CN108550584B - Array substrate, display device and preparation method of array substrate - Google Patents
Array substrate, display device and preparation method of array substrate Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims description 7
- 238000002834 transmittance Methods 0.000 claims abstract description 15
- 230000003287 optical effect Effects 0.000 claims description 34
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 239000011521 glass Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 7
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- 239000010408 film Substances 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 4
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- 229910021645 metal ion Inorganic materials 0.000 description 1
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
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- 229910001415 sodium ion Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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Abstract
The invention relates to an array substrate and a display device, wherein the array substrate comprises a substrate, and a display area and a non-display area are arranged on the substrate; the display area is used for displaying; the non-display area includes a groove area, and the light transmittance of the groove area is greater than that of the display area. The display device comprises the array substrate. According to the array substrate and the display device, the groove area is arranged on the substrate, so that the manufacturing difficulty of the groove area is reduced; in addition, as the groove area is provided with the substrate base plate and has good light transmittance, a circuit, a component or a signal line can be arranged in the groove space, the frame area of the display device is reduced, and the display area of the display device is increased. The invention also relates to a method for preparing the array substrate.
Description
Technical Field
The invention relates to the technical field of display, in particular to an array substrate, a display device and a preparation method of the array substrate.
Background
With the continuous update and iteration of display device products, large-screen display devices are increasingly popular with users, and the external structure and the internal structure of the display panel are gradually updated. Nowadays, a popular way is to make a slotted area on the top of a rectangular display panel, where components such as a front camera can be placed, and make a display area in other areas except the slotted area, so as to increase the area of the display area and bring stronger visual impact to users.
However, since the notching region has notches of various shapes and when the notching region is manufactured, each layer of substrate and film layer of the display panel needs to be cut, which makes the process difficult; in addition, the design of the slotted region needs to occupy the upper frame region of the display panel, and thus many circuits on the display panel are disposed on the lower frame of the display panel, so that the display region of the display panel cannot be fully utilized. Therefore, how to reduce the difficulty of the manufacturing process of the display panel while fully utilizing the display area of the display panel is a technical problem that needs to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of the above, it is desirable to provide an array substrate, a display device, and a method for manufacturing the array substrate, which can increase a display area and reduce the difficulty of a manufacturing process.
An array substrate, comprising:
the display device comprises a substrate base plate, a display area and a non-display area, wherein the substrate base plate is provided with the display area and the non-display area;
the display area is used for displaying;
the non-display area includes a groove area, and the light transmittance of the groove area is greater than that of the display area.
According to the array substrate, the groove area is arranged on the substrate, so that the manufacturing difficulty of the groove area is reduced; in addition, the substrate base plate is reserved in the groove area, the light transmittance is good, and circuits, components or signal lines can be arranged in the groove space, so that the frame area of the display device is reduced, and the display area of the display device is increased.
In one embodiment, an optical device light-transmitting area is reserved in the groove area; the area of the optical device light-transmitting area is smaller than that of the groove area.
In one embodiment, the array substrate further comprises a gate driving circuit and a peripheral circuit; the gate driving circuit and the peripheral circuit are disposed at peripheral positions of the optical device light-transmitting region in the groove region.
In one embodiment, the peripheral circuit includes at least one of a multiplexer circuit, an electrostatic discharge circuit, and a screen test circuit.
In one embodiment, the array substrate further comprises an ambient light sensing device disposed at a peripheral location of the optical device light transmissive region within the recess region.
In one embodiment, the ambient light sensing device is a photodiode or a light sensing thin film transistor.
In one embodiment, the array substrate further comprises a conductive pad, a signal connection line and a power supply potential line; the non-display area further comprises a frame area; the conductive bonding pad is arranged on the frame area in the opening direction of the groove area, the signal connecting wire is connected with the conductive bonding pad and the data wire in the display area through the groove area, and the power source potential wire is arranged on the frame area and connected to the conductive bonding pad.
A display device comprises the array substrate in each embodiment.
In one embodiment, the display device is a glass display device or a flexible display device.
A preparation method of an array substrate comprises the following steps:
providing a substrate base plate;
sequentially forming a buffer layer and an insulating layer on a substrate;
etching the buffer layer and the insulating layer in a preset area on the substrate to form a groove area;
and arranging pixel units outside the groove area and the substrate base plate frame area to form a display area, wherein the light transmittance of the groove area is greater than that of the display area.
