CN108549474B - Computer CPU heat abstractor - Google Patents
Computer CPU heat abstractor Download PDFInfo
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- CN108549474B CN108549474B CN201810340952.6A CN201810340952A CN108549474B CN 108549474 B CN108549474 B CN 108549474B CN 201810340952 A CN201810340952 A CN 201810340952A CN 108549474 B CN108549474 B CN 108549474B
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- base
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- cpu
- radiating
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a computer CPU heat dissipating device, which comprises a substrate, wherein two mounting blocks are symmetrically arranged on two sides of the substrate, a base is arranged above the substrate and between the two mounting blocks, and the two mounting blocks are movably connected with the base through movable clamping blocks and clamping grooves; the base is provided with a heat dissipation body, the heat dissipation body is provided with a mounting plate, the mounting plate is provided with a CPU mounting groove, and a water pump, a cooling water tank and a heat dissipation fin are also arranged on the mounting plate. This heat abstractor is connected through setting up draw-in groove and movable fixture block matched with, changes current structure through bolt fastening, realizes that heat abstractor dismantles fast and installs, and work efficiency is high, sets up a plurality of dustproof filter, effectively prevents that the dust from getting into the extrusion on CPU, still sets up a plurality of radiating parts, and the radiating effect is good, guarantees CPU's normal work, and the practicality is high.
Description
Technical Field
The invention relates to a desktop computer accessory, in particular to a computer CPU heat dissipation device.
Background
The CPU is a very large scale integrated circuit, and is the operation core and control core of a computer. In operation, the CPU emits a lot of heat. In order to ensure the normal operation of the CPU, a radiator is specially provided for cooling the CPU. The quality of the CPU cooling fan may even restrict the performance of the computer.
At present, a computer CPU radiator is generally fixed on a host computer through a plurality of bolt threads, and the radiator can be taken out only after the bolts are all loosened due to overlong thread rotation time, so that the radiator is long in disassembly and installation time and low in working efficiency. Furthermore, because the radiator is directly contacted with the outside, no dustproof measure is arranged, the radiator is extremely easy to extrude dust, so that the bolt is blocked, the radiator cannot be quickly disassembled, and the normal work of the CPU is also influenced. In addition, most of the existing CPU radiators are of plastic single fan structures, the number of fan blades is limited, the air outlet direction is parallel to the axis of the fan, and the radiating effect is not ideal.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention provides the computer CPU heat dissipating device, which is connected with the movable clamping block in a matched manner by arranging the clamping groove, changes the structure fixed by bolts in the prior art, realizes quick disassembly and installation of the heat dissipating device, has high working efficiency, is provided with a plurality of dustproof filtering pieces, effectively prevents dust from entering and extruding on the CPU, is also provided with a plurality of heat dissipating parts, has good heat dissipating effect, ensures the normal work of the CPU and has high practicability.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the CPU heat dissipating double-fuselage of the computer, including the base plate, the bilateral symmetry of the said base plate has two mounting blocks, and there is a base above the said base plate, and there is a limit slot in two mounting blocks, there is a spring in the said limit slot, one end of the said spring connects the limit slot, another end locates on a movable fixture block, the upper and lower ends of one side of the said movable fixture block are all connected with a horizontal cross bar extending out of the mounting block, connect a vertical connecting plate between two horizontal cross bars, there is a hand grip on the said vertical connecting plate, both sides of the said base have with two movable fixture block matched with draw-in grooves, can make two movable fixture blocks move in the two draw-in grooves straight line respectively through pressing and pulling the hand grip outward; the base is provided with a heat dissipation body, the heat dissipation body is sequentially provided with a mounting plate, a dustproof filter screen and a heat dissipation fan from bottom to top, the heat dissipation fan is used for dissipating heat of the mounting plate, the dustproof filter screen is used for preventing dust from entering the mounting plate, the bottom end of the mounting plate is provided with a cooling pipe for cooling the dust, and two ends of the cooling pipe are connected with heat dissipation pieces arranged on two sides of the heat dissipation body; be equipped with a heat conduction base on the mounting panel, the bottom of heat conduction base is provided with the cooling tube, offer the CPU mounting groove that is used for installing computer CPU on the heat conduction base, one side of heat conduction base is equipped with water pump, opposite side and connects coolant tank, the both sides of mounting panel all are equipped with a fin, water pump, coolant tank, fin all are used for the heat dissipation cooling of heat conduction base.
