CN108628022B - Liquid crystal display and preparation method thereof - Google Patents
Liquid crystal display and preparation method thereof Download PDFInfo
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- CN108628022B CN108628022B CN201810670975.3A CN201810670975A CN108628022B CN 108628022 B CN108628022 B CN 108628022B CN 201810670975 A CN201810670975 A CN 201810670975A CN 108628022 B CN108628022 B CN 108628022B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136254—Checking; Testing
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- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a liquid crystal display and a preparation method thereof, wherein the method comprises the following steps: providing an array substrate mother board and a color film substrate mother board; detecting the array substrate motherboard and marking a short circuit area of the array substrate motherboard; coating conductive adhesive on the array substrate mother board and/or the color film substrate mother board and attaching the two to obtain a composite substrate, wherein the conductive adhesive coating is not performed on the short circuit area; and curing the composite substrate, inputting an electric signal from the color film substrate mother board, and transmitting the electric signal to the array substrate mother board through the conductive adhesive. By the mode, the invention can avoid resource waste and improve the yield of products.
Description
Technical Field
The invention relates to the technical field of display, in particular to a liquid crystal display and a preparation method thereof.
Background
With the continuous development of display technology, the performance requirements of people on displays are continuously improved, and liquid crystal displays using ITO films as CF substrate electrodes are hot spots for research due to the characteristics of good conductive effect, high visible light transmittance and the like.
In the preparation process of a large-size display, one side of a CF substrate is used as an electric signal input end, so that the array substrate with circuit faults such as short circuit and the like can cause all areas on the CF substrate to be abnormal after being communicated with the CF substrate, and cannot be used as a product, thereby not only causing serious waste, but also seriously influencing the yield of the product.
In a long-term research and development process, the inventor of the application finds that the existing LOC (lead on chip) technology has serious resource waste and unreliable product quality.
Disclosure of Invention
The invention mainly solves the technical problem of providing a liquid crystal display and a preparation method thereof, which can avoid resource waste and improve the yield of products.
In order to solve the technical problems, the invention adopts a technical scheme that: a method for fabricating a liquid crystal display is provided.
Wherein, the method comprises the following steps:
providing an array substrate mother board and a color film substrate mother board;
detecting the array substrate motherboard and marking a short circuit area of the array substrate motherboard;
coating conductive adhesive on the array substrate mother board and/or the color film substrate mother board and attaching the two to obtain a composite substrate, wherein the conductive adhesive coating is not performed on the short circuit area;
and curing the composite substrate, inputting an electric signal from the color film substrate mother board, and transmitting the electric signal to the array substrate mother board through the conductive adhesive.
In order to solve the technical problem, the invention adopts another technical scheme that: a liquid crystal display is provided.
Wherein, the liquid crystal display is prepared by any one of the methods.
The invention has the beneficial effects that: different from the situation of the prior art, the short-circuit area of the array substrate mother board is marked, and the conductive adhesive is not coated on the short-circuit area in the process of attaching the array substrate mother board and the color film substrate mother board, so that the short-circuit area of the array substrate mother board cannot be conducted with the color film substrate mother board in the curing process, and signals such as short circuit of the short-circuit area cannot be abnormally transmitted to the color film substrate mother board, and thus, only the short-circuit area and the area corresponding to the short-circuit area on the color film substrate mother board cannot be processed continuously to obtain a product, the problem that the whole color film substrate mother board is scrapped is solved, the resource waste can be effectively reduced, and the yield of the product is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic flow chart illustrating a method for fabricating a liquid crystal display according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an embodiment of a motherboard of an array substrate according to the present invention;
FIG. 3 is a schematic structural diagram of an embodiment of the composite substrate of the present invention;
fig. 4 is a schematic structural diagram of another embodiment of the array substrate motherboard according to the invention;
FIG. 5 is a schematic mechanical diagram of another embodiment of the composite substrate of the present invention;
FIG. 6 is a schematic structural diagram of an embodiment of a liquid crystal display according to the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a liquid crystal display, the method including:
step S100: an array substrate mother board and a color film substrate mother board are provided.
