CN208386998U - Circuit board assemblies and electronic device with it - Google Patents
Circuit board assemblies and electronic device with it Download PDFInfo
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- CN208386998U CN208386998U CN201820929080.2U CN201820929080U CN208386998U CN 208386998 U CN208386998 U CN 208386998U CN 201820929080 U CN201820929080 U CN 201820929080U CN 208386998 U CN208386998 U CN 208386998U
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- circuit board
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- ventilation hole
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Abstract
The utility model discloses a kind of circuit board assemblies and with its electronic device, circuit board assemblies include: first circuit board, second circuit board, connector and radiating subassembly.Second circuit board is opposite with first circuit board and interval is arranged, connector is located between first circuit board and second circuit board, the both ends of connector are connected with first circuit board and second circuit board respectively, first circuit board, second circuit board and connector limit the installation cavity suitable for mounting related components jointly, radiating subassembly is located in installation cavity, radiating subassembly is connected or is contacted at least part component in installation cavity, and radiating subassembly is connected or contacted at least one of first circuit board and second circuit board.Circuit board assemblies according to the present utility model, heat dissipation performance is good, can extend the service life of circuit board assemblies, promotes the usage experience of user.
Description
Technical field
The utility model relates to technical field of electronic equipment, more particularly, to a kind of circuit board assemblies and with its electronics
Device.
Background technique
In the related technology, in order to improve the utilization rate of circuit board, using the circuit board assemblies of sandwich type structure, i.e., at two
Component is set in the cavity limited between circuit board.And the cavity of the circuit board assemblies of sandwich type structure is a relative closure
Space, heat dissipation be to need urgent problem to be solved.At present for the heat dissipation of the circuit board assemblies of sandwich type structure, all adopt
With the method for natural heat dissipation, lead to the inside cavity heat build-up of the circuit board assemblies of sandwich type structure, heat dissipation effect is bad, whole
Machine fever is serious, and user's experience is bad.
Utility model content
The utility model aims to solve at least one of the technical problems existing in the prior art.For this purpose, the utility model
One purpose is to propose a kind of circuit board assemblies, the perfect heat-dissipating of the circuit board assemblies.
The utility model also proposed a kind of electronic device with foregoing circuit board group part.
According to the circuit board assemblies of the utility model first aspect embodiment, comprising: first circuit board；Second circuit board,
The second circuit board is opposite with the first circuit board and interval is arranged；Connector, the connector are located at first electricity
Between road plate and the second circuit board, the both ends of the connector respectively with the first circuit board and the second circuit board
It is connected, the first circuit board, the second circuit board and the connector limit the installation suitable for mounting related components jointly
Chamber；Radiating subassembly, the radiating subassembly are located in the installation cavity, at least one in the radiating subassembly and the installation cavity
Divide component connection or contact, and the radiating subassembly and at least one of the first circuit board and the second circuit board
Connection or contact.
According to the circuit board assemblies of the utility model embodiment, by the way that heat dissipation group is arranged in the installation cavity of circuit board assemblies
Part, and make radiating subassembly in installation cavity at least part component connection or contact, and make radiating subassembly with it is described
The connection of at least one of first circuit board and the second circuit board or contact, the heat that thus component in installation cavity generates
Amount can be transferred at least one of first circuit board and second circuit board by radiating subassembly, and pass through first circuit board
And/or second circuit board goes out conduct heat away, improves the heat dissipation performance of circuit board assemblies, extend circuit board assemblies uses the longevity
Life, promotes the usage experience of user.
Some embodiments according to the present utility model, the radiating subassembly include multiple radiating pieces, multiple radiating pieces
It is located at least one of the first circuit board and the second circuit board, and in the first circuit board and described second
On the stacked direction of circuit board, each radiating piece is oppositely arranged with the corresponding component.
Optionally, the radiating piece is laminated structure.
Further, projection of the component on datum level is located at the corresponding radiating piece on the datum level
Projection in, the datum level is the plane for being parallel to the first circuit board or the second circuit board.
Optionally, the radiating piece is metalwork.
Further, the radiating piece is welded on the first circuit board or the second circuit board.
Optionally, heat conductive silica gel is equipped between the radiating piece and the corresponding component.
