CN108550417A - A kind of copper electrocondution slurry and preparation method thereof suitable for xenon lamp sintering - Google Patents
A kind of copper electrocondution slurry and preparation method thereof suitable for xenon lamp sintering Download PDFInfo
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- CN108550417A CN108550417A CN201810186271.9A CN201810186271A CN108550417A CN 108550417 A CN108550417 A CN 108550417A CN 201810186271 A CN201810186271 A CN 201810186271A CN 108550417 A CN108550417 A CN 108550417A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/06—Metallic powder characterised by the shape of the particles
- B22F1/068—Flake-like particles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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Abstract
The invention discloses a kind of copper electrocondution slurries and preparation method thereof suitable for xenon lamp sintering.The copper electrocondution slurry includes copper powder material of main part, assisted sintering flaky metallic material, auxiliary agent, adhesive, solvent, copper electrocondution slurry contains the sheet material there are two types of average thickness, by the sheet material of thinner thickness the defect being sintered is difficult to make up the thicker sheet material of thickness with high activity feature, the contact surface for the sheet material that the sheet material of the thinner thickness sheet material thicker with thickness can maintain thickness thicker after being combined, the copper film generated after use have the characteristics that high compactness and high conductivity.
Description
Technical field
The present invention relates to a kind of copper electrocondution slurries and preparation method thereof suitable for xenon lamp sintering.
Background technology
Curing type copper electrocondution slurry is the important raw material of printed circuit industry, as xenon lamp sintering technology develops in recent years,
So that the usage amount of copper electrocondution slurry steps up.Contain flake copper powder in copper electrocondution slurry, compared to the copper powder of spheric granules,
Contact area between flake copper powder material is much larger than the contact area between the copper powder of spheric granules.Flake copper powder has defect
Less, point conductance is high, is not easy to the characteristics of oxidation, but the flake copper powder thickness that copper electrocondution slurry in the prior art contains by it
It is thicker and be difficult to be sintered, i.e., sintering is completed not in millisecond and be difficult to link together between flake copper powder and flake copper powder.For
Overcome the defect of the hard-to-sinter, the prior art using to mixed between flake copper powder the higher nano level particle of activity come into
Row assisted sintering.Although the technological means is sintered difficult technical problem between solving flake copper powder to a certain extent,
It is that between nano particle is in two copper sheets with unsintered state, then can greatly reduce the contact between flake copper powder
Area influences compactness and conductivity, to which severe weakness flaky powder material has the advantage of large contact area.
Invention content
Sheet is reduced in the case of the technical problem to be solved by the present invention is to how maintain the exposure between flake copper powder
Thus the sintering difficulty of copper powder obtains a kind of copper electrocondution slurry suitable for xenon lamp sintering.
In order to solve the above technical problems, the present invention adopts the following technical scheme that：The copper electrocondution slurry includes copper powder main body material
Material, assisted sintering flaky metallic material, auxiliary agent, adhesive, solvent, the copper powder material of main part and assisted sintering lamellar gold
Belong to material surface and all contain modified organic matter, these modified organic matters come from auxiliary agent, adhesive and solvent, the copper powder
The average thickness of material of main part is 0.2-5 microns, average piece diameter is 2-25 microns, the assisted sintering flaky metallic material
Average thickness is 40-100 nanometers, average piece diameter is 2-30 microns,
The copper powder material of main part weight percent is 45wt%~70wt%,
The assisted sintering is 5wt%~30wt% with flaky metallic material weight percent,
The auxiliary agent weight percent is 0.1wt%~1wt%,
Described adhesive weight percent is 0.5wt%~2wt%,
The solvent weight percent is 10wt%~30wt%.
