CN108598113A - Array substrate and display screen - Google Patents
Array substrate and display screen Download PDFInfo
- Publication number
- CN108598113A CN108598113A CN201810373807.8A CN201810373807A CN108598113A CN 108598113 A CN108598113 A CN 108598113A CN 201810373807 A CN201810373807 A CN 201810373807A CN 108598113 A CN108598113 A CN 108598113A
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- Prior art keywords
- array substrate
- stress buffer
- buffer hole
- stress
- display area
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention relates to a kind of array substrate and display screens.There is array substrate non-display area, array substrate to be equipped with stress buffer hole, and stress buffer hole is located in non-display area.The above-mentioned array substrate of the present invention, due to being equipped with stress buffer hole on its surface, the stress that display screen generates during cutting etc. can be transferred at above-mentioned stress buffer hole, so that above-mentioned stress is rationally discharged, so as to avoid thin-film encapsulation layer breakage, the reliability of thin-film package can be improved.In addition, further relating to a kind of display screen.Display screen includes thin-film encapsulation layer and above-mentioned array substrate.
Description
Technical field
The present invention relates to display technology fields, more particularly to a kind of array substrate and display screen.
Background technology
Some special occasions that thin film encapsulation technology cannot achieve especially suitable for tradition capping encapsulation, such as have flexibility
The envelope of machine light emitting diode (Organic Light-Emitting Devices, OLED) and flexible organic solar batteries etc.
Dress.However, display screen body after thin-film package is durings cutting etc., between thin-film encapsulation layer and the film layer of lower section array substrate
There are stress, and above-mentioned stress be easy to cause thin-film encapsulation layer breakage, influences the reliability of thin-film package.
Invention content
Based on this, it is necessary to which the problem of for the reliability for how improving thin-film package, film can be improved by providing one kind
The array substrate and display screen of the reliability of encapsulation.
There is non-display area, the array substrate to be equipped with stress buffer hole, institute for a kind of array substrate, the array substrate
Stress buffer hole is stated to be located in the non-display area.
The above-mentioned array substrate of the present invention, due to being equipped with stress buffer hole on its surface, display screen is durings cutting etc.
The stress of generation can be transferred at above-mentioned stress buffer hole, so that above-mentioned stress is rationally discharged, so as to avoid film
Encapsulated layer is damaged, can improve the reliability of thin-film package.
The array substrate includes the support substrate being stacked, buffer layer and insulation in one of the embodiments,
Layer, the stress buffer hole is through the insulating layer and stretches into the buffer layer.
The depth Yu the array substrate in the stress buffer hole are in the non-display area in one of the embodiments,
The ratio of thickness is 1:1~3:5.
In one of the embodiments, the number in the stress buffer hole be several, several described stress buffer holes
It is uniformly distributed in the non-display area.
The face of the total opening area and the non-display area in several stress buffer holes in one of the embodiments,
Long-pending ratio is 1:10~1:50.
In one of the embodiments, several described stress buffer holes in the non-display area according to the side to embark on journey in column
Formula is arranged, and the stress buffer hole of adjacent rows or two row is staggered.
In one of the embodiments, between the adjacent stress buffer hole between be divided into 3 μm~15 μm.
The opening area in the stress buffer hole is 5 μm in one of the embodiments,2~20 μm2。
The opening section in the stress buffer hole is rounded in one of the embodiments, rectangle, diamond shape or ellipse
Shape.
In addition, a kind of display screen is also provided, including thin-film encapsulation layer and above-mentioned array substrate.
In one of the embodiments, in at least partially embedded stress buffer hole of the thin-film encapsulation layer.
Due to being equipped with stress buffer hole on the non-display area surface of array substrate, what display screen generated during cutting etc.
Stress can be transferred at above-mentioned stress buffer hole, so that above-mentioned stress is rationally discharged, so as to avoid thin-film encapsulation layer
Breakage can improve the reliability of thin-film package.