Some embodiments according to the present utility model, the component being located in the installation cavity are each provided at described second
On circuit board, the radiating subassembly is located on the first circuit board.
The surface far from the installation cavity of some embodiments according to the present utility model, the first circuit board is equipped with member
The surface far from the installation cavity of device and/or the second circuit board is equipped with component.
Some embodiments according to the present utility model, the connector are annular.
Some embodiments according to the present utility model, the component are central processing unit, power amplifying device or modulation
Demodulator.
Some embodiments according to the present utility model, the first circuit board and/or the second circuit board are dissipated with described
The corresponding part of hot component is equipped with ventilation hole, and the ventilation hole is connected to the external rings of the installation cavity and the circuit board assemblies
Border.
Optionally, the ventilation hole includes different the first hole section and the second hole section in aperture, and first hole section is adjacent to institute
Installation cavity is stated, second hole section is far from the installation cavity, wherein the aperture of first hole section is greater than second hole section
Aperture.
Optionally, the ventilation hole includes the first sub- ventilation hole and the second sub- ventilation hole to communicate with each other, first son
Ventilation hole adjacent to the installation cavity, the second sub- ventilation hole far from the installation cavity, the first sub- ventilation hole be one and
The second sub- ventilation hole is spaced multiple.
Optionally, the center line of the ventilation hole is linearly, broken line or curve extend.
According to the electronic device of the utility model second aspect embodiment, comprising: according to the above-mentioned first party of the utility model
The circuit board assemblies of face embodiment.
Circuit board can be improved by the way that above-mentioned circuit board assemblies are arranged according to the electronic device of the utility model embodiment
The heat dissipation performance of component reduces complete machine local temperature rise, promotes complete machine heat dissipation effect, extends the service life of electronic device, is promoted
The experience of user.
The additional aspect and advantage of the utility model will be set forth in part in the description, partially will be from following description
In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the utility model from the description of the embodiment in conjunction with the following figures will
Become obvious and be readily appreciated that, in which:
Fig. 1 is the schematic diagram according to the electronic device of the utility model one embodiment；
Fig. 2 is the schematic diagram according to the circuit board assemblies of the utility model one embodiment；
Fig. 3 is the structural schematic diagram according to the ventilation hole of the circuit board assemblies of the utility model another embodiment；
Fig. 4 is the structural schematic diagram according to the ventilation hole of the circuit board assemblies of the utility model another embodiment.
Appended drawing reference:
Electronic device 1000；
Circuit board assemblies 100；First circuit board 1；Ventilation hole 11；First hole section 111a；Second hole section 112b；First son is logical
Air holes 111c；Second sub- ventilation hole 112d；Second circuit board 2；Connector 3；Installation cavity 4；Radiating piece 5；Heat conductive silica gel 6；First device
Part 7；
Shell 200；
Cover board 300.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and should not be understood as to the utility model
Limitation.
Below with reference to Fig. 1-Fig. 4 description according to the circuit board assemblies 100 of the utility model embodiment.
Referring to Fig. 2, according to the circuit board assemblies 100 of the utility model first aspect embodiment, comprising: first circuit board 1,
Second circuit board 2, connector 3 and radiating subassembly.
Specifically, second circuit board 2 is opposite with first circuit board 1 and interval is arranged, connector 3 is located at first circuit board
Between 1 and second circuit board 2, the both ends of connector 3 are connected with first circuit board 1 and second circuit board 2 respectively.Pass through as a result,
The connector 3 being arranged between first circuit board 1 and second circuit board 2, can be convenient by first circuit board 1 and second circuit
Plate 2 is spaced apart, and is electrically connected between connector 3 and first circuit board 1, second circuit board 2.The 1, second electricity of first circuit board
Road plate 2 and connector 3 limit the installation cavity 4 suitable for mounting related components 7 jointly.Optionally, connector 3 can be annular, by
This makes installation cavity 4 be formed as the space of relative closure, has the function of good dustproof and waterproof.
