CN108628022A - A kind of liquid crystal display and preparation method thereof - Google Patents
A kind of liquid crystal display and preparation method thereof Download PDFInfo
- Publication number
- CN108628022A CN108628022A CN201810670975.3A CN201810670975A CN108628022A CN 108628022 A CN108628022 A CN 108628022A CN 201810670975 A CN201810670975 A CN 201810670975A CN 108628022 A CN108628022 A CN 108628022A
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- motherboard
- array substrate
- color membrane
- membrane substrates
- short
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136254—Checking; Testing
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of liquid crystal display and preparation method thereof, this method includes：Array basal plate motherboard and a color membrane substrates motherboard are provided；It detects the array substrate motherboard and marks the short-circuited region of the array substrate motherboard；Conducting resinl is coated on the array substrate motherboard and/or the color membrane substrates motherboard and is bonded the two, obtains composite substrate, wherein the short-circuited region does not carry out conductive glue；The composite substrate is cured, electric signal is inputted from the color membrane substrates motherboard, and is transferred to the array substrate motherboard by the conducting resinl.By the above-mentioned means, the present invention can avoid the wasting of resources, while improving the yield of product.
Description
Technical field
The present invention relates to display technology fields, more particularly to a kind of liquid crystal display and preparation method thereof.
Background technology
With the continuous development of display technology, the performance requirement of display is continuously improved in people, using ito thin film conduct
The liquid crystal display of CF electrode of substrate is because the features such as its conductive effect is good, visible light transmittance is high, is as the hot spot of research.
In the preparation process of large-sized monitor, using CF substrates side as electric signal input end, this allows for depositing
The all areas on CF substrates can be made to be abnormal after being connected with CF substrates in the array substrate of the line faults such as short circuit, no
It can be used as product, not only cause serious waste, but also seriously affect product yield.
Present inventor has found in existing LOC (on-chip lead) technology, resource in long-term R＆D process
Waste is serious, and product quality is unreliable.
Invention content
The invention mainly solves the technical problem of providing a kind of liquid crystal displays and preparation method thereof, can avoid resource
Waste, while improving the yield of product.
In order to solve the above technical problems, one aspect of the present invention is：A kind of system of liquid crystal display is provided
Preparation Method.
Wherein, this method includes：
Array basal plate motherboard and a color membrane substrates motherboard are provided；
It detects the array substrate motherboard and marks the short-circuited region of the array substrate motherboard；
Conducting resinl is coated on the array substrate motherboard and/or the color membrane substrates motherboard and is bonded the two,
Obtain composite substrate, wherein the short-circuited region does not carry out conductive glue；
The composite substrate is cured, electric signal is inputted from the color membrane substrates motherboard, and passes through the conducting resinl
It is transferred to the array substrate motherboard.
In order to solve the above technical problems, another technical solution used in the present invention is：A kind of liquid crystal display is provided.
Wherein, which is prepared using any the method.
The beneficial effects of the invention are as follows：The case where being different from the prior art, the present invention pass through to the array substrate motherboard
Short-circuited region is marked, and during the array substrate motherboard is bonded with the color membrane substrates motherboard, not to the short-circuited region
Conductive glue is carried out, this is allowed in solidification process, and the short-circuited region of the array substrate motherboard cannot be with color membrane substrates mother
Plate is connected, and the abnormal signals such as the short circuit of the short-circuited region cannot be also transmitted to the color membrane substrates motherboard, in this way, only
Region corresponding with the short-circuited region, which cannot continue to process, in the short-circuited region and the color membrane substrates motherboard obtains product, avoids
The problem of color membrane substrates motherboard full wafer is scrapped, can effectively reduce the wasting of resources, improve the yield of product.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.Wherein：
Fig. 1 is a kind of flow diagram of one embodiment of preparation method of liquid crystal display of the present invention；
Fig. 2 is the structural schematic diagram of one embodiment of array substrate motherboard of the present invention；
Fig. 3 is the structural schematic diagram of one embodiment of composite substrate of the present invention；
Fig. 4 is the structural schematic diagram of another embodiment of array substrate motherboard of the present invention；
Fig. 5 is the structural scheme of mechanism of another embodiment of composite substrate of the present invention；
Fig. 6 is a kind of structural schematic diagram of one embodiment of liquid crystal display of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole embodiments.Based on this
Embodiment in invention, those of ordinary skill in the art are obtained every other under the premise of not making performing creative labour
Embodiment shall fall within the protection scope of the present invention.
