CN108614324A - Array waveguide grating and method for wavelength compensation - Google Patents
Array waveguide grating and method for wavelength compensation Download PDFInfo
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- CN108614324A CN108614324A CN201810262827.8A CN201810262827A CN108614324A CN 108614324 A CN108614324 A CN 108614324A CN 201810262827 A CN201810262827 A CN 201810262827A CN 108614324 A CN108614324 A CN 108614324A
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- drive rod
- bottom plate
- contact
- array waveguide
- waveguide grating
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
- G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
- G02B6/12026—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence
- G02B6/1203—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides characterised by means for reducing the temperature dependence using mounting means, e.g. by using a combination of materials having different thermal expansion coefficients
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/124—Geodesic lenses or integrated gratings
Abstract
The present invention relates to a kind of grating and method for wavelength compensation, belong to technical field of photo communication, are specifically related to a kind of array waveguide grating and method for wavelength compensation.One end that the drive rod of the present invention is connect with bottom plate on-fixed is taper or spherical shape so that the problems such as way of contact between drive rod and bottom plate contacts for a point face, assembled so as to avoid the difficult processing caused by plane-plane contact, hardly possible, is unstable.
Description
Technical field
The present invention relates to a kind of grating and method for wavelength compensation, belong to technical field of photo communication, are specifically related to a kind of battle array
Train wave guide grating and method for wavelength compensation.
Background technology
In optical communication system, array waveguide grating (Arrayed Waveguide Gratings, abbreviation AWG) is close
Collect the crucial optical device of wavelength-division multiplex system.AWG can easily realize multiplexing and the demultiplexing of multipath light signal, be to increase light to lead to
Believe the important devices of power system capacity.AWG is the optical device based on planar optical waveguide, by input waveguide, input planar waveguide, array
Waveguide, output planar waveguide and output waveguide composition, wherein adjacent array waveguide have fixed length difference.When multiple and different waves
Long optical signal enters AWG from the same input port, after inputting planar waveguide, by diffraction optical power fluctuation to battle array
Train wave lead in each port, the length difference of Waveguide array will produce different transmission phase delay, in output planar waveguide
Middle coherent superposition, makes the light output of different wave length to different output ports, the effect of to play demultiplexing.Conversely, when more
A optical signal enters AWG from different output ports, the effect of multiplexing may be implemented in input port.
Dense wavelength division multiplexing system is more demanding to the sufficient center wavelength accuracy of multiplexing demultiplexing device part, and control is needed to exist
Within the certain proportion range of channel spacing, such as in the wavelength-division multiplex system at the intervals 100GHz, centre wavelength precision is often
It needs to control within +/- (5%-10%) of channel spacing, i.e., +/- (40-80) pm.For more dense wavelength-division multiplex system
System, such as 50G and 25G systems, the requirement higher of centre wavelength precision will reach +/- 40pm and +/- 20pm respectively, even higher.
Following table can specifically be referred to：
Commercial AWG chips are generally based on the planar optical waveguide device of silicon substrate, wherein cardiac wave personal attendant environment temperature at present
It changes greatly, susceptibility is about 12pm/ DEG C, then (- 5 DEG C to 65 DEG C), AWG cores in wavelength-division multiplex system operating ambient temperature
The centre wavelength drift value of piece can reach about 800pm, hence it is evident that have exceeded system requirements, therefore, it is necessary to take measures to control AWG
The centre wavelength of chip can work normally in operating ambient temperature.
Heatless AWG (Athermal AWG, abbreviation AAWG) can effectively control the drift of the center wavelength with temperature of AWG chips
Shifting problem, and power consumption is not needed, it is pure passive device, by many concerns.Patent CN101019053B (PCT/US2004/
014084 2004.05.05) in describe a kind of conventional AAWG schemes, the program carries bottom plate, and chip is connected with bottom plate, logical
The driver 301 of the planar waveguide of over-segmentation chip, bottom plate drives hinge 202 to move, and the chip above bottom plate is made to occur
Opposite waveguide movement, the variation of the center wavelength with temperature for compensating AWG chips.
