CN108633243A - A kind of heat conduction absorbing material - Google Patents
A kind of heat conduction absorbing material Download PDFInfo
- Publication number
- CN108633243A CN108633243A CN201810577362.5A CN201810577362A CN108633243A CN 108633243 A CN108633243 A CN 108633243A CN 201810577362 A CN201810577362 A CN 201810577362A CN 108633243 A CN108633243 A CN 108633243A
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- absorbing material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract
The invention discloses a kind of heat conduction absorbing material, the composition of the absorbing material includes component A and B component by mass parts, wherein component A includes 6 15 parts of silicone oil, 6 15 parts of heat filling, 70 85 parts of wave absorbing agent, 15 parts of coupling agent.B component includes 10 25 parts of curing agent, 10 25 parts of catalyst, 13 parts of accelerating agent.The present invention more contributes to the formation of heat conduction absorbing material so that the absorbing property of finally formed absorbing material is stronger, is better than the performance 5 15% of the absorbing material of commonsense method formation, and is formed by absorbing material performance and more stablizes.
Description
Technical field
The present invention relates to materials, particularly relate to a kind of heat conduction absorbing material.
Background technology
Currently, usually ferrite or metal are used alone as absorbing material, the absorbing property of these materials
It does not often reach requirement, while expensive.
Invention content
For deficiency in the prior art, the technical problem to be solved in the present invention is the provision of a kind of heat conduction suction wave material
Material.
In order to solve the above technical problems, the present invention is realized by following scheme：A kind of heat conduction absorbing material, the suction wave material
The composition of material includes by mass parts：
Component A：6-15 parts of silicone oil；
6-15 parts of heat filling；
70-85 parts of wave absorbing agent；
1-5 parts of coupling agent；
B component：10-25 parts of curing agent；
10-25 parts of catalyst；
1-3 parts of accelerating agent.
Further, the heat filling includes aluminium oxide, silica, zinc oxide, magnesia, calcium oxide, aluminium nitride, nitrogen
Change boron, a kind of in silicon carbide is compounded at several.
Further, the wave absorbing agent includes one kind of iron aluminum silicon powder, iron powder, graphite powder.
Further, the coupling agent includes silanes, one kind of phthalate, aluminate.
Further, the accelerating agent is triphenyl phosphite.
Further, the curing agent is containing hydrogen silicone oil.
Further, the catalyst is platinum catalyst.
A kind of preparation method of heat conduction absorbing material, the preparation method include the following steps：
Step 1 is surface-treated heat filling and wave absorbing agent with coupling agent respectively, then by heat filling, wave absorbing agent,
Silicone oil is packed into de-airing mixer, stirs 0.5-2h, and component A is made；
Step 2 mixes component A mixture with accelerating agent, curing agent, and mixed component stirs at a temperature of 25-40 DEG C
Then catalyst is added in 10-15min, continue stirring 5-10min and stir evenly；
Step 3, the mixed slurry after step 2 is stirred inject calender, are led by 100 DEG C of isothermal curing 5-15min
Hot absorbing material.
Further, the heat filling includes aluminium oxide, silica, zinc oxide, magnesia, calcium oxide, aluminium nitride, nitrogen
Change boron, a kind of in silicon carbide is compounded at several；
The wave absorbing agent includes one kind of iron aluminum silicon powder, iron powder, graphite powder；
The coupling agent includes silanes, one kind of phthalate, aluminate；
The accelerating agent is triphenyl phosphite；
The curing agent is containing hydrogen silicone oil；
The catalyst is platinum catalyst.
Further, in step 3, the calendering roll body on calender magnetizes.
Compared with the existing technology, the beneficial effects of the invention are as follows：The present invention more contributes to the formation of heat conduction absorbing material,
So that the absorbing property of finally formed absorbing material is stronger, it is better than the performance 5-15% of the absorbing material of commonsense method formation,
And it is formed by absorbing material performance more to stablize.
Specific implementation mode
The preferred embodiment of the present invention is described in detail below so that advantages and features of the invention can be easier to by
It will be appreciated by those skilled in the art that so as to make a clearer definition of the protection scope of the present invention.
Embodiment 1：
A kind of heat conduction absorbing material of the present invention, the composition of the absorbing material include by mass parts：
Component A：6-15 parts of silicone oil；
6-15 parts of heat filling；
70-85 parts of wave absorbing agent；
1-5 parts of coupling agent；
B component：10-25 parts of curing agent；
10-25 parts of catalyst；
1-3 parts of accelerating agent.
A kind of optimal technical scheme of the present embodiment：The heat filling includes aluminium oxide, silica, zinc oxide, oxidation
A kind of in magnesium, calcium oxide, aluminium nitride, boron nitride, silicon carbide is compounded at several.
A kind of optimal technical scheme of the present embodiment：The wave absorbing agent includes one kind of iron aluminum silicon powder, iron powder, graphite powder.
A kind of optimal technical scheme of the present embodiment：The coupling agent include silanes, phthalate, aluminate one
Kind.