Focus on the influence of the diameter and material category of sheet powder to sintering in the prior art, and has ignored sheet powder
Influence of the thickness for the sintering process based on xenon lamp sintering technology.The exactly technology prejudice, causes the prior art to be confined to adopt
The sintering difficulty between flake copper powder is reduced with piece diameter is changed, and either mixing or select other materials, (prior art is receives
Rice material) by way of assisted sintering reduce the sintering difficulty between flake copper powder.However, in the technical scheme can base
The thinking of sheeting is added in sheet material to solve technical problem, since sheet material is in the case of very thin, has very high
Activity, be conducive to " welding " between sheet material thicker in xenon lamp sintering process.Such as when copper powder material of main part is common
Flake copper powder when, solve to mix scale copper in technical problem i.e. thickness copper sheet powder using thinner flake copper powder is mixed
Powder, it with flaky metallic material is thin copper sheet powder that copper powder material of main part, which is thick copper sheet powder, assisted sintering,.In this way, should
Technical solution make full use of sheet stability good and thin slice activity in xenon lamp sintering process it is high and the characteristics of be easy to sintering.With
The reduction for sheet thickness is sintered required xenon lamp energy and also decreases, is more conducive to the stable operation of equipment, that is, carrying
The contact surface of " sheet-thin slice-sheet " in the case of for low xenon lamp sintering energy, still can be allowed to fuse so that sintered
Cheng Gengjia is steady.Assisted sintering flaky metallic material and copper powder material of main part are all sheet material, and two kinds of sheet materials admix institute together
It is identical as the sheet material stacking structure inside copper powder material of main part to obtain packed structures, even if the assisted sintering between copper powder material of main part
It is in unsintered state with flaky metallic material, still can ensure assisted sintering flaky metallic material and copper powder main body material
Have enough contact surfaces between material, i.e., both exposure is sufficient, thereby using when can obtain that compactness is high, conductivity is high
Copper film.
The copper powder material of main part can also be sheet silver in addition to that can be common flake copper powder in the technical scheme
One kind in the flake copper powder of oxide layer is contained on copper-clad powder, sheet cupric oxide powder, surface.
The assisted sintering flaky metallic material includes cupric oxide plate, flake silver powder, sheet of copper in the technical scheme
One kind of powder, tin flake, flitter, flaky silver coated copper powder, flake brass.
Preferably, the auxiliary agent is levelling agent, dispersant, one kind in thixotropic agent or the combination in them.
Preferably, adhesive is cellulose, polyurethane, epoxy resin, amino resins, polyvinylpyrrolidone, propylene
One kind in acid resin, gelatin, gum arabic, polyester resin, alkyd resin, alkyd resin or the combination in them.
Preferably, the solvent is ethyl alcohol, ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol monomethyl ether, propylene glycol first
Ether acetate, isophorone, propylene glycol, isopropanol, diethylene glycol (DEG), ethylene glycol, triethylene glycol, terpinol, glycol monoethyl ether, second two
Alcohol list ether, diglycol, dimethylbenzene, gummy ester, diethylene glycol methyl ether, butyl acetate, S100 aromatic hydrocarbons are molten
Agent oil, white spirit, glycerine and one kind in straight chained alkyl ether or the combination in them.
Copper electrocondution slurry in the present invention is obtained using following preparation method.
This is suitable for the preparation method of the copper electrocondution slurry of xenon lamp sintering,
The first step, the average thickness that mixed weight percentage is 45wt%~70wt% is 0.2-5 microns, average piece diameter is
The average thickness that 2-25 microns of copper powder material of main part and weight percent is 5wt%~30wt% is 40-100 nanometers, is averaged
The assisted sintering that piece diameter is 2-30 microns obtains compounding copper powder with flaky metallic material；
Second step, auxiliary agent that mixed weight percentage is 0.1wt%~1wt%, weight percent be 0.5wt%~
The adhesive of 2wt%, the solvent that weight percent is 10wt%~30wt%, gained mixed solution after high-speed stirred by obtaining
Uniform mixed solution；
Third walks, and compounding copper powder is added in mixed solution and obtains copper electrocondution slurry after evenly mixing.
