid guide flow pipe；The gas diversion tube is located on the right side of liquid guide flow pipe, gas diversion tube one end and liquid
Body diversion pipe is connected, and the gas diversion tube other end is connected with drying unit, and gas diversion tube is used for will be in liquid guide flow pipe
Air delivery to drying unit；The drying unit is located at below fixed frame on inner wall, and drying unit is used for will be after gluing
Diode lead drying；The circulator is located in the middle part of liquid guide flow pipe, and circulator is for realizing glue circulation；The pumping
Negative pressure machine is located on gas diversion tube, takes out Negative pressure machine for providing negative pressure.
The feed device includes crawler belt, Athey wheel and fixing device for diode；The Athey wheel is scheduled on fixed frame
Inside, Athey wheel quantity are two, and respectively a big belt wheel and a small pulley, big belt wheel are located on the right side of small pulley, big belt wheel
For driving wheel, small pulley is driven wheel；The crawler belt is mounted on Athey wheel, and crawler belt is rotated synchronously with Athey wheel；Two pole
Pipe fixing device is fixed on crawler belt, and fixing device for diode is for fixing diode.When work, the big belt wheel on right side is driven
Small pulley rotates clockwise, and crawler belt rotates synchronously under the drive of Athey wheel；Diode is fixed on the fixed dress of diode
It sets, diode rotates on crawler belt around Athey wheel with fixing device for diode.
The fixing device for diode includes clamping bracket and upper flitch；The clamping bracket is fixed on crawler belt, is clamped
Timbering material is nylon, and clamping bracket is a pair of F shape bracket, and the opposed placement of F carrier openings occurs so that clamping frame upper
One of square groove；It clamps and is additionally provided with gripping block on bracket, the gripping block, which is located at, to be clamped on bracket, and gripping block is used for upper flitch
It clamps, each clamping number of blocks clamped on bracket is four；The upper flitch, which is mounted on, to be clamped on bracket, and upper flitch is located at four
Between gripping block, feeding plate surface is provided with threading hole, and upper flitch is for placing diode；The threading hole inner wall is equipped with flexible glue
Circle, flexible glue circle is for fixing diode.When work, threading hole of the diode in upper flitch is inserted into upper flitch, threading hole
The flexible glue circle that inner wall is equipped with is used to diode being fixed on upper flitch.After filling diode in upper flitch, by upper flitch
Along the square groove insertion for clamping frame upper, gripping block at this time can be by feeding board clamping.
The glue stations includes hairbrush, baffle upper plate and chin spoiler；The hairbrush is located on the right side of fixed frame on inner wall,
Hairbrush is banister brush；The baffle upper plate is rectangular configuration, and baffle upper plate is fixed on above fixed frame inner wall, and baffle upper plate is used for
Glue is imported into hairbrush region；The chin spoiler is trapezium structure, and chin spoiler is fixed below fixed frame inner wall, under
Deflector is used to import the glue in hairbrush region in fixed frame.When work, glue flows into hairbrush institute from baffle upper plate
Glue is stained on region, hairbrush, remaining glue flows into fixed frame along hairbrush from chin spoiler, the liquid in fixed frame
Influent diversion pipe.