Formula 1 shows the relationship between the relative displacement dx and temperature change dT of the divided planar waveguides of AWG
Wherein nsAnd ncIt is input/output slab guide and the effective refractive index of Waveguide array of AWG, n respectivelygIt is group's folding
Rate is penetrated, d is spacing of the adjacent array waveguide on rowland circumference, and m is diffraction time, and R is Rowland circle focal length, and d λ are in AWG
Heart wavelength variation values.
If the effective length of driver 301 is L, linear expansion coefficient isSo caused by expanding with heat and contract with cold for driver 301
Relative displacement be：
Wherein k is the lever between the displacement of driver 301 and the first area of bottom plate and the relative displacement of second area
Coefficient.
In conjunction with formula 1 and formula 2, it can be deduced that following relationship：
From formula 3 as can be seen that the center wavelength variation value of the program and the changing value of temperature are linear relationships.
In fact, the central wavelength lambda of AWG chips is not single linear relationship with the changing value of temperature T, but have
Non-linear relation, shown in following formula 4：
D λ=a*dT2+ b*dT+c formula 4
Currently existing scheme can only compensate the first order of center wavelength with temperature variation, cannot compensate its quadratic term.By line
Property compensation after temperature/wavelength change curve be parabola, be the embodiment of remaining wavelength/nonlinear temperature effect.
Recently as WDM-PON (Wavelength Division Multiplexing-Passive Optical
Network) the continuous development of system, the application of AWG need to extend to outdoor from interior, i.e., operating ambient temperature can from -5 DEG C~
65 DEG C extend to -40 DEG C~85 DEG C, as technical grade temperature range, the drift value bigger of center wavelength with temperature, to wavelength control
The requirement higher of technology processed, when operating temperature range expands to -40-85 from -5-65 degree to be spent, centre wavelength precision will be from
40pm rises to about 70pm-80pm, it is easy to exceeded.
Invention content
The technical problems to be solved by the invention
It is in the prior art in order to adapt to the application demand to more wide operating temperature range or more dense wavelength-division multiplex system
Compensation device uses more drive rods, and seamed between the centre of at least one drive rod or the drive rod and light path pedestal
Gap, the gap are caused to open and are closed in different temperature regions by expanding with heat and contract with cold for drive rod.But due to plane machining
Accuracy be extremely difficult to um ranks, assembling process and can also introduce additional error, these gaps, which are difficult to keep, to be closed completely, and
During the motion, the position of closure may change, and formula leverage factor Ki is caused to change, to influence to compensate
Precision.
Specifically, during the motion, drive rod drives 203 around hinge of opposite second area of bottom plate first area 201
202 rotations, the contact area of plane contact is larger, is difficult to be always maintained at comprehensive engagement in rotation process, when drive rod extends
When, contact area is shifted to close to the direction of hinge, and when drive rod is shunk, contact area is shifted to the direction far from hinge.
When contact area changes, the torque arm length of contact action point opposite from hinge rotation accordingly changes, and leads to compensation effect
It changes.
Present invention improves over the structures of section linear compensating device so that the centre wavelength precision controlling of AAWG is more smart
Really.
Technical scheme applied to solve the technical problem
The above-mentioned technical problem of the present invention is mainly to be addressed by following technical proposals：
A kind of array waveguide grating, including：
Bottom plate has two regions that can be movable relatively, and the drive rod for driving two interregional relative motions；
The drive rod coefficient of thermal expansion is different from bottom plate comprising both ends are respectively and fixedly connected in the affixed driving in two sub-regions of bottom plate
Bar, and at least one end separates the contact drive rod being contacted on bottom plate subregion in drive rod deformation；
Array waveguide grid chip has two sub-portions, and is located on two regions of bottom plate；
At least one end of the contact drive rod is that point face contacts with bottom plate subregion.
Wherein, one end of the contact drive rod is fixed on the subregion of bottom plate, the other end and bottom plate subregion point face
Contact.
