CN108592847A - The method that the groove depth of electronic device is measured using measuring device - Google Patents
The method that the groove depth of electronic device is measured using measuring device Download PDFInfo
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- CN108592847A CN108592847A CN201810846320.7A CN201810846320A CN108592847A CN 108592847 A CN108592847 A CN 108592847A CN 201810846320 A CN201810846320 A CN 201810846320A CN 108592847 A CN108592847 A CN 108592847A
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- groove
- measuring
- electronic device
- measuring device
- depth
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/18—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring depth
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
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- General Physics & Mathematics (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
This application discloses a kind of method for the groove depth measuring electronic device using measuring device, electronic device includes shell, and shell is equipped with groove, and the method that the groove depth of electronic device is measured using measuring device includes：Detect the height value of the groove inner bottom surface position of a bit；Detect the height value of corresponding position on the surface of the notch edges positioned at groove of shell；Calculate the difference of both above-mentioned height value, and the depth value as groove at the detecting location；At least choose two detecting locations in groove inner bottom surface, and calculate groove detecting location depth value；By multiple depth values compared with predetermined difference value, the depth value beyond predetermined difference value is found out.According to the method for the groove depth for measuring electronic device using measuring device of the embodiment of the present application, the method that the groove depth of electronic device is measured by using measuring device, measurement operating efficiency is not only increased, and the precision for measuring groove depth is higher, may be implemented quickly, in batches, accurately to measure.
Description
Technical field
This application involves technical field of electronic equipment, more particularly, to a kind of slot measuring electronic device using measuring device
Deep method.
Background technology
The Logo matrixes with 3D stereoscopic effects are processed in relatively thin surface of shell, it usually needs use hot melt adhesive will
Logo matrixes heat on the surface of the housing, and the design of such Logo matrixes technique needs the hot melt that certain pressure, temperature are come unglued
Glue sticking so that the surface for processing rear Logo matrixes is lower than surface of shell (if the protrusion design of Logo matrixes can lead to Logo
Matrix abrasion mill flower), while also need to a protrusion pressure head hot pressing consistent with Logo base shapes Logo matrix surfaces into
And hot melt adhesive is pressed off.
If if the groove depth appearance of the corresponding groove for accommodating Logo matrixes is abnormal on shell or slot bottom has step, burr
When, it is easy to cause Logo matrixes to fall off, phenomena such as Logo matrixes warp.In the related technology, for this thin-wall case surface
Logo matrix narrow slots measure and measured using high metric, slide calliper rule, depth gauge, slice, the less efficient, low precision that not only operates,
It is of high cost or even the case where be unable to measure, for example, measuring the groove depth of case surface, the width of the alphabetical lines of Logo matrixes
Degree only has 0.37~1.20mm, can not quickly, in batches, accurately measure.
Invention content
The application aims to solve at least one of the technical problems existing in the prior art.
For this purpose, the application propose it is a kind of using measuring device measure electronic device groove depth method, may be implemented quickly,
In batches, accurate to measure.
According to the method for the groove depth for measuring electronic device using measuring device of the embodiment of the present application, the electronic device packet
Shell is included, the shell is equipped with groove, and the method for the groove depth that electronic device is measured using measuring device includes：Detection institute
State the height value of the groove inner bottom surface position of a bit；It is right on the surface of the notch edges positioned at the groove of the shell to detect
Answer the height value of position；Calculate the difference of both above-mentioned height value, and the depth as the groove at the detecting location
Angle value；Two detecting locations are at least chosen in the groove inner bottom surface, and calculate the groove in the detecting location
Depth value；By multiple depth values compared with the critical field of predetermined depth value, find out beyond the predetermined depth value mark
The depth value of quasi- range.
According to the method for the groove depth for measuring electronic device using measuring device of the embodiment of the present application, filled by using measuring
The method for setting the groove depth for measuring electronic device not only increases measurement operating efficiency, and the precision for measuring groove depth is higher, Ke Yishi
Now quickly, in batches, accurately measure.
According to one embodiment of the application, the width of the groove is w, wherein 0.37mm≤w≤1.2mm.
According to another embodiment of the application, the detecting location includes being intervally arranged along the extending direction of the groove
It is multiple.
According to another embodiment of the application, when the groove is annular groove, the detecting location includes at least two,
Two detecting locations are spaced and positioned opposite in the groove.
According to another embodiment of the application, when the groove is straight line type groove, the detecting location includes at least two
A, two detecting locations are located at the both ends of the groove.
According to the optional embodiment of the application, the shell is fixed in the measuring device, in the measuring device
Equipped with measurement portion, the groove is arranged towards the measurement portion to measure the depth value of the groove.