The present invention uses above-mentioned technical proposal：Copper electrocondution slurry contains the sheet material there are two types of average thickness, passes through thinner thickness
Sheet material be difficult to the defect being sintered with high activity feature to make up the thicker sheet material of thickness, the sheet material of thinner thickness and thickness compared with
There is high compactness and height to lead for the contact surface for the sheet material that thick sheet material can maintain thickness thicker after combining, the copper film generated after use
The characteristics of electric rate.
Specific implementation mode
The first embodiment of the invention.
Copper powder material of main part uses flake copper powder, and average thickness is 0.2 micron, average piece diameter is 2 microns.Assisted sintering
Cupric oxide plate is used with flaky metallic material, average thickness is 40 nanometers, average piece diameter is 2 microns.Auxiliary agent uses levelling agent.
Adhesive uses polyurethane.Solvent uses one to one mixed liquor of ethylene glycol and terpinol.
When preparation, mixed weight percentage is 45wt% first copper powder material of main part and weight percent are 22.9wt%
Assisted sintering with flaky metallic material obtain compounding copper powder；Then, mixed weight percentage is the auxiliary agent of 0.1wt%, weight
The solvent that adhesive that percentage is 2wt%, weight percent are 30wt%, gained mixed solution after high-speed stirred by obtaining
Uniform mixed solution；Finally, compounding copper powder is added in mixed solution and obtains copper conductive paste after evenly mixing using three-roller
Material.
In use, copper electrocondution slurry obtains copper film by way of silk-screen printing in substrate, at a temperature of 30 DEG C into
3 minutes pre-heating dryings of row, the average thickness after copper film desiccation are 25 microns.Then, using xenon lamp to the copper of gained desiccation
Film is irradiated sintering, and the energy density of xenon lamp is 10J/cm2。
By test, the resistivity of sintered copper film is 60-80 micrin ohm cms in substrate.Adhesion strength is marked using international
Quasi- ASTM D3359 are tested, and are 5B grades.At this point, sheet-thin slice-sheet has melted so that sheet sinters into sheet
It is integrated.
Second of embodiment of the invention.
Copper powder material of main part uses flake copper powder, and average thickness is 0.5 micron, average piece diameter is 5 microns.Assisted sintering
Flaky silver coated copper powder is used with flaky metallic material, average thickness is 60 nanometers, average piece diameter is 6 microns.Auxiliary agent is using stream
Flat agent.Adhesive uses polyester resin.Solvent uses one to one mixing of butyl acetate and ethylene glycol monomethyl ether
Liquid.
When preparation, mixed weight percentage is 70wt% first copper powder material of main part and weight percent are 10wt%'s
Assisted sintering obtains compounding copper powder with flaky metallic material；Then, mixed weight percentage is the auxiliary agent of 1wt%, weight percent
The solvent for being 17wt% than adhesive, the weight percent for 2wt%, gained mixed solution after high-speed stirred by obtaining uniformly
Mixed solution；Finally, compounding copper powder is added in mixed solution and obtains copper electrocondution slurry after evenly mixing using three-roller.
In use, copper electrocondution slurry obtains copper film by way of silk-screen printing in substrate, at a temperature of 50 DEG C into
15 minutes pre-heating dryings of row, the average thickness after copper film desiccation are 40 microns.Then, using xenon lamp to the copper of gained desiccation
Film is irradiated sintering, and the energy density of xenon lamp is 37.5J/cm2.By test, the electricity of sintered copper film in substrate
Resistance rate is 30-60 micrin ohm cms.The adhesion strength ASTM D3359 that adopt international standards are tested, and are 5B grades.At this point, sheet-is thin
Piece-sheet has melted so that sheet is sintered into one with sheet.
Three kinds of embodiments of the invention.
Copper powder material of main part uses flaky silver coated copper powder, and average thickness is 1.3 microns, average piece diameter is 3.5 microns.It is auxiliary
Sintering flaky metallic material is helped to use flake brass, average thickness is 90 nanometers, average piece diameter is 20 microns.Auxiliary agent is adopted
Use levelling agent.Adhesive uses acrylic resin.Solvent uses one to one mixed liquor of isophorone and ethylene glycol monomethyl ether.