According to the preparation method of the array substrate, the groove area with high light transmittance can be obtained by etching the local reserved area on the substrate, so that a complicated process for cutting the substrate is omitted, and the manufacturing difficulty of the groove area of the array substrate is reduced; in addition, the groove area with the substrate base plate can be used for placing circuits, components or signal lines and the like, so that the frame area of the display device is reduced, and the display area of the display device is increased.
Drawings
FIG. 1 is a schematic structural diagram of an array substrate according to an embodiment;
FIG. 2 is a schematic diagram illustrating a partial structure of an array substrate according to an embodiment;
FIG. 3 is a schematic view of a partial structure of an array substrate according to another embodiment;
FIG. 4 is a schematic view of a partial structure of an array substrate according to another embodiment;
FIG. 5 is a schematic view of a partial structure of an array substrate according to another embodiment;
fig. 6 is a schematic flow chart illustrating a method for manufacturing an array substrate according to an embodiment.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
Referring to fig. 1, a schematic structural diagram of an embodiment of an array substrate according to the present application is shown.
As shown in fig. 1, the array substrate 1000 includes a substrate on which a display region 1100 and a non-display region 1200 are disposed. On one side edge of the display area 1100, a groove region 1210 is provided, and an opening direction of the groove region 1210 faces an outer side of the substrate base plate. Specifically, film layer structures such as a buffer layer, a gate insulating layer and an interlayer insulating layer are sequentially deposited on the substrate, and in the area corresponding to the groove area 1210, the film layer structures such as the buffer layer, the gate insulating layer and the interlayer insulating layer on the substrate are etched away, and only one layer of substrate is left, so that the groove area 1210 has higher light transmittance compared with the display area 1100, and optical components such as a camera can be conveniently placed below the position corresponding to the groove area without affecting the performance of the optical components. Pixel units are distributed at other positions of the display area 1100, so that the display area 1100 is used for displaying.
According to the array substrate, the groove area is arranged on the substrate, so that the manufacturing difficulty of the groove area is reduced; in addition, the substrate base plate is reserved in the groove area, the light transmittance is good, the circuit, the integrated component or the signal line can be arranged in the groove space, the frame area of the display device is reduced, and the display area of the display device is increased.
In one embodiment, as shown in fig. 2, an optical device light-transmitting region 1211 is reserved in the groove region 1210, and the area of the optical device light-transmitting region 1211 is smaller than the area of the groove region 1210. In this embodiment, the optical device specifically refers to components such as a camera having optical characteristics and an ambient light sensor, and the optical device is generally disposed below the display panel and receives light through the display panel. Since the area of the optical device light-transmitting region 1211 is smaller than that of the recess region 1210, a circuit, an integrated component, a signal line, or the like may be arranged at a position not occupied by the optical device light-transmitting region 1211. It is to be noted that the circuits, signal lines, or integrated components arranged around the optical device need to be kept away from the position directly above the optical device light-transmitting region 1211.
In one embodiment, as shown in fig. 3, the array substrate 1000 further includes a gate driving circuit 1212 and a peripheral circuit, and the gate driving circuit 1212 and the peripheral circuit are disposed at a peripheral position of the optical device transmission region 1211 in the groove region 1210. Specifically, the gate driving circuit 1212 and the peripheral circuits may be disposed at left and right rims or a lower rim of the recess 1210. In the present embodiment, the gate driving circuit 1212 disposed in the recessed area 1210 is used for driving the display area on both sides of the recessed area 1210. Specifically, there may be one or more gate driving circuits 1212, and preferably, two gate driving circuits 1212 are disposed on two sides of the optical device light-transmitting area 1211, and a plurality of compensation capacitors for compensating light are connected between the scanning driving lines in the display areas on two sides of the recessed area 1210. The compensation capacitor may be disposed between the display region and the gate driving circuit 1212 along the edge of the recessed area 1210, or may be disposed at other positions of the recessed area 1210.
In one embodiment, as shown in FIG. 3, the peripheral circuitry includes one or more of multiplexing circuitry 1213, electrostatic discharge circuitry 1214, and screen test circuitry 1215. Specifically, the multi-path selection circuit 1213 is used to assist the display panel in the lighting test; the electrostatic discharge circuit 1214 is used for protecting important parts in the display device from electrostatic damage; the screen body test circuit 1215 is used for conducting the access and short circuit tests on the signal connection lines on the display panel. In this embodiment, the multi-path selection circuit 1213, the electrostatic discharge circuit 1214 and the panel test circuit 1215 may be disposed at the peripheral position of the optical device transparent area 1211 and avoid the position right above the optical device transparent area 1211, and since the gate driving circuit is generally disposed at the left and right frame positions of the recessed area 1210, the multi-path selection circuit 1213, the electrostatic discharge circuit 1214 and the panel test circuit 1215 are preferably disposed at the lower frame position of the recessed area 1210.
