CN108630560A - The manufacturing method and sensing device of sensing device - Google Patents
The manufacturing method and sensing device of sensing device Download PDFInfo
- Publication number
- CN108630560A CN108630560A CN201710161544.XA CN201710161544A CN108630560A CN 108630560 A CN108630560 A CN 108630560A CN 201710161544 A CN201710161544 A CN 201710161544A CN 108630560 A CN108630560 A CN 108630560A
- Authority
- CN
- China
- Prior art keywords
- flexible
- chip
- conducting rubber
- manufacturing
- flexible pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83874—Ultraviolet [UV] curing
Abstract
The invention discloses a kind of manufacturing method of sensing device and sensing devices.Manufacturing method includes the following steps.Flexible chip is pressed to by anisotropic conducting rubber film on flexible PCB.Using ultraviolet light through flexible PCB irradiation anisotropic conducting rubber the first predetermined time of film so that anisotropic conducting rubber film cures, the solidification temperature of anisotropic conducting rubber film is less than the deformation temperature of flexible chip.The manufacturing method of embodiment of the present invention is less than the anisotropic conducting rubber film of the deformation temperature of flexible chip using solidification temperature, and anisotropic conducting rubber film is irradiated to reach solidification temperature from flexible PCB side using ultraviolet light, it avoids flexible chip, anisotropic conducting rubber film and flexible PCB being all placed in hot environment, to effectively avoid or at least improve the situation of flexible chip warpage, mounting quality is promoted.
Description
Technical field
The present invention relates to sensor field more particularly to the manufacturing methods and sensing device of a kind of sensing device.
Background technology
It may when certain flexible chips are mounted by anisotropic conducting rubber film onto flexible PCB under high temperature environment
Cause flexible chip that warpage occurs because of the thermal expansion difference between flexible chip and flexible PCB, influences mounting quality, most
The operating accuracy of flexible chip is influenced eventually.
Invention content
Embodiment of the present invention provides a kind of manufacturing method and sensing device of sensing device.
The manufacturing method that embodiment of the present invention provides is used for flexible chip attachment to flexible PCB, the manufacturer
Method includes the following steps：
The flexible chip is pressed to by anisotropic conducting rubber film on the flexible PCB；
First predetermined time of anisotropic conducting rubber film is irradiated so that institute through the flexible PCB using ultraviolet light
The solidification of anisotropic conducting rubber film is stated, the solidification temperature of the anisotropic conducting rubber film is less than the deformation temperature of the flexible chip.
The anisotropy that the manufacturing method of embodiment of the present invention is less than the deformation temperature of flexible chip using solidification temperature is led
Electric glued membrane, and anisotropic conducting rubber film is irradiated from flexible PCB side using ultraviolet light and reaches solidification temperature, avoid by
Flexible chip, anisotropic conducting rubber film and flexible PCB are all placed in hot environment, to effectively avoid or at least improve
The situation of flexible chip warpage promotes mounting quality.
In some embodiments, the deformation temperature of the flexible chip is more than or equal to 130 DEG C, and the solidification temperature is less than
Equal to 100 DEG C.
In some embodiments, the solidification temperature is more than or equal to 50 DEG C.
In some embodiments, the flexible PCB uses polyimide material.
In some embodiments, the flexible chip includes the chip binding face being bonded with the anisotropic conducting rubber film
With the multiple chip pins being formed on the chip binding face, the flexible PCB includes and the anisotropic conducting rubber film
The circuit board binding face of fitting and the multiple circuit board connecting pins being formed on the circuit board binding face, the two neighboring chip
Between pin, the distance between two neighboring circuit board connecting pins be less than 50 μm.
In some embodiments, the anisotropic conducting rubber film includes colloid layer and conductive layer, and the conductive layer includes
Conducting particles, the conducting particles are electrically connected the chip pin and the circuit board connecting pins, the diameter of the conducting particles
It is 3 μm -5 μm.
In some embodiments, the colloid layer includes respectively close to the flexible chip and the flexible PCB
Colloid layer, the conductive layer is between the colloid layer.