Wherein, contact drive rod at least one end is taper or spherical shape.
Wherein, the contact drive rod is two or more, and has different coefficient of thermal expansion.
Wherein, index-matching material, the refractive index of the material are filled in the gap of the array waveguide grid chip
It is identical or close that the refractive index of the waveguide material in region is divided with array waveguide grating.
Wherein, the contact drive rod is two or more, is connect respectively with bottom plate subregion point face in high temperature section and low-temperature zone
It touches；The high temperature section and low-temperature zone are located at room temperature section both sides, the room temperature section be all contact drive rods at least one end and
The temperature section of bottom plate subregion separation.
Wherein, the high temperature section and/or the contact drive rod of low-temperature zone work are two or more.
A kind of array waveguide grating method for wavelength compensation, including：
It is different from two sub-regions that the affixed bottom plate of affixed drive rod of bottom plate can be movable relatively using coefficient of thermal expansion；Profit
The contact drive rod for being different from bottom plate with coefficient of thermal expansion is fixed in a sub-regions of bottom plate, and in the another of the contact drive rod
Contact structures when drive rod deformation is arranged in one end with another subregion of bottom plate；
Array waveguide grid chip is divided into two sub-portions, and on the different subregions of be respectively placed in bottom plate two；
Two sub-portions of array waveguide grid chip are driven to generate relative displacement to carry out wavelength using the drive rod deformation
Compensation；
The contact structures point surface contact structure.
Wherein, the affixed drive rod is the first drive rod, and the contact drive rod includes that the second drive rod and third are driven
Lever, also, each drive rod meets following formula：
Wherein, the effective length of the first drive rod is L1, coefficient of thermal expansion isThe leverage factor of itself and bottom plate 2 is k1；
The effective length of second drive rod 302 is L2, coefficient of thermal expansion isThe leverage factor of itself and bottom plate 2 is k2；Third drive rod
Effective length be L3, coefficient of thermal expansion isThe leverage factor of itself and bottom plate is k3；Wherein, lever system is bottom plate first
The ratio of the spacing variation and drive rod collapsing length of region and second area under drive rod effect.
Wherein, the affixed drive rod is the first drive rod, and the contact drive rod includes that the second drive rod and third are driven
Lever, first drive rod 301 and the leverage factor of bottom plate are 0.63, and the leverage factor of the second drive rod 302 and bottom plate is
0.69, the leverage factor of third drive rod 303 and bottom plate is 0.5, and institute's lever system is that bottom plate first area and second area exist
The ratio of spacing variation and drive rod collapsing length under drive rod effect.
Inventive technique effect
In the present invention, one end that drive rod is connect with bottom plate on-fixed is taper or spherical shape so that drive rod and bottom plate it
Between the way of contact be point-face contact.Point-face contact avoids difficult processing caused by surface-to-surface contact, difficult assembly, unstable
The problems such as, it has the following advantages that：(1) at um grades, point face contacts required the precision of the plane machining required by plane contact
Machining accuracy substantially reduces；(2) plane contact requires two contact planes during component assembly to keep fitting completely, difficulty
It is larger, it is clear that the contact of point face reduces assembly difficulty；(3) contact position of point face contact remains solid during the motion
Fixed, the torque arm length of contact action point opposite from hinge is held essentially constant, thus is more stablized.
Description of the drawings
Figure 1A, general structure schematic diagram of the present invention；
Figure 1B, the structural schematic diagram of the invention in high temperature section；
Fig. 1 C, the structural schematic diagram of the invention in low-temperature zone；
Fig. 2, overall structure schematic cross-section of the present invention；
Fig. 3, AWG chips schematic diagram of the present invention；
Fig. 4, bottom plate of the present invention and driver schematic diagram；
The temperature curve comparison diagram 1 of Fig. 5, the present invention and conventional linear compensation scheme；
The temperature curve comparison diagram 2 of Fig. 6, the present invention and conventional linear compensation scheme；
The temperature profile of Fig. 7, prior art linear compensation under different compensation effects；
Fig. 8, traditional linear compensation schemes.