The circulator includes rotating electric machine, fan blade and connecting shaft；It is right that the rotating electric machine is located at liquid guide flow pipe
Side, rotating electric machine are fixed in liquid guide flow pipe outer wall, and rotating electric machine is used to provide power for fan blade；The connecting shaft and rotation
Rotating motor output shaft is connected, and connecting shaft and rotating electric machine synchronous rotary, connecting shaft is for connecting rotating electric machine and fan blade；Institute
Stating is hollow cylinder among fan blade, and the fan blade of fan blade is fixed on cylindrical outer surface, and fan blade quantity is six, fan blade
Inside liquid guide flow pipe, fan blade is connected with connecting shaft end, and fan blade and connecting shaft rotate synchronously.When work, electricity
Machine drives connecting shaft rotation, and fan blade is rotated together with connecting shaft, with the rotation of fan blade, the glue stream of fixed frame bottom
Enter in liquid guide flow pipe and be sucked into fixed frame upper end along liquid guide flow pipe under the action of circulator, again on toward
Lower inflow brush section, realization recycle；
Semi-permeable membrane is additionally provided on the gas diversion tube；The semi-permeable membrane is a kind of film that gas can only be allowed to pass through,
Semi-permeable membrane is located at gas diversion tube and is connected with liquid guide flow pipe position.When work, under the action of taking out Negative pressure machine, liquid guide flow
Air in pipe can enter gas diversion tube by semi-permeable membrane, into the gas in gas diversion tube can along gas diversion tube into
Enter drying unit, provide wind energy for drying unit, the diode pin on crawler belt above drying unit is dried.
The beneficial effects of the present invention are:
1. a kind of diode lead sealing processing system of the present invention, diode lead passes through on upper flitch threading hole
The flexible glue circle of setting is inserted into, and flexible glue circle can correct diode, and single upper flitch can place multiple diodes, and carry out
The fixed plate taken is uniformly fixed around crawler belt, and what upper flitch can be convenient dismounts on clamping bracket, facilitates feeding and discharging, this
A little block combiners can greatly improve the production efficiency of diode lead gluing together.
2. a kind of diode lead sealing processing system of the present invention, the glue stations includes hairbrush, upper water conservancy diversion
Plate and chin spoiler；Glue enters after hairbrush via baffle upper plate carries out gluing to diode lead, and hairbrush is banister brush, gluing
For device while guaranteeing that diode lead gluing is uniform, glue stations also assures that diode lead will not be bent over.
3. a kind of diode lead sealing processing system of the present invention, the pumping Negative pressure machine, gas diversion tube and
Drying unit cooperate, negative pressure device by gas present in glue by semi-permeable membrane feeding gas diversion tube, gas via
Gas diversion tube enters drying unit, and the gas into drying unit provides wind energy for drying unit and draws for drying diode
Line.
Detailed description of the invention
The present invention will be further explained below with reference to the attached drawings.
Fig. 1 is main view of the invention；
Fig. 2 is A-A cross-sectional view in Fig. 1 of the present invention；
Fig. 3 is that diode is fixed on the schematic diagram on crawler belt by fixing device for diode in the present invention；
Fig. 4 is that diode is located at the schematic perspective view in upper flitch in the present invention；
In figure: fixed frame 1, glue stations 3, liquid guide flow pipe 4, gas diversion tube 5, drying unit 6, follows at feed device 2
Loop device 7, gum-injecting port 8 take out Negative pressure machine 9, crawler belt 21, Athey wheel 22, fixing device for diode 23, clamp bracket 24, upper flitch
25, gripping block 26, flexible glue circle 27, hairbrush 31, baffle upper plate 32, chin spoiler 33, semi-permeable membrane 51, rotating electric machine 71, fan blade
72 and connecting shaft 73.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Specific embodiment is closed, the present invention is further explained.