When preparation, mixed weight percentage is 70wt% first copper powder material of main part and weight percent are 20wt%'s
Assisted sintering obtains compounding copper powder with flaky metallic material；Then, mixed weight percentage is the auxiliary agent of 1wt%, weight percent
The solvent for being 7wt% than adhesive, the weight percent for 2wt%, gained mixed solution after high-speed stirred by obtaining uniformly
Mixed solution；Finally, compounding copper powder is added in mixed solution and obtains copper electrocondution slurry after evenly mixing using three-roller.
In use, copper electrocondution slurry obtains copper film by way of silk-screen printing in substrate, at a temperature of 40 DEG C into
5 minutes pre-heating dryings of row, the average thickness after copper film desiccation are 20 microns.Then, using xenon lamp to the copper of gained desiccation
Film is irradiated sintering, and the energy density of xenon lamp is 12.5J/cm2。
By test, the resistivity of sintered copper film is 20-30 micrin ohm cms in substrate.Adhesion strength is marked using international
Quasi- ASTM D3359 are tested, and are 5B grades.At this point, sheet-thin slice-sheet has melted so that sheet sinters into sheet
It is integrated.
Four kinds of embodiments of the invention.
Copper powder material of main part uses flake copper powder, and average thickness is 4 microns, average piece diameter is 7.5 microns.Assisted sintering
Flake silver powder is used with flaky metallic material, average thickness is 90 nanometers, average piece diameter is 15 microns.Auxiliary agent uses levelling
Agent.Adhesive uses alkyd resin.Solvent uses one to one mixed liquor of ethylene glycol monoethyl ether and diglycol.
When preparation, mixed weight percentage is 65wt% first copper powder material of main part and weight percent are 25wt%'s
Assisted sintering obtains compounding copper powder with flaky metallic material；Then, mixed weight percentage is the auxiliary agent of 1wt%, weight percent
The solvent for being 7wt% than adhesive, the weight percent for 2wt%, gained mixed solution after high-speed stirred by obtaining uniformly
Mixed solution；Finally, compounding copper powder is added in mixed solution and obtains copper electrocondution slurry after evenly mixing using three-roller.
In use, copper electrocondution slurry obtains copper film by way of silk-screen printing in substrate, at a temperature of 65 DEG C into
15 minutes pre-heating dryings of row, the average thickness after copper film desiccation are 40 microns.Then, using xenon lamp to the copper of gained desiccation
Film is irradiated sintering, and the energy density of xenon lamp is 37.5J/cm2。
By test, the resistivity of sintered copper film is 10-20 micrin ohm cms in substrate.Adhesion strength is marked using international
Quasi- ASTM D3359 are tested, and are 5B grades.At this point, sheet-thin slice-sheet has melted so that sheet sinters into sheet
It is integrated.
Five kinds of embodiments of the invention.
Copper powder material of main part uses flake copper powder, and average thickness is 3.5 microns, average piece diameter is 12.5 microns.Auxiliary
Sintering flaky metallic material uses flaky silver coated copper powder, and average thickness is 90 nanometers, average piece diameter is 25 microns.Auxiliary agent is adopted
Use levelling agent.Adhesive uses polyvinylpyrrolidone.Solvent uses the one of propylene glycol methyl ether acetate and diglycol
Mixed liquor than one.
When preparation, mixed weight percentage is 55wt% first copper powder material of main part and weight percent are 30wt%'s
Assisted sintering obtains compounding copper powder with flaky metallic material；Then, mixed weight percentage is the auxiliary agent of 0.2wt%, weight hundred
Divide the solvent that adhesive, weight percent that ratio is 1.3wt% are 13.5wt%, gained mixed solution after high-speed stirred by obtaining
To uniform mixed solution；Finally, compounding copper powder is added in mixed solution and obtains copper conduction after evenly mixing using three-roller
Slurry.