Wherein, the component 7 being located in above-mentioned installation cavity 4, can connect on first circuit board 1, also can connect
On second circuit board 2.For example, the component 7 being located in installation cavity 4 can be both connected on first circuit board 1；Alternatively, being located at
Component 7 in installation cavity 4 can be each provided on second circuit board 2；Alternatively, the component 7 being located in installation cavity 4, wherein one
Part is located on first circuit board 1 and another part is located on second circuit board 2.It should be noted that component 7 and the first electricity
The connection of road plate 1 or second circuit board 2 both may be implemented to be mechanically connected, and also may be implemented to be electrically connected.
Optionally, the surface of the separate installation cavity 4 of first circuit board 1 is equipped with the remote of component 7 and/or second circuit board 2
Surface from installation cavity 4 is equipped with component 7.Thus, it is possible to which the density of component 7 is arranged in increasing circuit board group part 100, electricity is improved
The utilization rate of road plate.For example, while component 7 are set in above-mentioned installation cavity 4, it can be in the separate peace of first circuit board 1
Behave affectedly 4 surface setting component 7；Alternatively, component 7 can be arranged on the surface of the separate installation cavity 4 of second circuit board 2；
Alternatively, can simultaneously first circuit board 1 separate installation cavity 4 surface and second circuit board 2 separate installation cavity 4 surface
Component 7 is set.
Radiating subassembly is located in installation cavity 4, and radiating subassembly has a good thermal conductivity, in radiating subassembly and installation cavity 4
At least part component 7 connection or contact, radiating subassembly can in installation cavity 4 a part of component 7 (such as power compared with
Big component) it connects or contacts, radiating subassembly can also be all connected with or contact with all components 7 in installation cavity 4.Heat dissipation
Component is connected or is contacted at least one of first circuit board 1 and second circuit board 2, i.e., radiating subassembly can be only electric with first
The connection of road plate 1 or contact, radiating subassembly only with second circuit board 2 can also be connected or be contacted or radiating subassembly and first electric
Road plate 1 and second circuit board 2 are all connected with or contact.
For example, radiating subassembly can be located at component when the component 7 in installation cavity 4 is each provided on second circuit board 2
Between 7 and first circuit board 1, radiating subassembly only can be connected with first circuit board 1 or be contacted (for example, radiating subassembly is set at this time
On first circuit board 1).The component 7 for connecting or contacting with radiating subassembly in installation cavity 4 as a result, in some components 7
The heat generated when work can pass to radiating subassembly, and heat is transmitted to first circuit board 1 by radiating subassembly, can will install
The heat that the component 7 of chamber 4 generates is sent out rapidly heat by first circuit board 1 by the quick conductive force of radiating subassembly
It sheds.
In another example radiating subassembly can be located at first device when the component 7 in installation cavity 4 is each provided on first circuit board 1
Between part 7 and second circuit board 2, radiating subassembly only can be connected or be contacted with second circuit board 2 at this time.As a result, in installation cavity 4
The component 7 for connecting or contacting with radiating subassembly, the heat generated in some components 7 work, can pass to heat dissipation
Heat is transmitted to second circuit board 2 by component, radiating subassembly, and the heat that the component 7 of installation cavity 4 can be generated passes through heat dissipation group
The quick conductive force of part exhales rapidly heat by second circuit board 2.
For another example a part in the component 7 in installation cavity 4 is located on first circuit board 1 and another part is located at
When on second circuit board 2, a part of in radiating subassembly can be located between component 7 and second circuit board 2 and radiating subassembly
In another part can be located between component 7 and first circuit board 1, radiating subassembly can be with first circuit board 1, at this time
Two circuit boards 2 are all connected with or contact.The component 7 for connecting or contacting with radiating subassembly in installation cavity 4 as a result, in part member
The heat that device 7 generates when working, can pass to radiating subassembly, heat is transmitted to first circuit board 1 and second by radiating subassembly
Circuit board 2, the heat that the component 7 of installation cavity 4 can be generated are passed through heat by the quick conductive force of radiating subassembly
First circuit board 1 and second circuit board 2 exhale rapidly.
Optionally, above-mentioned component 7 can be larger for central processing unit, power amplifying device, modem constant power
Component.Thus, it is possible to make on circuit board assemblies 100 that power is larger, generates the biggish component of heat and obtain and is good
Heat dissipation.