As shown in Figures 1 to 4, a kind of diode lead sealing processing system of the present invention, including fixed frame 1, give
Expect device 2, glue stations 3, liquid guide flow pipe 4, gas diversion tube 5, drying unit 6, circulator 7 and takes out Negative pressure machine 9；It is described
Feed device 2 be located inside fixed frame 1, feed device 2 be used for diode input and output；The glue stations 3 is located at
1 right side of fixed frame, glue stations 3 is for giving diode lead gluing；The liquid guide flow pipe 4 is located at 1 right side of fixed frame, liquid
4 one end of diversion pipe is connected with 1 upper end of fixed frame, and 4 other end of liquid guide flow pipe is connected with 1 lower end of fixed frame, liquid guide flow
Pipe 4 is used to glue being transported to 1 top of fixed frame from 1 lower part of fixed frame；Liquid guide flow pipe 4 is equipped with gum-injecting port 8, the injecting glue
Mouth 8 is for injecting liquid guide flow pipe 4 for glue；The gas diversion tube 5 is located at 4 right side of liquid guide flow pipe, gas diversion tube 5 one
End is connected with liquid guide flow pipe 4, and 5 other end of gas diversion tube is connected with drying unit 6, and gas diversion tube 5 is used for liquid
Air delivery in body diversion pipe 4 is to drying unit 6；The drying unit 6 is located on 1 lower section inner wall of fixed frame, drying unit 6
For the diode lead after gluing to be dried；The circulator 7 is located at 4 middle part of liquid guide flow pipe, and circulator 7 is for real
Existing glue circulation；The pumping Negative pressure machine 9 is located on gas diversion tube 5, takes out Negative pressure machine 9 for providing negative pressure.
The feed device 2 includes crawler belt 21, Athey wheel 22 and fixing device for diode 23；The Athey wheel 22 is fixed
Inside fixed frame 1,22 quantity of Athey wheel is two, and a respectively big belt wheel and a small pulley, big belt wheel is located at small pulley
Right side, big belt wheel are driving wheel, and small pulley is driven wheel；The crawler belt 21 is mounted on Athey wheel 22, and crawler belt 21 is with Athey wheel
22 rotate synchronously；The fixing device for diode 23 is fixed on crawler belt 21, and fixing device for diode 23 is for consolidating diode
It is fixed.When work, the big belt wheel on right side drives small pulley to rotate clockwise, and crawler belt 21 is synchronous under the drive of Athey wheel 22
Rotation；Diode is fixed on fixing device for diode 23, diode with fixing device for diode 23 on crawler belt 21 around shoe
Belt wheel 22 rotates.
The fixing device for diode 23 includes clamping bracket 24 and upper flitch 25；The clamping bracket 24 is fixed on crawler belt
On 21, clamping 24 material of bracket is nylon, and clamping bracket 24 is a pair of F shape bracket, the opposed placement of F carrier openings, so that folder
There is one of square groove in 24 top of locking bracket；It clamps and is additionally provided with gripping block 26 on bracket 24, the gripping block 26, which is located at, clamps branch
On frame 24, for gripping block 26 for clamping upper flitch 25, each 26 quantity of gripping block clamped on bracket 24 is four；The feeding
Plate 25, which is mounted on, to be clamped on bracket 24, and upper flitch 25 is located between four gripping blocks 26, and 25 surface of upper flitch is provided with threading hole, on
Flitch 25 is for placing diode；The threading hole inner wall is equipped with flexible glue circle 27, and flexible glue circle 27 is for fixing diode.Work
When, threading hole of the diode in upper flitch 25 is inserted into upper flitch 25, the flexible glue circle 27 that threading hole inner wall is equipped with is used for
Diode is fixed in upper flitch 25.After filling diode in upper flitch 25, by upper flitch 25 on clamping bracket 24
The square groove in portion is inserted into, and gripping block 26 at this time can clamp upper flitch 25.
The glue stations 3 includes hairbrush 31, baffle upper plate 32 and chin spoiler 33；The hairbrush 31 is located at fixed frame 1
On the inner wall of right side, hairbrush 31 is banister brush 31；The baffle upper plate 32 is rectangular configuration, and baffle upper plate 32 is fixed on fixed frame 1
Above inner wall, baffle upper plate 32 is used to glue importing 31 region of hairbrush；The chin spoiler 33 be trapezium structure, under lead
Flowing plate 33 is fixed below 1 inner wall of fixed frame, and chin spoiler 33 is used to the glue in 31 region of hairbrush importing fixed frame 1
It is interior.When work, glue flows into 31 region of hairbrush from baffle upper plate 32, is stained with glue on hairbrush 31, remaining glue along
Hairbrush 31 flows into fixed frame 1 from chin spoiler 33, and the liquid in fixed frame 1 flows into liquid guide flow pipe 4.