Refering to fig. 1, Fig. 1 is a kind of flow diagram of one embodiment of preparation method of liquid crystal display, this method packet
It includes：
Step S100：Array basal plate motherboard and a color membrane substrates motherboard are provided.
In step S100, the array substrate motherboard and the color membrane substrates motherboard be production process of liquid crystal displays not
Cut large-size substrate, area is up to 2 square metres or 2 square metres or more.The array substrate motherboard includes multi-strip scanning
Line, multiple data lines, the multi-strip scanning line intersect multiple the array substrate motherboard to be divided into the multi-strip scanning line
Pixel；Wherein, each pixel respectively includes：Thin film transistor (TFT) is electrically connected to a corresponding scan line and a corresponding number
According to line, to control whether the pixel is connected；Pixel electrode is electrically connected to the thin film transistor (TFT).
Step S200：It detects the array substrate motherboard and marks the short-circuited region of the array substrate motherboard.
More array substrate motherboards are detected in step S200, and detected short-circuited region is marked and
Feedback, convenient for being handled the short-circuited region during subsequent technique.Further, referring to FIG. 2, Fig. 2 is the present invention
The structural schematic diagram of one embodiment of array substrate motherboard, wherein it is short to be detected determination to the array substrate motherboard 100
Road region is 110.And the short-circuited region 110 is static discharge short-circuited region, the detection method to the array substrate motherboard 100 is
Short bar detection method.
Step S300：Conducting resinl is coated on the array substrate motherboard and/or the color membrane substrates motherboard and carries out the two
Fitting, obtains composite substrate, wherein the short-circuited region does not carry out conductive glue.
In step S300, please also refer to Fig. 1, Fig. 2 and Fig. 3, in molding process, by array substrate mother
Conducting resinl 120 is coated between plate 100 and the color membrane substrates motherboard 200 to be bonded the two, obtains composite substrate 300, and
Coating in the short-circuited region 110 without conducting resinl, namely in the face of the short-circuited region 110 with conduction is not coated by outside face
Glue 120.The conducting resinl 120 is other than the array substrate motherboard 100 and the color membrane substrates motherboard 200 are connected, also conduct
The transmission medium of electric current between the two forms the electric field of control liquid crystal rotation.Certainly, which can be coated in the battle array
On row substrate motherboard 100, it can also be coated on the color membrane substrates motherboard 200, can be also coated in the two.In real time at one
In mode, which is coated on the color membrane substrates motherboard 200.In another embodiment, please continue to refer to Fig. 1
And Fig. 2, which is coated on the array substrate motherboard 100, and does not carry out the conducting resinl in the short-circuited region 110
Coating.
Step S400：The composite substrate is cured, electric signal is inputted from the color membrane substrates motherboard, and passes through the conduction
Glue is transferred to the array substrate motherboard.
In step S400, which is carried out in solidification process, using electric signal from color membrane substrates motherboard one
In the technique of side input, ITO electrode is that monoblock is connected on the color membrane substrates motherboard, is passed to from the array substrate motherboard side
Signal will generate the different zones of the color membrane substrates motherboard corresponding influence.
In the present embodiment, it is marked by the short-circuited region to the array substrate motherboard, and in the array substrate
During motherboard is bonded with the color membrane substrates motherboard, conductive glue is not carried out to the short-circuited region, this allows for solidification process
In, the short-circuited region of the array substrate motherboard cannot be connected with the color membrane substrates motherboard, also cannot be by the short-circuited region
The abnormal signals such as short circuit be transmitted to the color membrane substrates motherboard, in this way, only on the short-circuited region and the color membrane substrates motherboard with
The corresponding region of the short-circuited region cannot continue processing and obtain product, avoid the problem of color membrane substrates motherboard full wafer is scrapped,
The wasting of resources can be effectively reduced, the yield of product is improved.
In one embodiment, it please refers to Fig.4 and Fig. 5, the array substrate motherboard 700 includes at least one array substrate
Unit 701, including the array substrate unit 701 of the short-circuited region 710 is not coated by conducting resinl 720.It, will be big according to product demand
The array substrate motherboard 700 of size is divided into the array substrate unit 701 of multiple and different sizes, further, the array substrate
The size of unit 701 is identical or different.In one embodiment, the size of the array substrate unit 701 is different, different sizes
Array substrate unit 701 can make full use of the space of array substrate template 700, reduce waste, improve production efficiency.Accordingly
, which is also divided into and the corresponding color membrane substrates unit of 701 size of array substrate unit and position
(not shown), and the ITO electrode 810 of the different color membrane substrates units is connected with each other, this mode that is correspondingly arranged was convenient for should
Composite substrate cuts into multiple composite substrate units.