According to one optional example of the application, the measurement portion is probe, and the probe is telescopically connected to described
In measuring device.
Another optional example according to the application, the probe is in the contour area of the groove and the groove
Contour area periphery translation.
Another optional example according to the application, when the probe translation, the probe is spaced apart with measured surface
Arrangement；When the measurement portion is directed at the measured surface, the probe elongation is until be only against on the measured surface.
Another optional example according to the application, the diameter of the probe are less than the width of the groove.
Another optional example according to the application, the probe stretch into the diameter of the inside grooves point less than described recessed
The width of slot, the probe do not extend into width of the diameter more than or equal to the groove of the inside grooves point.
Optionally, the measurement portion is laser aid, and the laser that the laser aid generates is in the profile region of the groove
In domain and surrounding automatic running and the scanning detecting location.
Some optional examples, the multiple detecting locations being intervally arranged of laser scanning that the laser aid generates.
Other optional examples, described in extending direction scanning of the laser that the laser aid generates along the groove
The entire bottom surface of groove and the shell positioned at the surface of the notch edges.
Other optional example, the measuring device further include：Controller, the controller control the measurement portion and visit
Survey the detecting location.
Other optional example, the measuring device further include：Computing module and display device, the computing module point
It is not connected with the measurement portion and the display device, the computing module calculates the depth value of the detecting location, described
Depth value described in display device real-time display.
Further, the measuring device further includes：Warning device, one or several in the depth value exceed institute
When stating predetermined difference value, the warning device sends out alarm signal and the display device is highlighted beyond the target offset
Depth value.
The additional aspect and advantage of the application will be set forth in part in the description, and will partly become from the following description
It obtains obviously, or recognized by the practice of the application.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the application will become in the description from combination following accompanying drawings to embodiment
Obviously and it is readily appreciated that, wherein：
Fig. 1 is the schematic diagram according to the groove of the shell of the electronic device of the embodiment of the present application
Fig. 2 is the method flow diagram according to the groove depth for measuring electronic device using measuring device of the embodiment of the present application；
Fig. 3 is the method flow according to the groove depth for measuring electronic device using measuring device of the application another embodiment
Figure；
Fig. 4 is the schematic diagram according to the measuring device of the groove depth of the measurement electronic device of the embodiment of the present application；
Fig. 5 is the front view according to the electronic device of the embodiment of the present application；
Fig. 6 is the side view according to the electronic device of the embodiment of the present application.
Reference numeral：
100：Shell；10：Groove；110：Electronic device；
200：Measuring device；210：Measurement portion；220：Display device.
Specific implementation mode
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
Electronic device 110 is measured using measuring device 200 according to the embodiment of the present application below with reference to Fig. 1-Fig. 6 descriptions
The method of groove depth.
According to the method for the groove depth for measuring electronic device 110 using measuring device 200 of the embodiment of the present application, wherein electronics
Device 110 includes shell 100, is equipped in the outside wall surface equipped with groove 10 on shell 100, such as on shell 100 for holding
Receive the grooves 10 of Logo matrixes.Specifically, the method for the groove depth of electronic device 110 being measured using measuring device 200 includes following
Step, the height value of the position of 10 inner bottom surface of detection groove a bit (A points in groove 10 as shown in Figure 2), then detects shell
Corresponding position on the surface of 100 notch edges positioned at groove 10 (such as the A ' points at the notch edges of groove 10, it needs to manage
Solution, A points be positioned adjacent to A ' point position) height value, after having measured the height value behind above-mentioned two position, in calculating
State the difference of the two height value, and depth value (i.e. depth of the groove 10 in A points position as groove 10 at the detecting location
Value).Secondly two detecting locations are at least chosen in 10 inner bottom surface of groove, using abovementioned steps to height value at each detecting location
It measures, further, two detecting locations are spaced apart and are oppositely arranged, when such as groove 10 being annular groove, in annular groove
Two detecting locations are selected at two opposite positions, while calculating depth value of the groove 10 at respective detecting location, this
Sample can measure the depth value of the part of groove 10 relatively far away from, finally by the critical field of multiple depth values and predetermined depth value
Be compared, therefrom find out the depth value beyond predetermined depth value critical field, it is to be understood that calculated depth value with
The difference of predetermined depth value is within critical field, then the depth value of groove depth is consistent, if calculated depth value and predetermined depth
The difference of value is except critical field, then corresponding to have found the groove depth of corresponding detecting location, and then can determine that groove 10 exists
Whether corresponding position has step, burr etc., can targetedly handle the corresponding part of groove 10.