Description of the drawings
Fig. 1 is the schematic diagram of the array substrate of first embodiment of the invention；
Fig. 2 is the schematic diagram of the array substrate of second embodiment of the invention；
Fig. 3 is the schematic diagram of the display screen of an embodiment of the present invention.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of violating intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
Fig. 1 is referred to, the array substrate 100 of first embodiment of the invention has non-display area 110, array substrate 100
It is equipped with stress buffer hole 120, stress buffer hole 120 is located in non-display area 110.
Wherein, also there is the region where packed device in array substrate 100.Non-display area 110 refers to being located at quilt
The peripheral region of packaging, the region include partial encapsulation area and cutting trough.
Wherein, stress buffer hole 120 can be through-hole, can also be blind hole.When stress buffer hole 120 is through-hole, answer
Power cushion hole 120 penetrates non-display area 110.When stress buffer hole 120 is blind hole, the bottom wall in stress buffer hole 120 is positioned at non-
The inside of viewing area 110.
Wherein, array substrate 100 is preferably flexible base board.It can be by techniques such as etchings on the surface of array substrate 100
Open up stress buffer hole 120.
Since the non-display area 110 in array substrate 100 is equipped with stress buffer hole 120, display screen is durings cutting etc.
The stress of generation can be transferred at above-mentioned stress buffer hole 120, so that above-mentioned stress is rationally discharged, so as to avoid thin
Film encapsulated layer is damaged, can improve the reliability of thin-film package.
Further, since the non-display area 110 in array substrate 100 is equipped with stress buffer hole 120, thin-film package is subsequently carried out
Later, in at least partially embedded stress buffer hole 120 of thin-film encapsulation layer, thin-film encapsulation layer and array substrate can be increased in this way
100 contact area can also improve thin-film package so as to promote the adhesion strength of thin-film encapsulation layer and array substrate 100
Reliability.
Preferably, stress buffer hole 120 is blind hole.That is, the bottom of array substrate 100 is closed, such energy
The enough inside for preferably avoiding steam from entering display device, to improve packaging effect.
On the basis of aforementioned embodiments, array substrate 100 includes the support substrate 101 being stacked, buffer layer 102
And insulating layer 108, stress buffer hole 120 is through insulating layer 108 and stretches into buffer layer 102.
Wherein, array substrate 100 includes the support substrate 101 being stacked, buffer layer 102, the first interlayer insulating film
(GI) 103, capacitance interior insulation dielectric layer (CI) 104 and the second interlayer insulating film (ILD) 105.Stress buffer hole 120 is passed through successively
The second interlayer insulating film 105, capacitance interior insulation dielectric layer 104 and the first interlayer insulating film 103 are worn, and stretches into buffer layer 102.
Wherein, support substrate 101 is used to support buffer layer 102 and insulating layer 108.Support substrate 101 is preferably flexible liner
Bottom, for example, PI substrates.
Wherein, buffer layer 102 includes the silicon nitride layer 106 and silicon oxide layer 107 of stacking, wherein silicon nitride layer 106 is close
Support substrate 101 is arranged, and silicon oxide layer 107 is arranged close to the first interlayer insulating film 103.Wherein, oxygen is run through in stress buffer hole 120
SiClx layer 107, and the upper surface that the bottom wall in stress buffer hole 120 is silicon nitride layer 106.
Wherein, insulating layer 108 includes the first interlayer insulating film (GI) 103, the capacitance interior insulation dielectric layer being stacked
(CI) 104 and second interlayer insulating film (ILD) 105.
In present embodiment, the inside that array substrate 100 is stretched into stress buffer hole 120 is deeper, can not only fully discharge
Stress when cutting, additionally it is possible to the contact area of thin-film encapsulation layer and array substrate 100 is effectively increased, to effectively promote film
The adhesion strength of encapsulated layer and array substrate 100, it is above-mentioned to be integrated with conducive to the reliability of thin-film package is promoted.