Wherein：
1, AWG chips
101, input waveguide；
102, planar waveguide is inputted；103, Waveguide array；
104, planar waveguide is exported；105, output waveguide；
106, chip separation end face；
2, bottom plate
201, bottom plate first area；202, hinge；
203, bottom plate second area；
3, driver
301, the first drive rod；302, the second drive rod；
303, third drive rod.
Specific implementation mode
Below with reference to the embodiments and with reference to the accompanying drawing the technical solutions of the present invention will be further described.
Embodiment：
In linear AAWG, if penalty coefficient d λ/dT are just consistent with the single order of chip wavelength/temperature coefficient,
Exactly it is fully compensated；If penalty coefficient d λ/dT are more than single order wavelength/temperature coefficient, referred to as overcompensation of chip；If
Penalty coefficient d λ/dT are less than single order wavelength/temperature coefficient of chip, then referred to as undercompensation, Fig. 7 show these three compensation effects
Temperature profile.Section linear compensating can be carried out in conjunction with different compensation effects in the present invention, for reducing linear compensation
Remaining nonlinear effect.
Figure 1A is the general structure schematic diagram of the present invention, including array waveguide grating (AWG) chip 1, bottom plate 2 and driver
3。
Figure 1B is structural schematic diagram of the present invention in high temperature section；It is same by the first drive rod 301 and the second drive rod 302 at this time
When compensate, and it is preferential with wherein displacement the greater.
Fig. 1 C are structural schematic diagram of the present invention in low-temperature zone；Wavelength/temperature coefficient caused by third drive rod 303 is
9pm/ DEG C, it is less than wavelength/temperature coefficient caused by the first drive rod 301, main function can be played, at this time by the first drive rod
301 and third drive rod 303 be carried out at the same time compensation.
The structure of the present embodiment is specifically described in 2-4 below in conjunction with the accompanying drawings.
Fig. 2 is the overall structure sectional view of the present invention, and AWG chips 1 are fixedly installed on a base plate 2 by suitable mode.
The schematic diagram of AWG chips 1 is as shown in Figure 3 comprising input waveguide 101, input planar waveguide 102, Waveguide array 103, output
Planar waveguide 104, output waveguide 105.AWG chips are divided into two parts, segmentation portion can be located at input planar waveguide 102,
It exports above planar waveguide 104 or Waveguide array 103.
Fig. 4 is the typical structure schematic diagram of bottom plate and driver in the initial state, and bottom plate 2 includes first area
201, second area 203 and the hinge 202 for connecting first area 201 and second area 203.Bottom plate 2 has relatively low
The first coefficient of thermal expansion, it is not easy to vary with temperature deformation, can be by glass, crystal, metal, alloy or other composite materials
Etc. being made.AWG chips 1 are fixed on 2 top of bottom plate.
Driver 3 includes two or more drive rods, these drive rods are connected to the first area 201 of bottom plate 2
Between second area 203, lever construction is formed, phase occurs for the first area 201 and second area 203 for driving bottom plate 2
To movement.The coefficient of thermal expansion of these drive rods is different from bottom plate 2.Heat of the coefficient of thermal expansion of these usual drive rods than bottom plate
The coefficient of expansion is big so that these drive rods are easy to vary with temperature and deform, and cause the first area 201 and second of bottom plate 2
Relative motion occurs between region 203.Wherein the both ends of the first drive rod 301 respectively with the first area of bottom plate 2 201 and
Two regions, 203 phase is fixed；One end of second drive rod 302 and third drive rod 303 and 203 phase of second area of bottom plate 2 are fixed,
The other end between taper and spherical shape, and the first area 201 of bottom plate there are certain gap, the gap with temperature variation
And change, closure or openness can occur in the above-mentioned gap of process heated up or cooled down, when being closed, drive rod 302
And 303 end and bottom plate between formed point a face contact.In addition, each drive rod of driver needs have different heat swollen
Swollen coefficient or effective length and different leverage factors, to make each drive rod at the hinge 202 caused by displacement not
Together, overcompensation or under-compensated effect can occur in this way, to be to realize nonlinear temperature effect compensating.