The method for measuring the groove depth of electronic device 110 using measuring device 200 according to the embodiment of the present application, by using
The method that measuring device 200 measures the groove depth of electronic device 110, can rapidly measure the groove depth of groove 10, improve survey
Operating efficiency is measured, and the precision for measuring groove depth is higher, further, it is also possible to realize that mass measures, especially can be applied to criticize
On the product for measuring production.
According to one embodiment of the application, the width of groove 10 is w, wherein 0.37mm≤w≤1.2mm, wherein groove
10 width can be 0.37mm, 0.57mm, 0.73mm, 0.85mm, 1.0mm, 1.1mm or 1.2mm, specifically can be according to reality
The width value of border demand selection groove 10, such as electronic device 110 is wrist-watch, mobile phone, it can on the shell 100 of electronic device 110
Typically small relatively narrow with the groove 10 for accommodating Logo matrixes, the application measuring device 200 in the embodiment of the present application measures electronics dress
The method for setting 110 groove depth, compared to the method for measuring groove depth using high metric, slide calliper rule etc. in the related technology, not only customer service nothing
The phenomenon that method measures, and the operating efficiency of measurement is improved, the precision of measurement greatly promotes, further, it is also possible to realize that batch is surveyed
Amount.By the way that the width of groove 10 is limited within above range, and using the slot of the measurement electronic device 110 of measuring device 200
Deep method, and then the groove depth for meeting narrow slot on compact electronic device 110 (such as mobile phone, wrist-watch electronic equipment) measures, in turn
Know whether the depth in groove 10 is consistent.
According to another embodiment of the application, detecting location include along groove 10 extending direction be intervally arranged it is more
It is a, that is to say, that multiple detecting locations being intervally arranged can be chosen on the extending direction of groove 10, in this way, along groove
On 10 extending direction, multiple depth values on the extending direction along groove 10 can be measured, are then compared multiple
Whether depth value is unanimous on the whole, the groove depth variation of groove 10 in the direction of extension is also just realised that, further, it is also possible to substantially measure
The flatness of the bottom surface of groove 10.
As shown in Fig. 2, according to another embodiment of the application, when groove 10 is annular groove, detecting location includes at least
Two, two detecting locations interval and positioned opposite in the groove 10 such as takes A points and B points in annular groove, A points and B points are in annular
It is spaced apart on slot and positioned opposite, i.e. A points and B points are located at the opposite both sides of annular groove, then neighbouring on shell 100
A ' points are taken on the surface of the notch edges of A points, are taken B ' points on the surface of the notch edges of neighbouring B points on shell 100, are surveyed respectively
Go out the height value of A points and A ' points, and the difference of the height value and the height value of A points of A ' points will be calculated, which is annular
Depth value of the slot at A points similarly obtains depth value of the annular groove at B points, then by A points depth value and B points at
Depth value compared with predetermined difference value (i.e. the standard depth value of groove 10), sees whether exceed acceptable deviation range respectively.
With reference to Fig. 3, according to another embodiment of the application, when groove 10 is straight line type groove, detecting location includes at least
Two, two detecting locations are located at the both ends of groove 10, and such as C points in cut-off linear groove and D points, C points and D points are in linear type
It is spaced apart on slot and positioned opposite, i.e. C points and D points are located at the both ends of straight line type groove, then the neighbouring C points on shell 100
Notch edges surface on take C ' points, take D ' points on the surface of the notch edges of neighbouring D points on shell 100, measure C respectively
The height value of point and C ' points, and the difference of the height value and the height value of C points of C ' points will be calculated, which is straight line type groove
Depth value at C points similarly obtains depth value of the straight line type groove at D points, then by C points depth value and D points at
Depth value compared with predetermined difference value (i.e. the standard depth value of groove 10), sees whether exceed acceptable deviation range respectively.
As shown in figure 4, according to the optional embodiment of the application, shell 100 is fixed in measuring device 200, is being surveyed
It measures device 200 and is equipped with measurement portion 210, the wherein groove 10 on shell 100 is arranged towards measurement portion 210, such measurement portion 210
The depth value of groove 10 can be measured, as measuring device 200 is formed as the concave structure of edge-on placement, i.e. measuring device
200 upper and lower ends are symmetrical and mutually towards arrangement, and measurement portion 210 is arranged on the top of measuring device 200, and shell 100 is fixed
In the lower end of measuring device 200, measurement portion 210 is towards the arrangement of shell 100, and the region where measurement portion 210 and groove 10 is just
It is right, in this way, can be measured to the groove depth of groove 10 by measuring device 200.