In use, copper electrocondution slurry obtains copper film by way of silk-screen printing in substrate, at a temperature of 40 DEG C into
6 minutes pre-heating dryings of row, the average thickness after copper film desiccation are 20 microns.Then, using xenon lamp to the copper of gained desiccation
Film is irradiated sintering, and the energy density of xenon lamp is 12.5J/cm2。
By test, the resistivity of sintered copper film is 60-80 micrin ohm cms in substrate.Adhesion strength is marked using international
Quasi- ASTM D3359 are tested, and are 5B grades.At this point, sheet-thin slice-sheet has melted so that sheet sinters into sheet
It is integrated.
6th kind of embodiment of the invention.
Copper powder material of main part uses flake copper powder, and average thickness is 5 microns, average piece diameter is 25 microns.Assisted sintering
Cupric oxide plate is used with flaky metallic material, average thickness is 100 nanometers, average piece diameter is 30 microns.Auxiliary agent uses levelling
Agent.Adhesive uses polyurethane.Solvent uses one to one mixed liquor of ethylene glycol and terpinol.
When preparation, mixed weight percentage is 70wt% first copper powder material of main part and weight percent are 5wt%'s
Assisted sintering obtains compounding copper powder with flaky metallic material；Then, mixed weight percentage is the auxiliary agent of 0.5wt%, weight hundred
Divide the solvent that adhesive, weight percent that ratio is 0.5wt% are 24wt%, gained mixed solution after high-speed stirred by obtaining
Uniform mixed solution；Finally, compounding copper powder is added in mixed solution and obtains copper conductive paste after evenly mixing using three-roller
Material.
In use, copper electrocondution slurry obtains copper film by way of silk-screen printing in substrate, at a temperature of 45 DEG C into
5 minutes pre-heating dryings of row, the average thickness after copper film desiccation are 35 microns.Then, using xenon lamp to the copper of gained desiccation
Film is irradiated sintering, and the energy density of xenon lamp is 13J/cm2。
By test, the resistivity of sintered copper film is 25-50 micrin ohm cms in substrate.Adhesion strength is marked using international
Quasi- ASTM D3359 are tested, and are 5B grades.At this point, sheet-thin slice-sheet has melted so that sheet sinters into sheet
It is integrated.
7th kind of embodiment of the invention.
Copper powder material of main part uses flake copper powder, and average thickness is 3 microns, average piece diameter is 18 microns.Assisted sintering
Cupric oxide plate is used with flaky metallic material, average thickness is 55 nanometers, average piece diameter is 10 microns.Auxiliary agent uses levelling
Agent.Adhesive uses polyurethane.Solvent uses one to one mixed liquor of ethylene glycol and terpinol.
When preparation, mixed weight percentage is 69wt% first copper powder material of main part and weight percent are 20wt%'s
Assisted sintering obtains compounding copper powder with flaky metallic material；Then, mixed weight percentage is the auxiliary agent of 0.5wt%, weight hundred
Divide the solvent that adhesive, weight percent that ratio is 0.5wt% are 10wt%, gained mixed solution after high-speed stirred by obtaining
Uniform mixed solution；Finally, compounding copper powder is added in mixed solution and obtains copper conductive paste after evenly mixing using three-roller
Material.
In use, copper electrocondution slurry obtains copper film by way of silk-screen printing in substrate, at a temperature of 45 DEG C into
5 minutes pre-heating dryings of row, the average thickness after copper film desiccation are 35 microns.Then, using xenon lamp to the copper of gained desiccation
Film is irradiated sintering, and the energy density of xenon lamp is 13J/cm2。
By test, the resistivity of sintered copper film is 25-50 micrin ohm cms in substrate.Adhesion strength is marked using international
Quasi- ASTM D3359 are tested, and are 5B grades.At this point, sheet-thin slice-sheet has melted so that sheet sinters into sheet
It is integrated.