According to the circuit board assemblies 100 of the utility model embodiment, by being set in the installation cavity 4 of circuit board assemblies 100
Radiating subassembly is set, and makes radiating subassembly connect or contact at least part component 7 in installation cavity 4, and to radiate
The connection of at least one of component and the first circuit board 1 and described second circuit board 2 contacts, thus in installation cavity 4
The heat that component 7 generates can be transferred at least one of first circuit board 1 and second circuit board 2 by radiating subassembly
On, and conduct heat away is gone out by first circuit board 1 and/or second circuit board 2, improve the thermal diffusivity of circuit board assemblies 100
Can, extend the service life of circuit board assemblies 100, promotes the usage experience of user.
Some embodiments according to the present utility model, referring to Fig. 2, radiating subassembly includes multiple radiating pieces 5, multiple radiating pieces
5 are located at least one of first circuit board 1 and second circuit board 2, and multiple radiating pieces 5 of radiating subassembly can be only defined
On one circuit board 1, multiple radiating pieces 5 of radiating subassembly can also be only defined on second circuit board 2 or radiating subassembly it is multiple
A part of radiating piece 5 is located on first circuit board 1 and another part is located on second circuit board 2.And in 1 He of first circuit board
On the stacked direction of second circuit board 2, each radiating piece 5 is oppositely arranged with corresponding component 7.Facilitate radiating subassembly as a result,
Setting, and the space that first circuit board 1 or second circuit board 2 arrange component 7 can be occupied to avoid radiating subassembly, made simultaneously
Each radiating piece 5 be oppositely arranged with corresponding component 7, can make between radiating piece 5 and corresponding component 7 with compared with
Big heat-conducting area improves radiating efficiency.
Optionally, referring to Fig. 2, above-mentioned radiating piece 5 can be laminated structure.Thus, it is possible to increase the radiating surface of radiating piece 5
Product, can also increase the heat-conducting area between radiating piece 5 and component 7 and first circuit board 1 or second circuit board 2, into one
Step ground improving heat radiation efficiency.
Further, referring to Fig. 2, projection of the component 7 on datum level is located at corresponding radiating piece 5 on datum level
In projection, datum level is the plane for being parallel to first circuit board 1 or second circuit board 2.Thus, it is possible to make component 7 with it is right
There is biggish heat-conducting area between the radiating piece 5 answered, guarantee heat dissipation effect.
Optionally, radiating piece 5 can be metalwork.For example, radiating piece 5 can be copper foil.
Further, when radiating piece 5 is metalwork, radiating piece 5 can be welded on first circuit board 1 or second circuit board
On 2.Thus, it is possible to realize being reliably connected between radiating piece 5 and first circuit board 1 or second circuit board 2.
Optionally, referring to Fig. 2, heat conductive silica gel 6 is equipped between radiating piece 5 and corresponding component 7.As a result, using thermally conductive
The flexible nature of silica gel 6 can make radiating piece 5 by the way that heat conductive silica gel 6 is arranged between radiating piece 5 and corresponding component 7
It is fitted closely between corresponding component 7, so that the heat that component 7 generates quickly is transferred to heat dissipation by heat conductive silica gel 6
Component further improves radiating efficiency.
Some embodiments according to the present utility model, referring to Fig. 2-Fig. 4, first circuit board 1 and/or second circuit board 2 with
The corresponding part of radiating subassembly is equipped with ventilation hole 11, and ventilation hole 11 is connected to the external environment of installation cavity 4 and circuit board assemblies 100.
Specifically, when radiating subassembly is located between first circuit board 1 and component 7, the portion corresponding with radiating subassembly of first circuit board 1
It is arranged with above-mentioned ventilation hole 11；When radiating subassembly is located between second circuit board 2 and component 7, second circuit board 2 and heat dissipation
The corresponding part of component is equipped with above-mentioned ventilation hole 11；It is located between first circuit board 1 and component 7 in a part of radiating subassembly
And another part is when being located between second circuit board 2 and component 7, first circuit board 1, second circuit board 2 and radiating subassembly pair
The part answered is equipped with above-mentioned ventilation hole 11.After the heat transfer to radiating subassembly that the component 7 in installation cavity 4 generates as a result,
Heat on radiating subassembly is quickly transferred to the external environment of circuit board assemblies 100 by ventilation hole 11, passes through the above-mentioned of setting
Ventilation hole 11 can increase the coefficient of heat transfer of thermal coefficient and outside air, and heat dissipation speed can be further improved by convection current
Degree and radiating efficiency.