By arranging the gate driving circuit and the peripheral circuit in the groove region, the width of the frame region can be effectively reduced, and the narrow frame design of the display device is facilitated.
In one embodiment, as shown in fig. 4, the array substrate further includes an ambient light sensing device 1216, and the ambient light sensing device 1216 is disposed at a peripheral position of the optical device light transmissive region 1211 within the recess region 1210. Specifically, there may be one or more ambient light sensing devices 1216. In this embodiment, the ambient light sensing device 1216 has a smaller volume and occupies a smaller space, and can be used to monitor the change of the light intensity in the environment and instruct the display device to perform a corresponding adjustment action according to the change, such as instructing the display device to dim the display brightness of the display panel under the condition that the ambient light is stronger.
In one embodiment, as shown in FIG. 4, the ambient light sensing device 1216 is a photodiode or a light sensing thin film transistor. In this embodiment, the photodiode or the light sensing Thin Film Transistor may be fabricated simultaneously with a TFT (Thin Film Transistor) array on the display region. Specifically, when the TFT array of the display panel is manufactured, trivalent or pentavalent element doping with different contents and different types can be performed on the basis of common polysilicon, so that a photodiode or a photosensitive thin film transistor for ambient light detection is synchronously manufactured.
By integrating the ambient light sensing device in the groove area of the array substrate, the area of the light transmitting area of the optical device can be effectively reduced, and the intelligent degree of the display panel is improved.
In one embodiment, as shown in fig. 5, the array substrate further includes conductive pads 1217, signal connection lines 1218, and power potential lines 1219. The conductive pads 1217 are disposed on a frame area in the opening direction of the groove area 1210, the signal connection lines 1218 are led out from the conductive pads 1217 into the groove area 1210, and the power supply potential lines 1219 are disposed on the frame area and connected to the conductive pads 1217. Specifically, the groove 1210 has a certain depth and can accommodate a routing space of the signal connection line of the bonding area, and the anode power supply potential line VDD and the cathode power supply potential line VSS can also be routed in the groove. The signal connection line 1218 and the power potential line 1219 are disconnected at the corresponding positions of the groove 1210 to avoid the optical device light-transmitting area 1211. In this embodiment, one end of the signal connection line 1218 is connected to the conductive pad 1217, and the other end is connected to the data line in the display area 1110. The data lines of the display area 1110 are connected to the signal driving circuit of the bonding area through the signal connection lines 1218 and the conductive pads 1217 to drive the pixel units of the display area 1110 for display and brightness adjustment.
Through setting up the electrically conductive pad between the frame of recess district and array substrate to the space of make full use of recess district carries out the wire winding and arranges, can effectual reduction display panel's lower frame area, thereby increases the area of display area.
In one embodiment, as shown in fig. 3-6, the array substrate 1000 includes one or more circuits, integrated devices, or signal lines of a gate driving circuit 1212, a multiplexing circuit 1213, an electrostatic discharge circuit 1214, a screen test circuit 1215, an ambient light sensing device 1216, conductive pads 1217, signal connection lines 1218, and power supply potential lines 1219. All the circuits, integrated components, or signal lines are disposed at positions avoiding the optical device light-transmitting area 1211, wherein the circuits and the integrated components are disposed at positions avoiding the position right above the optical device light-transmitting area 1211. In this embodiment, all the circuits, integrated devices, or signal lines disposed in the groove 1211 need to be mutually avoided to reduce the influence therebetween, and are arranged and disposed according to practical situations.
In one embodiment, a display device is provided. Specifically, the display device can be a glass display device or a flexible display device, and although the glass display device and the flexible display device are different in structure and manufacturing material, the glass display device and the flexible display device are provided with array substrates in the structure, and the array substrates are provided with groove regions which do not need to be cut into the substrate substrates. In this embodiment, the position of the package substrate of the display device corresponding to the groove region does not need to be cut, and a circuit, a signal line or an integrated component and the like can be arranged in the groove region between the package substrate and the substrate of the display device.