In step S100, the array substrate mother board and the color film substrate mother board are large-sized substrates that are not cut in the liquid crystal display production process, and the area of each substrate can reach 2 square meters or more than 2 square meters. The array substrate motherboard comprises a plurality of scanning lines and a plurality of data lines, wherein the plurality of scanning lines and the plurality of scanning lines are mutually crossed so as to divide the array substrate motherboard into a plurality of pixels; wherein each pixel comprises: a thin film transistor electrically connected to a corresponding scan line and a corresponding data line to control whether the pixel is turned on; and a pixel electrode electrically connected to the thin film transistor.
Step S200: and detecting the array substrate motherboard and marking the short-circuit area of the array substrate motherboard.
In step S200, the multi-array substrate motherboard is detected, and the detected short-circuited area is marked and fed back, so that the short-circuited area can be conveniently processed in a subsequent process. Further, referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of the array substrate motherboard according to the present invention, wherein the array substrate motherboard 100 is detected to determine that the short-circuit area is 110. The short-circuit area 110 is an electrostatic discharge short-circuit area, and the detection method for the array substrate motherboard 100 is a shorting bar detection method.
Step S300: and coating conductive adhesive on the array substrate mother board and/or the color film substrate mother board and attaching the two to obtain the composite substrate, wherein the conductive adhesive coating is not carried out in the short circuit area.
In the step S300, please refer to fig. 1, fig. 2 and fig. 3 together, in the box forming process, the composite substrate 300 is obtained by coating the conductive adhesive 120 between the array substrate mother board 100 and the color film substrate mother board 200 and attaching the two, and the conductive adhesive is not coated in the short circuit region 110, that is, the conductive adhesive 120 is not coated in the surface and outside the surface of the short circuit region 110. The conductive adhesive 120 not only conducts the array substrate mother board 100 and the color film substrate mother board 200, but also serves as a transmission medium for current between the two, so as to form an electric field for controlling the rotation of liquid crystal. Of course, the conductive adhesive 120 may be coated on the array substrate motherboard 100, the color film substrate motherboard 200, or both. In a real-time manner, the conductive adhesive 120 is coated on the color filter substrate mother substrate 200. In another embodiment, with continued reference to fig. 1 and 2, the conductive paste 120 is coated on the array substrate motherboard 100, and the conductive paste is not coated on the short circuit region 110.
Step S400: and curing the composite substrate, inputting an electric signal from the color film substrate mother board, and transmitting the electric signal to the array substrate mother board through the conductive adhesive.
In step S400, in the process of inputting an electrical signal from one side of the color filter substrate mother board during curing of the composite substrate, the ITO electrodes on the color filter substrate mother board are integrally connected, and the signal transmitted from one side of the array substrate mother board will have a corresponding influence on different areas of the color filter substrate mother board.
In this embodiment, by marking the short-circuit area of the array substrate motherboard and applying no conductive adhesive to the short-circuit area during the process of attaching the array substrate motherboard to the color film substrate motherboard, the short-circuit area of the array substrate motherboard cannot be conducted with the color film substrate motherboard during the curing process, and thus, signals such as short circuit in the short-circuit area cannot be abnormally transmitted to the color film substrate motherboard, so that only the short-circuit area and the area corresponding to the short-circuit area on the color film substrate motherboard cannot be processed to obtain a product, thereby avoiding the problem of scrapping of the entire color film substrate motherboard, effectively reducing resource waste, and improving the yield of the product.
In one embodiment, referring to fig. 4 and 5, the array substrate motherboard 700 includes at least one array substrate unit 701, and the array substrate unit 701 including the short circuit region 710 is not coated with a conductive paste 720. According to the product requirements, the large-size array substrate motherboard 700 is divided into a plurality of array substrate units 701 with different sizes, and further, the sizes of the array substrate units 701 are the same or different. In one embodiment, the array substrate units 701 have different sizes, and the array substrate units 701 with different sizes can fully utilize the space of the array substrate template 700, thereby reducing waste and improving production efficiency. Correspondingly, the color filter substrate mother board 800 is also divided into color filter substrate units (not shown) corresponding to the size and position of the array substrate unit 701, and the ITO electrodes 810 of different color filter substrate units are connected to each other, so that the composite substrate is conveniently cut into a plurality of composite substrate units.
Specifically, the short-circuit regions 710 may be all located in a certain array substrate unit 701, or may be distributed in a plurality of array substrate units 701, so that the array substrate units 701 including the short-circuit regions 710 are not coated with the conductive adhesive 720, and in the process of conducting the array substrate mother board 700 and the color film substrate mother board 800, the short-circuit signal cannot be transmitted to the color film substrate mother board 800, so that abnormal transmission of signals such as short circuit of the short-circuit regions 710 to the color film substrate mother board 800 can be avoided, and the whole color film substrate mother board 800 is scrapped, which is beneficial to improving the yield and production efficiency of products.