For example, in the figure 2 example, multiple components 7 are equipped in installation cavity 4, multiple components 7 are each provided at second circuit
On plate 2, radiating subassembly is located in installation cavity 4 and between first circuit board 1 and component 7.Radiating subassembly includes multiple dissipates
Warmware 5, each radiating piece 5 are located between corresponding component 7 and first circuit board 1, and each radiating piece 5 is formed as sheet knot
Structure, radiating piece 5 are copper foil, and each radiating piece 5 is welded to connect on first circuit board 1, each radiating piece 5 and corresponding member
Heat conductive silica gel 6 is equipped between device 7.The part corresponding with multiple radiating pieces 5 of first circuit board 1 is equipped with ventilation hole 11, ventilation hole
11 cross-sectional area is less than the cross-sectional area of corresponding radiating piece 5.It is generated when multiple components 7 in installation cavity 4 work as a result,
Heat, corresponding radiating piece 5 can be transferred to, each radiating piece 5 is again rapidly passed heat by corresponding ventilation hole 11
It is handed in the external environment of circuit board assemblies 100.
Optionally, referring to Fig. 3, ventilation hole 11 includes the first different hole section 111a of aperture and the second hole section 112b, and first
Hole section 111a is adjacent to installation cavity 4, and the second hole section 112b is far from installation cavity 4, wherein the aperture of the first hole section 111a is greater than the second hole
The aperture of section 112b.Thus, it is possible to guarantee the sky with biggish heat transfer between ventilation hole 11 and corresponding component 7
Between, while the area on the surface of the separate installation cavity 4 of the occupancy first circuit board 1 of ventilation hole 11 can be reduced, and can guarantee
The structural strength of first circuit board 1.
Optionally, referring to Fig. 4, ventilation hole 11 includes the first sub- sub- ventilation hole of ventilation hole 111c and second to communicate with each other
112d, the first sub- ventilation hole 111c are adjacent to installation cavity 4, and the second sub- ventilation hole 112d is far from installation cavity 4, the first sub- ventilation hole 111c
It is spaced multiple for one and the second sub- ventilation hole 112d.Ventilation hole 11 is arranged to above structure as a result, is equivalent to
Heat dissipation path is increased, radiating rate and effect are further improved.
Optionally, the center line of above-mentioned ventilation hole 11 can linear, broken line or curve extension.As a result, ventilation hole
11 structure diversification is adapted to the structure of different circuit boards, such as can dexterously avoid the component on circuit board
7, so that (outer surface of the circuit board refers to first circuit board 1 or second circuit for outer surface of the ventilation hole 11 far from circuit board
The surface of the separate installation cavity 4 of plate 2) on component 7.
According to the electronic device 1000 of the utility model second aspect embodiment, comprising: according to the utility model above-mentioned
The circuit board assemblies 100 of one side embodiment.
Optionally, above-mentioned electronic device 1000 can be the mobile terminals such as mobile phone.Referring to Fig.1, electronic device 1000 can be with
Including shell 200, cover board 300 and foregoing circuit board group part 100, installation space is limited between cover board 300 and shell 200, electricity
Road board group part 100 is located in installation space.
It can be improved according to the electronic device 1000 of the utility model embodiment by the way that above-mentioned circuit board assemblies 100 are arranged
The heat dissipation performance of circuit board assemblies 100 reduces complete machine local temperature rise, promotes complete machine heat dissipation effect, extends electronic device 1000
Service life promotes the experience of user.
