CN108560029B - A kind of FPC flexible board copper plating additive and preparation method thereof - Google Patents
A kind of FPC flexible board copper plating additive and preparation method thereof Download PDFInfo
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- CN108560029B CN108560029B CN201810022784.6A CN201810022784A CN108560029B CN 108560029 B CN108560029 B CN 108560029B CN 201810022784 A CN201810022784 A CN 201810022784A CN 108560029 B CN108560029 B CN 108560029B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to producing circuit board metallized processing technology field, especially a kind of FPC flexible board copper plating additive and preparation method thereof.Wherein, additive includes following components by weight: 2-5 parts of polyethers, 0.15-0.3 parts of benzyl dithiopropane sodium sulfonate, 0.1-0.2 parts of imidazoles, 1-3 parts of phenol polyoxyethylene ether, 0.02-0.05 parts of yellow dye, 90-96 parts of water.The present invention can only achieve 150% performance compared to existing copper plating additive maximum covering power, its covering power with 180%-200%, under the premise of same uniform current density and little holding properties of product otherness, electroplating time can be shortened using the circuit that additive of the invention carries out flexible board, improve generation；And it can be adapted for rolling copper plating.
Description
Technical field
The present invention relates to producing circuit board metallized processing technology field, especially a kind of FPC flexible board copper plating additive and its
Preparation method.
Background technique
FPC flexible circuit board hole metallization technology is the key that one of flexible circuit board manufacturing technology.For a long time, flexible
TP value (covering power) maximum of copper plating additive employed in wiring board copper-plating technique can only accomplish 100-150%, thus
So that causing the electroplating time of process flow long, low efficiency and the face copper of wiring board finally produced thicker, get over
Not to be suitable for the trend of accurate flexible circuitry plate technique development more.
Summary of the invention
In view of the deficiency of the prior art, one of them of the invention is designed to provide a kind of FPC flexible board
Copper plating additive；It is another object of the present invention to provide a kind of preparation methods of FPC flexible board copper plating additive.
To achieve the goals above, the present invention uses first technical solution are as follows:
A kind of FPC flexible board copper plating additive, by weight, including following components: 2-5 parts of polyethers, two sulphur third of benzyl
0.15-0.3 parts of alkyl sulfonic acid sodium, 0.1-0.2 parts of imidazoles, 1-3 parts of phenol polyoxyethylene ether, 0.02-0.05 parts of yellow dye, water 90-
96 parts.
Preferably, the imidazoles is ternary imidazoles copolymer.
Preferably, the phenol polyoxyethylene ether is styrylphenol polyoxyethylene ether.
Preferably, the polyethers is modified polyether.
The present invention uses first technical solution are as follows:
A kind of preparation method of FPC flexible board copper plating additive, comprising the following steps:
S1, the water of phenol polyoxyethylene ether and 50% is mixed by weight ratio, until phenol polyoxy second
Alkene ether is completely dissolved, and obtains primary mixture；
S2, it will be mixed in imidazoles addition primary mixture, until imidazoles is completely dissolved, obtain by weight ratio
To secondary mixture；
S3, it will be mixed in polyethers addition secondary mixture, until polyethers is completely dissolved, obtain by weight ratio
To mixture three times；
S4, it will be mixed in the addition of benzyl dithiopropane sodium sulfonate three times mixture by weight ratio, until
Benzyl dithiopropane sodium sulfonate is completely dissolved, and obtains four mixtures；
Yellow dye is added in four mixtures and is mixed by S5, parts by weights proportion, until yellow dye is completely molten
Solution, obtains five mixtures；
S6, it will be stirred in 50% water five mixtures of addition by weight ratio, can be prepared by copper plating additive.
As the above scheme is adopted, the present invention has the advantage that compared to existing copper plating additive
1, covering power is excellent, the covering power with 180-200%, and used additive in industry at present
Maximum covering power only has 150%；The electroplating technology processing of FPC flexible board is carried out after using copper plating additive of the invention
When, electroplating time can be shortened, improve production capacity.