Copper powder material of main part can also use sheet cupric oxide powder or surface to contain oxide layer in above-mentioned each embodiment
Flake copper powder, thus obtain corresponding embodiment.
Assisted sintering flaky metallic material can also use flake copper powder or tin flake in above-mentioned each embodiment
Or flitter, thus obtain corresponding embodiment.
In above-mentioned each embodiment auxiliary agent can also use dispersant or thixotropic agent or advection agent and dispersant,
Thus the combination of advection agent and thixotropic agent, dispersant and thixotropic agent obtains corresponding embodiment.
Adhesive can also use cellulose, polyurethane, epoxy resin, amino resins, gather in above-mentioned each embodiment
One kind in vinylpyrrolidone, acrylic resin, gelatin, gum arabic, polyester resin, alkyd resin, alkyd resin or
Thus combination in them obtains corresponding embodiment.
Solvent is stated in above-mentioned each embodiment can also use ethyl alcohol, ethylene glycol, diethylene glycol, triethylene glycol, second two
Alcohol methyl ether, propylene glycol methyl ether acetate, isophorone, propylene glycol, isopropanol, diethylene glycol (DEG), ethylene glycol, triethylene glycol, terpinol, second
Glycol monomethyl ether, ethylene glycol monoethyl ether, diglycol, dimethylbenzene, gummy ester, diethylene glycol methyl ether, butyl vinegar
Acid esters, S100 aromatic solvent naphthas, white spirit, glycerine and one kind in straight chained alkyl ether or the combination in them, thus
Obtain corresponding embodiment.
Claims (7)
1. a kind of copper electrocondution slurry suitable for xenon lamp sintering, it is characterised in that：
The copper electrocondution slurry includes copper powder material of main part, assisted sintering flaky metallic material, auxiliary agent, adhesive, solvent, described
Modified organic matter is all contained on copper powder material of main part and assisted sintering flaky metallic material surface, the copper powder material of main part
Average thickness is 0.2-5 microns, average piece diameter is 2-25 microns, and the average thickness of assisted sintering flaky metallic material is
40-100 nanometers, average piece diameter be 2-30 microns,
The copper powder material of main part weight percent is 45wt%~70wt%,
The assisted sintering is 5wt%~30wt% with flaky metallic material weight percent,
The auxiliary agent weight percent is 0.1wt%~1wt%,
Described adhesive weight percent is 0.5wt%~2wt%,
The solvent weight percent is 10wt%~30wt%.
2. being suitable for the copper electrocondution slurry of xenon lamp sintering according to claim 1, it is characterised in that：The copper powder material of main part
Contain one kind in the flake copper powder of oxide layer including flake copper powder, flaky silver coated copper powder, sheet cupric oxide powder, surface.
3. being suitable for the copper electrocondution slurry of xenon lamp sintering according to claim 1, it is characterised in that：The assisted sintering piece
Shape metal material includes cupric oxide plate, flake silver powder, flake copper powder, tin flake, flitter, flaky silver coated copper powder, sheet
One kind of brass powder.
4. being suitable for the copper electrocondution slurry of xenon lamp sintering according to claim 1, it is characterised in that：The auxiliary agent is levelling
One kind in agent, dispersant, thixotropic agent or the combination in them.
5. being suitable for the copper electrocondution slurry of xenon lamp sintering according to claim 1, it is characterised in that：Adhesive be cellulose,
Polyurethane, epoxy resin, amino resins, polyvinylpyrrolidone, acrylic resin, gelatin, gum arabic, polyester resin,
One kind in alkyd resin, alkyd resin or the combination in them.