Illustratively, electronic device 1000 can be various types of calculating that are mobile or portable and executing wireless communication
Any one of machine system equipment (only illustratively shows a kind of form) in Fig. 1.Specifically, electronic device 1000 can be with
For mobile phone or smart phone (for example, being based on iPhone TM, the phone based on Android TM), portable gaming device
(such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), knee
Laptop, PDA, portable Internet appliance, music player and data storage device, other handheld devices and such as
Wrist-watch, In-Ear Headphones, pendant, headphone etc., electronic device 1000 can also for other wearable devices (for example,
Such as electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics tatoo, the wear-type of electronic equipment or smartwatch is set
Standby (HMD)).
Electronic device 1000 can also be that any one of multiple electronic equipments, multiple electronic equipments include but is not limited to
Cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, sound
Happy logger, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator, can
Program remote controler, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant
(PDA), portable media player (PMP), Motion Picture Experts Group's (MPEG-1 or MPEG-2) audio layer 3 (MP3) play
Device, portable medical device and digital camera and combinations thereof.
In some cases, electronic device 1000 can execute multiple functions and (for example, playing music, show video, storage
Picture and send and receive call).If desired, electronic device 10000 can be such as cellular phone, media play
The portable device of device, other handheld devices, watch equipment, pendant equipment, receiver device or other compact portable equipment.
It takes the mobile phone as an example and the electronic device 1000 that the utility model is applicable in is introduced.In the utility model embodiment
In, mobile phone may include radio circuit, memory, input unit, Wireless Fidelity (WiFi, wireless fidelity) module,
The components such as display unit, sensor, voicefrequency circuit, processor, projecting cell, shooting unit, battery.
Wherein, radio circuit can be used for receive and send messages or communication process in, signal sends and receivees, particularly, will
After the downlink information of base station receives, processor processing is given；In addition, the data of mobile phone uplink are sent to base station.In general, radio frequency electrical
Road includes but is not limited to antenna, at least one amplifier, transceiver, coupler, low-noise amplifier, duplexer etc..In addition,
Radio circuit can also be communicated with network and other equipment by wireless communication.Any communication mark can be used in above-mentioned wireless communication
Quasi- or agreement, including but not limited to global system for mobile communications (GSM, Global System for Mobile
Communication), general packet radio service (GPRS, General Packet Radio Service), CDMA
(CDMA, Code Division Multiple Access), wideband code division multiple access (WCDMA, Wideband Code
Division Multiple Access), long term evolution (LTE, Long Term Evolution), Email, short message clothes
Be engaged in (SMS, Short Messaging Service) etc..
Memory can be used for storing software program and module, and processor is stored in the software program of memory by operation
And module, thereby executing the various function application and data processing of mobile phone.Memory can mainly include storing program area and
Storage data area, wherein storing program area can application program needed for storage program area, at least one function (such as sound is broadcast
Playing function, image player function etc.) etc.；Storage data area, which can be stored, uses created data (such as audio number according to mobile phone
According to, phone directory etc.) etc..In addition, memory may include high-speed random access memory, it can also include non-volatile memories
Device, for example, at least a disk memory, flush memory device or other volatile solid-state parts.
Input unit can be used for receiving the number or character information of input, and generate the user setting and function with mobile phone
It can control related key signals.Specifically, input unit may include touch panel and other input equipments.Touch panel,
Referred to as touch screen, collecting the touch operation of user on it or nearby, (for example user is any suitable using finger, stylus etc.
The operation of object or attachment on touch panel or near touch panel), and driven accordingly according to preset formula
Attachment device.Optionally, touch panel may include both touch detecting apparatus and touch controller.
Touch detecting apparatus detects the touch orientation of user, and detects touch operation bring signal, transmits a signal to
Touch controller；Touch controller receives touch information from touch detecting apparatus, and is converted into contact coordinate, then gives
Processor, and order that processor is sent can be received and executed.Furthermore, it is possible to use resistance-type, condenser type, infrared ray with
And the multiple types such as surface acoustic wave realize touch panel.In addition to touch panel, input unit can also include other input equipments.
Specifically, other input equipments can include but is not limited to physical keyboard, function key (such as volume control button, switch key
Deng), trace ball, mouse, one of operating stick etc. or a variety of.
In addition, mobile phone may also include at least one sensor, such as attitude transducer, optical sensor and other sensings
Device.