In some embodiments, the manufacturing method is pressed to flexible chip by anisotropic conducting rubber film described
Include the following steps before step on flexible flexible PCB：
The anisotropic conducting rubber film is pressed to using pressure head under the first temperature environment less than the deformation temperature
On the flexible PCB, protective film is provided between the pressure head and the anisotropic conducting rubber film；
Kept for the second predetermined time of the pressure head so that the anisotropic conducting rubber film attaches to the flexible flexible circuit
Plate；
Withdraw the pressure head；With
Detach the protective film.
In some embodiments, first temperature environment is 50 DEG C -80 DEG C.
In some embodiments, second predetermined time is 1-10 seconds.
In some embodiments, described to press to flexible chip on flexible PCB by anisotropic conducting rubber film
Step includes the following steps：
Using pressure head the flexible chip pressed under the second temperature environment less than the deformation temperature described soft
On property circuit board, protective film is provided between the pressure head and the flexible chip；
Kept for the pressure head third predetermined time so that the flexible chip attaches to the flexible PCB；
Withdraw the pressure head；With
Detach the protective film.
In some embodiments, the second temperature environment is 50 DEG C -100 DEG C.
In some embodiments, the third predetermined time is 1-10 seconds.
In some embodiments, first predetermined time is -30 seconds 5 seconds.
A kind of sensing device that embodiment of the present invention provides, including：
The deformation temperature of flexible chip, the flexible chip is more than or equal to 130 DEG C；
Flexible PCB；
The flexible chip is pressed to by anisotropic conductive film on the flexible PCB, the anisotropic conductive adhesive paste
The solidification temperature of film is less than 100 DEG C.
The anisotropy that the sensing device of embodiment of the present invention is less than the deformation temperature of flexible chip using solidification temperature is led
Electric glued membrane, and due to reaching solidification temperature from flexible PCB side irradiation anisotropic conducting rubber film using ultraviolet light, avoid
Flexible chip, anisotropic conducting rubber film and flexible PCB are all placed in hot environment, effectively prevents or at least improves
The situation of flexible chip warpage, ensure that the operating accuracy of sensing device.
In some embodiments, the flexible chip includes the chip binding face being bonded with the anisotropic conducting rubber film
With the multiple chip pins being formed on the chip binding face, the flexible PCB includes and the anisotropic conducting rubber film
The circuit board binding face of fitting and the multiple circuit board connecting pins being formed on the circuit board binding face, the chip pin and institute
The quantity for stating the chip pin and the circuit board connecting pins that circuit board connecting pins are correspondingly arranged and are not correspondingly arranged is less than 25%.
In some embodiments, the pulling capacity between the flexible chip and the flexible PCB is more than or equal to 5N.
The additional aspect and advantage of embodiment of the present invention will be set forth in part in the description, partly will be from following
Become apparent in description, or practice through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, wherein：
Fig. 1 is the flow diagram of the manufacturing method of the sensing device of embodiment of the present invention.
Fig. 2 is the structural schematic diagram of the sensing device of embodiment of the present invention.
Main element symbol description：
Sensing device 100, flexible chip 10, flexible PCB 20, anisotropic conducting rubber film 30, chip pin 12, circuit
Plate pin 22, colloid layer 32, conductive layer 34, conducting particles 36.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be to be electrically connected or can mutually communicate to be mechanical connection；It can be directly connected, it can also be by between intermediary
It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the description of the present invention unless specifically defined or limited otherwise, fisrt feature in the "upper" of second feature or
"lower" may include that the first and second features are in direct contact, can also include the first and second features not be in direct contact but
Pass through the other characterisation contact between them.Moreover, fisrt feature second feature " on ", " top " and " above " include
Fisrt feature is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.First
Feature second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or only
Only indicate that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
It please refers to Fig.1 and Fig. 2, the manufacturing method and sensing of a kind of sensing device 100 that embodiment of the present invention provides fills
Set 100.
A kind of manufacturing method that embodiment of the present invention provides, for flexible PCB 20 to be arrived in the attachment of flexible chip 10,
Manufacturing method includes the following steps：
S1：Flexible chip 10 is pressed to by anisotropic conducting rubber film 30 on flexible PCB 20；
S2：30 first predetermined time of anisotropic conducting rubber film is irradiated through flexible PCB 20 using ultraviolet light (not shown)
So that anisotropic conducting rubber film 30 cures.
