CN108550678A - 一种发光二极管支架工艺区保护方法 - Google Patents

一种发光二极管支架工艺区保护方法 Download PDF

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Publication number
CN108550678A
CN108550678A CN201810318314.4A CN201810318314A CN108550678A CN 108550678 A CN108550678 A CN 108550678A CN 201810318314 A CN201810318314 A CN 201810318314A CN 108550678 A CN108550678 A CN 108550678A
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led support
process island
photic
guard method
materials
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何海营
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Foshan City Pu Sen Electronics Co Ltd
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Foshan City Pu Sen Electronics Co Ltd
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Priority to CN201810318314.4A priority Critical patent/CN108550678A/zh
Publication of CN108550678A publication Critical patent/CN108550678A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/564Details not otherwise provided for, e.g. protection against moisture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种发光二极管支架工艺区保护方法,该发光二极管支架工艺区保护方法具体步骤如下:将光致或其他材料涂覆在发光二极管支架上,在发光二极管工艺区周围增加一个保护带,防止封装后外界物质通过封装缝隙侵入工艺区。本发明采用光致或其他材料,可以将发光二极管支架的工艺区与发光二极管支架外边沿之间形成一个阻挡带,避免外界物质对发光二极管的工艺区电路的侵蚀,大大提高二极管的使用寿命。

Description

一种发光二极管支架工艺区保护方法
技术领域
本发明涉及二极管技术领域,具体为一种发光二极管电路工艺区保护方法。
背景技术
发光二极管(LightEmitting Diode,LED),是一种半导体组件。初时多用作为指示灯、显示发光二极管板等;随着白光LED的出现,也被用作照明。LED被称为第四代照明光源或绿色光源,具有节能、环保、寿命长、体积小等特点,广泛应用于各种指示、显示、装饰、背光源、普通照明和城市夜景等领域。根据使用功能的不同,可以将其划分为信息显示、信号灯、车用灯具、液晶屏背光源、通用照明五大类。但是在具体使用中我们会发现外界物质会渗透进入发光二极管,导致二极管中的电路工艺区被锈蚀,尤其是潮湿的沿海地带更是严重。大大降低发光二极管的使用寿命。这些是我们需要面对和解决的问题。
发明内容
本发明的目的在于提供一种发光二极管支架工艺区的保护方法,该发光二极管支架工艺区的保护方法具体步骤如下:
S1:光致或者其他材料的涂覆:在发光二极管支架制作时,进行光致或其他材料的涂覆,该材料涂覆后外形为环形或者带形,使得支架的工艺区处于环形区域或者带形区域内;
与现有技术相比,本发明的有益效果是:本发明采用光致或者其他材料,涂覆在发光二极管支架上,可以将支架的工艺区与支架的外边沿隔离,在发光二极管封装后,增加的涂覆材料可以阻挡外界物质对工艺区的侵蚀,大大提高二极管的使用寿命。
附图说明
图1为本发明的光致或者其他材料涂覆范围示意图。
图中:1支架正极、2支架负极、3光致或者其他形式材料涂覆区域,4区域内支架工艺区
本发明采用光致或者其材料的涂覆,可以保护发光二极管支架的工艺区,避免外界物质对工艺区的侵蚀,大大提高二极管的使用寿命。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。

Claims (2)

1.一种发光二极管支架工艺区的保护方法,具体步骤如下:
S1:光致或者其他材料的涂覆:在发光二极管支架制作时,增加光致或其他材料的涂覆,涂覆形状为环形或者带形,使得发光二极管支架工艺区处于环形区域或者带形区域内。
2.根据权利要求1所述的一种发光二极管支架工艺区保护方法,其特征在于:在发光二极管支架上使用光致或其他材料的涂覆,保护发光二极管支架的工艺区。
CN201810318314.4A 2018-04-11 2018-04-11 一种发光二极管支架工艺区保护方法 Pending CN108550678A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102097549A (zh) * 2010-12-28 2011-06-15 广州市鸿利光电股份有限公司 一种芯片级集成封装工艺及led器件
CN102683563A (zh) * 2011-03-10 2012-09-19 富士康(昆山)电脑接插件有限公司 发光芯片导线架
CN202948669U (zh) * 2012-11-30 2013-05-22 深圳市安普光光电科技有限公司 Led户外显示屏模组
CN203364092U (zh) * 2013-05-31 2013-12-25 江门市鸿海电子有限公司 防水led驱动器
CN104075140A (zh) * 2013-03-26 2014-10-01 天津津亚电子有限公司 一种led柔软防水光源模块

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102097549A (zh) * 2010-12-28 2011-06-15 广州市鸿利光电股份有限公司 一种芯片级集成封装工艺及led器件
CN102683563A (zh) * 2011-03-10 2012-09-19 富士康(昆山)电脑接插件有限公司 发光芯片导线架
CN202948669U (zh) * 2012-11-30 2013-05-22 深圳市安普光光电科技有限公司 Led户外显示屏模组
CN104075140A (zh) * 2013-03-26 2014-10-01 天津津亚电子有限公司 一种led柔软防水光源模块
CN203364092U (zh) * 2013-05-31 2013-12-25 江门市鸿海电子有限公司 防水led驱动器

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