As shown in figure 4, according to one optional example of the application, measurement portion 210 is probe, and probe is telescopically connected to
In measuring device 200, the upper end of probe is connected to the upper end of measurement portion 210, as probe is located at the upper end direction of measuring device 200
On the surface of lower end, probe can extend or shorten in the vertical direction, specifically, do not measure when measuring device 200 or
In planar movement, probe shortens to keep interval with shell 100 probe, facilitates shell 100 being fixed on measuring device 200
On, or probe is facilitated planar to move, when the point of probe alignment detecting location, probe extends downwards and the end of probe
It is only against on the inner bottom surface of groove 10 or on the surface of shell 100, probe can be measured pair by being contacted with surface at this time
Answer the height value on surface.
Another optional example according to the application, probe can be moved in the contour area inner plane of groove 10, simultaneously
Probe can also can both measure in the contour area of groove 10 selected in this way in the periphery translation of the contour area of groove 10
Point height value, the height value of institute's reconnaissance on the peripheral surface of the contour area of groove 10 can also be measured, as a result, by using
The height value of corresponding points subtracts the height value of respective point on 10 inner bottom surface of groove on surface at periphery, you can calculates groove 10 and exists
Depth value at the detecting location.
Another optional example according to the application, measuring device 200 is when measuring, and when probe planar moves, visits
Needle and measured surface are arranged spaced apart, so that probe can move back and forth, while probe also being avoided to scratch 100 table of shell
Face, when measurement portion 210, which is aligned, is measured surface, specifically, probe translation to detecting location and the tool being aligned at detecting location
When body point, probe elongation until the end of probe is only against on measured surface, contacted with measured surface by probe thus
Know the height value of the measurement surface.
Another optional example according to the application, the diameter of probe are less than the width of groove 10, i.e., entire probe it is straight
Diameter is respectively less than the width of groove 10, in this way, probe, when being directed at corresponding detecting location, probe can stretch into relatively narrow groove 10
It is interior, it is to be understood that the probe of this spline structure can be used for measuring the groove depth of the smaller groove 10 of width.
Another optional example according to the application, probe stretch into width of the diameter less than groove 10 of 10 inside points of groove
Degree, the diameter that probe does not extend into 10 inside points of groove are greater than or equal to the width of groove 10, i.e., part is relatively large in diameter on probe,
Such as the width more than groove 10, the lower part diameter of probe is smaller, such as less than the width of groove 10, in this way, probe is being aligned
When mutually corresponding detecting location, the lower part (the smaller part of diameter) of probe can stretch into relatively narrow groove 10, Ke Yili
Solution, the probe of this spline structure can be used for measuring the groove depth of the smaller groove 10 of width.
Further, it is also possible to be that the lower part of probe is telescopically located at the upper part of probe, that is to say, that probe is translating
When, the lower part of probe is retracted in part, and when the corresponding points of probe alignment detecting location, the lower part of probe is stretched downwards
It is long, and probe can stretch into width of the diameter less than groove 10 of the part of groove 10, the application does not do the concrete structure of probe
Limit, if can be used for measure electronic device 110 relatively narrow groove 10 groove depth within the protection domain of the application.
Optionally, measurement portion 210 be laser aid, laser aid generate laser in the contour area of groove 10 and
Surrounding automatic running and scanning probe position, laser aid are located at the upper end of measuring device 200, will produce on laser aid sharp
Light, laser can within the scope of scheduled automatically scanning, and without in vertical direction movement can scan scheduled point, i.e.,
By choosing multiple detecting locations on the groove 10 of shell 100, each detecting location includes on 10 inner bottom surface of scheduled groove
Point (such as A points in groove as shown in Figure 2 10) and shell 100 on be located at 10 notch edges surface of groove on point (such as
A ' points at the notch edges of groove 10), specifically, laser can voluntarily run to scheduled point and be scanned, such as sweep
A points and A ' points are retouched, the height value at A points and the height value at A ' points can be measured in this way, by calculating the height at A ' points
Value and the difference of the height value at A points can be obtained by the depth value at the detecting location.
Some optional examples, the multiple detecting locations being intervally arranged of laser scanning that laser aid generates, specifically,
Multiple detecting locations are set on groove 10, and laser aid is by scanning the corresponding point of multiple detecting locations, you can obtains corresponding spy
Location sets the depth value at place, for example, choosing two detecting locations on groove 10, i.e. A points and A ' points, B points and B ' points are sharp respectively
With the height value of the height value of height value and A ' point, the height value of the B points and B ' point of laser scanning A points, and calculate separately A ' points
The difference of height value of height value and A points, B ' points height value and the height value of B points difference, so that it may to obtain the two
The depth value of groove 10 at detecting location, it is simple in structure, and measurement efficiency is high, it is accurate to measure.