As the preferred technical scheme, in order to guarantee the ventilation of heat dissipation body, make CPU's heat distribute away as far as possible, be favorable to improving the radiating effect, prevent effectively that the dust from getting into simultaneously, ensure CPU's normal work and extension life-span, one side of heat dissipation body is equipped with the communicating vent of mounting panel air current, and this vent passes through the connecting pipe and connects a dustproof filter, dustproof filter inside is equipped with elementary filter screen, carbon fiber filter screen, baffle in proper order, be equipped with air filter element in the baffle.
As the preferable technical scheme, in order to increase the contact area of the radiating pipe and the heat conduction base, the heat of the heat conduction base is ensured to be radiated as far as possible, the radiating effect of the whole radiating device is further improved, the heat conduction base is arranged to be round, and the radiating pipe is arranged to be a plurality of concentric circles to encircle the bottom end of the heat conduction base.
As the preferred technical scheme, in order to ensure that the movable clamping block can be firmly clamped in the clamping groove, the stability of the radiating body and the base is ensured, the installation stability of the whole radiating device is improved, and an anti-slip pad with anti-slip patterns is arranged between the movable clamping block and the base.
Compared with the prior art, the invention has the beneficial effects that:
1. this heat abstractor is connected through setting up draw-in groove and movable fixture block matched with, changes current structure through bolt fastening, realizes that heat abstractor dismantles fast and installs, and work efficiency is high, sets up a plurality of dustproof filter, effectively prevents that the dust from getting into the extrusion on CPU, still sets up a plurality of radiating parts, and the radiating effect is good, guarantees CPU's normal work, and the practicality is high.
2. The vent is arranged on the heat dissipation body and the dustproof filtering piece is also connected, so that ventilation and ventilation of the heat dissipation body are guaranteed, heat of the CPU is emitted as far as possible, heat dissipation effect is improved, dust is effectively prevented from entering, and normal operation of the CPU is guaranteed, and service life of the CPU is prolonged.
3. The heat conduction base, the structure setting scientific and reasonable of cooling tube, increase cooling tube and heat conduction base's area of contact, guarantee as far as the heat of heat conduction base and give off, further improve whole heat abstractor's radiating effect.
4. A non-slip mat with non-slip patterns is arranged between the movable clamping block and the base, so that the movable clamping block can be firmly clamped in the clamping groove, the heat dissipation body and the base are ensured to be stable, and the installation stability of the whole heat dissipation device is improved.
Drawings
The invention is described in further detail below with reference to the drawings and the specific examples.
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic structural diagram of a heat dissipating body;
FIG. 3 is a top view of the mounting plate;
FIG. 4 is a schematic view of a filter dust;
reference numerals: 1. the base plate, 2, the installation piece, 3, the base, 4, the spacing groove, 5, the spring, 6, the slipmat, 7, movable fixture block, 8, horizontal pole, 9, vertical connecting plate, 10, handle, 11, the draw-in groove, 12, radiating body, 13, the mounting panel, 14, dustproof filter screen, 15, radiator fan, 16, cooling tube, 17, radiator piece, 18, heat conduction base, 19, cooling tube, 20, CPU mounting groove, 21, water pump, 22, coolant tank, 23, fin, 24, vent, 25, dustproof filter piece, 26, primary filter screen, 27, carbon fiber filter screen, 28, baffle, 29, air filter element.