The advantages of point face contacts is formed between the end and bottom plate of drive rod 302 and 303 to be：(1) plane contact is wanted
At um grades, contact required machining accuracy in point face substantially reduces the precision for the plane machining asked；(2) plane contact is required zero
Two contact planes keep fitting, difficulty completely larger in part assembling process, it is clear that the contact of point face reduces assembly difficulty；(3)
During the motion, drive rod driving bottom plate first area 201 is rotated relative to 203 around hinge 202 of second area, plane contact
Contact area is larger, is difficult to be always maintained at comprehensive engagement in rotation process, and when drive rod extends, contact area is to close to hinge
The direction of chain is shifted, and when drive rod is shunk, contact area is shifted to the direction of principle hinge.When contact area changes,
The torque arm length of contact action point opposite from hinge rotation accordingly changes, and compensation effect is caused to change.The contact of point face
Contact position is always kept in a fixed state during the motion, and the torque arm length of contact action point opposite from hinge is held essentially constant, because
And more stablize.
The present invention is described in detail the structure and operation principle of the present invention according to the combination of 3 drive rods, this field
Technical staff is it should be appreciated that the quantity of drive rod can be flexibly arranged according to actual needs, it is not limited to which the present invention is real
3 in example are applied, such as can also be 2 drive rods, 4 drive rods or more.
According to Figure 1A of the present invention, AWG chips 1 and bottom plate 2 are connected and fixed, fixed form can be using bonding agent,
Welding or other modes, near the hinge 202 of bottom plate 2, AWG chips 1 are divided into two parts, and segmentation end face is 106, point
Two parts after cutting can relatively move, and cause the variation of AWG centre wavelengths, the middle cardiac wave for compensating AWG chips 1
Length varies with temperature caused drift.
The cutting end face 106 of AWG chips 1 can pass through the modes such as laser cutting, Water Cutting, chemical etching, saw cut
Be split, cutting profile can be straight line, curve or other shapes, the width general control of cutting within 1-50um, this
Sample can ensure that the AWG chips 1 after cutting relatively move, and can both be led to avoid when high/low temperature changes since slit width is too small
It is collided when cut surface being caused to relatively move, causes chip rupture, can also avoided since slit width is too big caused additional
Insertion loss problem bigger than normal.End face after cutting should not it is exposed in air, need to be allowed to and AWG chips using matching way
1 refractive index is consistent, typically refractive index is used to be coated in chip separation end face 106 with the close matching glue of AWG core refractive rates
On, and being had the gap in light path is covered, the modes such as plated film can also be used to carry out index matching.
As shown in Figure 1A, in the prior art on the basis of linear compensation schemes, retain the first drive rod 301, introduce another
The length of outer two kinds of drive rods, respectively the second drive rod 302 and third drive rod 303, the second drive rod 302 is maximum, and first
Drive rod 301 takes second place, and third drive rod 303 is most short.Wherein the second drive rod 302 and third drive rod 303 at normal temperatures with bottom
There is certain gap between the first area 201 of plate.