The solidification temperature of anisotropic conducting rubber film 30 is less than the deformation temperature of flexible chip 10.
The manufacturing method of embodiment of the present invention is less than the anisotropy of the deformation temperature of flexible chip 10 using solidification temperature
Conductive adhesive film 30, and solidification temperature is reached from 20 side of flexible PCB irradiation anisotropic conducting rubber film 30 using ultraviolet light
Degree, avoids flexible chip 10, anisotropic conducting rubber film 30 and flexible PCB 20 being all placed in hot environment, to effectively keep away
The case where exempting from or at least improving 10 warpage of flexible chip, promotes the mounting quality of sensing device.
Specifically, carrier of the embodiment of the present invention using flexible PCB 20 as encapsulation flexible chip 10, passes through heat
Pressing engages flexible chip 10 with soft type circuit board 20.
This packaging method has the characteristic of miniaturization, group's engagement, high production and high-reliability, substantially increases sensing
The manufacture efficiency of device 100.
Further, the curing degree of anisotropic conducting rubber film 30 is more than 70%.
In this way, improving the Cohesion reliability between flexible chip 10 and soft type circuit board 20, flexible chip 10 and flexibility
It is less prone to peeling between circuit board 20.Meanwhile it being not easy to be formed between flexible chip 10 and soft type circuit board 20 and overlaying gas
Bubble, ensure that the reliability that electrically conducts between flexible chip 10 and flexible PCB 20.
Specifically, the anisotropic conducting rubber film 30 of 16 models may be selected in anisotropic conducting rubber film 30.
Hot press operation can be completed in the anisotropic conducting rubber film 30 of 16 models at 80 DEG C, and flexible chip 10 is without being subjected to height
Temperature ensure that the stability of flexible chip 10, improve the accuracy of identification of sensing device 100.Meanwhile 16 the anisotropy of model lead
Electric glued membrane 30 press after impedance is low, stability is high, can high temperature resistant and high humidity environment, further ensure the matter of sensing device 100
Amount.
In some embodiments, the deformation temperature of flexible chip 10 is more than or equal to 130 DEG C, and solidification temperature is less than or equal to
100℃。
In this way, when irradiating anisotropic conducting rubber film 30 using ultraviolet light, anisotropic conducting rubber film 30 is easy to cure, to tight
Close cohesive flexible chip 10 and flexible PCB 20 avoid flexible chip 10 and exist without making flexible chip 10 deform upon
Warpage occurs when higher than deformation temperature, influences the tight ness rating of the bonding between flexible chip 10 and flexible PCB 20.
In some embodiments, solidification temperature is more than or equal to 50 DEG C.
In this way, avoiding at normal temperatures or using the electronic device adstante febre anisotropic conducting rubber of this sensing device 100
Film 30 melts, the case where to influence the electric connection between flexible chip 10 and flexible PCB 20.
It is possible to further the different electronic devices being applicable according to sensing device 100, the different of different solidification temperatures is selected
Tropism conductive adhesive film 30.
In this way, can guarantee that anisotropic conducting rubber film 30 will not melt sensing device 100 in use, ensure sensing dress
Set 100 operating accuracy.
In some embodiments, flexible PCB 20 uses polyimide material.
Polyimides is the preferable high-molecular organic material of comprehensive performance, and high temperature resistant possesses higher insulation performance.Such as
This, flexible PCB 20 is not susceptible to deformation in bonding processes.Simultaneously as the insulation performance of flexible PCB 20 is preferable,
Sensing device 100 is not susceptible to short circuit phenomenon, extends the service life of sensing device 100.
In some embodiments, flexible chip 10 includes the chip binding face being bonded with anisotropic conducting rubber film 30 and shape
At in multiple chip pins 12 on 10 binding face of flexible chip, flexible PCB 20 includes and anisotropic conducting rubber film 30 is bonded
Circuit board binding face and multiple circuit board connecting pins 22 for being formed on circuit board binding face, two neighboring chip pin 12 it
Between, the distance between two neighboring circuit board connecting pins 22 be less than 50 μm.