2, it can reduce face copper thickness, can be under the premise of copper thickness reach requirement in hole since depth capability is excellent, drop
Bottom surface copper thickness meets the requirement of modern times FPC precise circuit technique to improve the etch capabilities of fine-line technique.
3, guarantee that copper facing has excellent ductility, while being equally applicable to calendering copper plating.
Specific embodiment
The embodiment of the present invention is described in detail below, but what the present invention can be defined by the claims and cover
Multitude of different ways is implemented.
Embodiment one:
It S1, is that styrylphenol polyoxyethylene ether and 45kg water are mixed by 2kg molecular weight, until styrene
Base phenol polyoxyethylene ether is completely dissolved, and obtains primary mixture；
S2, it will be mixed in 0.1kg ternary imidazoles copolymer addition primary mixture, until ternary imidazoles is copolymerized
Object is completely dissolved, and obtains secondary mixture；
S3, it will be mixed in 2kg modified polyether addition secondary mixture, until modified polyether is completely dissolved, obtain
To mixture three times；
S4, it will be mixed in the addition of 0.15kg benzyl dithiopropane sodium sulfonate three times mixture, until benzyl two
Sulphur propane sulfonic acid sodium is completely dissolved, and obtains four mixtures；
S5, it will be mixed in 0.02kg yellow dye four mixtures of addition, until yellow dye is completely dissolved, obtain
Five mixtures；
S6,45kg water is added in five mixtures and stirs 30min, can be prepared by copper plating additive.
Embodiment two:
It S1, is that styrylphenol polyoxyethylene ether and 47kg water are mixed by 1kg molecular weight, until styrene
Base phenol polyoxyethylene ether is completely dissolved, and obtains primary mixture；
S2, it will be mixed in 0.2kg ternary imidazoles copolymer addition primary mixture, until ternary imidazoles is copolymerized
Object is completely dissolved, and obtains secondary mixture；
S3, it will be mixed in 3kg modified polyether addition secondary mixture, until modified polyether is completely dissolved, obtain
To mixture three times；
S4, it will be mixed in the addition of 0.2kg benzyl dithiopropane sodium sulfonate three times mixture, until two sulphur of benzyl
Propane sulfonic acid sodium is completely dissolved, and obtains four mixtures；
S5, it will be mixed in 0.03kg yellow dye four mixtures of addition, until yellow dye is completely dissolved, obtain
Five mixtures；
S6,47kg water is added in five mixtures and stirs 30min, can be prepared by copper plating additive.
Embodiment three:
It S1, is that styrylphenol polyoxyethylene ether and 48kg water are mixed by 5kg molecular weight, until styrene
Base phenol polyoxyethylene ether is completely dissolved, and obtains primary mixture；
S2, it will be mixed in 0.2kg ternary imidazoles copolymer addition primary mixture, until ternary imidazoles is copolymerized
Object is completely dissolved, and obtains secondary mixture；
S3, it will be mixed in 5kg modified polyether addition secondary mixture, until modified polyether is completely dissolved, obtain
To mixture three times；
S4, it will be mixed in the addition of 0.3kg benzyl dithiopropane sodium sulfonate three times mixture, until two sulphur of benzyl
Propane sulfonic acid sodium is completely dissolved, and obtains four mixtures；
S5, it will be mixed in 0.05kg yellow dye four mixtures of addition, until yellow dye is completely dissolved, obtain
Five mixtures；
S6,48kg water is added in five mixtures and stirs 30min, can be prepared by copper plating additive.
By copper plating additive obtained by embodiment one to three and existing copper plating additive, according to FPC copper-plating technique
Process (oil removing-washing-pickling-FPC copper facing-washing-drying) same process flow (be shown in Table one, wherein described in table and
Open cylinder agent and brightener are the copper plating additive of the present embodiment) in carry out using rear, the copper plating additive of the present embodiment and existing
Performance comparison between some copper plating additives and respectively to the performance comparison (being shown in Table two) of process flow and final products, with
This can be determined: the TP value of the copper plating additive of the present embodiment can reach 180-200%, and keep other all properties differences
Under the premise of property is little, using the present embodiment copper plating additive when, the electroplating time of copper-plating technique greatly shortens, production capacity obtains
It is promoted, the face copper thickness of FPC wiring board is also effectively reduced.