In the description of the present application, the meaning of " plurality " is two or more.
Other optional examples, the laser that laser aid generates can also be along the extending direction swept notch of groove 10
10 entire bottom surface, at the same scan shell 100 positioned at the surface of notch edges, in this way, can both obtain being located at for shell 100
The difference of the height value of the inner bottom surface of the height value on the surface of notch edges and entire groove 10, the two can obtain entire groove
10 depth Distribution value, while the case where according to depth Distribution value, the inner bottom surface of groove 10 can be obtained in extension side indirectly
Upward flat conditions go out slot bottom plane part boss, bad section of particle (influencing coming into full contact with for hot melt adhesive and slot bottom), real
The synchronous detection of existing groove depth and slot bottom flatness.
Other optional example, measuring device 200 further include controller, and controller is located in measuring device 200, and with
Measurement portion 210 is connected, and controller detects detecting location for controlling measurement portion 210, in particular it is required that measuring the depth of groove 10
When value, by taking measurement portion 210 is probe as an example, controller needs to control at probe translation to scheduled point first, when alignment is predetermined
Point when, then control probe and move down until the end of probe is contacted with measured surface, when having surveyed this, control spy
Needle is retracted upwards so that the end of probe keeps being spaced with measured surface, to be moved easily.When measurement portion 210 fills for laser
It sets, laser can be controlled and run to scheduled point and scan the point.
Other optional example, measuring device 200 further include computing module and display device 220, computing module difference
It is connected with measurement portion 210 and display device 220, computing module is used to calculate the depth value of detecting location, and display device 220 is real
When display depth value, specifically, measurement portion 210 is used to measure 2 points of height value at scheduled detecting location, such as predetermined
10 inner bottom surface of groove on point height value and shell 100 on be located at 10 notch edges surface of groove on point height value,
Then computing module calculates the difference of two point height values at the detecting location to get depth of the groove 10 at the detecting location is gone out
Angle value, for the depth value by 220 real-time display of display device out to observe, operator is very clear without calculating.
Further, measuring device 200 further includes warning device, passes through depth value after measurement and scheduled depth value
(i.e. standard depth value) is compared, if the deviation of one or several and the scheduled depth value in depth value is larger, and
Beyond in experiment when acceptable deviation range, warning device sends out alarm signal, at the same display device 220 highlight it is super
Go out the depth value of target offset, such as the depth value generally shown in display device 220 is green digital, when beyond predetermined inclined
Difference depth value will red display come out.
The method of the groove depth for measuring electronic device 110 using measuring device 200 in the application can quick, batch, standard
The depth for really measuring narrow slot on thin-wall case, is used in the Logo narrow slot depth dimensions full inspections that processing is realized in practical volume production,
It is partially shallow, partially deep on hot melt Logo influences to greatly reduce Logo groove depths.In conjunction with the function of scanning slot bottom flatness, effectively solve
When batch machining of having determined sheet metal counterbore, slot bottom glue the test problems of slot bottom part boss, particle caused by knife breaking, to heat
The quality of molten Logo has significant enhancement.Using the scheme of above-mentioned full inspection groove depth, Logo warps bad being dropped by 500ppm of falling off
To 10ppm.
1 to Fig. 6 application measuring device 200 for specifically describing the embodiment of the present application measures electronic device below in conjunction with the accompanying drawings
The method of 110 groove depth.
The shell 100 of electronic device 110 is fixed on first on the upward surface in lower end of measuring device 200, and shell
100 10 side of groove towards it is upper and with 210 face of measurement portion arrange, first in groove 10 preselect detecting location, mark
Need to measure specific on each detecting location, then controller control measurement portion 210 measures, and is with measurement portion 210
For probe, controller controls probe translation to scheduled point (such as A points) first, and after being directed at scheduled point, controller controls
Probe extends downwards and contacts measured surface, and after having measured the point, controller controls probe and retracts, then moves to the detection position
Another point (A ' points corresponding with A points) is set, aforementioned operation is repeated, the measurement of other detecting locations is similarly, no longer superfluous herein
It states.
After measurement portion 210 measures 2 points of height value on detecting location, obtain groove 10 right by computing module
The depth value of detecting location is answered, and is shown in display device 220, further by compared with scheduled depth value, if with pre-
Fixed depth value deviation is larger, will be highlighted in display device 220 and send out alarm signal.