In this way, between the filling chip pin 12 of anisotropic conducting rubber film 30 between chip pin 12, circuit board connecting pins 22
Between be not susceptible to short circuit, ensure that the service life of sensing device 100.Meanwhile between adjacent chips pin 12, adjacent circuit
The distance between plate pin 22 is advantageously implemented less than 50 μm and is set on the flexible chip 10 and flexible PCB 20 of finite length
More chips pin 12 and circuit board connecting pins 22 are set, the electrical exchange effect between flexible chip 10 and flexible PCB 20 is improved
Rate.
In some embodiments, anisotropic conducting rubber film 30 includes colloid layer 32 and conductive layer 34, and conductive layer 34 includes
Conducting particles 36, the electric connection chip pin 12 of conducting particles 36 and circuit board connecting pins 22, a diameter of 2 μm -5 of conducting particles 36
μm。
In embodiment of the present invention, 32 energy blocks moisture of colloid layer, heat-resisting and insulation are kept inside anisotropic conducting rubber film 30
Drying, avoid short circuit between flexible chip 10 and soft type circuit board 20.Meanwhile colloid layer 32 secures flexibility
Relative position between chip 10 and soft type circuit board 20, and certain compressing strength is provided to maintain chip pin 12 and circuit
Contact area between plate pin 22 and conducting particles 36 ensures the conducting between chip pin 12 and circuit board connecting pins 22.In addition,
A diameter of 2 μm -5 μm of conducting particles 36 is chosen, is conducive to make electrically conducting between flexible chip 10 and flexible PCB 20
Reach preferable effect, improves the reaction speed of sensing device 100.
Specifically, colloid layer 32 includes epoxy resin.
Epoxy resin belongs to type thermosetting resin, and the epoxy resin after solidification has good physics, chemical property, to core
There is excellent adhesive strength between piece pin 12 and circuit board connecting pins 22.Epoxy resin dielectric properties after solidification are good, become
Shape shrinking percentage is small, good stability of the dimension, hardness are high, and flexibility is also preferable so that between flexible chip 10 and soft type circuit board 20
Stable connection, electrically exchanges unobstructed, further improves the work precision of sensing device 100.
36 surface of conducting particles carries out insulation processing.
In this way, conducting particles 36 can prevent the short-circuit conditions in transverse direction, that is, prevent between adjacent chips pin 12 and phase
Between adjacent circuit plate pin 22 due to the presence of conducting particles 36 short circuit.
Specifically, 36 plating metal on surface powder of conducting particles, metal powder include the powder etc. of nickel, gold, silver and tin.
In some embodiments, colloid layer 32 includes the colloid layer respectively close to flexible chip 10 and flexible PCB 20
32, conductive layer 34 is between colloid layer 32.
In this way, the connection between flexible chip 10 and flexible PCB 20 is more closely and stable, meanwhile, flexible chip 10
It is electrically exchanged between flexible PCB 20 more stable.
In some embodiments, manufacturing method is in S1：Flexible chip 10 is pressed to by anisotropic conducting rubber film 30
Include the following steps before step on flexible flexible PCB 20：
S3：Anisotropic conducting rubber film 30 is pressed using pressure head (not shown) under the first temperature environment less than deformation temperature
It closes on flexible PCB 20.
Protective film (not shown) is provided between pressure head and anisotropic conducting rubber film 30.
S4：Kept for the second predetermined time of pressure head so that anisotropic conducting rubber film 30 attaches to flexible PCB 20.
S5：Withdraw pressure head.
S6：Separating protective film.
In embodiment of the present invention, when anisotropic conducting rubber film 30 is pressed on flexible PCB 20 using pressure head,
Pad layer protecting film between pressure head and anisotropic conducting rubber film 30, avoid anisotropic conducting rubber film 30 deform upon influence and
Flexible chip 10 is bonded or pressure head causes to damage to anisotropic conducting rubber film 30.
Specifically, the operation that anisotropic conducting rubber film 30 presses on flexible PCB 20 is completed by this press.
This press is a kind of machine suitable for the pressing of high density glued membrane and touch screen this pressure production technology.Operating accuracy
It is higher, the tight ness rating connected between anisotropic conducting rubber film 30 and flexible PCB 20 can be effectively improved.
In some embodiments, the first temperature environment is 50 DEG C -80 DEG C.
