CN108565236A - A kind of more size wafer compatible type tooling boxes - Google Patents
A kind of more size wafer compatible type tooling boxes Download PDFInfo
- Publication number
- CN108565236A CN108565236A CN201810045605.0A CN201810045605A CN108565236A CN 108565236 A CN108565236 A CN 108565236A CN 201810045605 A CN201810045605 A CN 201810045605A CN 108565236 A CN108565236 A CN 108565236A
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- China
- Prior art keywords
- wafer
- shell
- box cover
- tooling
- size wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of more size wafer compatible type tooling boxes, the wafer for storing two or more sizes；Including shell (3) and box cover (6)；The shell (3) uses aluminum alloy materials with box cover (6), the shell (3) divides upper layer and lower layer, lower layer includes multiple small size wafer storages position (31), and small size wafer stores position (31) bottom and is equipped with annular protrusion (311)；Upper layer includes multiple large scale wafer storages position (32)；When tooling box is laminated, the cyclic annular convex falcon (34) of shell on upper layer is buckled on the box cover ring-type bayonet (61) of lower layer.More size wafers are shared with box, are conducive to neat storage, batch processed and the record identification of wafer, solve the problems, such as that more size small lot wafers are mobile and store, and save tooling space, convenient wafer heated baking and Electro-static Driven Comb by the gross.Significantly improve the efficiency of wafer transhipment and batch processing.
Description
Technical field
The present invention relates to frame for movement technical field more particularly to a kind of more size wafer compatible type tooling boxes.
Background technology
Chip used in field of microelectronics is usually to be produced on wafer, the effect of tooling box be lossless efficient movement,
Storing wafer, the wafer cassette used in current chip manufacturing is mainly used for the independent single thin plate storage of wafer and batch is deposited with size
It puts, it is difficult to meet the problem that more size wafers are shared with box in some scientific research projects, be unfavorable for the neat of wafer and store, at batch
Reason and record identification etc..
Invention content
The object of the present invention is to provide a kind of more size wafer compatible type tooling boxes, more size wafers are shared with box, favorably
In neat storage, batch processed and the record identification of wafer, solves the problems, such as that more size small lot wafers are mobile and store, save
Tooling space, convenient wafer heated baking and Electro-static Driven Comb by the gross.Significantly improve the efficiency of wafer transhipment and batch processing.
The purpose of the present invention is what is be achieved through the following technical solutions：
A kind of more size wafer compatible type tooling boxes, the wafer for storing two or more sizes；Including shell 3 and box cover
6；The shell 3 uses aluminum alloy materials, the shell 3 that upper layer and lower layer, lower layer is divided to include that multiple small sizes are brilliant with box cover 6
Circle storage position 31, small size wafer store 31 bottom of position and are equipped with annular protrusion 311；Upper layer includes multiple large scale wafer storages position
32；
It is recessed at shell ring-type bayonet 33 above 3 edge of shell, it is convex at the cyclic annular convex falcon 34 of shell under lower section, it is described
6 edge of box cover above under be recessed into box cover ring-type bayonet 61, convex at the cyclic annular convex falcon 62 of box cover under lower section, the box cover ring-type is convex
Falcon 62 is buckled on shell ring-type bayonet 33, and box cover 6 is buckled on shell 3；
When tooling box is laminated, the cyclic annular convex falcon of the shell on upper layer 34 is buckled on the box cover ring-type bayonet 61 of lower layer.
The small size wafer storage position 31 has seven, and one is set to 3 center of shell, and another six edges are set to the small of center
It is circumferentially-spaced uniformly distributed that size wafer stores 31 center of position.
The small size wafer storage position 31 is used to store 2 cun of wafer.
There are three the large scale wafer storage positions 32, circumferentially-spaced uniformly distributed along 3 center of shell.
The large scale wafer storage position 32 is used to store 3 cun of wafer.
As seen from the above technical solution provided by the invention, a kind of more size wafers provided in an embodiment of the present invention are simultaneous
Appearance type tooling box, more size wafers are shared with box, are conducive to neat storage, batch processed and the record identification of wafer, are solved more
The problem of size small lot wafer is mobile and stores saves tooling space, convenient wafer heated baking and Electro-static Driven Comb by the gross.It is aobvious
Write the efficiency for improving wafer transhipment and batch processing.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, required use in being described below to embodiment
Attached drawing be briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for this
For the those of ordinary skill in field, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is the structural schematic diagram one of more size wafer compatible type tooling boxes provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram two of more size wafer compatible type tooling boxes provided in an embodiment of the present invention；
Fig. 3 is that the small size wafer arrangement of more size wafer compatible type tooling boxes provided in an embodiment of the present invention is illustrated
Figure；
Fig. 4 is that the large scale wafer arrangement of more size wafer compatible type tooling boxes provided in an embodiment of the present invention is illustrated
Figure；
Fig. 5 is the box cover structural schematic diagram one of more size wafer compatible type tooling boxes provided in an embodiment of the present invention.
Fig. 6 is the box cover structural schematic diagram two of more size wafer compatible type tooling boxes provided in an embodiment of the present invention.
Specific implementation mode
With reference to the attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on this
The embodiment of invention, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, belongs to protection scope of the present invention.
The embodiment of the present invention is described in further detail below in conjunction with attached drawing.
As shown in Fig. 1 to 6, a kind of more size wafer compatible type tooling boxes, the wafer for storing two or more sizes；This
Example is by taking two kinds of sizes as an example, 2 cun of wafers 1 and 3 cun of wafers 2.Other proportional sizes are also suitable.Include shell 3 and box cover in structure
6；The shell 3 uses aluminum alloy materials with box cover 6, and the aluminum alloy materials of high temperature resistant electrostatic discharge specifically can be used, and has resistance to
High temperature, release electrostatic, it is cheap the advantages that.The aluminum alloy materials of market routine are used, the prices of raw materials are cheap and are convenient for
Machine-shaping has preferable thermal stability during use, is conducive to the baking and annealing of wafer.It is advantageous using metal material
In Electro-static Driven Comb, electrostatic is all the natural enemy of microelectronics all the time, and electrostatic burning accident is often the basic of electronic device failure
Reason.
The shell 3 divides upper layer and lower layer, lower layer to include multiple small size wafer storages position 31, and small size wafer stores position
31 bottoms are equipped with annular protrusion 311, and there are circular gaps between small size wafer storage position 31, facilitate pickup wafer.Wafer
Between independently of each other, avoid overlapping causing to rub wound.Upper layer includes multiple large scale wafer storages position 32；Between wafer mutually solely
It is vertical, it avoids overlapping causing to rub wound.
Specific in this example, small size wafer storage position 31 has seven, and one is set to 3 center of shell, another six
Small size wafer storage 31 center of position along the center of being set to is circumferentially-spaced uniformly distributed.The small size wafer storage position 31 is for depositing
Put 2 cun of wafer.There are three the large scale wafer storage positions 32, circumferentially-spaced uniformly distributed along 3 center of shell.
It is recessed at shell ring-type bayonet 33 above 3 edge of shell, it is convex at the cyclic annular convex falcon 34 of shell under lower section, it is described
6 edge of box cover above under be recessed into box cover ring-type bayonet 61, convex at the cyclic annular convex falcon 62 of box cover under lower section, the box cover ring-type is convex
Falcon 62 is buckled on shell ring-type bayonet 33, and box cover 6 is buckled on shell 3；When tooling box is laminated, the cyclic annular convex falcon of the shell on upper layer 34
It is buckled on the box cover ring-type bayonet 61 of lower layer.Make tooling box can pile, save space
As shown in Fig. 2, the diameter 55mm of the small size wafer storage position 31 of 2 cun of wafers 1 of storage, depth 3.5mm, 2 cun
Slot is mutually circumscribed, tangent interval 1mm, and slot bottom is the annular protrusion 311 of protrusion concentric ring, thickness 0.2mm, annular protrusion 311
Less than 45mm.As shown in figure 3, small size wafer storage position 31 is inscribed within large scale wafer storage position 32,3 cun of wafers are stored
2 large scale wafer storage 32 circular groove of position is diameter 77mm, depth 2mm, tangent two-by-two.In order to ensure the support of 3 cun of wafers,
The position that adjacent three small size wafers storage position 31 is intersected is provided with circular groove, diameter 16mm, and depth to small size wafer is deposited
Put 31 bottom of position.
Specifically, as shown in Figure 1, being subject to upper space, it is 2mm that large scale wafer, which stores 32 depth of position, and small size is brilliant
Circle storage 31 depth of position is 3.5mm.Bottom thickness is 2mm.The wide 2mm in 32 edge of shell, the cyclic annular convex falcon 34 of shell is 3mm, shell
Cyclic annular bayonet 33 is 3mm.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Any one skilled in the art is in the technical scope of present disclosure, the change or replacement that can be readily occurred in,
It should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with the protection model of claims
Subject to enclosing.
Claims (5)
1. a kind of more size wafer compatible type tooling boxes, the wafer for storing two or more sizes；It is characterised in that it includes shell
Body (3) and box cover (6)；The shell (3) uses aluminum alloy materials, the shell (3) to divide upper layer and lower layer with box cover (6),
Lower layer includes multiple small size wafer storages position (31), and small size wafer stores position (31) bottom and is equipped with annular protrusion (311)；On
Layer includes that multiple large scale wafers store position (32)；
It is recessed at shell ring-type bayonet (33) above described shell (3) edge, it is convex at the cyclic annular convex falcon (34) of shell, institute under lower section
It is recessed into box cover ring-type bayonet (61) under above box cover (6) edge for stating, it is convex at the cyclic annular convex falcon (62) of box cover, the box under lower section
The convex falcon of bezel ring, shape (62) is buckled on shell ring-type bayonet (33), and box cover (6) is buckled on shell (3)；
When tooling box is laminated, the cyclic annular convex falcon (34) of shell on upper layer is buckled on the box cover ring-type bayonet (61) of lower layer.
2. more size wafer compatible type tooling boxes according to claim 1, which is characterized in that the small size wafer is deposited
Putting position (31) has seven, and one is set to shell (3) center, and the small size wafer that another six edges are set to center stores position (31) center
It is circumferentially-spaced uniformly distributed.
3. more size wafer compatible type tooling boxes according to claim 2, which is characterized in that the small size wafer is deposited
Put wafer (1) of the position (31) for storing 2 cun.
4. more size wafer compatible type tooling boxes according to claim 1,2 or 3, which is characterized in that the large scale
Wafer is stored there are three position (32), circumferentially-spaced uniformly distributed along shell (3) center.
5. more size wafer compatible type tooling boxes according to claim 4, which is characterized in that the large scale wafer is deposited
Put wafer (2) of the position (32) for storing 3 cun.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810045605.0A CN108565236A (en) | 2018-01-17 | 2018-01-17 | A kind of more size wafer compatible type tooling boxes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810045605.0A CN108565236A (en) | 2018-01-17 | 2018-01-17 | A kind of more size wafer compatible type tooling boxes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108565236A true CN108565236A (en) | 2018-09-21 |
Family
ID=63530938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810045605.0A Pending CN108565236A (en) | 2018-01-17 | 2018-01-17 | A kind of more size wafer compatible type tooling boxes |
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| Country | Link |
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| CN (1) | CN108565236A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109712921A (en) * | 2018-12-22 | 2019-05-03 | 中智(泰兴)电力科技有限公司 | A kind of flower basket structure of monocrystalline silicon heterojunction solar cell thin slice |
| CN110354735A (en) * | 2019-07-30 | 2019-10-22 | 上海汇像信息技术有限公司 | Shaking table device and its shake localization method |
| CN112349635A (en) * | 2020-10-23 | 2021-02-09 | 杭州长川科技股份有限公司 | Wafer and needle cleaning sheet storage device |
Citations (5)
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|---|---|---|---|---|
| JPH10209252A (en) * | 1997-01-24 | 1998-08-07 | Sony Corp | Wafer tray |
| JPH11111831A (en) * | 1997-09-30 | 1999-04-23 | Hitachi Cable Ltd | Wafer tray |
| CN103165502A (en) * | 2011-12-14 | 2013-06-19 | 无锡华瑛微电子技术有限公司 | Wafer tray and wafer box |
| CN204315544U (en) * | 2015-01-16 | 2015-05-06 | 安徽三安光电有限公司 | A kind of many wafer size load plate |
| CN105719992A (en) * | 2014-09-09 | 2016-06-29 | 辛纳普蒂克斯显像装置合同会社 | Semiconductor chip tray |
-
2018
- 2018-01-17 CN CN201810045605.0A patent/CN108565236A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209252A (en) * | 1997-01-24 | 1998-08-07 | Sony Corp | Wafer tray |
| JPH11111831A (en) * | 1997-09-30 | 1999-04-23 | Hitachi Cable Ltd | Wafer tray |
| CN103165502A (en) * | 2011-12-14 | 2013-06-19 | 无锡华瑛微电子技术有限公司 | Wafer tray and wafer box |
| CN105719992A (en) * | 2014-09-09 | 2016-06-29 | 辛纳普蒂克斯显像装置合同会社 | Semiconductor chip tray |
| CN204315544U (en) * | 2015-01-16 | 2015-05-06 | 安徽三安光电有限公司 | A kind of many wafer size load plate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109712921A (en) * | 2018-12-22 | 2019-05-03 | 中智(泰兴)电力科技有限公司 | A kind of flower basket structure of monocrystalline silicon heterojunction solar cell thin slice |
| CN109712921B (en) * | 2018-12-22 | 2022-12-02 | 中智(泰兴)电力科技有限公司 | Flower basket structure of monocrystalline silicon heterojunction solar cell slice |
| CN110354735A (en) * | 2019-07-30 | 2019-10-22 | 上海汇像信息技术有限公司 | Shaking table device and its shake localization method |
| CN112349635A (en) * | 2020-10-23 | 2021-02-09 | 杭州长川科技股份有限公司 | Wafer and needle cleaning sheet storage device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180921 |
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| RJ01 | Rejection of invention patent application after publication |