It should be noted that the position in stress buffer hole 120 is without being limited thereto, stress buffer hole 120 can also be stretched into but not
Through silicon nitride layer 106, or run through entire buffer layer 102.In addition, stress buffer hole 120 can also stretch to the second interlayer
In insulating layer 105, capacitance interior insulation dielectric layer 104, the first interlayer insulating film 103, buffer layer 102 and support substrate 101
Any one layer of any position.
In addition, the structure of buffer layer 102 is also not limited to this, buffer layer 102 can also be that other can play cushioning effect
Film layer and its arbitrary combine.At this point, stress buffer hole 120 can stretch into or any one film layer therethrough.
Certainly, the structure of array substrate 100 is also not limited to this.
On the basis of aforementioned embodiments, the depth and array substrate 100 in stress buffer hole 120 are in non-display area 110
Thickness ratio be 1:1~3:5.Stress buffer hole 120 is larger in the depth of non-display area 110 in this way, stress buffer hole 120
The film layer of position is etched totally or residual is less, therefore cutting stress can discharge completely here, will not extend
Position to other than non-display area 110, effectively prevents package failure.
On the basis of aforementioned embodiments, the number in stress buffer hole 120 is several, several stress buffer holes
120 are uniformly distributed in non-display area.Equably cushioning effect can be played to stress when being cut after thin-film package in this way.
On the basis of aforementioned embodiments, total opening area and the non-display area 110 in several stress buffer holes 120
The ratio of area is 1:10~1:100.The contact area that thin-film encapsulation layer and array substrate 100 can be increased in this way, so as to
The adhesion strength for enough promoting thin-film encapsulation layer and array substrate 100, can also improve the reliability of thin-film package.
On the basis of aforementioned embodiments, between adjacent stress buffer hole 120 between be divided into 3 μm~20 μm.Several
When stress buffer hole 120 is distributed according to above-mentioned interval, distribution will not be especially intensive, and this avoid stress buffer holes
120 dense distribution causes the problem that 120 hole depth of stress buffer hole is inadequate in etching process, can be released effectively cutting stress.
On the basis of aforementioned embodiments, the opening area in stress buffer hole 120 is 5 μm2~20 μm2.Above-mentioned stress is slow
The opening of punching 120 is larger, and the film layer for capableing of 120 position of proof stress cushion hole is etched totally or residual is less, favorably
In the complete release of stress, stress is avoided to extend to package failure caused by the position other than non-display area 110.Above-mentioned opening
Areal extent is particularly suitable for stress buffer hole 120 and is distributed relatively intensive region.
On the basis of aforementioned embodiments, the opening section in stress buffer hole 120 is rounded, rectangle, diamond shape or ellipse
It is round.Certainly, the opening section in stress buffer hole 120 is without being limited thereto, can also be in other rules or irregular shape, such as ladder
Shape, diamond shape etc..
In addition, the distribution in several stress buffer holes in the array substrate of the present invention is not limited to the above embodiment.
Fig. 2 is referred to, the array substrate 200 of second embodiment of the invention has non-display area 210, array substrate 200
Surface be equipped with stress buffer hole 220, stress buffer hole 220 is located in non-display area 210.
As shown in Fig. 2, several stress buffer holes 220 are arranged in non-display area 210 in the way of embarking on journey in column, and phase
The stress buffer hole 220 of adjacent two rows or two columns is staggered.Be conducive in this way by stress along the direction far from packed device
Evenly dispersed, when cutting stress along close to the direction transmission for being packaged device, above-mentioned staggered stress buffer hole 220 is right
Above-mentioned stress plays the role of discharging layer by layer, and stress is first transferred to the position in the stress buffer hole 220 of periphery, at this point, periphery
Stress buffer hole 220 can discharge most of stress.Later, it is then further discharged positioned at the interior stress buffer hole 220 enclosed
Remaining fraction stress.Above-mentioned entirety ensure that stress is rationally discharged, to effectively prevent thin-film encapsulation layer breakage,
The reliability of thin-film package can be improved.