It is cured when in this way, anisotropic conducting rubber film 30 can be made to be placed on flexible PCB 20, so that incorgruous
Property conductive adhesive film 30 and flexible PCB 20 more stably connect.
Specifically, the pressure head of this press can be controlled by microcontroller, and PULSE HEATING is carried out to anisotropic conducting rubber film 30.
In this way, the realization of anisotropic conducting rubber film 30 can be made to be rapidly heated, be quickly cooled down, and the pressure head of this press can be arranged four
Section heating temperature work, makes the temperature of anisotropic conducting rubber film 30 accurately control, ensures anisotropic conducting rubber film 30 and flexible electrical
The stability of connection between road plate 20.
Further, titanium alloy thermal head can be used in pressure head.
In this way, the heating of anisotropic conducting rubber film 30 is rapider, the process time of sensing device 100 can be saved, reduces and adds
Work cost.
In some embodiments, the second predetermined time was 1-10 seconds.
It is pressed on flexible PCB 20 in this way, pressure head can stablize anisotropic conducting rubber film 30, avoids anisotropy and lead
It is bonded not close between electric glued membrane 30 and flexible PCB 20 and influences electrical between flexible chip 10 and flexible PCB 20
Exchange.Meanwhile the control of the second predetermined time is 1-10 seconds, can shorten the process time of sensing device 100, improves sensing device
100 processing efficiency, to reduce processing cost.
Specifically, the second predetermined time was not limited to the time discussed in the above embodiment, and can be according to different
Anisotropic conducting rubber film 30 and different environmental selections suitable time, so that the stabilization of anisotropic conducting rubber film 30 is attached to flexibility
On circuit board 20.
In some embodiments, S1：Flexible chip 10 is pressed into flexible PCB by anisotropic conducting rubber film 30
Step on 20 includes the following steps：
S7：Flexible chip 10 is pressed into flexible PCB using pressure head under the second temperature environment less than deformation temperature
On 20.
It is provided with protective film between pressure head and flexible chip 10.
S8：Kept for the pressure head third predetermined time so that flexible chip 10 attaches to flexible PCB 20.
S5：Withdraw pressure head.
S6：Separating protective film.
In embodiment of the present invention, when being pressed to flexible chip 10 on flexible PCB 20 using pressure head, in pressure head
Pad layer protecting film between flexible chip 10, avoid flexible chip 10 deform upon influence and flexible PCB 20 fitting or
Person's pressure head causes to damage to flexible chip 10.
Specific pressing mode had above carried out description, and details are not described herein again.
In some embodiments, second temperature environment is 50 DEG C -100 DEG C.
In this way, flexible chip 10 will not be affected by temperature generation warpage, metaboly, flexible core under second temperature environment
Piece 10 can precisely attach on flexible PCB 20.Effective electrically friendship can be carried out between flexible chip 10 and flexible PCB 20
Stream.Meanwhile second temperature environment cannot be too small, otherwise anisotropic conducting rubber film 30 can not be fully cured, and can influence flexible chip
Electric connection between 10 and flexible PCB 20.
Specifically, second temperature environment changes with the variation of anisotropic conducting rubber film 30.Anisotropic conducting rubber film 30 is solid
It is higher to change required temperature, second temperature environment is then larger；It is relatively low that anisotropic conducting rubber film 30 cures required temperature, and
Two temperature environments are then smaller.But it should be noted that second temperature environment not above flexible chip 10 and flexible PCB 20
Deformation temperature.
In some embodiments, the third predetermined time is 1-10 seconds.
After flexible chip 10 and flexible PCB 20 are bonded, pressure head continues to keep pressure 1-10 seconds to flexible chip 10,
It can be more stable by the connection between flexible chip 10 and flexible PCB 20.Meanwhile effectively saving the encapsulation of sensing device 100
Time improves the packaging efficiency of sensing device 100.
Specifically, the third predetermined time is not limited to the time discussed above, and can be according to flexible chip 10 and flexible electrical
Fitting situation between road plate 20 is adjusted.
In some embodiments, the first predetermined time was -30 seconds 5 seconds.
In this way, anisotropic conducting rubber can be made through the ultraviolet light that flexible PCB 20 is irradiated on anisotropic conducting rubber film 30
30 rapid curing of film, to firmly bond flexible chip 10 and flexible PCB 20.