6. being suitable for the copper electrocondution slurry of xenon lamp sintering according to claim 1, it is characterised in that：The solvent be ethyl alcohol,
Ethylene glycol, diethylene glycol, triethylene glycol, ethylene glycol monomethyl ether, propylene glycol methyl ether acetate, isophorone, propylene glycol, isopropanol,
Diethylene glycol (DEG), ethylene glycol, triethylene glycol, terpinol, glycol monoethyl ether, ethylene glycol monoethyl ether, diglycol, dimethylbenzene, tree
Glue ester, diethylene glycol methyl ether, butyl acetate, S100 aromatic solvent naphthas, white spirit, glycerine and straight chained alkyl
One kind in ether or the combination in them.
7. a kind of preparation method of copper electrocondution slurry suitable for xenon lamp sintering, it is characterised in that：
The first step, the average thickness that mixed weight percentage is 45wt%~70wt% is 0.2-5 microns, average piece diameter is 2-25
The average thickness that the copper powder material of main part and weight percent of micron are 5wt%~30wt% is 40-100 nanometers, be averaged piece diameter
For 2-30 microns of assisted sinterings compounding copper powder is obtained with flaky metallic material；
Second step, auxiliary agent that mixed weight percentage is 0.1wt%~1wt%, weight percent are 0.5wt%~2wt%'s
Adhesive, the solvent that weight percent is 10wt%~30wt%, gained mixed solution are uniform by being obtained after high-speed stirred
Mixed solution；
Third walks, and compounding copper powder is added in mixed solution and obtains copper electrocondution slurry after evenly mixing.
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| CN201810186271.9A CN108550417B (en) | 2018-03-07 | 2018-03-07 | Copper conductive paste suitable for xenon lamp sintering and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276296A (en) * | 2020-03-05 | 2020-06-12 | 南京理工大学 | Conductive silver paste composite sintering method and device |
| CN115642000A (en) * | 2022-12-23 | 2023-01-24 | 西北工业大学 | Preparation method of conductive copper paste capable of being subjected to photon sintering |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1745437A (en) * | 2002-05-17 | 2006-03-08 | 日立化成工业株式会社 | Conductive paste |
| CN103021512A (en) * | 2011-09-21 | 2013-04-03 | 三星电机株式会社 | Conductive paste composition for low temperature firing |
| CN104900297A (en) * | 2014-03-07 | 2015-09-09 | 湖南利德电子浆料股份有限公司 | Copper conductive slurry for radio frequency identification (RFID) tag and preparation method thereof |
| CN105225723A (en) * | 2015-10-26 | 2016-01-06 | 东莞市圣龙特电子科技有限公司 | A kind of copper electrocondution slurry and preparation method thereof |
| CN106981324A (en) * | 2017-04-26 | 2017-07-25 | 上海安缔诺科技有限公司 | A kind of copper electrocondution slurry and its production and use |
-
2018
- 2018-03-07 CN CN201810186271.9A patent/CN108550417B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1745437A (en) * | 2002-05-17 | 2006-03-08 | 日立化成工业株式会社 | Conductive paste |
| CN103021512A (en) * | 2011-09-21 | 2013-04-03 | 三星电机株式会社 | Conductive paste composition for low temperature firing |
| CN104900297A (en) * | 2014-03-07 | 2015-09-09 | 湖南利德电子浆料股份有限公司 | Copper conductive slurry for radio frequency identification (RFID) tag and preparation method thereof |
| CN105225723A (en) * | 2015-10-26 | 2016-01-06 | 东莞市圣龙特电子科技有限公司 | A kind of copper electrocondution slurry and preparation method thereof |
| CN106981324A (en) * | 2017-04-26 | 2017-07-25 | 上海安缔诺科技有限公司 | A kind of copper electrocondution slurry and its production and use |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276296A (en) * | 2020-03-05 | 2020-06-12 | 南京理工大学 | Conductive silver paste composite sintering method and device |
| CN111276296B (en) * | 2020-03-05 | 2021-08-31 | 南京理工大学 | Conductive silver paste composite sintering method and device |
| CN115642000A (en) * | 2022-12-23 | 2023-01-24 | 西北工业大学 | Preparation method of conductive copper paste capable of being subjected to photon sintering |
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| CN108550417B (en) | 2020-01-14 |
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