Table one:
Table two:
| Existing copper plating additive | The copper plating additive of the present embodiment one | Explanation | |
| Current density | 2.5ASD | 2.5ASD | |
| Electroplating time | 18min. | 12min. | Promote production capacity 34% |
| Uniformity COV | 4.6% | 3.5% | Uniformity is more excellent |
| Ductility % | 19.25% | 18.8% | Ductility is equally excellent |
| Covering power (TP value) | 147% | 192% | TP value is more excellent |
| Roll copper plating | It is not applicable | It is applicable in |
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all utilizations
Equivalent structure or equivalent flow shift made by present specification is applied directly or indirectly in other relevant technologies
Field is included within the scope of the present invention.
Claims (2)
1. a kind of FPC flexible board copper plating additive, it is characterised in that: by weight, including following components: 2-5 parts of polyethers, benzyl
0.15-0.3 parts of base dithiopropane sodium sulfonate, 0.1-0.2 parts of imidazoles, 1-3 parts of phenol polyoxyethylene ether, yellow dye 0.02-0.05
Part, 90-96 parts of water；Wherein, the imidazoles is ternary imidazoles copolymer, and the phenol polyoxyethylene ether is poly- for styrylphenol
Ethylene oxide ether, the polyethers are modified polyether.
2. a kind of method for preparing FPC flexible board copper plating additive as described in claim 1, it is characterised in that: including following
Step:
S1, the water of phenol polyoxyethylene ether and 50% is mixed by weight ratio, until phenol polyoxyethylene ether
It is completely dissolved, obtains primary mixture；
S2, it will be mixed in imidazoles addition primary mixture by weight ratio, until imidazoles is completely dissolved, obtain two
Secondary mixture；
S3, it will be mixed in polyethers addition secondary mixture by weight ratio, until polyethers is completely dissolved, obtain three
Secondary mixture；
S4, it will be mixed in the addition of benzyl dithiopropane sodium sulfonate three times mixture by weight ratio, until benzyl
Dithiopropane sodium sulfonate is completely dissolved, and obtains four mixtures；
Yellow dye is added in four mixtures and is mixed by S5, parts by weights proportion, until yellow dye is completely dissolved, obtains
To five mixtures；
S6, it will be stirred in 50% water five mixtures of addition by weight ratio, can be prepared by copper plating additive.
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| CN201810022784.6A CN108560029B (en) | 2018-01-10 | 2018-01-10 | A kind of FPC flexible board copper plating additive and preparation method thereof |
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| CN201810022784.6A CN108560029B (en) | 2018-01-10 | 2018-01-10 | A kind of FPC flexible board copper plating additive and preparation method thereof |
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| CN108560029B true CN108560029B (en) | 2019-09-13 |
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| CN109219272A (en) * | 2018-10-22 | 2019-01-15 | 台山市精诚达电路有限公司 | A kind of conduction method of flexible electric circuit board |
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| US5174886A (en) * | 1991-02-22 | 1992-12-29 | Mcgean-Rohco, Inc. | High-throw acid copper plating using inert electrolyte |
| CN101481812B (en) * | 2008-12-31 | 2011-04-06 | 清华大学 | Electrolytic solution for integrated circuit copper wire laying electrodeposition |
| CN103806030A (en) * | 2012-11-08 | 2014-05-21 | 无锡新三洲特钢有限公司 | Stage electroplating process copper electroplating method |
| CN105734623A (en) * | 2016-05-06 | 2016-07-06 | 广东利尔化学有限公司 | High-dispersity acidic copper plating additive as well as preparation method and application thereof |
| CN107268042B (en) * | 2017-06-02 | 2018-07-10 | 吕艺璇 | A kind of electronic engraving printing gravure hard copper additive |
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