Specifically, ultraviolet light irradiation anisotropic conducting rubber film 30 and to be allowed to the cured time be 5-10 seconds.
In this way, substantially reducing the packaging time of sensing device 100, the production efficiency of sensing device 100 is improved.
Specifically, ultraviolet light source has longer service life, non-thermal radiation, service life not by opening and closing times influence, energy is high, shines
Uniform advantage is penetrated, while ultraviolet light source is free of Toxic substance.
In this way, the method encapsulation sensing device 100 of ultraviolet light irradiation is more safer than conventional method, more environmentally friendly.
Further, when irradiating anisotropic conducting rubber film 30 using ultraviolet light, moreover it is possible to be made using reflector (not shown) different
Tropism conductive adhesive film 30 obtains the uv energy of higher intensity, while reducing the temperature of anisotropic conducting rubber film 30, further protects
Card flexible chip 10 will not deform upon, warpage the phenomenon that.
A kind of sensing device 100 that embodiment of the present invention provides, including flexible chip 10 and flexible PCB 20.It is flexible
The deformation temperature of chip 10 is more than or equal to 130 DEG C.Flexible chip 10 presses to flexible PCB 20 by anisotropic conductive film
On, the solidification temperature of anisotropic conductive film is less than 100 DEG C.
The sensing device 100 of embodiment of the present invention is less than the incorgruous of the deformation temperature of flexible chip 10 using solidification temperature
Property conductive adhesive film 30, and due to reaching solidification from 20 side of flexible PCB irradiation anisotropic conducting rubber film 30 using ultraviolet light
Temperature is avoided flexible chip 10, anisotropic conducting rubber film 30 and flexible PCB 20 being all placed in hot environment, effectively be avoided
Or the situation of 10 warpage of flexible chip is at least improved, it ensure that the operating accuracy of sensing device 100.
Specifically, flexible chip 10 and flexible PCB 20 are described in detail above, and details are not described herein again.
In some embodiments, flexible chip 10 includes the chip binding face being bonded with anisotropic conducting rubber film 30 and shape
At in multiple chip pins 12 on chip binding face, flexible PCB 20 includes the circuit being bonded with anisotropic conducting rubber film 30
Plate binding face and the multiple circuit board connecting pins 22 being formed on circuit board binding face, chip pin 12 and circuit board connecting pins 22 correspond to
The quantity of the chip pin 12 and circuit board connecting pins 22 that are arranged and are not correspondingly arranged is less than 25%.
In this way, the electrical communication efficiency between flexible chip 10 and flexible PCB 20 is improved, to improve sensing
The reaction speed of device 100.
Specifically, flexible chip 10, anisotropic conducting rubber film 30 are being placed and when flexible PCB 20, should be noted pair
Neat chip pin 12 and circuit board connecting pins 22.Using pressure head to anisotropic conducting rubber film 30 and flexible chip 10 press when
It waits, pressure head is kept to be moved upwards perpendicular to the side of flexible chip 10 and flexible PCB 20.
In this way, can be further ensured that chip pin 12 and circuit board connecting pins 22 are correspondingly arranged, the core not being correspondingly arranged is reduced
The quantity of piece pin 12 and circuit board connecting pins 22, to improve the effect electrically exchanged between flexible chip 10 and flexible PCB 20
Rate.
In some embodiments, the pulling capacity between flexible chip 10 and flexible PCB 20 is more than or equal to 5N.
In this way, when sensing device 100 occurs slight impact or falls, flexible chip 10 and flexible PCB 20 are not easy to take off
It falls, ensure that the service life of sensing device 100.
Specifically, the pulling capacity between flexible chip 10 and flexible PCB 20 can be surveyed by universal tensile testing machine
Examination.
The precision of universal tensile testing machine is high, can reach 0.5 grade, flexible chip 10 and flexible PCB 20 has been effectively ensured
Between pulling capacity test accuracy, for improve sensing device 100 quality provide effective reference.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the present invention.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
Can these embodiments be carried out with a variety of variations in the case of not departing from the principle of the present invention and objective, modification, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (17)
1. a kind of manufacturing method, for by flexible chip attachment to flexible PCB, which is characterized in that the manufacturing method includes
Following steps：
The flexible chip is pressed to by anisotropic conducting rubber film on the flexible PCB；
First predetermined time of anisotropic conducting rubber film is irradiated so that described different through the flexible PCB using ultraviolet light
Tropism conductive adhesive film cures, and the solidification temperature of the anisotropic conducting rubber film is less than the deformation temperature of the flexible chip.