Specifically, attitude transducer is referred to as motion sensor, also, one kind as the motion sensor, can
To enumerate gravity sensor, cantilevered shifter is made using elastic sensing element in gravity sensor, and using the sensitive member of elasticity
Energy-stored spring made of part drives electric contact, to realize the variation that Gravity changer is converted into electric signal.
As the another kind of motion sensor, accelerometer sensor can be enumerated, accelerometer sensor can detect all directions
Upper (generally three axis) acceleration magnitude, can detect that size and the direction of gravity, can be used to identify mobile phone posture when static
It (for example pedometer, is struck using (such as horizontal/vertical screen switching, dependent game, magnetometer pose calibrating), Vibration identification correlation function
Hit) etc..
It, can be using motion sensor listed above as aftermentioned " the posture ginseng of acquisition in the utility model embodiment
Number " element, but not limited to this, other sensors that can obtain " attitude parameter " each fall within the protection model of the utility model
In enclosing, for example, gyroscope etc., also, the working principle of the gyroscope and data handling procedure can be similar to the prior art, this
In, in order to avoid repeating, description is omitted.
In addition, in the utility model embodiment, as sensor, barometer, hygrometer, thermometer and red can also configure
The other sensors such as outside line sensor, details are not described herein.
Optical sensor may include ambient light sensor and proximity sensor, wherein ambient light sensor can be according to environment light
The light and shade of line adjusts the brightness of display panel, proximity sensor can when mobile phone is moved in one's ear, close display panel and/or
Backlight.
Voicefrequency circuit, loudspeaker and microphone can provide the audio interface between user and mobile phone.Voicefrequency circuit can will connect
Electric signal after the audio data conversion received, is transferred to loudspeaker, is converted to voice signal output by loudspeaker；Another party
The voice signal of collection is converted to electric signal by face, microphone, is converted to audio data after being received by voicefrequency circuit, then by audio
After the processing of data output processing device, such as another mobile phone is sent to through radio circuit, or audio data is exported to storage
Device is to be further processed.
WiFi belongs to short range wireless transmission technology, mobile phone can help user to send and receive e-mail by WiFi module,
Webpage and access streaming video etc. are browsed, it provides wireless broadband internet access for user.Although Fig. 3 shows WiFi
Module, but it is understood that, and it is not belonging to must be configured into for mobile phone 200, it can according to need do not changing reality completely
It is omitted in the range of novel essence.
Processor is that the control centre of mobile phone is passed through using the various pieces of various interfaces and connection whole mobile phone
Operation executes the software program and/or module being stored in memory, and calls the data being stored in memory, executes
The various functions and processing data of mobile phone, to carry out integral monitoring to mobile phone.Optionally, processor may include one or more
Processing unit；Preferably, processor can integrate application processor and modem processor, wherein application processor is mainly located
Operating system, user interface and application program etc. are managed, modem processor mainly handles wireless communication.
It is understood that above-mentioned modem processor can not also be integrated into the processor.
Also, the processor can be used as the realization element of above-mentioned processing unit, execute same or similar with processing unit
Function.
Mobile phone further includes the power supply (such as battery) powered to all parts.
Preferably, power supply can be logically contiguous with processor by power-supply management system, to pass through power-supply management system
Realize the functions such as management charging, electric discharge and power managed.Although being not shown, mobile phone can also be including bluetooth module etc., herein
It repeats no more.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the utility model.In the present specification, to above-mentioned art
The schematic representation of language may not refer to the same embodiment or example.Moreover, description specific features, structure, material or
Person's feature can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that the embodiments of the present invention, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principles of the present invention and objective
And modification, the scope of the utility model are defined by the claims and their equivalents.
Claims (16)
1. a kind of circuit board assemblies characterized by comprising
First circuit board；
Second circuit board, the second circuit board is opposite with the first circuit board and interval is arranged；
Connector, the connector are located between the first circuit board and the second circuit board, the both ends of the connector
It is connected respectively with the first circuit board and the second circuit board, the first circuit board, the second circuit board and described
Connector limits the installation cavity suitable for mounting related components jointly；
Radiating subassembly, the radiating subassembly are located in the installation cavity, at least one in the radiating subassembly and the installation cavity
Some components connection or contact, and at least one in the radiating subassembly and the first circuit board and the second circuit board
A connection or contact.