Specifically, the short-circuited region 710 may be entirely located in a certain array substrate unit 701, it is also possible to multiple
All be distributed in the array substrate unit 701, then by the array substrate unit 701 comprising the short-circuited region 710 all without
Conducting resinl 720 coats, in the array substrate motherboard 700 and the color membrane substrates motherboard 800 are carried out turn on process, short circuit letter
It number cannot be propagated to the color membrane substrates motherboard 800, the abnormal signals such as the short circuit of the short-circuited region 710 can be avoided to be transmitted to
The color membrane substrates motherboard 800 makes entire 800 full wafer of color membrane substrates motherboard scrap, and is conducive to improve product yield and production efficiency.
In one embodiment, further include before which is bonded with the color membrane substrates motherboard：By liquid crystal drop
It notes on the array substrate motherboard and/or color membrane substrates motherboard.Specifically, carrying out liquid crystal drip-injection using ODF techniques, i.e., in air
Liquid crystal drip-injection is carried out under atmosphere, is bonded under vacuum conditions.In one embodiment, include the battle array of the short-circuited region
Row base board unit is without liquid crystal drip-injection.Namely the region stopping further operating of product cannot be obtained in determination, in this way can
The waste for effectively avoiding subsequent technique raw material can reduce production cost, improve production efficiency.
Further, this method further includes cutting the composite substrate, obtains composite substrate unit, the cutting process
Different modes may be used to carry out, in one embodiment, the composite substrate is cut by the way of laser cutting,
Cutting efficiency and sharpnes of cuts can be effectively improved.Further, the size of the compound basic unit and the corresponding array
The size of base board unit is identical, the size of the composite substrate unit namely the size of LCD products.
In one embodiment, which is the compound of conductive gold size, conductive silver glue or the two.The conducting resinl is
Bonding effect can be played and carry out electric current transmission.Typically prepared by the method for dispersed electro-conductive metal in a binder,
In one embodiment, to obtain preferable conductive effect, which is conductive gold size.Further, the conducting resinl
Coating thickness is 10-20 microns.For preferable bonding and conductive effect can be obtained, and excessive glue problem does not occur, in a reality
It applies in mode, the coating thickness of the conducting resinl is 10-20 microns, e.g., 10 microns, 15 microns or 20 microns etc..Certainly, according to waiting for
The size of the substrate of bonding and the type of conducting resinl can select different conductive glue thickness.
In order to solve the above technical problems, another technical solution used in the present invention is：A kind of liquid crystal display is provided.Please
With reference to figure 6, Fig. 6 is a kind of structural schematic diagram of one embodiment of liquid crystal display of the present invention.Wherein, which adopts
It is prepared with any the method.In the present embodiment, which is large scale liquid crystal display, the liquid crystal display
The screen time size of device 10 is more than 65 inches, such as 88 inches, 110 inches.
In conclusion the invention discloses a kind of liquid crystal display and preparation method thereof, this method includes：An array is provided
Substrate motherboard and a color membrane substrates motherboard；It detects the array substrate motherboard and marks the shorting region of the array substrate motherboard
Domain；Conducting resinl is coated on the array substrate motherboard and/or the color membrane substrates motherboard and is bonded the two, is answered
Close substrate, wherein the short-circuited region does not carry out conductive glue；The composite substrate is cured, electric signal is from described
Color membrane substrates motherboard inputs, and is transferred to the array substrate motherboard by the conducting resinl.By the above-mentioned means, energy of the present invention
The wasting of resources is enough avoided, while improving the yield of product.
Mode the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field is included within the scope of the present invention.
Claims (10)
1. a kind of preparation method of liquid crystal display, which is characterized in that the method includes：
Array basal plate motherboard and a color membrane substrates motherboard are provided；
It detects the array substrate motherboard and marks the short-circuited region of the array substrate motherboard；
Conducting resinl is coated on the array substrate motherboard and/or the color membrane substrates motherboard and is bonded the two, is obtained
Composite substrate, wherein the short-circuited region does not carry out conductive glue；
The composite substrate is cured, electric signal is inputted from the color membrane substrates motherboard, and transmitted by the conducting resinl
To the array substrate motherboard.
2. according to the method described in claim 1, it is characterized in that, the array substrate motherboard includes at least one array substrate
Unit, including the array substrate unit of the short-circuited region is not coated by conducting resinl.
3. according to the method described in claim 2, it is characterized in that, the size of the array substrate unit is identical or different.
