CN108601205A - It is a kind of unidirectionally to bend and the circuit board of good heat dissipation effect - Google Patents
It is a kind of unidirectionally to bend and the circuit board of good heat dissipation effect Download PDFInfo
- Publication number
- CN108601205A CN108601205A CN201810560776.7A CN201810560776A CN108601205A CN 108601205 A CN108601205 A CN 108601205A CN 201810560776 A CN201810560776 A CN 201810560776A CN 108601205 A CN108601205 A CN 108601205A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- unidirectionally
- dissipation effect
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
It can unidirectionally be bent and the circuit board of good heat dissipation effect the invention discloses a kind of, including circuit board body and flexible link belt, the surface middle position of the circuit board body is provided with the first heat storing plate, and first top and the bottom end of heat storing plate the first heat sink is fixed with by heat-conducting plate, the surface both sides of the circuit board body are provided with the second heat storing plate, and second the outside of heat storing plate the second heat sink is fixed with by heat-conducting plate, the flexible link belt is arranged in the inside of circuit board body.In the present invention, the circuit board is divided into four parts, pass through a flexible connection band connection per part, under the action of flexible link belt, the function that achievable circuit board is unidirectionally bent can be under the premise of ensureing that circuit board is not impaired to be directed to some special installations, instead of using soft board made of special material, to greatly reduce cost of manufacture.
Description
Technical field
It a kind of can bend the present invention relates to computer electronic equipment technical field more particularly to unidirectionally and good heat dissipation effect
Circuit board.
Background technology
Computer is made of hardware system and software systems, and the computer for being fitted without any software is known as bare machine.It can
It is divided into supercomputer, industrial control computer, network computer, personal computer, five class of embedded computer, it is more advanced
Computer has biocomputer, photonic computer, quantum computer etc..Wiring board is divided into single sided board if dividing by the number of plies, double
The three big classification of panel and multilayer circuit board.It is single sided board first, on most basic PCB, part concentrates wherein one
Face, conducting wire then concentrate on another side.Because conducting wire is only present in wherein one side, this PCB is just claimed to be called single side circuit
Plate.Single sided board usually makes simple, low cost, but a disadvantage is that can not be applied on too complicated product.Dual platen is single side
The extension of plate, when single layer wiring cannot meet electronic product when needing it is necessary to using dual platen.It is two-sided have cover copper and walk
Line, and the circuit between two layers can be connected by via, it is allowed to form required network connection.
However existing computer circuit board is in use that there are still shortcomings, is mostly hard plate, the accurate instrument in part
For the soft board used in device due to being made of special substance, cost is generally higher, and popularization degree is relatively low, meanwhile, heat dissipation is asked
Topic be all the time circuit board it is safe to use the most pay close attention to the problem of one of.
Invention content
The purpose of the present invention is to solve disadvantages existing in the prior art, and the one kind proposed unidirectionally can bend and dissipate
The good circuit board of thermal effect.
To achieve the goals above, present invention employs following technical solutions：One kind can unidirectionally be bent and good heat dissipation effect
Circuit board, including circuit board body and flexible link belt, the surface middle position of the circuit board body be provided with first
Heat storing plate, and the top of the first heat storing plate is fixed with the first heat sink with bottom end by heat-conducting plate, the circuit board body
Surface both sides are provided with the second heat storing plate, and the outside of the second heat storing plate is fixed with the second heat sink by heat-conducting plate, described soft
Property connect band is arranged in the inside of circuit board body, and the centre position of flexible link belt vertically equidistantly offers and leads
String holes.
As further describing for above-mentioned technical proposal：
Four corners of the circuit board body offer location hole.
As further describing for above-mentioned technical proposal：
Mounting groove is offered on first heat storing plate and the second heat storing plate.
As further describing for above-mentioned technical proposal：
The wire guide is internally provided with conducting wire.
As further describing for above-mentioned technical proposal：
The circuit board body is divided into four parts, and is fixedly connected by flexible link belt between every part.
As further describing for above-mentioned technical proposal：
Each mounting groove in the circuit board body is electrically connected by conducting wire.
In the present invention, first, on the basis of original, which is divided into four parts, soft by one per part
Property connection band connection, it can be achieved that the function that circuit board is unidirectionally bent under the action of flexible link belt, to special for some
Equipment, can be under the premise of ensureing that circuit board is not impaired, instead of using soft board made of special material, to greatly reduce
Cost of manufacture；Secondly, the position tiling which is used to install electronic component has the first heat storing plate and the second heat accumulation
Plate, and the outside of the first heat storing plate and the second heat storing plate is connected with the first heat sink and the second heat sink by heat-conducting plate respectively,
To the heat for generation that during the work time, electronic component can be worked well by the first heat sink and the second heat sink
Directed outwards simultaneously radiate.
Description of the drawings
Fig. 1 is proposed by the present invention a kind of can unidirectionally bend and the structural schematic diagram of the circuit board of good heat dissipation effect；
Fig. 2 is the flexible link belt structural schematic diagram of the present invention；
Fig. 3 is the front view of the present invention.