If the effective length of the first drive rod 301 is L1, coefficient of thermal expansion isLeverage factor with bottom plate 2 is k1；The
The effective length of two drive rods 302 is L2, coefficient of thermal expansion isLeverage factor with bottom plate 2 is k2；Third drive rod 303
Effective length be L3, coefficient of thermal expansion isLeverage factor with bottom plate is k3, these parameters need to meet following condition：
About leverage factor k, it can be understood as the relative displacement for two parts that the displacement of driver and chip are cut
Between relationship.Leverage factor is determined by floor structure, the length of drive rod and the installation site of drive rod and bottom plate, the bottom of at
Harden structure can be determined when designing by analogue.It illustrates by the first drive rod 301, when the temperature is changed, due to
Expanding with heat and contract with cold, which causes the first drive rod 301 that length occurs, changes, and variable quantity 10um causes hinge 202 to deform at this time,
Cause bottom plate first area 201 and second area 202 that relative displacement occurs, including the variation of angle and displacement, to AWG cores
For piece, change in displacement value is effective, and angle change is unnecessary, therefore ignores angle change, and fetch bit moves changing value,
The relative displacement of bottom plate first area 201 and second area 203 at this time is 5um, then the thick stick of the first drive rod 301 can be obtained
Leverage number is 0.5.That is, leverage factor be equivalent to bottom plate first area and second area drive rod effect under spacing variation with
The ratio of drive rod collapsing length, the bigger expression drive rod of leverage factor become bottom plate first area and second area relative displacement
The effect of change is bigger, and vice versa.
When room temperature range, 301 linear compensating action of the first drive rod, chip displacement caused by bottom plate at this time is
After temperature is increased to a certain range, three kinds of drive rods thermally expand, the swell increment of the second drive rod 302
Maximum, left side top are in contact with the first area of bottom plate, occur by the first drive rod 301 and the second drive rod 302 simultaneously
The case where having an effect, and it is subject to the larger displacement value introduced in the first drive rod 301 and the second drive rod 302, such as Figure 1B
It is shown.
Chip displacement caused by bottom plate 2 at this time is
In this way, the phenomenon that high temperature section will will appear overcompensation, it can be by the temperature after linear compensation/wavelength change parabola
Right half of curve drop-down, tend to horizontal direction.
After temperature drops to a certain range from room temperature, driver is shunk, and 302 shrinkage of the second drive rod is maximum,
Its left side top and the first area of bottom plate are separated, and do not play temperature compensation function；The left side top of third drive rod 303 and bottom
The first area of plate is in contact, and starts to play compensating action, and to introduce in the first drive rod 301 and third drive rod 303
Subject to thin tail sheep value.
Chip relative displacement caused by bottom plate 2 at this time is
In this way, will will appear under-compensated phenomenon in low-temperature zone, it can be by the temperature after linear compensation/wavelength change parabola
Left half of curve drop-down, tend to horizontal direction, as shown in Figure 5.
According to this principle, the drive rod quantity of driver can be increased, such as increase to five from three, high temperature section two
High temperature section and low-temperature zone can be divided into more temperature sections by root, low-temperature zone two, room temperature Duan Yigen in this way.At this time by bottom plate 2
Caused 1 relative displacement of AWG chips is
In this way, the parabolical left and right both sides of temperature/wavelength change after linear compensation will tend to level side
To until close to a horizontal straight line is become, as shown in fig. 6, significantly reducing the non-thread of wavelength/temperature of AWG chips 1
Property effect.
In the first scheme as shown in figs. 1A-1 c, in order to meet technical grade temperature job requirement, such as -40~85 DEG C
Entire operating temperature range is divided into three humidity provinces by interior wavelength compensation, if low-temperature zone is -40~-10 DEG C, room temperature section
It is -10~50 DEG C, high temperature section is 50~85 DEG C, in figure 1A, the first area 201 and second of the first drive rod 301 and bottom plate
Region 203 is connected and centre does not have gap, has one between the second drive rod 302 and the left end and bottom plate of third drive rod 303
Fixed gap.First drive rod 301, the second drive rod 302, third drive rod 303 are respectively used to room temperature section, high temperature section and low
The compensation of temperature section.