4. according to the method described in claim 1, it is characterized in that, the array substrate motherboard is pasted with the color membrane substrates motherboard
Further include before conjunction：By liquid crystal drip-injection on the array substrate motherboard and/or the color membrane substrates motherboard.
5. according to the method described in claim 2, it is characterized in that, the array substrate unit comprising the short-circuited region not
Carry out liquid crystal drip-injection.
6. according to the method described in claim 1, it is characterized in that, the method further includes：The composite substrate is cut
It cuts, obtains composite substrate unit, the size of the composite substrate unit is identical as the size of the corresponding array substrate unit.
7. according to the method described in claim 1, it is characterized in that, being carried out to the composite substrate by the way of laser cutting
Cutting.
8. according to the method described in claim 1, it is characterized in that, the conducting resinl is conductive gold size, conductive silver glue or the two
It is compound.
9. according to the method described in claim 1, it is characterized in that, the coating thickness of the conducting resinl is 10-20 microns.
10. a kind of liquid crystal display, which is characterized in that the liquid crystal display uses any the method systems of claim 1-9
It is standby.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810670975.3A CN108628022B (en) | 2018-06-26 | 2018-06-26 | Liquid crystal display and preparation method thereof |
| PCT/CN2018/116855 WO2020000883A1 (en) | 2018-06-26 | 2018-11-22 | Liquid crystal display and fabrication method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810670975.3A CN108628022B (en) | 2018-06-26 | 2018-06-26 | Liquid crystal display and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108628022A true CN108628022A (en) | 2018-10-09 |
| CN108628022B CN108628022B (en) | 2020-07-03 |
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ID=63688244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810670975.3A Active CN108628022B (en) | 2018-06-26 | 2018-06-26 | Liquid crystal display and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108628022B (en) |
| WO (1) | WO2020000883A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110221491A (en) * | 2019-05-06 | 2019-09-10 | 惠科股份有限公司 | Array substrate and preparation method thereof, liquid crystal display panel |
| WO2020000883A1 (en) * | 2018-06-26 | 2020-01-02 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display and fabrication method therefor |
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| JPH09258254A (en) * | 1996-03-27 | 1997-10-03 | Seiko Epson Corp | Production of liquid crystal device |
| US5684546A (en) * | 1994-10-06 | 1997-11-04 | Samsung Electronics Co., Ltd. | Electrostatic discharge protective circuit in a liquid crystal display |
| CN101576691A (en) * | 2008-05-06 | 2009-11-11 | 上海广电Nec液晶显示器有限公司 | Method for repairing liquid crystal display device |
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| CN107290900A (en) * | 2017-08-07 | 2017-10-24 | 上海中航光电子有限公司 | A kind of motherboard |
| CN107632441A (en) * | 2017-10-12 | 2018-01-26 | 京东方科技集团股份有限公司 | The manufacture method and display panel of display panel |
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| CN101609217A (en) * | 2009-07-14 | 2009-12-23 | 江西永盛电子有限公司 | Method for preparing thin film transistor color liquid crystal display module |
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| CN107884977A (en) * | 2017-12-26 | 2018-04-06 | 深圳市华星光电技术有限公司 | A kind of liquid crystal display and preparation method thereof |
| CN108628022B (en) * | 2018-06-26 | 2020-07-03 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display and preparation method thereof |
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- 2018-06-26 CN CN201810670975.3A patent/CN108628022B/en active Active
- 2018-11-22 WO PCT/CN2018/116855 patent/WO2020000883A1/en active Application Filing
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| US5684546A (en) * | 1994-10-06 | 1997-11-04 | Samsung Electronics Co., Ltd. | Electrostatic discharge protective circuit in a liquid crystal display |
| JPH09258254A (en) * | 1996-03-27 | 1997-10-03 | Seiko Epson Corp | Production of liquid crystal device |
| CN101576691A (en) * | 2008-05-06 | 2009-11-11 | 上海广电Nec液晶显示器有限公司 | Method for repairing liquid crystal display device |
| CN204331211U (en) * | 2014-12-31 | 2015-05-13 | 上海天马微电子有限公司 | A kind of display module and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020000883A1 (en) * | 2018-06-26 | 2020-01-02 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal display and fabrication method therefor |
| CN110221491A (en) * | 2019-05-06 | 2019-09-10 | 惠科股份有限公司 | Array substrate and preparation method thereof, liquid crystal display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108628022B (en) | 2020-07-03 |
| WO2020000883A1 (en) | 2020-01-02 |
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