In one embodiment, before the array substrate mother board and the color film substrate mother board are attached to each other, the method further includes: and dripping liquid crystal on the array substrate mother board and/or the color film substrate mother board. Specifically, the liquid crystal is dripped by adopting an ODF process, namely, the liquid crystal is dripped in the atmosphere and attached in a vacuum state. In one embodiment, the array substrate unit including the short-circuit region is not subjected to liquid crystal dropping. That is, the further operation is stopped in the area where the product cannot be obtained, so that the waste of the raw materials of the subsequent process can be effectively avoided, the production cost can be reduced, and the production efficiency can be improved.
Further, the method further comprises the step of cutting the composite substrate to obtain the composite substrate unit, the cutting process can be carried out in different modes, in one embodiment, the composite substrate is cut in a laser cutting mode, and the cutting efficiency and the cutting accuracy can be effectively improved. Furthermore, the size of the composite basic unit is the same as the size of the corresponding array substrate unit, and the size of the composite substrate unit is also the size of the liquid crystal display product.
In one embodiment, the conductive adhesive is conductive gold adhesive, conductive silver adhesive or a composite of the conductive gold adhesive and the conductive silver adhesive. The conductive adhesive can not only play a role in bonding, but also carry out current transmission. Generally prepared by dispersing a conductive metal in a binder, and in one embodiment, the conductive adhesive is a conductive gold adhesive for better conductive effect. Further, the coating thickness of the conductive adhesive is 10-20 microns. To achieve good adhesion and electrical conductivity without the problem of flash, in one embodiment, the conductive paste is applied to a thickness of 10-20 microns, e.g., 10 microns, 15 microns, or 20 microns. Of course, different coating thicknesses of the conductive paste may be selected according to the size of the substrate to be bonded and the kind of the conductive paste.
In order to solve the technical problem, the invention adopts another technical scheme that: a liquid crystal display is provided. Referring to fig. 6, fig. 6 is a schematic structural diagram of an embodiment of a liquid crystal display according to the invention. Wherein the liquid crystal display 10 is manufactured by any of the methods. In the present embodiment, the lcd 10 is a large-sized lcd, and the screen size of the lcd 10 is greater than 65 inches, such as 88 inches, 110 inches, etc.
In summary, the present invention discloses a liquid crystal display and a method for manufacturing the same, the method comprising: providing an array substrate mother board and a color film substrate mother board; detecting the array substrate motherboard and marking a short circuit area of the array substrate motherboard; coating conductive adhesive on the array substrate mother board and/or the color film substrate mother board and attaching the two to obtain a composite substrate, wherein the conductive adhesive coating is not performed on the short circuit area; and curing the composite substrate, inputting an electric signal from the color film substrate mother board, and transmitting the electric signal to the array substrate mother board through the conductive adhesive. By the mode, the invention can avoid resource waste and improve the yield of products.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A method of fabricating a liquid crystal display, the method comprising:
providing an array substrate mother board and a color film substrate mother board;
detecting the array substrate motherboard and marking a short circuit area of the array substrate motherboard;
coating conductive adhesive on the array substrate mother board and/or the color film substrate mother board and attaching the array substrate mother board and the color film substrate mother board to obtain a composite substrate, wherein the conductive adhesive is not coated on the short circuit area, so that the short circuit area of the array substrate mother board cannot be conducted with the color film substrate mother board in the curing process;
and curing the composite substrate, inputting an electric signal from the color film substrate mother board, and transmitting the electric signal to the array substrate mother board through the conductive adhesive.
2. The method of claim 1, wherein the array substrate motherboard comprises at least one array substrate unit, and the array substrate unit including the short circuit region is not coated with a conductive paste.
3. The method of claim 2, wherein the at least one array substrate unit is the same or different in size.
4. The method of claim 1, wherein before the array substrate mother board and the color film substrate mother board are attached to each other, the method further comprises: and dripping liquid crystal on the array substrate mother board and/or the color film substrate mother board.
5. The method of claim 2, wherein the array substrate unit including the short-circuit region is not subjected to liquid crystal dropping.