The circulator 7 includes rotating electric machine 71, fan blade 72 and connecting shaft 73；The rotating electric machine 71 is located at liquid
4 right side of diversion pipe, rotating electric machine 71 are fixed on 4 outer wall of liquid guide flow pipe, and rotating electric machine 71 is used to provide for fan blade 72 dynamic
Power；The connecting shaft 73 is connected with 71 output shaft of rotating electric machine, connecting shaft 73 and 71 synchronous rotary of rotating electric machine, connecting shaft 73
For connecting rotating electric machine 71 and fan blade 72；It is hollow cylinder among the fan blade 72, the fan blade of fan blade 72 is fixed
On cylindrical outer surface, fan blade quantity is six, and fan blade 72 is located inside liquid guide flow pipe 4, fan blade 72 and connecting shaft 73
End is connected, and fan blade 72 and connecting shaft 73 rotate synchronously.When work, motor drive connecting shaft 73 rotate, fan blade 72 with
Connecting shaft 73 rotate together, with the rotation of fan blade 72, in the glue influent diversion pipe 4 of 1 bottom of fixed frame and
It is sucked into 1 upper end of fixed frame along liquid guide flow pipe 4 under the action of circulator 7, flows into 31st area of hairbrush from top to bottom again
Domain, realization recycle；
Semi-permeable membrane 51 is additionally provided on the gas diversion tube 5；The semi-permeable membrane 51 is a kind of to allow gas to pass through
Film, semi-permeable membrane 51 are located at gas diversion tube 5 and are connected with liquid guide flow pipe 4 position.When work, in the effect for taking out Negative pressure machine 9
Under, the air in liquid guide flow pipe 4 can enter gas diversion tube 5 by semi-permeable membrane 51, into the gas meeting in gas diversion tube 5
Enter drying unit 6 along gas diversion tube 5, wind energy is provided for drying unit 6, by two on 6 top crawler belt 21 of drying unit
The drying of pole pipe pin.
Specific workflow is as follows:
When work, threading hole of the diode in upper flitch 25 is inserted into upper flitch 25, threading hole inner wall is equipped with
Flexible glue circle 27 is used to diode being fixed on upper flitch 25.After filling diode in upper flitch 25, by upper flitch 25 along
The square groove insertion on 24 top of bracket is clamped, gripping block 26 at this time can clamp upper flitch 25.Then, the big belt wheel on right side drives
Small pulley rotates clockwise, and crawler belt 21 rotates synchronously under the drive of Athey wheel 22；Diode is fixed with diode
Device 23 rotates on crawler belt 21 around Athey wheel 22；Meanwhile glue injects liquid guide flow pipe from gum-injecting port 8 above liquid guide flow pipe
4, glue is flowed out from liquid guide flow pipe 4 flows to 31 region of hairbrush via baffle upper plate 32, is stained with glue on hairbrush 31, at this point,
The diode lead for moving to 31 region of hairbrush contacts the smearing for realizing glue with hairbrush；It is flowed out from 4 upper end of liquid guide flow pipe
Glue falls into the bottom of fixed frame 1 after hairbrush；Then, rotating electric machine 71 drive connecting shaft 73 rotate, fan blade 72 with
Connecting shaft 73 rotates together, and with the rotation of fan blade 72, in the glue influent diversion pipe 4 of 1 bottom of fixed frame and is following
It is sucked into 1 upper end of fixed frame along liquid guide flow pipe 4 under the action of loop device 7, flows into 31 region of hairbrush from top to bottom again,
Realization recycles；Meanwhile under the action of taking out Negative pressure machine 9, the air in liquid guide flow pipe 4 can enter gas by semi-permeable membrane 51
Body diversion pipe 5 can enter drying unit 6 along gas diversion tube 5 into the gas in gas diversion tube 5, mention for drying unit 6