Three drive rods are all made of stainless steel and are made, coefficient of thermal expansion 16*10-6/ DEG C, the length of each drive rod has area
Not, the length of the first drive rod 301 is 36.2mm, and the length of the second drive rod 302 is 41.5mm, the length of third drive rod 303
Degree is 34mm.The coefficient of thermal expansion of the above drive rod, effective length, leverage factor meet formula 5 in the present embodiment.By adjusting
The installation site of driver, it is 0.63 to make the leverage factor of the first drive rod 301 and bottom plate, the second drive rod 302 and bottom plate
Leverage factor is 0.69, and the leverage factor of third drive rod 303 and bottom plate is 0.5.In room temperature section, the first drive rod 301 plays benefit
The effect of repaying.There are gaps between second drive rod 302 and third drive rod 303 and bottom plate, cannot play a role.Chip is cut at this time
Face occur relative displacement be
dx1=0.63*36.2*10-3*16*10-6*dT1=0.365*10-6*dT1Formula 10
It is calculated according to the parameter of AWG, the relative displacement in chip separation face and the relationship of wavelength change are every micron and correspond to
33 micromicrons.
The relationship of wavelength/temperature can be obtained at this time
dλ1=0.365*33*10-12*dT1=12.04*10-12*dT1Formula 11
The Monomial coefficient of wavelength/temperature of the AWG chips 1 of selection is 12pm/ DEG C, it can be seen that the first drive rod 301
Linear compensation can be just carried out in room temperature section.
As shown in Figure 1B, compensation is carried out at the same time by the first drive rod 301 and the second drive rod 302 at this time, and with wherein position
It is preferential to move the greater, is calculated by formula 12, wavelength/temperature coefficient caused by the second drive rod 302 is 15pm/ DEG C, greatly
Wavelength/temperature coefficient caused by the first drive rod 301, can play main function.
dλ2=0.69*41.5*10-3*16*10-6*33*10-12*dT2=15.1*10-12*dT2Formula 12
It is at this time overcompensation in high temperature section, it can will be upward on the right of the temperature after linear compensation/wavelength change parabola
Warped portion pulls down.
In low-temperature zone, three drive rods are all shunk, and 302 shrinkage of the second drive rod is larger, the seam between bottom plate
Gap is increasing, does not play compensating action；Third drive rod 303 shrinkage is minimum, since the length of the first drive rod 301 is than the
Three drive rods 303 are big, and when the first drive rod 301 is shunk, shrinkage is bigger than third drive rod 303, therefore makes third
Gap between drive rod 303 and bottom plate is filled, and third drive rod 303 starts to play compensating action, a left side for third drive rod
End top is ball, and top occurs point face with the first area of bottom plate and contacts..
As shown in Figure 1 C, it is calculated by formula 13, wavelength/temperature coefficient caused by third drive rod 303 is 9pm/
DEG C, it is less than wavelength/temperature coefficient caused by the first drive rod 301, main function can be played.
dλ4=0.5*34*10-3*16*10-6*33*10-12*dT4=9*10-12*dT4Formula 13
There is undercompensation in low-temperature zone at this time, can by the temperature after linear compensation/wavelength change parabola left side to
Upper warped portion drop-down.
After nonlinear compensation, wavelength/temperature profile of AWG as shown in figure 5, compared with conventional linear scheme ,-
Within the scope of 40~85 DEG C, wavelength shift can be reduced to 20pm from 65pm.
Thinking according to the present invention can extend kinds of schemes.Although the present invention has been illustrated in detail in and has described phase
The specific embodiment of pass refers to, but it will be appreciated by those of skill in the art that in thinking and range without departing substantially from the present invention
Various changes can be made in the form and details, these changes fall within the protection required by the claim of the present invention
In range.
Claims (10)
1. a kind of array waveguide grating, including：
Bottom plate has two regions that can be movable relatively, and the drive rod for driving two interregional relative motions；It is described
Drive rod coefficient of thermal expansion is different from bottom plate comprising and both ends are respectively and fixedly connected in the affixed drive rod in two sub-regions of bottom plate,
And at least one end separates the contact drive rod being contacted on bottom plate subregion in drive rod deformation；
Array waveguide grid chip has two sub-portions, and is located on two regions of bottom plate；
It is characterized in that,
At least one end of the contact drive rod is that point face contacts with bottom plate subregion.
2. a kind of array waveguide grating according to claim 1, which is characterized in that one end of the contact drive rod is affixed
In on the subregion of bottom plate, the other end is contacted with bottom plate subregion point face.