A kind of optimal technical scheme of the present embodiment：The accelerating agent is triphenyl phosphite.
A kind of optimal technical scheme of the present embodiment：The curing agent is containing hydrogen silicone oil.
A kind of optimal technical scheme of the present embodiment：The catalyst is platinum catalyst.
Embodiment 2：
A kind of preparation method with the heat conduction absorbing material described in claim 1-7 any one, which is characterized in that the preparation side
Method includes the following steps：
Step 1 is surface-treated heat filling and wave absorbing agent with coupling agent respectively, then by heat filling, wave absorbing agent,
Silicone oil is packed into de-airing mixer, stirs 0.5-2h, and component A is made；
Step 2 mixes component A mixture with accelerating agent, curing agent, and mixed component stirs at a temperature of 25-40 DEG C
Then catalyst is added in 10-15min, continue stirring 5-10min and stir evenly；
Step 3, the mixed slurry after step 2 is stirred inject calender, are led by 100 DEG C of isothermal curing 5-15min
Hot absorbing material.
A kind of optimal technical scheme of the present embodiment：The heat filling includes aluminium oxide, silica, zinc oxide, oxidation
A kind of in magnesium, calcium oxide, aluminium nitride, boron nitride, silicon carbide is compounded at several；
The wave absorbing agent includes one kind of iron aluminum silicon powder, iron powder, graphite powder；
The coupling agent includes silanes, one kind of phthalate, aluminate；
The accelerating agent is triphenyl phosphite；
The curing agent is containing hydrogen silicone oil；
The catalyst is platinum catalyst.
A kind of optimal technical scheme of the present embodiment：In step 3, the calendering roll body on calender magnetizes, and improves flux density
Degree, to improve the mode of magnetic conductivity and thermal coefficient.
The present invention more contributes to the formation of heat conduction absorbing material so that the absorbing property of finally formed absorbing material is more
By force, it is better than the performance 5-15% of the absorbing material of commonsense method formation, and is formed by absorbing material performance and more stablizes.
The foregoing is merely the preferred embodiment of the present invention, are not intended to limit the scope of the invention, every profit
The equivalent structure or equivalent flow shift made by description of the invention and content is applied directly or indirectly in other relevant
Technical field is included within the scope of the present invention.
Claims (10)
1. a kind of heat conduction absorbing material, which is characterized in that the composition of the absorbing material includes by mass parts：
Component A：6-15 parts of silicone oil；
6-15 parts of heat filling；
70-85 parts of wave absorbing agent；
1-5 parts of coupling agent；
B component：10-25 parts of curing agent；
10-25 parts of catalyst；
1-3 parts of accelerating agent.
2. a kind of heat conduction absorbing material according to claim 1, it is characterised in that：The heat filling include aluminium oxide,
A kind of in silica, zinc oxide, magnesia, calcium oxide, aluminium nitride, boron nitride, silicon carbide is compounded at several.
3. a kind of heat conduction absorbing material according to claim 1, it is characterised in that：The wave absorbing agent include iron aluminum silicon powder,
One kind of iron powder, graphite powder.
4. a kind of heat conduction absorbing material according to claim 1, it is characterised in that：The coupling agent includes silanes, phthalein
Esters of gallic acid, one kind of aluminate.
5. a kind of heat conduction absorbing material according to claim 1, it is characterised in that：The accelerating agent is phosphorous triphenyl phosphate
Ester.
6. a kind of heat conduction absorbing material according to claim 1, it is characterised in that：The curing agent is containing hydrogen silicone oil.
7. a kind of heat conduction absorbing material according to claim 1, it is characterised in that：The catalyst is platinum catalyst.
8. a kind of preparation method with the heat conduction absorbing material described in claim 1-7 any one, which is characterized in that the preparation
Method includes the following steps：
Step 1 is surface-treated heat filling and wave absorbing agent with coupling agent respectively, then by heat filling, wave absorbing agent,
Silicone oil is packed into de-airing mixer, stirs 0.5-2h, and component A is made；
Step 2 mixes component A mixture with accelerating agent, curing agent, and mixed component stirs at a temperature of 25-40 DEG C
Then catalyst is added in 10-15min, continue stirring 5-10min and stir evenly；
Step 3, the mixed slurry after step 2 is stirred inject calender, are led by 100 DEG C of isothermal curing 5-15min
Hot absorbing material.
9. preparation method according to claim 8, it is characterised in that：
The heat filling includes in aluminium oxide, silica, zinc oxide, magnesia, calcium oxide, aluminium nitride, boron nitride, silicon carbide
A kind of compounded at several；
The wave absorbing agent includes one kind of iron aluminum silicon powder, iron powder, graphite powder；
The coupling agent includes silanes, one kind of phthalate, aluminate；
The accelerating agent is triphenyl phosphite；
The curing agent is containing hydrogen silicone oil；
The catalyst is platinum catalyst.