It should be noted that being defined as follows about " electronic device 110 " described herein：
Illustratively, electronic device 110 can be various types of calculating that are mobile or portable and executing wireless communication
Any one of machine system equipment.Specifically, electronic device 110 can be mobile phone or smart phone (for example, being based on
IPhone TM, the phone based on Android TM), portable gaming device (such as Nintendo DS TM, PlayStation
Portable TM, Gameboy Advance TM, iPhone TM), laptop computer, PDA, portable Internet appliance, sound
Happy player and data storage device, other handheld devices and such as wrist-watch, In-Ear Headphones, pendant, headphone
Can also be other wearable devices (for example, such as electronic glasses, electronics clothes, electronics bracelet, electricity Deng, electronic device 110
Subitem chain, electronics tatoo, the headset equipment (HMD) of electronic equipment or smartwatch).
Electronic device 110 can also be that any one of multiple electronic equipments, multiple electronic equipments include but not limited to
Cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, sound
Happy logger, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator, can
Program remote controler, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant
(PDA), portable media player (PMP), Motion Picture Experts Group's (MPEG-1 or MPEG-2) audio layer 3 (MP3) play
Device, portable medical device and digital camera and combinations thereof.
In some cases, electronic device 110 can execute multiple functions and (for example, playing music, show video, storage
Picture and send and receive call).If desired, electronic device 1100 can be such as cellular phone, media play
The portable device of device, other handheld devices, watch equipment, pendant equipment, receiver device or other compact portable equipment.
In one embodiment of the application, referring to figure 5 and figure 6 shown in, electronic device 110 be mobile phone.Further,
The mobile phone can also include radio circuit, memory, input unit, Wireless Fidelity (WiFi, wireless fidelity) mould
The components such as block, sensor, voicefrequency circuit, processor, power supply.
Radio circuit can be used for receive and send messages or communication process in, signal sends and receivees, particularly, by base station
After downlink information receives, processor processing is given；In addition, the data of mobile phone uplink are sent to base station.In general, radio circuit includes
But be not limited to antenna, at least one amplifier, transceiver, coupler, low-noise amplifier, duplexer etc..In addition, radio frequency electrical
Road can also be communicated with network and other devices by radio communication.Above-mentioned wireless communication can use any communication standard or association
View, including but not limited to global system for mobile communications (GSM, Global System for Mobile communication),
General packet radio service (GPRS, General Packet Radio Service), CDMA (CDMA, Code
Division Multiple Access), wideband code division multiple access (WCDMA, Wideband Code Division Multiple
Access), long term evolution (LTE, Long Term Evolution), Email, short message service (SMS, Short
Messaging Service) etc..
Memory can be used for storing software program and module, and processor is stored in the software program of memory by operation
And module, to execute various function application and the data processing of mobile phone.Memory can mainly include storing program area and
Storage data field, wherein storing program area can storage program area, the application program needed at least one function (such as broadcast by sound
Playing function, image player function etc.) etc.；Storage data field can be stored uses created data (such as audio number according to mobile phone
According to, phone directory etc.) etc..In addition, memory may include high-speed random access memory, can also include non-volatile memories
Device, for example, at least a disk memory, flush memory device or other volatile solid-state parts.
Input unit can be used for receiving the number or character information of input, and generate the user setting and work(with mobile phone
Related key signals can be controlled.Specifically, input unit may include touch panel and other input units.Touch panel,
Referred to as touch screen, collect user on it or neighbouring touch operation (for example user is any suitable using finger, stylus etc.
The operation of object or attachment on touch panel or near touch panel), and driven accordingly according to preset formula
Attachment device.Optionally, touch panel may include both touch detecting apparatus and touch controller.Wherein, touch detection
Device detects the touch orientation of user, and detects the signal that touch operation is brought, and transmits a signal to touch controller；Touch control
Device processed receives touch information from touch detecting apparatus, and is converted into contact coordinate, then gives processor, and can receiving area
It manages the order that device is sent and is executed.Furthermore, it is possible to a variety of using resistance-type, condenser type, infrared ray and surface acoustic wave etc.
Type realizes touch panel.In addition to touch panel, input unit can also include other input equipments.Specifically, other are inputted
Equipment can include but is not limited to physical keyboard, function key (such as volume control button, switch key etc.), trace ball, mouse,
It is one or more in operating lever etc..
WiFi belongs to short range wireless transmission technology, and electronic device 110 can help user to receive and dispatch electricity by WiFi module
Sub- mail, browsing webpage and access streaming video etc., it has provided wireless broadband internet to the user and has accessed.But it can manage
Solution, WiFi module are simultaneously not belonging to must be configured into for electronic device 110, completely can be as needed in the sheet for not changing application
It is omitted in the range of matter.