The above-mentioned array substrate of the present invention, due to being equipped with stress buffer hole on its surface, display screen is durings cutting etc.
The stress of generation can be transferred at above-mentioned stress buffer hole, so that above-mentioned stress is rationally discharged, so as to avoid film
Encapsulated layer is damaged, can improve the reliability of thin-film package.
Fig. 3 is referred to, the display screen 300 of an embodiment of the present invention includes thin-film encapsulation layer 310 and above-mentioned array
Substrate 100,
On the basis of aforementioned embodiments, in at least partially embedded stress buffer hole 120 of thin-film encapsulation layer 310.This
Sample can increase the contact area of thin-film encapsulation layer 310 and array substrate 100, so as to promote thin-film encapsulation layer 310 and battle array
The adhesion strength of row substrate 100 can also improve the reliability of thin-film package.
Wherein, display screen 300 is preferably flexible display screen.
Due to being equipped with stress buffer hole 120 on the non-display area surface of array substrate 100, display screen 300 was waited in cutting
The stress generated in journey can be transferred at above-mentioned stress buffer hole 120, so that above-mentioned stress is rationally discharged, to avoid
Thin-film encapsulation layer 310 is damaged, can improve the reliability of thin-film package.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of array substrate, which is characterized in that there is the array substrate non-display area, the array substrate to be equipped with stress
Cushion hole, the stress buffer hole are located at the non-display area.
2. array substrate according to claim 1, which is characterized in that the array substrate includes the branch support group being stacked
Bottom, buffer layer and insulating layer, the stress buffer hole is through the insulating layer and stretches into the buffer layer.
3. array substrate according to claim 1, which is characterized in that the depth in the stress buffer hole and the array base
Plate is 1 in the ratio of the thickness of the non-display area:1~3:5.
4. array substrate according to claim 1, which is characterized in that the number in the stress buffer hole is several, if
The dry stress buffer hole is uniformly distributed in the non-display area.
5. array substrate according to claim 4, which is characterized in that the total opening area in several stress buffer holes
Ratio with the area of the non-display area is 1:10~1:50.
6. array substrate according to claim 4, which is characterized in that several described stress buffer holes are described non-display
Area arranges in the way of embarking on journey in column, and the stress buffer hole of adjacent rows or two row is staggered.
7. array substrate according to claim 4, which is characterized in that be divided into 3 μ between the adjacent stress buffer hole
M~15 μm.
8. array substrate according to claim 1, which is characterized in that the opening area in the stress buffer hole is 5 μm2~
20μm2。
9. a kind of display screen, which is characterized in that including thin-film encapsulation layer and such as battle array according to any one of claims 1 to 8
Row substrate.
10. display screen according to claim 9, which is characterized in that the thin-film encapsulation layer it is at least partially embedded described
In stress buffer hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810373807.8A CN108598113B (en) | 2018-04-24 | 2018-04-24 | Array substrate and display screen |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810373807.8A CN108598113B (en) | 2018-04-24 | 2018-04-24 | Array substrate and display screen |
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| Publication Number | Publication Date |
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| CN108598113A true CN108598113A (en) | 2018-09-28 |
| CN108598113B CN108598113B (en) | 2022-02-22 |
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| CN110143025A (en) * | 2019-04-02 | 2019-08-20 | 福建华佳彩有限公司 | A kind of back board structure of novel glass substrate |
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| US10923548B2 (en) | 2019-02-25 | 2021-02-16 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and method for manufacturing same |
| WO2021114473A1 (en) * | 2019-12-10 | 2021-06-17 | 武汉华星光电半导体显示技术有限公司 | Array substrate and flexible display panel |
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| CN108598113B (en) | 2022-02-22 |
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