3. a kind of array waveguide grating according to claim 1, which is characterized in that contact drive rod at least one end is taper
Or it is spherical.
4. a kind of array waveguide grating according to claim 1, which is characterized in that the contact drive rod be two with
On, and there is different coefficient of thermal expansion.
5. a kind of array waveguide grating according to claim 1, which is characterized in that the seam of the array waveguide grid chip
Index-matching material is filled in gap, the refractive index of the material is divided the folding of the waveguide material in region with array waveguide grating
It is identical or close to penetrate rate.
6. a kind of array waveguide grating according to claim 1, which is characterized in that the contact drive rod be two with
On, it is contacted respectively with bottom plate subregion point face in high temperature section and low-temperature zone；The high temperature section and low-temperature zone are located at room temperature section
Both sides, the room temperature section are all contact drive rod temperature sections that at least one end is detached with bottom plate subregion.
7. a kind of array waveguide grating according to claim 6, which is characterized in that the high temperature section and/or low-temperature zone work
The contact drive rod of work is two or more.
8. a kind of array waveguide grating method for wavelength compensation, including：
It is different from two sub-regions that the affixed bottom plate of affixed drive rod of bottom plate can be movable relatively using coefficient of thermal expansion；Utilize heat
The coefficient of expansion is fixed in a sub-regions of bottom plate different from the contact drive rod of bottom plate, and in the other end of the contact drive rod
Contact structures when drive rod deformation is set with another subregion of bottom plate；
Array waveguide grid chip is divided into two sub-portions, and on the different subregions of be respectively placed in bottom plate two；
Two sub-portions of array waveguide grid chip are driven to generate relative displacement to carry out wavelength compensation using the drive rod deformation；
It is characterized in that, the contact structures point surface contact structure.
9. a kind of array waveguide grating method for wavelength compensation according to claim 8, which is characterized in that the affixed driving
Bar is the first drive rod, and the contact drive rod includes the second drive rod and third drive rod, also, each drive rod satisfaction is following
Formula：
Wherein, the effective length of the first drive rod is L1, coefficient of thermal expansion isThe leverage factor of itself and bottom plate 2 is k1；Second
The effective length of drive rod 302 is L2, coefficient of thermal expansion isThe leverage factor of itself and bottom plate 2 is k2；Third drive rod has
Effect length is L3, coefficient of thermal expansion isThe leverage factor of itself and bottom plate is k3；Wherein, lever system be bottom plate first area and
The ratio of spacing variation and drive rod collapsing length of the second area under drive rod effect.
10. a kind of array waveguide grating method for wavelength compensation according to claim 8, which is characterized in that the affixed drive
Lever be the first drive rod, the contact drive rod include the second drive rod and third drive rod, first drive rod 301 and
The leverage factor of bottom plate is 0.63, and the leverage factor of the second drive rod 302 and bottom plate is 0.69, third drive rod 303 and bottom plate
Leverage factor be 0.5, institute's lever system be the spacing variation of bottom plate first area and second area under drive rod effect with
The ratio of drive rod collapsing length.
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| CN109541747A (en) * | 2019-01-24 | 2019-03-29 | 清远市亿源通光电科技有限公司 | A kind of temperature compensation structure based on array waveguide grating |
| WO2020238124A1 (en) * | 2019-05-29 | 2020-12-03 | 武汉光迅科技股份有限公司 | Compensation device, arrayed waveguide grating chip and compensation method |
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| CN1392961A (en) * | 2000-10-13 | 2003-01-22 | 古河电气工业株式会社 | Array waveguide type diffraction grating and light transmitting centre wavelength correcting method |
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| CN1392961A (en) * | 2000-10-13 | 2003-01-22 | 古河电气工业株式会社 | Array waveguide type diffraction grating and light transmitting centre wavelength correcting method |
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| CN109541747A (en) * | 2019-01-24 | 2019-03-29 | 清远市亿源通光电科技有限公司 | A kind of temperature compensation structure based on array waveguide grating |
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