2. manufacturing method as described in claim 1, which is characterized in that the deformation temperature of the flexible chip is more than or equal to 130
DEG C, the solidification temperature is less than or equal to 100 DEG C.
3. manufacturing method as described in claim 1, which is characterized in that the solidification temperature is more than or equal to 50 DEG C.
4. manufacturing method as described in claim 1, which is characterized in that the flexible PCB uses polyimide material.
5. manufacturing method as described in claim 1, which is characterized in that the flexible chip include and the anisotropic conducting rubber
The chip binding face of film fitting and multiple chip pins for being formed on the chip binding face, the flexible PCB include and
The circuit board binding face of the anisotropic conducting rubber film fitting and the multiple circuit boards being formed on the circuit board binding face draw
Foot, between the two neighboring chip pin, the distance between two neighboring circuit board connecting pins be less than 50 μm.
6. manufacturing method as claimed in claim 5, which is characterized in that the anisotropic conducting rubber film includes colloid layer and conduction
Layer, the conductive layer includes conducting particles, and the conducting particles is electrically connected the chip pin and the circuit board connecting pins, institute
State conducting particles a diameter of 3 μm -5 μm.
7. manufacturing method as claimed in claim 6, which is characterized in that the colloid layer includes respectively close to the flexible chip
With the colloid layer of the flexible PCB, the conductive layer is between the colloid layer.
8. manufacturing method as described in claim 1, which is characterized in that the manufacturing method it is described flexible chip passed through it is different
Include the following steps before the step that tropism conductive adhesive film presses on flexible flexible PCB：
Using pressure head the anisotropic conducting rubber film pressed under the first temperature environment less than the deformation temperature described
On flexible PCB, protective film is provided between the pressure head and the anisotropic conducting rubber film；
Kept for the second predetermined time of the pressure head so that the anisotropic conducting rubber film attaches to the flexible flexible PCB；
Withdraw the pressure head；With
Detach the protective film.
9. manufacturing method as claimed in claim 8, which is characterized in that first temperature environment is 50 DEG C -80 DEG C.
10. manufacturing method as claimed in claim 8, which is characterized in that second predetermined time is 1-10 seconds.
11. manufacturing method as described in claim 1, which is characterized in that described that flexible chip is passed through anisotropic conducting rubber film
The step pressed on flexible PCB includes the following steps：
The flexible chip is pressed into the flexible electrical using pressure head under the second temperature environment less than the deformation temperature
On the plate of road, protective film is provided between the pressure head and the flexible chip；
Kept for the pressure head third predetermined time so that the flexible chip attaches to the flexible PCB；
Withdraw the pressure head；With
Detach the protective film.
12. manufacturing method as claimed in claim 11, which is characterized in that the second temperature environment is 50 DEG C -100 DEG C.
13. manufacturing method as claimed in claim 11, which is characterized in that the third predetermined time is 1-10 seconds.
14. manufacturing method as described in claim 1, which is characterized in that first predetermined time is -30 seconds 5 seconds.
15. a kind of sensing device, which is characterized in that including：
The deformation temperature of flexible chip, the flexible chip is more than or equal to 130 DEG C；
Flexible PCB；
The flexible chip is pressed to by anisotropic conductive film on the flexible PCB, the anisotropic conductive film
Solidification temperature is less than 100 DEG C.
16. sensing device as claimed in claim 15, which is characterized in that the flexible chip includes and the anisotropy is conductive
The chip binding face of glued membrane fitting and the multiple chip pins being formed on the chip binding face, the flexible PCB include
The circuit board binding face being bonded with the anisotropic conducting rubber film and the multiple circuit boards being formed on the circuit board binding face
Pin, the chip pin and the circuit board connecting pins are correspondingly arranged and the chip pin not being correspondingly arranged and the circuit
The quantity of plate pin is less than 25%.