For wind energy, drying unit 6 dries the diode pin on 6 top crawler belt 21 of drying unit.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe originals of the invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (4)
1. a kind of diode lead sealing processing system, it is characterised in that: including fixed frame (1), feed device (2), apply mucilage binding
It sets (3), liquid guide flow pipe (4), gas diversion tube (5), drying unit (6), circulator (7) and takes out Negative pressure machine (9)；Described
Feed device (2) is located at fixed frame (1) inside, and feed device (2) is used for the input and output of diode；The glue stations
(3) it is located on the right side of fixed frame (1), glue stations (3) is for giving diode lead gluing；The liquid guide flow pipe (4) is located at solid
Determine on the right side of frame (1), liquid guide flow pipe (4) one end is connected with fixed frame (1) upper end, liquid guide flow pipe (4) other end and fixation
Frame (1) lower end is connected, and liquid guide flow pipe (4) is used to for glue being transported at the top of fixed frame (1) from fixed frame (1) bottom；Liquid
Body diversion pipe (4) is equipped with gum-injecting port (8), and the gum-injecting port (8) is used to glue injecting liquid guide flow pipe (4)；The gas
Diversion pipe (5) is located on the right side of liquid guide flow pipe (4), and gas diversion tube (5) one end is connected with liquid guide flow pipe (4), and gas is led
Flow tube (5) other end is connected with drying unit (6), and gas diversion tube (5) is used for the air delivery in liquid guide flow pipe (4)
To drying unit (6)；The drying unit (6) is located at below fixed frame (1) on inner wall, and drying unit (6) is used for will be after gluing
Diode lead drying；The circulator (7) is located in the middle part of liquid guide flow pipe (4), and circulator (7) is for realizing glue
Circulation；The pumping Negative pressure machine (9) is located on gas diversion tube (5), takes out Negative pressure machine (9) for providing negative pressure；
The glue stations (3) includes hairbrush (31), baffle upper plate (32) and chin spoiler (33)；The hairbrush (31) is located at solid
Determine on the right side of frame (1) on inner wall, hairbrush (31) is banister brush (31)；The baffle upper plate (32) is rectangular configuration, baffle upper plate
(32) it is fixed on above fixed frame (1) inner wall, baffle upper plate (32) is used to glue importing hairbrush (31) region；Under described
Deflector (33) is trapezium structure, and chin spoiler (33) is fixed below fixed frame (1) inner wall, and chin spoiler (33) is used for hair
The glue brushed in (31) region imports in fixed frame (1)；
Semi-permeable membrane (51) are additionally provided on the gas diversion tube (5)；The semi-permeable membrane (51) is that one kind can only allow gas to pass through
Film, semi-permeable membrane (51) is located at gas diversion tube (5) and is connected with liquid guide flow pipe (4) position.
2. a kind of diode lead sealing processing system according to claim 1, it is characterised in that: the feed device
It (2) include crawler belt (21), Athey wheel (22) and fixing device for diode (23)；The Athey wheel (22) is scheduled on fixed frame (1)
Inside, Athey wheel (22) quantity are two, and respectively a big belt wheel and a small pulley, big belt wheel are located on the right side of small pulley, greatly
Belt wheel is driving wheel, and small pulley is driven wheel；The crawler belt (21) is mounted on Athey wheel (22), and crawler belt (21) is with Athey wheel
(22) it rotates synchronously；The fixing device for diode (23) is fixed on crawler belt (21), and fixing device for diode (23) is used for will
Diode is fixed.