In addition, mobile phone may also include such as attitude transducer, optical sensor and other sensors.
Specifically, attitude transducer is referred to as motion sensor, also, as one kind of the motion sensor, can
To enumerate gravity sensor, cantilevered shifter is made using elastic sensing element in gravity sensor, and using the sensitive member of elasticity
Energy-stored spring made of part drives electric contact, to realize the variation that Gravity changer is converted into electric signal.
As the another kind of motion sensor, accelerometer sensor can be enumerated, accelerometer sensor can detect all directions
Upper (generally three axis) acceleration magnitude, can detect that size and the direction of gravity, can be used to identify mobile phone posture when static
It (for example pedometer, is struck using (such as horizontal/vertical screen switching, dependent game, magnetometer pose calibrating), Vibration identification correlation function
Hit) etc..
In the embodiment of the present application, it is first as aftermentioned " attitude parameter " is obtained that motion sensor listed above may be used
Part, but not limited to this, other sensors that can obtain " attitude parameter " are each fallen in the protection domain of the application, example
Such as, gyroscope etc., also, the operation principle of the gyroscope and data handling procedure can be similar to the prior art, here, in order to
It avoids repeating, description is omitted.
In addition, in the embodiment of the present application, as sensor, can also configure barometer, hygrometer, thermometer and infrared ray
The other sensors such as sensor, details are not described herein.
Optical sensor may include ambient light sensor and proximity sensor, wherein ambient light sensor can be according to ambient light
The light and shade of line adjusts the brightness of display panel, proximity sensor can when mobile phone is moved in one's ear, close display panel and/or
Backlight.
Voicefrequency circuit, loud speaker and microphone can provide the audio interface between user and mobile phone.Voicefrequency circuit can will connect
The transformed electric signal of audio data received, is transferred to loud speaker, and voice signal output is converted to by loud speaker；Another party
The voice signal of collection is converted to electric signal by face, microphone, is converted to audio data after being received by voicefrequency circuit, then by audio
After the processing of data output processing device, through radio circuit to be sent to such as another mobile phone, or audio data exported to storage
Device is to be further processed.
Processor is the control centre of electronic device 110, and processor is mounted on circuit board assemblies, using various interfaces and
The various pieces of the entire electronic device of connection 110, by run or execute the software program being stored in memory and/or
Module, and the data being stored in memory are called, the various functions and processing data of electronic device 110 are executed, to right
Electronic device 110 carries out integral monitoring.Optionally, processor may include one or more processing units；Preferably, processor can
Integrated application processor and modem processor, wherein the main processing operation system of application processor, user interface and application
Program etc., modem processor mainly handle wireless communication.
Power supply can be logically contiguous with processor by power-supply management system, is managed to be realized by power-supply management system
The functions such as charging, electric discharge and power managed.Although being not shown, electronic device 110 can also include bluetooth module, sensor
(such as attitude transducer, optical sensor, other sensings such as can also configure barometer, hygrometer, thermometer and infrared sensor
Device) etc., details are not described herein.
It should be understood that mobile phone is only 110 1 examples of electronic device, the application is not limited to ground, such as the application
Electronic device 110 can also be tablet computer etc..
It should be noted that whole features described in the application (include the technology spy of record in different embodiments
Sign), in the case that rational, can with any combination, in conjunction with and the new technical solution that is formed in the protection domain of the application
It is interior.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the application.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that embodiments herein, it will be understood by those skilled in the art that：Not
In the case of being detached from the principle and objective of the application a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The range of application is limited by claim and its equivalent.
Claims (17)
1. a kind of method for the groove depth measuring electronic device using measuring device, which is characterized in that the electronic device includes outer
Shell, the shell are equipped with groove, and the method for the groove depth that electronic device is measured using measuring device includes：
Detect the height value of the groove inner bottom surface position of a bit；
Detect the height value of corresponding position on the surface of the notch edges positioned at the groove of the shell；
Calculate the difference of both above-mentioned height value, and the depth value as the groove at the detecting location；
Two detecting locations are at least chosen in the groove inner bottom surface, and calculate the groove in the detecting location
Depth value；
Multiple depth values are compared with predetermined depth value, find out the depth of the critical field beyond the predetermined depth value
Angle value.
2. the method for the groove depth according to claim 1 for measuring electronic device using measuring device, which is characterized in that described
The width of groove is w, wherein 0.37mm≤w≤1.2mm.
3. the method for the groove depth according to claim 1 for measuring electronic device using measuring device, which is characterized in that described
Detecting location include along the groove extending direction be intervally arranged it is multiple.