6. The method of claim 2, further comprising: and cutting the composite substrate to obtain a composite substrate unit, wherein the size of the composite substrate unit is the same as that of the corresponding array substrate unit.
7. The method of claim 1, wherein the composite substrate is cut by laser cutting.
8. The method of claim 1, wherein the conductive adhesive is a conductive gold adhesive, a conductive silver adhesive, or a combination thereof.
9. The method of claim 1, wherein the conductive paste is applied to a thickness of 10-20 microns.
10. A liquid crystal display, characterized in that it is produced by a method according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810670975.3A CN108628022B (en) | 2018-06-26 | 2018-06-26 | Liquid crystal display and preparation method thereof |
| PCT/CN2018/116855 WO2020000883A1 (en) | 2018-06-26 | 2018-11-22 | Liquid crystal display and fabrication method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810670975.3A CN108628022B (en) | 2018-06-26 | 2018-06-26 | Liquid crystal display and preparation method thereof |
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| Publication Number | Publication Date |
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| CN108628022A CN108628022A (en) | 2018-10-09 |
| CN108628022B true CN108628022B (en) | 2020-07-03 |
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| WO (1) | WO2020000883A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108628022B (en) * | 2018-06-26 | 2020-07-03 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display and preparation method thereof |
| CN110221491A (en) * | 2019-05-06 | 2019-09-10 | 惠科股份有限公司 | Array substrate and preparation method thereof, liquid crystal display panel |
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| JPH09258254A (en) * | 1996-03-27 | 1997-10-03 | Seiko Epson Corp | Production of liquid crystal device |
| US5684546A (en) * | 1994-10-06 | 1997-11-04 | Samsung Electronics Co., Ltd. | Electrostatic discharge protective circuit in a liquid crystal display |
| CN101576691A (en) * | 2008-05-06 | 2009-11-11 | 上海广电Nec液晶显示器有限公司 | Method for repairing liquid crystal display device |
| CN204331211U (en) * | 2014-12-31 | 2015-05-13 | 上海天马微电子有限公司 | A kind of display module and display device |
| CN107290900A (en) * | 2017-08-07 | 2017-10-24 | 上海中航光电子有限公司 | A kind of motherboard |
| CN107632441A (en) * | 2017-10-12 | 2018-01-26 | 京东方科技集团股份有限公司 | The manufacture method and display panel of display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101609217A (en) * | 2009-07-14 | 2009-12-23 | 江西永盛电子有限公司 | Method for preparing thin film transistor color liquid crystal display module |
| CN102723311B (en) * | 2012-06-29 | 2014-11-05 | 京东方科技集团股份有限公司 | Array substrate measuring method |
| CN106445259A (en) * | 2015-08-05 | 2017-02-22 | 南京瀚宇彩欣科技有限责任公司 | Manufacture method of touch display component and repairing equipment of touch display component |
| CN107884977A (en) * | 2017-12-26 | 2018-04-06 | 深圳市华星光电技术有限公司 | A kind of liquid crystal display and preparation method thereof |
| CN108628022B (en) * | 2018-06-26 | 2020-07-03 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display and preparation method thereof |
-
2018
- 2018-06-26 CN CN201810670975.3A patent/CN108628022B/en active Active
- 2018-11-22 WO PCT/CN2018/116855 patent/WO2020000883A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5684546A (en) * | 1994-10-06 | 1997-11-04 | Samsung Electronics Co., Ltd. | Electrostatic discharge protective circuit in a liquid crystal display |
| JPH09258254A (en) * | 1996-03-27 | 1997-10-03 | Seiko Epson Corp | Production of liquid crystal device |
| CN101576691A (en) * | 2008-05-06 | 2009-11-11 | 上海广电Nec液晶显示器有限公司 | Method for repairing liquid crystal display device |
| CN204331211U (en) * | 2014-12-31 | 2015-05-13 | 上海天马微电子有限公司 | A kind of display module and display device |
| CN107290900A (en) * | 2017-08-07 | 2017-10-24 | 上海中航光电子有限公司 | A kind of motherboard |
| CN107632441A (en) * | 2017-10-12 | 2018-01-26 | 京东方科技集团股份有限公司 | The manufacture method and display panel of display panel |
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| WO2020000883A1 (en) | 2020-01-02 |
| CN108628022A (en) | 2018-10-09 |
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