3. a kind of diode lead sealing processing system according to claim 2, it is characterised in that: the diode is fixed
Device (23) includes clamping bracket (24) and upper flitch (25)；The clamping bracket (24) is fixed on crawler belt (21), clamps branch
Frame (24) material is nylon, and clamping bracket (24) is a pair of F shape bracket, the opposed placement of F carrier openings, so that clamping bracket
(24) there is one of square groove in top；It clamps and is additionally provided with gripping block (26) on bracket (24), the gripping block (26), which is located at, to be clamped
On bracket (24), gripping block (26) is used to clamp upper flitch (25), each gripping block (26) quantity clamped on bracket (24)
It is four；The upper flitch (25), which is mounted on, to be clamped on bracket (24), and upper flitch (25) is located between four gripping blocks (26), feeding
Plate (25) surface is provided with threading hole, and upper flitch (25) is for placing diode；The threading hole inner wall is equipped with flexible glue circle (27),
Flexible glue circle (27) is for fixing diode.
4. a kind of diode lead sealing processing system according to claim 1, it is characterised in that: the circulator
It (7) include rotating electric machine (71), fan blade (72) and connecting shaft (73)；The rotating electric machine (71) is located at liquid guide flow pipe (4)
Right side, rotating electric machine (71) are fixed on liquid guide flow pipe (4) outer wall, and rotating electric machine (71) is used to provide for fan blade (72) dynamic
Power；The connecting shaft (73) is connected with rotating electric machine (71) output shaft, connecting shaft (73) and rotating electric machine (71) synchronous rotary,
Connecting shaft (73) is for connecting rotating electric machine (71) and fan blade (72)；It is hollow cylinder, wind among the fan blade (72)
The fan blade of impeller (72) is fixed on cylindrical outer surface, and fan blade quantity is six, and fan blade (72) is located in liquid guide flow pipe (4)
Portion, fan blade (72) are connected with connecting shaft (73) end, and fan blade (72) and connecting shaft (73) rotate synchronously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810491366.1A CN108636687B (en) | 2018-05-21 | 2018-05-21 | A kind of diode lead sealing processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810491366.1A CN108636687B (en) | 2018-05-21 | 2018-05-21 | A kind of diode lead sealing processing system |
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| CN108636687A CN108636687A (en) | 2018-10-12 |
| CN108636687B true CN108636687B (en) | 2019-10-18 |
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| CN201810491366.1A Active CN108636687B (en) | 2018-05-21 | 2018-05-21 | A kind of diode lead sealing processing system |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113426616B (en) * | 2021-07-01 | 2022-04-29 | 深圳市华勋基业科技有限公司 | Surface treatment device and surface treatment method for diode processing |
| CN115376975B (en) * | 2022-10-24 | 2022-12-27 | 常州银河电器有限公司 | Plugging device and method based on diode processing |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203329928U (en) * | 2013-06-24 | 2013-12-11 | 安徽中鑫半导体有限公司 | Novel diode gluing machine |
| CN104959275B (en) * | 2015-06-22 | 2017-04-19 | 定远县安卓电子科技有限公司 | Diode lead gluing equipment |
| CN205436126U (en) * | 2016-02-23 | 2016-08-10 | 山东融创电子科技有限公司 | Automatic rubber coating device of diode |
| KR20170128801A (en) * | 2016-05-16 | 2017-11-24 | 삼성전자주식회사 | Method of cleaning a substrate and apparatus for performing the same |
| CN206064722U (en) * | 2016-07-28 | 2017-04-05 | 衢州艾尚工业设计有限公司 | A kind of bin paint brushing machine |
| CN107159509A (en) * | 2017-07-26 | 2017-09-15 | 江苏苏高流体机械有限公司 | A kind of rolled products rust prevention treatment device |
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Denomination of invention: A diode lead sealing treatment system Effective date of registration: 20231128 Granted publication date: 20191018 Pledgee: Zhejiang Shaoxing Ruifeng Rural Commercial Bank Co.,Ltd. Binhai sub branch Pledgor: Shaoxing Huawei New Materials Co.,Ltd. Registration number: Y2023980067903 |