4. the method for the groove depth according to claim 1 for measuring electronic device using measuring device, which is characterized in that described
When groove is annular groove, the detecting location includes at least two, and two detecting locations are spaced in the groove and phase
To arrangement.
5. the method for the groove depth according to claim 1 for measuring electronic device using measuring device, which is characterized in that described
When groove is straight line type groove, the detecting location includes at least two, and two detecting locations are located at the groove
Both ends.
6. the method for the groove depth according to any one of claims 1-5 for measuring electronic device using measuring device, special
Sign is that the shell is fixed in the measuring device, and the measuring device is equipped with measurement portion, and the groove is described in
Measurement portion is arranged to measure the depth value of the groove.
7. the method for the groove depth according to claim 6 for measuring electronic device using measuring device, which is characterized in that described
Measurement portion is probe, and the probe is telescopically connected in the measuring device.
8. the method for the groove depth according to claim 7 for measuring electronic device using measuring device, which is characterized in that described
Probe is in the contour area of the groove and the periphery of the contour area of the groove translates.
9. the method for the groove depth according to claim 7 for measuring electronic device using measuring device, which is characterized in that described
When probe translation, the probe and measured surface are arranged spaced apart；It is described when the measurement portion is directed at the measured surface
Probe elongation is until be only against on the measured surface.
10. the method for the groove depth according to claim 7 for measuring electronic device using measuring device, which is characterized in that institute
The diameter for stating probe is less than the width of the groove.
11. the method for the groove depth according to claim 7 for measuring electronic device using measuring device, which is characterized in that institute
Width of the diameter less than the groove that probe stretches into the inside grooves point is stated, the probe does not extend into the inside grooves point
Diameter be greater than or equal to the groove width.
12. the method for the groove depth according to claim 6 for measuring electronic device using measuring device, which is characterized in that institute
It is laser aid to state measurement portion, and the laser that the laser aid generates is in the contour area of the groove and surrounding is transported automatically
It goes and scans the detecting location.
13. the method for the groove depth according to claim 12 for measuring electronic device using measuring device, which is characterized in that institute
State the multiple detecting locations being intervally arranged of laser scanning of laser aid generation.
14. the method for the groove depth according to claim 12 for measuring electronic device using measuring device, which is characterized in that institute
The laser for stating laser aid generation scans the entire bottom surface of the groove and the shell along the extending direction of the groove
Positioned at the surface of the notch edges.
15. the method for the groove depth according to claim 6 for measuring electronic device using measuring device, which is characterized in that institute
Stating measuring device further includes：Controller, the controller control the measurement portion and detect the detecting location.
16. the method for the groove depth according to claim 6 for measuring electronic device using measuring device, which is characterized in that institute
Stating measuring device further includes：Computing module and display device, the computing module are filled with the measurement portion and the display respectively
Set connected, the computing module calculates the depth value of the detecting location, depth value described in the display device real-time display.
17. the method for the groove depth according to claim 16 for measuring electronic device using measuring device, which is characterized in that institute
Stating measuring device further includes：When warning device, one or several in the depth value exceed the predetermined difference value, the report
Alarm device sends out alarm signal and the display device highlights the depth value beyond the target offset.
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| CN201810846320.7A CN108592847A (en) | 2018-07-27 | 2018-07-27 | The method that the groove depth of electronic device is measured using measuring device |
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|---|---|---|---|
| CN201810846320.7A CN108592847A (en) | 2018-07-27 | 2018-07-27 | The method that the groove depth of electronic device is measured using measuring device |
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| CN110487201A (en) * | 2019-07-26 | 2019-11-22 | 广东天机工业智能系统有限公司 | Side opening depth measurement device |
| CN111156901A (en) * | 2018-11-08 | 2020-05-15 | 苏州多祥自动化科技有限公司 | Device for detecting heights of inner holes in batches |
| CN111256609A (en) * | 2020-01-21 | 2020-06-09 | 上海悦易网络信息技术有限公司 | Method and device for detecting USB interface depth |
| CN111311749A (en) * | 2020-01-21 | 2020-06-19 | 上海悦易网络信息技术有限公司 | Method and device for automatically inserting USB hole of equipment |
| CN112683190A (en) * | 2020-10-27 | 2021-04-20 | 广东奥普特科技股份有限公司 | Transparent body built-in object depth detection method and detection system thereof |
| WO2022222658A1 (en) * | 2021-04-21 | 2022-10-27 | 深圳市道通科技股份有限公司 | Groove depth measurement method, apparatus and system, and laser measurement device |
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