Specifically, the display device includes, but is not limited to, a display panel, a mobile phone, a tablet computer, a notebook computer, and a wearable electronic device with a display function.
In one embodiment, as shown in fig. 6, a method of manufacturing an array substrate is provided.
Step S102, a substrate is provided.
Specifically, the base substrate may be a glass substrate or a flexible substrate. In this embodiment, the light transmittance of the substrate is relatively high, and the substrate serves as a bottom substrate of the array substrate and has a certain protection effect.
Step S104 is to sequentially form a buffer layer and an insulating layer on the base substrate.
Specifically, film layer structures such as a buffer layer, a gate insulating layer and an interlayer insulating layer are sequentially deposited on the substrate, so that metal ions in the substrate can be prevented, such as: aluminum ions, barium ions, sodium ions, etc. diffuse into other film layers during the process.
Step S106, etching the buffer layer and the insulating layer in the preset area on the substrate to form a groove area.
Specifically, in a groove-shaped predetermined region on the substrate base plate, film layer structures such as a buffer layer, a grid insulating layer and an interlayer insulating layer on the substrate base plate can be etched, and only one layer of substrate base plate is left, so that the groove region has better light transmittance, and optical components such as a camera can be placed below the position corresponding to the groove region conveniently without affecting the performance of the optical components.
Step S108, arranging pixel units at positions outside the groove area and the substrate base plate frame area to form a display area, wherein the light transmittance of the groove area is greater than that of the display area.
Specifically, a crisscross data driving line and a scanning driving line are arranged on the substrate except for the frame area and the groove area, and a pixel unit is arranged at the crossing position of the data driving line and the scanning driving line to form a display area. Because the display area is provided with the multi-layer film layer structure and the pixel units, the light transmittance of the display area is lower.
According to the preparation method of the array substrate, the groove area with high light transmittance can be obtained by etching the local reserved area on the substrate, so that a complicated process for cutting the substrate is omitted, and the manufacturing difficulty of the groove area of the array substrate is reduced; in addition, the groove area with the substrate base plate can be used for placing circuits, components or signal lines and the like, so that the frame area of the display device is reduced, and the display area of the display device is increased.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. An array substrate, comprising:
the display device comprises a substrate base plate, a display area and a non-display area, wherein the substrate base plate is provided with the display area and the non-display area;
the display area is used for displaying;
the non-display area comprises a groove area, the light transmittance of the groove area is greater than that of the display area, an optical device light-transmitting area is reserved in the groove area, and the area of the optical device light-transmitting area is smaller than that of the groove area;
the grid driving circuit is arranged at the peripheral position of the optical device light-transmitting area in the groove area, and a plurality of compensation capacitors for compensating light rays are connected between the grid driving circuit and scanning driving wires of display areas at two sides of the groove area.
2. The array substrate of claim 1, wherein the array substrate further comprises peripheral circuitry; the peripheral circuit is arranged at the peripheral position of the optical device light-transmitting area in the groove area.
3. The array substrate of claim 2, wherein the peripheral circuit comprises at least one of a multiplexing circuit, an electrostatic discharge circuit, and a screen test circuit.
4. The array substrate of claim 1, further comprising an ambient light sensing device disposed at a peripheral location of the optical device light transmissive region within the recess region.
5. The array substrate of claim 4, wherein the ambient light sensing device is a photodiode or a light sensing thin film transistor.
6. The array substrate of any one of claims 1-5, wherein the array substrate further comprises conductive pads, signal connection lines, and power supply potential lines; the non-display area further comprises a frame area; the conductive bonding pad is arranged on the frame area in the opening direction of the groove area, the signal connecting line is connected with the conductive bonding pad and the data line in the display area through the groove area, and the power source potential line is arranged on the frame area and connected to the conductive bonding pad.
7. A display device comprising the array substrate according to any one of claims 1 to 6.
8. The display device according to claim 7, wherein the display device is a glass display device or a flexible display device.