10. preparation method according to claim 8, it is characterised in that step 3, the calendering roll body on calender magnetize.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810577362.5A CN108633243A (en) | 2018-06-07 | 2018-06-07 | A kind of heat conduction absorbing material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810577362.5A CN108633243A (en) | 2018-06-07 | 2018-06-07 | A kind of heat conduction absorbing material |
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| CN108633243A true CN108633243A (en) | 2018-10-09 |
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| CN201810577362.5A Pending CN108633243A (en) | 2018-06-07 | 2018-06-07 | A kind of heat conduction absorbing material |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110294939A (en) * | 2019-06-04 | 2019-10-01 | 深圳市飞荣达科技股份有限公司 | High thermal conductivity inhales wave silicon composition and preparation method thereof |
| CN110564161A (en) * | 2019-09-09 | 2019-12-13 | 东莞市雷兹盾电子材料有限公司 | Solvent-free high-thermal-conductivity magnetic silicone rubber and preparation method thereof |
| CN110730607A (en) * | 2019-10-16 | 2020-01-24 | 深圳市飞鸿达科技有限公司 | Heat-conducting wave-absorbing insulating sheet with high heat-conducting performance and preparation method thereof |
| CN111909524A (en) * | 2020-04-16 | 2020-11-10 | 深圳和畅电磁材料有限公司 | Silica gel wave-absorbing material for high-frequency welding and preparation method thereof |
| CN112143239A (en) * | 2020-10-14 | 2020-12-29 | 深圳市飞荣达科技股份有限公司 | Broadband heat-conducting wave-absorbing gasket and preparation method thereof |
| CN113199837A (en) * | 2021-05-12 | 2021-08-03 | 深圳和畅电磁材料有限公司 | Preparation method of high-performance heat-conducting wave-absorbing composite material |
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| CN104530706A (en) * | 2014-12-16 | 2015-04-22 | 惠州力王佐信科技有限公司 | Graphene reinforced organic silicon heat-conductive material and preparation method thereof |
| CN104531022A (en) * | 2014-12-16 | 2015-04-22 | 惠州力王佐信科技有限公司 | High-heat-conductivity insulating adhesive material and preparation method thereof |
| CN104559131A (en) * | 2014-12-16 | 2015-04-29 | 惠州力王佐信科技有限公司 | High heat-conducting wave-absorbing heat-dissipation composite material |
| CN105647191A (en) * | 2016-04-01 | 2016-06-08 | 平湖阿莱德实业有限公司 | Flexible heat conduction interface material with wave absorbing function and preparation method thereof |
| CN107690270A (en) * | 2017-07-31 | 2018-02-13 | 广州金南磁性材料有限公司 | Ripple electromagnetic material and preparation method thereof is inhaled in a kind of paste heat conduction |
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2018
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Patent Citations (5)
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| CN104530706A (en) * | 2014-12-16 | 2015-04-22 | 惠州力王佐信科技有限公司 | Graphene reinforced organic silicon heat-conductive material and preparation method thereof |
| CN104531022A (en) * | 2014-12-16 | 2015-04-22 | 惠州力王佐信科技有限公司 | High-heat-conductivity insulating adhesive material and preparation method thereof |
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| CN105647191A (en) * | 2016-04-01 | 2016-06-08 | 平湖阿莱德实业有限公司 | Flexible heat conduction interface material with wave absorbing function and preparation method thereof |
| CN107690270A (en) * | 2017-07-31 | 2018-02-13 | 广州金南磁性材料有限公司 | Ripple electromagnetic material and preparation method thereof is inhaled in a kind of paste heat conduction |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110294939A (en) * | 2019-06-04 | 2019-10-01 | 深圳市飞荣达科技股份有限公司 | High thermal conductivity inhales wave silicon composition and preparation method thereof |
| CN110564161A (en) * | 2019-09-09 | 2019-12-13 | 东莞市雷兹盾电子材料有限公司 | Solvent-free high-thermal-conductivity magnetic silicone rubber and preparation method thereof |
| CN110730607A (en) * | 2019-10-16 | 2020-01-24 | 深圳市飞鸿达科技有限公司 | Heat-conducting wave-absorbing insulating sheet with high heat-conducting performance and preparation method thereof |
| CN111909524A (en) * | 2020-04-16 | 2020-11-10 | 深圳和畅电磁材料有限公司 | Silica gel wave-absorbing material for high-frequency welding and preparation method thereof |
| CN112143239A (en) * | 2020-10-14 | 2020-12-29 | 深圳市飞荣达科技股份有限公司 | Broadband heat-conducting wave-absorbing gasket and preparation method thereof |
| CN112143239B (en) * | 2020-10-14 | 2022-05-27 | 深圳市飞荣达科技股份有限公司 | Broadband heat-conducting wave-absorbing gasket and preparation method thereof |
| CN113199837A (en) * | 2021-05-12 | 2021-08-03 | 深圳和畅电磁材料有限公司 | Preparation method of high-performance heat-conducting wave-absorbing composite material |
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Application publication date: 20181009 |