Marginal data：
1- circuit board bodies, the first heat storing plates of 2-, the first heat sinks of 3-, 4- location holes, the second heat storing plates of 5-, 6- installations
Slot, the second heat sinks of 7-, 8- flexible link belts, 9- heat-conducting plates, 10- conducting wires, 11- wire guides.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Referring to Fig.1-3, a kind of unidirectionally to bend and the circuit board of good heat dissipation effect, including circuit board body 1 and it is flexible even
The surface middle position of tape splicing 8, circuit board body 1 is provided with the first heat storing plate 2, and the top and bottom end of the first heat storing plate 2
The first heat sink 3 is fixed with by heat-conducting plate 9, the surface both sides of circuit board body 1 are provided with the second heat storing plate 5, and second
The outside of heat storing plate 5 is fixed with the second heat sink 7 by heat-conducting plate 9, and flexible link belt 8 is arranged in the inside of circuit board body 1,
And the centre position of flexible link belt 8 vertically equidistantly offers wire guide 11.
Four corners of circuit board body 1 offer location hole 4, on the first heat storing plate 2 and the second heat storing plate 5
Offering mounting groove 6, wire guide 11 is internally provided with conducting wire 10, and circuit board body 1 is divided into four parts, and per part
Between be fixedly connected by flexible link belt 8, each mounting groove 6 in circuit board body 1 is electrically connected by conducting wire 10.
Mounting groove 6 is used for for installing electronic component, wire guide 11 across conducting wire 10, and conducting wire 10 is for connecting each electronics
Element.
Operation principle：In use, circuit board body 1 is fixedly mounted across location hole 4 by bolt, when work, installation
Electronic component fever in slot 6, the first heat storing plate 2 and the second heat storing plate 5 tentatively store heat as medium, and pass through heat conduction
Plate 9 is individually directed the first heat sink 3 and the second heat sink 7, to realize whole heat dissipation, due to the effect of flexible link belt 8,
The laterally bending of circuit board body 1 can be achieved, meanwhile, conducting wire 10 is in relaxed state, conducting wire when in order to bend under normal circumstances
10 will not be broken.
The foregoing is only a preferred embodiment of the present invention, but the scope of protection of the utility model do not limit to
In this, any one skilled in the art in the technical scope disclosed by the present invention, technique according to the invention side
Case and its utility model design are subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
- It can unidirectionally be bent and the circuit board of good heat dissipation effect 1. a kind of, including circuit board body (1) and flexible link belt (8), It is characterized in that, the surface middle position of the circuit board body (1) is provided with the first heat storing plate (2), and the first heat storing plate (2) Top and bottom end the first heat sink (3) is fixed with by heat-conducting plate (9), the surface both sides of the circuit board body (1) are set It is equipped with the second heat storing plate (5), and the outside of the second heat storing plate (5) is fixed with the second heat sink (7) by heat-conducting plate (9), it is described Flexible link belt (8) setting is in the inside of circuit board body (1), and the centre position of flexible link belt (8) is vertically etc. Spacing offers wire guide (11).
- It a kind of can unidirectionally be bent and the circuit board of good heat dissipation effect 2. according to claim 1, which is characterized in that the electricity Four corners of road plate ontology (1) offer location hole (4).
- It a kind of can unidirectionally be bent and the circuit board of good heat dissipation effect 3. according to claim 1, which is characterized in that described Mounting groove (6) is offered on one heat storing plate (2) and the second heat storing plate (5).
- It a kind of can unidirectionally be bent and the circuit board of good heat dissipation effect 4. according to claim 1, which is characterized in that described to lead String holes (11) is internally provided with conducting wire (10).
- It a kind of can unidirectionally be bent and the circuit board of good heat dissipation effect 5. according to claim 1, which is characterized in that the electricity Road plate ontology (1) is divided into four parts, and is fixedly connected by flexible link belt (8) between every part.
- It a kind of can unidirectionally be bent and the circuit board of good heat dissipation effect 6. according to claim 4, which is characterized in that the electricity Each mounting groove (6) on road plate ontology (1) is electrically connected by conducting wire (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810560776.7A CN108601205A (en) | 2018-05-31 | 2018-05-31 | It is a kind of unidirectionally to bend and the circuit board of good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810560776.7A CN108601205A (en) | 2018-05-31 | 2018-05-31 | It is a kind of unidirectionally to bend and the circuit board of good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108601205A true CN108601205A (en) | 2018-09-28 |
Family
ID=63630331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810560776.7A Withdrawn CN108601205A (en) | 2018-05-31 | 2018-05-31 | It is a kind of unidirectionally to bend and the circuit board of good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108601205A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111031654A (en) * | 2018-10-09 | 2020-04-17 | 群光电子股份有限公司 | Multi-layer circuit board structure |
| TWI700025B (en) * | 2018-10-04 | 2020-07-21 | 群光電子股份有限公司 | Multi-layer circuit board structure |
-
2018
- 2018-05-31 CN CN201810560776.7A patent/CN108601205A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI700025B (en) * | 2018-10-04 | 2020-07-21 | 群光電子股份有限公司 | Multi-layer circuit board structure |
| CN111031654A (en) * | 2018-10-09 | 2020-04-17 | 群光电子股份有限公司 | Multi-layer circuit board structure |
| CN111031654B (en) * | 2018-10-09 | 2021-01-26 | 群光电子股份有限公司 | Multi-layer circuit board structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180928 |
|
| WW01 | Invention patent application withdrawn after publication |