17. sensing device as claimed in claim 15, which is characterized in that between the flexible chip and the flexible PCB
Pulling capacity be more than or equal to 5N.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710161544.XA CN108630560A (en) | 2017-03-17 | 2017-03-17 | The manufacturing method and sensing device of sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710161544.XA CN108630560A (en) | 2017-03-17 | 2017-03-17 | The manufacturing method and sensing device of sensing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108630560A true CN108630560A (en) | 2018-10-09 |
Family
ID=63687442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710161544.XA Pending CN108630560A (en) | 2017-03-17 | 2017-03-17 | The manufacturing method and sensing device of sensing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108630560A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102498562A (en) * | 2009-07-27 | 2012-06-13 | 飞际控股有限公司 | Flexible circuit module |
| CN103309535A (en) * | 2013-06-06 | 2013-09-18 | 敦泰科技有限公司 | Capacitive touch screen |
| CN104380313A (en) * | 2012-04-24 | 2015-02-25 | 维普公司 | Method of manufacturing an electronic card |
| CN105375232A (en) * | 2014-08-18 | 2016-03-02 | 迪睿合株式会社 | Method for manufacturing connection structure and anisotropic conductive adhesive film |
| US20160218289A1 (en) * | 2015-01-23 | 2016-07-28 | Samsung Display Co., Ltd. | Bonding method and system for flexible display device |
-
2017
- 2017-03-17 CN CN201710161544.XA patent/CN108630560A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102498562A (en) * | 2009-07-27 | 2012-06-13 | 飞际控股有限公司 | Flexible circuit module |
| CN104380313A (en) * | 2012-04-24 | 2015-02-25 | 维普公司 | Method of manufacturing an electronic card |
| CN103309535A (en) * | 2013-06-06 | 2013-09-18 | 敦泰科技有限公司 | Capacitive touch screen |
| CN105375232A (en) * | 2014-08-18 | 2016-03-02 | 迪睿合株式会社 | Method for manufacturing connection structure and anisotropic conductive adhesive film |
| US20160218289A1 (en) * | 2015-01-23 | 2016-07-28 | Samsung Display Co., Ltd. | Bonding method and system for flexible display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7341642B2 (en) | Manufacturing method for electric device | |
| KR950008410B1 (en) | A method for electrically connecting ic chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby | |
| CN110265174A (en) | Anisotropic conductive film | |
| JP4123998B2 (en) | Electronic circuit device and manufacturing method thereof | |
| CN101960578A (en) | Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus | |
| KR20090051721A (en) | Electric components connecting method | |
| TWI425598B (en) | Adhesive for connection of circuit components | |
| US20030178132A1 (en) | Method for manufacturing connection structure | |
| CN106062118B (en) | The connection method of anisotropically conducting adhesive, the manufacturing method of connector and electronic component | |
| KR102634024B1 (en) | Manufacturing method of connection structure | |
| JP2013171656A (en) | Anisotropic conductive connection material, connection structure, method for manufacturing the same, and connection method | |
| CN102598884A (en) | Mounting apparatus and manufacturing method of electronic module | |
| CN107219949A (en) | A kind of binding technique of touch-screen | |
| CN101951725A (en) | Printed board unit and electronic installation | |
| CN203367239U (en) | Pressure connection device | |
| CN107481988B (en) | Flip chip packaging product without conductive adhesive and manufacturing process thereof | |
| CN108630560A (en) | The manufacturing method and sensing device of sensing device | |
| US10998201B2 (en) | Semiconductor encapsulation structure | |
| KR101211753B1 (en) | Method and device for connecting electronic parts using high frequency electromagnetic field | |
| KR100946597B1 (en) | Conductive ball with easily pressed down, method of mamufacturing thereof and anisotropic conductive film using the same | |
| JP5168110B2 (en) | Manufacturing method of electronic device | |
| CN103531437B (en) | Method for manufacturing semiconductor device and semiconductor device | |
| CN108633180A (en) | The manufacturing method and ultrasonic fingerprint sensing device of ultrasonic fingerprint sensing device | |
| JP5164499B2 (en) | Electronic component mounting method and electronic component mounting substrate | |
| JP4378788B2 (en) | IC chip connection method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181009 |