Detailed Description
As shown in fig. 1, a specific embodiment of the present invention is proposed, the CPU heat dissipating device of the computer includes a rectangular substrate 1, two square mounting blocks 2 are symmetrically disposed on two sides of the substrate 1, a rectangular base 3 is disposed above the substrate 1 and between the two mounting blocks 2, a limiting groove 4 is disposed in each of the two mounting blocks 2, a spring 5 is sleeved in each of the limiting grooves 4, one end of the spring 5 is connected with the limiting groove 4, the other end is disposed on a movable clamping block 7, the upper end and the lower end of one side of the movable clamping block 6 are connected with a horizontal cross rod 8 extending out of the mounting block 2, a vertical connecting plate 9 is connected between the two horizontal cross rods 8, a handle 10 is disposed on the vertical connecting plate 9, and clamping grooves 11 matched with the two movable clamping blocks 7 are disposed on two sides of the base 3, so that the two movable clamping blocks 7 can be respectively linearly moved in the two clamping grooves 11 by pressing and pulling the handle 10, thereby realizing rapid installation and detachment; the base 3 is provided with a square radiating body 12, the radiating body 12 is sequentially provided with a mounting plate 13, a dustproof filter screen 14 and a radiating fan 15 from bottom to top, the radiating fan 15 is used for radiating heat of the mounting plate 13, the dustproof filter screen 14 is used for preventing dust from entering the mounting plate 13, the bottom end of the mounting plate 13 is provided with a cooling pipe 16 for cooling the mounting plate, and two ends of the cooling pipe 16 are connected with radiating pieces 17 arranged on two sides of the radiating body 12, as shown in fig. 2; the mounting plate 13 is provided with a heat conducting base 18, the bottom of the heat conducting base 18 is provided with a radiating pipe 19, the heat conducting base 18 is provided with a CPU mounting groove 20 for mounting a computer CPU, one side of the heat conducting base 18 is provided with a water pump 21, the other side is connected with a cooling water tank 22, the flow rate of the water pump 21 is small in this embodiment, two sides of the mounting plate 13 are provided with radiating fins 23, as shown in fig. 3, the water pump 21, the cooling water tank 22 and the radiating fins 23 are all used for radiating and cooling the heat conducting base 18.
One side of the heat dissipation body 12 is provided with a ventilation opening 24 communicated with the air flow of the mounting plate 13, the ventilation opening 24 is connected with a dustproof filter piece 25 through a connecting pipe, a primary filter screen 26, a carbon fiber filter screen 27 and a partition plate 28 are sequentially arranged inside the dustproof filter piece 25, an air filter element 29 is arranged in the partition plate 28, as shown in fig. 4, the ventilation opening 24 is arranged to ensure ventilation of the heat dissipation body 12, so that heat of a CPU is emitted as far as possible, the heat dissipation effect is improved, a plurality of layers of filter pieces are arranged, dust is prevented from entering effectively, normal operation of the CPU is ensured, and the service life of the CPU is prolonged.
The heat conduction base 18 is circular, the radiating pipes 19 are arranged to be a plurality of concentric circles and encircle the bottom of the heat conduction base 18, the contact area between the radiating pipes 19 and the heat conduction base 18 is increased, the heat dissipation of the heat conduction base 18 is ensured as much as possible, and the radiating effect of the whole radiating device is further improved.
The anti-slip pad 6 with anti-slip patterns is arranged between the movable clamping block 7 and the base 3, so that the movable clamping block 7 can be firmly clamped in the clamping groove 11, the stability of the heat dissipation body 12 and the base 1 is ensured, and the installation stability of the whole heat dissipation device is improved.
Of course, the above description of the preferred embodiments of the present invention is provided only with reference to the accompanying drawings, and is not intended to limit the scope of the invention, but rather to cover all equivalent modifications in terms of the principle, structure and structure of the invention.
Claims (4)
1. