CN108561391B

CN108561391B - Dispensing method, input/output assembly and electronic device

Info

Publication number: CN108561391B
Application number: CN201810200804.4A
Authority: CN
Inventors: 向韬; 曾武春; 周国安; 侯康
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-03-12
Filing date: 2018-03-12
Publication date: 2020-08-07
Anticipated expiration: 2038-03-12
Also published as: CN108561391A

Abstract

The invention discloses a dispensing method, which comprises the following steps: providing a shell and a panel assembly, wherein the shell is provided with a groove for accommodating the panel assembly, the panel assembly comprises an outer side face, and the groove is provided with an inner side face which is oppositely matched with the outer side face; arranging the panel assembly in the groove, and forming a gap between the inner side and the outer side; filling gap filling glue into the gap; providing a pressure device, and enabling the air pressure in the gap to be smaller than the ambient air pressure outside the gap through the pressure device, so that the gap filling glue flows into the gap; and curing the caulking glue to fixedly connect the housing and the panel assembly. In the glue dispensing method, the air pressure in the gap is smaller than the ambient air pressure outside the gap through the pressure device, so that the joint filling glue flows into the gap, the problem that glue dispensing is difficult after the panel assembly is arranged in the groove can be solved, and the gap between the inner side surface and the outer side surface can be further reduced. The invention also discloses an input/output assembly and an electronic device.

Description

Dispensing method, input/output assembly and electronic device

Technical Field

The present disclosure relates to electronic devices, and particularly to a dispensing method, an input/output assembly and an electronic device.

Background

In the related art, an electronic device such as a mobile phone includes a housing and a panel assembly, the housing is formed with a groove, the panel assembly is disposed in the groove, and the housing is generally fixedly connected to a side surface of the panel assembly by means of dispensing. However, in order to increase the screen occupation ratio of the electronic device, the gap between the housing and the side surface of the panel assembly is small, and it is difficult for glue to be spotted into the gap between the housing and the side surface of the panel assembly.

Disclosure of Invention

The invention provides a dispensing method, an input/output assembly and an electronic device.

The dispensing method of the embodiment of the invention comprises the following steps:

providing a shell and a panel assembly, wherein the shell is provided with a groove for accommodating the panel assembly, the panel assembly comprises an outer side face, and the groove is provided with an inner side face oppositely matched with the outer side face;

arranging the panel assembly in the groove, wherein a gap is formed between the inner side face and the outer side face;

filling gap filling glue into the gap;

providing a pressure device, and enabling the air pressure in the gap to be smaller than the ambient air pressure outside the gap through the pressure device, so that the gap filling glue flows into the gap; and

and curing the caulking glue to fixedly connect the shell and the panel assembly.

The input/output assembly of the embodiment of the invention is manufactured and formed by the glue dispensing method.

The electronic device of the embodiment of the invention comprises the input and output assembly.

In the glue dispensing method, the pressure device enables the air pressure in the gap to be smaller than the ambient air pressure outside the gap, so that the joint filling glue flows into the gap, the problem that glue dispensing is difficult after the panel assembly is arranged in the groove can be solved, and the gap between the inner side surface and the outer side surface can be further reduced.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic plan view of an electronic device according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of an input-output assembly in accordance with an embodiment of the present invention;

FIG. 3 is a schematic plan view of an input-output assembly according to an embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view of the input-output assembly of FIG. 3 taken along the direction III-III;

FIG. 5 is an enlarged schematic view of a portion of the input-output assembly IV of FIG. 4;

FIG. 6 is a schematic cross-sectional view of the input-output assembly of FIG. 3 taken along the direction V-V;

FIG. 7 is an enlarged schematic view of a VI portion of the input-output assembly of FIG. 6;

FIG. 8 is a schematic flow chart illustrating a dispensing method according to an embodiment of the present invention;

FIG. 9 is a schematic process diagram of a dispensing method according to an embodiment of the invention;

fig. 10 is another schematic process diagram of a dispensing method according to an embodiment of the invention;

FIG. 11 is a schematic flow chart illustrating a dispensing method according to another embodiment of the present invention;

FIG. 12 is a schematic process diagram of a dispensing method according to another embodiment of the invention;

fig. 13 is a schematic process diagram of step S14 of the dispensing method according to the embodiment of the invention;

description of the main element symbols:

the electronic device 100, the body 20, the input/output assembly 10, the housing 12, the groove 122, the inner side 1222, the long side 1224, the short side 1226, the bottom 1228, the substrate 124, the suction hole 1241, the side wall 126, the step 128, the step 1282, the step lower surface 1284, the step upper surface 1286, the outer side 121, the panel assembly 14, the outer side 142, the step surface 1422, the touch panel 144, the touch panel outer side 1442, the cover 146, the cover outer side 1462, the cover lower surface 1464, the upper surface 148, the glue overflow preventing strip 16, the glue filling strip 18, the gap 11, the opening 112, the glue adhering strip 19, and the pressure device 200.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.

Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes an input/output device 10 and a body 20, wherein the input/output device 10 is disposed on the body 20. The electronic device 100 includes, but is not limited to, a cell phone, a tablet computer, or a wearable device.

Specifically, the electronic device 100 further includes a battery cover (not shown), a battery (not shown), and a main circuit board (not shown) disposed in the electronic device 100, wherein the battery cover covers the internal components of the electronic device 100, such as the battery and the main circuit board. The battery is used to provide power to the electronic device 100, and the main circuit board is configured to control the operating state of the electronic device 100.

Referring to fig. 2 to 5, an input/output assembly 10 according to an embodiment of the present invention includes a housing 12, a panel assembly 14, at least one anti-overflow glue strip 16, and a caulking glue strip 18.

The housing 12 is formed with a recess 122 for receiving the panel assembly 14, the panel assembly 14 is disposed in the recess 122, and the panel assembly 14 includes an outer side 142. Recess 122 is formed with an inner side 1222 for opposing engagement with outer side 142. The spill-proof strip 16 can be formed by providing a spill-proof glue on the inner side 1222 in the circumferential direction of the inner side 1222 and curing the glue. The spill-resistant strip 16 seals the gap 11 between the inner side 1222 and the outer side 142. The joint strip 18 may be formed by placing a joint glue between the inner side 1222 and the outer side 142 and curing. The joint compound 18 fixedly bonds the housing 12 and the panel assembly 14.

In the input/output assembly 10 according to the embodiment of the present invention, the input/output assembly 10 can prevent the filling glue from infiltrating into the groove 122 to contaminate the housing 12 and/or the panel assembly 14 when the filling glue for curing the housing 12 and the panel assembly 14 is subsequently disposed by previously disposing and curing the filling glue to form at least one filling glue prevention strip 16, such that the filling glue prevention strip 16 seals the gap 11 between the inner side 1222 and the outer side 142. Specifically, the housing 12 includes a substrate 124 and a sidewall 126 extending from the substrate 124, the substrate 124 and the sidewall 126 enclosing the recess 122. The housing 12 is substantially rectangular parallelepiped, and the housing 12 is a carrier of the electronic device 100 and is used for carrying most parts of the electronic device 100. The housing 12 may be made of plastic, metal, or plastic and metal by an in-mold injection molding process. In one example, the substrate 124 is made of metal and the sidewall 126 is made of plastic, and the substrate 124 can be placed in a mold, and then the molten plastic is injected into the mold to form the sidewall 126 after the plastic is solidified, so as to obtain the housing 12.

In some embodiments, recess 122 is formed with a bottom surface 1228 connected to an inner side surface 1222, and inner side surface 1222 is a plane perpendicular to bottom surface 1228. The inner side 1222 is positioned on the sidewall 126 and the bottom surface 1228 is positioned on the base 124.

In some embodiments, recess 122 forms a bottom surface 1228 connected to inner side surface 1222, and inner side surface 1222 is a bevel extending upwardly and outwardly from the edge of bottom surface 1228.

The inner side 1222 may be perpendicular to the bottom surface 1228, or may extend upward and outward from the edge of the bottom surface 1228, and the specific structure of the input/output module 10 may be selected as required.

In some embodiments, the panel assembly 14 includes a touch panel 144 and a cover 146 overlying the touch panel 144. The lateral dimension of the cover 146 is larger than the lateral dimension of the touch panel 144 such that the outer side 142 forms a stepped surface between the cover 146 and the touch panel 144. The outer side 142 includes a cover outer side 1462 and a touch panel outer side 1442. The anti-overflow glue strip 16 seals the gap 11 between the inner side 1222 and the outer side 1442 of the touch panel. The joint strip 18 is fixedly connected to the outer side surface 1462 and the inner side surface 1222 of the cover plate.

In this manner, the outer side 1462 of the cover and the inner side 1222 of the recess 122 are connected by the joint strip 18, thereby fixedly connecting the panel assembly 14 to the housing 12.

Specifically, the material of the cover plate 146 may be made of a light-transmitting material such as glass, ceramic, or sapphire. Since the cover plate 146 is an input part of the electronic device 100, the cover plate 146 is often contacted by impact, scratch, or the like. For example, when the user places the electronic device 100 in a pocket, the cover plate 146 may be scratched by a key in the pocket of the user and damaged. Therefore, the material of the cover plate 146 may be a material with a relatively high hardness, such as the above sapphire material. Or a hardened layer may be formed on the surface of the cover plate 146 to improve scratch resistance of the cover plate 146.

The touch panel 144 includes a display module (not shown), such as a liquid crystal display module (L CD), and a touch layer (not shown) disposed on the display module, which may also be a flexible display module.

The touch panel 144 and the cover plate 146 are adhered and fixed together by, for example, optical Adhesive (OCA), which not only adheres and fixes the touch panel 144 and the cover plate 146, but also transmits light emitted from the touch panel 144.

In one example, the panel assembly 14 may be formed by: the touch panel 144 and the cover plate 146 are provided, then the optical adhesive is coated on the touch panel 144, and finally the cover plate 146 is attached to the optical adhesive, so that the cover plate 146 and the touch panel 144 are fixed together.

In some embodiments, medial side 1222 includes a long side 1224 and a short side 1226 connecting long sides 1224, and spill-resistant strip 16 is disposed on long sides 1224 along the length of long sides 1224. In this manner, the longer sides 1224 are larger in size, and placement of the spill-resistant strip 16 on the longer sides 1224 along the length of the longer sides 1224 facilitates sealing the gap 11 between the inner side 1222 and the outer side 1226.

Referring to fig. 6 and 7 together, in some embodiments, recess 122 is generally rectangular, and inner side 1222 includes a long side 1224 and a short side 1226 connected to long side 1224, short side 1226 being formed with step 128, and panel assembly 14 being supported on step 128 and adhesively secured to step 128. In this manner, the step 128 acts as a support for the panel assembly 14, facilitating stable attachment of the panel assembly 14 to the housing 12. Specifically, in the present embodiment, the cover plate 146 is supported on the step 128, and the touch panel 144 is located on one side of the step 128.

In other embodiments, short sides 1226 may omit step 128 and have the same structure as long sides 1224, and may also be coated with anti-spill glue and formed into anti-spill strip 16.

In some embodiments, the spill-resistant strip 16 is attached to the inner face 1222 circumferentially about the inner face 1222. That is, the glue overflow prevention strip 16 and the sidewall 126 are separate structures. The spill-proof strip 16 is, for example, foam, and the spill-proof strip 16 is attached to the side wall 126 by double-sided adhesive. In addition, the foam is elastic, and the use of the foam as the glue overflow preventing strip 16 can not only prevent the subsequent caulking glue from infiltrating into the groove 122 to contaminate the housing 12 and/or the panel assembly 14, but also can serve as a buffer material to protect the panel assembly 14 when the housing 12 and/or the panel assembly 14 is impacted. Furthermore, the foam is simple and light, which can reduce the weight of the housing 12 and the panel assembly 14 while improving the production efficiency and reducing the cost.

Of course, in other embodiments, the spill-resistant strip 16 is integral with the sidewall 126, for example, the spill-resistant strip 16 and the sidewall 126 may be formed by an injection molding process. It should be noted that the spill-resistant strip 16 is interrupted along the circumferential extension of the inner side 1222, so that air in the gap 11 can flow out of the gap 11 after the dispensing of the caulking compound.

The invention also provides a dispensing method, and the dispensing method of the embodiment of the invention can be used for manufacturing and forming the input-output assembly 10 of the embodiment of the invention. Specifically, the dispensing method according to the embodiment of the present invention will be described in detail below.

Referring to fig. 8 and 9, a dispensing method according to an embodiment of the present invention includes the following steps:

s12: providing a shell 12 and a panel assembly 14, wherein the shell 12 is provided with a groove 122 for accommodating the panel assembly 14, the panel assembly 14 comprises an outer side 142, and the groove 122 is provided with an inner side 1222 matched with the outer side 142 oppositely;

s14: positioning the panel assembly 14 within the recess 122 with a gap 11 formed between the inner side 1222 and the outer side 142;

s16: filling gap filling glue into the gap 11;

s18: providing a pressure device 200, and enabling the air pressure in the gap 11 to be smaller than the ambient air pressure outside the gap 11 through the pressure device 200, so that the gap filling glue flows into the gap 11;

s20: the caulking glue is cured to fixedly connect the housing 12 and the panel assembly 14.

In the dispensing method according to the embodiment of the present invention, the pressure device 200 makes the air pressure in the gap 11 smaller than the ambient air pressure outside the gap 11, so that the gap filling glue flows into the gap 11, which not only solves the problem that the dispensing is difficult after the panel assembly 14 is installed in the groove 122, but also further reduces the size of the gap between the inner side 1222 and the outer side 142.

In step S14, the panel assembly 14 may be loaded into the recess 122 using suction cups.

In step S16, the filling glue may be dispensed around the gap 11 by the dispenser, and since the filling glue has viscosity, the filling glue may not smoothly flow into the gap 11.

In step S18, the pressure device 200 may be a pressure increasing device or a negative pressure device. When the pressure device 200 is a pressure boosting device, as shown in fig. 9, step S18 specifically includes: the housing 12 and the panel assembly are disposed together in the pressure device 200 to increase the ambient air pressure outside the gap 11 so that the air pressure inside the gap 11 is less than the ambient air pressure outside the gap 11. The pressurizing means may increase the ambient air pressure outside the gap 11 by filling the pressurizing means with air. It will be appreciated that the air pressure within the gap 11 may be maintained at this point, thereby creating a pressure differential between the interior and exterior of the gap 11 to force the caulking glue from the exterior of the gap 11 into the gap 11.

When the pressure device 200 is a negative pressure device, the housing 12 is formed with the suction hole 1241 communicating with the groove 122, and further, the suction hole 1241 communicates with the slit 11. Preferably, the air-extracting hole 1241 is opened in the substrate. At this time, as shown in fig. 10, step S18 specifically includes: the pressure device 200 extracts the gas in the gap 11 through the air extraction hole 1241 so that the gas pressure in the gap 11 is smaller than the ambient gas pressure outside the gap 11, thereby allowing the caulking glue to flow into the gap 11. It can be understood that the ambient air pressure outside the gap 11 may not be changed, and after the air in the gap 11 is extracted, a negative pressure is formed in the gap 11, so that a pressure difference is formed between the inside and the outside of the gap 11, and the caulking glue is pressed into the gap 11 under the ambient air pressure.

In step S20, the caulking glue may be cured naturally or in other manners. For example, when the caulking glue is a UV glue, the caulking glue may be irradiated by ultraviolet rays to be cured.

Referring to fig. 11 and 12, in some embodiments, step S14 is preceded by the following steps:

s131, arranging anti-overflow glue on the inner side 1222 along the circumferential direction of the inner side 1222;

s132, curing the anti-overflow glue to form at least one anti-overflow glue strip 16;

step S14 includes:

s141, disposing the panel assembly 14 in the groove 122 and sealing the overflow prevention rubber strip 16 to the gap 11 between the inner side 1222 and the outer side 124, wherein the overflow prevention rubber strip 16 is used to be located under the water of the caulking compound.

In particular, the spill-resistant strip 16 is in contact with the outer side 142, so that the gap 11 between the inner side 1222 and the outer side 142 can be sealed. It should be noted that the spill-resistant strip 16 seals the gap 11 at the lower part of the inner side 1222 and the outer side 142, and the extension of the spill-resistant strip 16 in the circumferential direction of the inner side 1222 is interrupted, so that air in the gap 11 can flow out of the gap 11 after the dispensing of the caulking glue.

In this manner, the spill proof strip 16 seals the gap 11 between the inner side 1222 and the outer side 142, thereby preventing the caulking glue from seeping into the recess 122 to contaminate the housing 12 and/or the panel assembly 14.

In some embodiments, the recess 122 is generally rectangular and the medial side 1222 includes a long side 1224 and a short side 1226 connecting the long sides 1224. Step S131 includes the steps of:

spill proof glue is provided on long sides 1224 along the length of long sides 1224.

In this manner, provision of the spill-proof glue on the long side 1224 of the inner side 1222 may be achieved.

In some embodiments, the spill-resistant glue comprises a silicone glue.

The silicone adhesive has strong bonding force and good moisture resistance. The silicone adhesive is used as the anti-overflow glue, so that the sealing performance and the moisture resistance of the anti-overflow glue strip 16 formed by curing the anti-overflow glue can be better. In addition, the silicone adhesive can also accommodate large temperature changes, so that the anti-overflow adhesive tape 16 does not reduce the sealing effect due to the temperature changes. Of course, the caulking glue may also be a silicone glue. The anti-overflow glue and the joint filling glue can also be other glues with better fluidity, such as UV glue and the like.

In certain embodiments, step S132 includes the steps of:

and curing the anti-overflow glue in an environment of 20-25 ℃ for more than five minutes.

In one example, the anti-overflow glue is cured in an environment of 20 ℃ for 15 minutes; in another example, the spill-proof glue is cured in an environment at 22 ℃ for 12 minutes; in yet another example, the flood-proof glue is cured in an environment at 25 ℃ for a curing time of 6 minutes. The curing temperature in the range of 20 to 25 c and the curing time in the range of more than five minutes are not particularly limited herein.

Therefore, the temperature of 20-25 ℃ is a normal temperature environment, and the anti-overflow glue is cured in the normal temperature environment, so that the curing condition of the anti-overflow glue is simple and easy to realize, and the manufacturing cost of the input/output assembly 10 is reduced.

In certain embodiments, the curing time of the spill proof glue is less than the full curing time of the spill proof glue. In one example, the time for complete curing of the spill proof glue is greater than 25min, whereas in the present invention, the time for curing of the spill proof glue is 10 min.

As such, after the anti-spill glue is cured for a period of time, the panel assembly 14 is disposed in the recess 122, such that the closeness between the panel assembly 14 and the recess 122 may be less than if the panel assembly 14 were disposed in the recess 122 when the anti-spill glue had not been cured, facilitating disassembly during subsequent maintenance. Further, by disposing the panel assembly 14 in the recess 122 before the spill-proof glue is completely cured, poor sealing due to reduced fluidity caused by the complete curing of the spill-proof glue can be avoided.

It will be appreciated that after the glue has completely cured, the glue loses its flowability, and by placing the panel assembly 14 in the recess 122, the glue cannot deform to achieve a better sealing effect due to the squeezing of the panel assembly 14 and the recess 122. In addition, the glue spill prevention strip 16 formed by the fully cured glue spill prevention glue is not flat and has a certain hardness, which may cause an obstruction when placing the panel assembly 14 into the recess 122.

Referring to FIG. 13, in some embodiments, recess 122 is generally rectangular and medial side 1222 includes a long side 1224 and a short side 1226 connecting long sides 1224. The short side surface 1226 is formed with a step 128, and the step 128 includes a step surface 1282, a step lower surface 1284 connecting the step surface 1282 and the long side surface 1224, and a step upper surface 1286 connecting the step surface 1282.

Step S131 includes the steps of:

the anti-spill glue is continuously disposed on the step underside 1284 along the length of the step underside 1284.

So, can make the anti-overflow glue distribute on the rank is below 1284 in succession for the anti-overflow adhesive tape 16 after the anti-overflow glue solidification is continuous on rank is below 1284, prevents to lead to the anti-overflow adhesive tape 16 can not form continuous sealing washer because the discontinuous point of anti-overflow adhesive tape 16 is scribbled and makes the effect of sealed gap 11 between medial surface 1222 and lateral surface 142 poor.

It will be appreciated that one of the glue solutions applied to the long side 1224 and the short side 1226 is continuous, so that the glue-overflow preventing strip 16 formed after curing is prevented from completely sealing the gap 11 so that the gas in the gap 11 cannot flow out.

Referring again to fig. 13, in some embodiments, step S14 includes the following steps:

arranging bonding glue on the step surface 1282;

supporting the panel assembly 14 on the step surface 1282; and

the bonding glue is cured to bond the step surface 1282 and the panel assembly 14.

In this manner, the panel assembly 14 is seated against and secured to the stepped surface 1282 by the adhesive bead 19 formed by curing the adhesive glue. The step 128 acts as a support for the panel assembly 14 and facilitates stable attachment of the panel assembly 14 to the housing 12.

In particular, the bonding glue and the caulking glue may be of the same composition, e.g. both silicone glues described above. In addition, the panel assembly 14 includes a touch panel 144 and a cover plate 146 covering the touch panel 144, the longitudinal dimension of the cover plate 146 is larger than the longitudinal dimension of the touch panel 144, the cover plate 146 of the panel assembly 14 is abutted on the step surface 1282, and the touch panel 144 of the panel assembly 14 is adhered to the overflow preventing glue strip 16 formed by curing the overflow preventing glue on the step surface 1284.

In some embodiments, the panel assembly 14 includes a touch panel 144 and a cover 146 overlying the touch panel 144. The cover 146 has a lateral dimension greater than that of the touch panel 144 such that the outer side 142 forms a stepped surface between the cover 146 and the touch panel 144, and the outer side 142 includes a cover outer side 1462 and a touch panel outer side 1442.

Step S14 includes:

the panel assembly 14 is placed in the recess 122 with the spill proof strip 16 sealing the gap 11 between the inner side 1222 and the outer touch panel side 1442.

In certain embodiments, step S20 includes:

the caulking glue is cured in an environment of 20-25 ℃ for more than five minutes.

In one example, the caulking glue is cured in an environment of 20 ℃ for 15 minutes; in another example, the caulking glue is cured in an environment of 22 ℃ for a 12 minute cure time; in yet another example, the underfill glue is cured in an environment at 25 ℃ for a cure time of 6 minutes. The curing temperature in the range of 20 to 25 c and the curing time in the range of more than five minutes are not particularly limited herein.

Thus, the solidification of the joint filling glue is realized. It will be appreciated that after the caulking glue has fully cured, the caulking glue loses its flowability and the fully cured caulking strip 18 has a degree of stiffness that makes subsequent removal of the caulking glue located on the upper surface 148 of the panel assembly 14 and the outer side 121 of the housing 12 inconvenient and may even damage the upper surface 148 of the panel assembly 14 and the outer side 121 of the housing 12 during removal. The caulking glue cured for more than five minutes at 20-25 c has not yet reached a fully cured state facilitating subsequent removal of the caulking glue located on the upper surface 148 of the panel assembly 14 and the exterior side 121 of the housing 12. In addition, the temperature of 20-25 ℃ is a normal temperature environment, and the curing condition of the joint filling glue is simple and easy to realize by curing the joint filling glue in the normal temperature environment, so that the manufacturing cost of the input/output assembly 10 is reduced.

In some embodiments, the dispensing method further includes the following steps after step S20:

the caulking glue (not shown) located on the upper surface 148 of the panel assembly 14 and the exterior side 121 of the housing 12 is removed.

During the process of installing the panel assembly 14 into the recess 122, since the gap 11 is very narrow, the caulking glue is squeezed and easily spills over to the outside 121 of the housing 12 and the upper surface 148 of the panel assembly 14. Therefore, after curing the caulking glue, the caulking glue also needs to be wiped off so that the outer side 121 of the housing 12 and the upper surface 148 of the panel assembly 14 are no longer filled with caulking glue.

In some embodiments, the step of removing the caulking glue located on the upper surface 148 of the panel assembly 14 and the exterior side 121 of the housing 12 comprises the steps of:

the caulking glue on the upper surface 148 of the panel assembly 14 and the exterior side 121 of the housing 12 is wiped off using a dust free cloth.

The dust cloth is soft in surface and has good cleaning efficiency, and the use of the dust cloth to wipe off the caulking glue can achieve higher cleaning efficiency without damaging the upper surface 148 of the panel assembly 14 and the outer side 121 of the housing 12. In one example, the input-output assembly 10 may be secured using a clamp, then a dust free cloth may be held by a robot arm, and finally the robot arm may be controlled to move to wipe off the caulking glue located on the upper surface 148 of the panel assembly 14 and the exterior side 121 of the housing 12.

wiping the cured caulking glue in the gap between the outer side 142 and the inner side 1222 to make the cured caulking glue have substantially the same appearance as the housing 12. After the filling glue is cured, the fluidity of the filling glue is reduced, and the cured filling glue is wiped, so that the appearance surface of the filling glue is rough to present a matte state, and is approximately the same as the appearance of the shell 12.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A dispensing method is characterized by comprising the following steps:

arranging anti-overflow glue on the inner side surface along the circumferential direction of the inner side surface;

curing the anti-overflow glue to form at least one anti-overflow glue strip;

arranging the panel assembly in the groove, wherein a gap is formed between the inner side surface and the outer side surface, and the anti-overflow rubber strip seals the gap between the inner side surface and the outer side surface;

filling gap filling glue into the gap;

providing a pressure device and enabling the air pressure in the gap to be smaller than the ambient air pressure outside the gap through the pressure device, wherein the pressure device is a negative pressure device, the shell is provided with an air extraction hole communicated with the groove, the air extraction hole is communicated with the gap, and the pressure device extracts air in the gap through the air extraction hole so that the air pressure in the gap is smaller than the ambient air pressure outside the gap, so that the gap filling glue flows into the gap; and

2. The dispensing method of claim 1, wherein the panel assembly includes a touch panel and a cover plate covering the touch panel, the cover plate having a lateral dimension greater than a lateral dimension of the touch panel such that the outer side forms a step surface between the cover plate and the touch panel, the outer side including a cover plate outer side and a touch panel outer side, and the step of curing the caulking glue to fixedly connect the housing and the panel assembly includes:

and curing the joint filling glue to fixedly connect the inner side face and the outer side face of the cover plate.

3. The dispensing method of claim 1, wherein the gap is formed with an upwardly facing opening, and the step of filling the gap with caulking glue comprises the steps of:

and filling the gap with the gap filling glue from the opening.

4. The dispensing method of claim 1, wherein the gap is annular, and the step of filling the gap with caulking glue comprises the steps of:

and continuously filling the gap with the gap filling glue along the circumferential direction of the gap.

5. The method of dispensing in accordance with claim 1, wherein said step of curing said caulking glue comprises the steps of:

and curing the joint sealing glue in an environment of 20-25 ℃ for more than five minutes.

6. The method of dispensing of claim 1, wherein the recess is generally rectangular, the inner side surface includes a long side surface and a short side surface connecting the long side surface, the short side surface is formed with a step, the step includes a step surface, a step lower surface connecting the step surface and the long side surface, and a step upper surface connecting the step surface, the step of positioning the panel assembly within the recess includes the steps of:

arranging bonding glue on the step surface;

supporting the panel assembly on the step surface; and

and curing the bonding glue to bond the step surface and the panel assembly.

7. The dispensing method of claim 6, wherein the panel assembly includes a touch panel and a cover plate overlying the touch panel, the cover plate having a lateral dimension greater than a lateral dimension of the touch panel such that the outer side surface forms a stepped surface between the cover plate and the touch panel, the step of supporting the panel assembly on the stepped surface comprising:

supporting the cover plate on the step surface, wherein the touch panel is positioned on one side of the step;

the step of curing the bonding glue to bond the step surface and the panel assembly comprises:

and curing the bonding glue to bond the step surface and the cover plate.

8. The dispensing method of claim 1, wherein the dispensing method further comprises, after the step of curing the caulking glue, the steps of:

and removing the joint filling glue on the upper surface of the panel assembly and the outer side of the shell.

9. The method of dispensing of claim 8, wherein the step of removing the caulking glue on the upper surface of the panel assembly and the outside of the housing comprises the steps of:

and wiping off the caulking glue on the upper surface of the panel assembly and the outer side of the shell by using dust-free cloth.

10. The dispensing method of claim 1, wherein the dispensing method further comprises, after the step of curing the caulking glue, the steps of:

wiping the solidified caulking glue in the gap so that the appearance of the solidified caulking glue is approximately the same as that of the shell.

11. An input-output device manufactured by the dispensing method according to any one of claims 1 to 10.

12. An electronic device comprising the input-output assembly of claim 11.