2. circuit board assemblies according to claim 1, which is characterized in that the radiating subassembly includes multiple radiating pieces, more
A radiating piece is located at least one of the first circuit board and the second circuit board, and in first circuit
On the stacked direction of plate and the second circuit board, each radiating piece is oppositely arranged with the corresponding component.
3. circuit board assemblies according to claim 2, which is characterized in that the radiating piece is laminated structure.
4. circuit board assemblies according to claim 3, which is characterized in that projection of the component on datum level is located at
For the corresponding radiating piece in the projection on the datum level, the datum level is to be parallel to the first circuit board or described
The plane of second circuit board.
5. circuit board assemblies according to claim 2, which is characterized in that the radiating piece is metalwork.
6. circuit board assemblies according to claim 5, which is characterized in that the radiating piece is welded on the first circuit board
Or on the second circuit board.
7. circuit board assemblies according to claim 2, which is characterized in that the radiating piece and the corresponding component it
Between be equipped with heat conductive silica gel.
8. circuit board assemblies according to claim 1, which is characterized in that the component being located in the installation cavity is equal
It is located on the second circuit board, the radiating subassembly is located on the first circuit board.
9. circuit board assemblies according to claim 1, which is characterized in that the separate installation cavity of the first circuit board
Surface be equipped with the surface far from the installation cavity of component and/or the second circuit board and be equipped with component.
10. circuit board assemblies according to claim 1, which is characterized in that the connector is annular.
11. circuit board assemblies according to claim 1, which is characterized in that the component is central processing unit, power is put
Big device or modem.
12. circuit board assemblies described in any one of -11 according to claim 1, which is characterized in that the first circuit board and/
Or second circuit board part corresponding with the radiating subassembly is equipped with ventilation hole, the ventilation hole be connected to the installation cavity and
The external environment of the circuit board assemblies.
13. circuit board assemblies according to claim 12, which is characterized in that the ventilation hole includes different first in aperture
Hole section and the second hole section, first hole section is adjacent to the installation cavity, and second hole section is far from the installation cavity, wherein described
The aperture of first hole section is greater than the aperture of second hole section.
14. circuit board assemblies according to claim 12, which is characterized in that the ventilation hole includes first to communicate with each other
Sub- ventilation hole and the second sub- ventilation hole, the first sub- ventilation hole is adjacent to the installation cavity, and the second sub- ventilation hole is far from institute
Installation cavity is stated, the first sub- ventilation hole is one and the second sub- ventilation hole is spaced multiple.
15. circuit board assemblies according to claim 12, which is characterized in that the center line of the ventilation hole is linear, rolls over
Line or curve extend.
16. a kind of electronic device characterized by comprising circuit board assemblies described in any one of -15 according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820929080.2U CN208386998U (en) | 2018-06-14 | 2018-06-14 | Circuit board assemblies and electronic device with it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820929080.2U CN208386998U (en) | 2018-06-14 | 2018-06-14 | Circuit board assemblies and electronic device with it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208386998U true CN208386998U (en) | 2019-01-15 |
Family
ID=64967863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820929080.2U Active CN208386998U (en) | 2018-06-14 | 2018-06-14 | Circuit board assemblies and electronic device with it |
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| Country | Link |
|---|---|
| CN (1) | CN208386998U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113129745A (en) * | 2019-12-31 | 2021-07-16 | 乐金显示有限公司 | Display device |
| CN113225891A (en) * | 2020-01-21 | 2021-08-06 | 鹏鼎控股(深圳)股份有限公司 | Circuit board with heat dissipation structure and manufacturing method thereof |
-
2018
- 2018-06-14 CN CN201820929080.2U patent/CN208386998U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113129745A (en) * | 2019-12-31 | 2021-07-16 | 乐金显示有限公司 | Display device |
| CN113129745B (en) * | 2019-12-31 | 2023-09-12 | 乐金显示有限公司 | Display apparatus |
| CN113225891A (en) * | 2020-01-21 | 2021-08-06 | 鹏鼎控股(深圳)股份有限公司 | Circuit board with heat dissipation structure and manufacturing method thereof |
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