9. A preparation method of an array substrate is characterized by comprising the following steps:
providing a substrate base plate;
sequentially forming a buffer layer and an insulating layer on the substrate base plate;
etching the buffer layer and the insulating layer in a preset area on the substrate to form a groove area;
arranging pixel units at positions outside the groove area and the substrate base substrate frame area to form a display area, wherein the light transmittance of the groove area is greater than that of the display area;
an optical device light-transmitting area is reserved in the groove area, the area of the optical device light-transmitting area is smaller than that of the groove area, a grid driving circuit is arranged on the periphery of the optical device light-transmitting area, and a plurality of compensation capacitors used for compensating light are connected between the grid driving circuit and scanning driving wires of display areas on two sides of the groove area.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810453667.5A CN108550584B (en) | 2018-05-14 | 2018-05-14 | Array substrate, display device and preparation method of array substrate |
| PCT/CN2018/110691 WO2019218587A1 (en) | 2018-05-14 | 2018-10-17 | Array substrate, display device, and manufacturing method of array substrate |
| US16/446,655 US10608022B2 (en) | 2018-05-14 | 2019-06-20 | Array substrates, display devices and methods of manufacturing array substrates |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810453667.5A CN108550584B (en) | 2018-05-14 | 2018-05-14 | Array substrate, display device and preparation method of array substrate |
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| CN108550584A CN108550584A (en) | 2018-09-18 |
| CN108550584B true CN108550584B (en) | 2020-12-11 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10608022B2 (en) | 2018-05-14 | 2020-03-31 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Array substrates, display devices and methods of manufacturing array substrates |
| CN108550584B (en) * | 2018-05-14 | 2020-12-11 | 昆山国显光电有限公司 | Array substrate, display device and preparation method of array substrate |
| CN109254444A (en) * | 2018-10-15 | 2019-01-22 | 武汉华星光电技术有限公司 | Display panel |
| CN109358444A (en) * | 2018-12-20 | 2019-02-19 | 合肥惠科金扬科技有限公司 | A kind of display device |
| CN112930516B (en) * | 2018-12-29 | 2023-06-02 | 华为技术有限公司 | Display module and display device |
| CN109782503B (en) * | 2019-03-14 | 2021-11-30 | 京东方科技集团股份有限公司 | Display module and terminal |
| CN110211972B (en) * | 2019-05-23 | 2021-02-02 | 武汉华星光电半导体显示技术有限公司 | Array substrate and display device |
| CN110211490A (en) * | 2019-05-31 | 2019-09-06 | 上海天马有机发光显示技术有限公司 | A kind of display panel, display panel mother matrix and display device |
| TWI729742B (en) * | 2020-03-23 | 2021-06-01 | 友達光電股份有限公司 | Display device |
| CN115917412A (en) * | 2021-06-23 | 2023-04-04 | 京东方科技集团股份有限公司 | Display substrate, display device and compensation method thereof |
| TWI826059B (en) * | 2022-10-20 | 2023-12-11 | 友達光電股份有限公司 | Display device |
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| CN204613909U (en) * | 2015-05-08 | 2015-09-02 | 上海天马微电子有限公司 | Array substrate, touch display panel and touch display device |
| KR102384068B1 (en) * | 2015-09-11 | 2022-04-07 | 삼성디스플레이 주식회사 | Liquid Crystal Display |
| CN206674022U (en) * | 2017-05-08 | 2017-11-24 | 广东欧珀移动通信有限公司 | Input and output module and electronic installation |
| CN207217536U (en) * | 2017-06-28 | 2018-04-10 | 北京小米移动软件有限公司 | Array base palte and mobile terminal |
| CN107315295A (en) * | 2017-07-31 | 2017-11-03 | 广东欧珀移动通信有限公司 | Array base palte, display panel and electronic equipment |
| CN107561806B (en) * | 2017-09-29 | 2020-07-03 | 厦门天马微电子有限公司 | Array substrate and display panel |
| CN107831937B (en) * | 2017-11-07 | 2020-11-20 | 武汉天马微电子有限公司 | Touch sensor and display device |
| CN107946341B (en) * | 2017-11-10 | 2020-05-22 | 上海天马微电子有限公司 | Display device and method for manufacturing display device |
| CN108010942B (en) * | 2017-11-28 | 2020-06-30 | 武汉天马微电子有限公司 | Organic light-emitting display panel and organic light-emitting display device |
| CN108010949A (en) * | 2017-11-30 | 2018-05-08 | 武汉华星光电半导体显示技术有限公司 | The OLED display panel and OLED display of abnormity cutting |
| CN108550584B (en) * | 2018-05-14 | 2020-12-11 | 昆山国显光电有限公司 | Array substrate, display device and preparation method of array substrate |
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- 2018-10-17 WO PCT/CN2018/110691 patent/WO2019218587A1/en active Application Filing
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| CN108550584A (en) | 2018-09-18 |
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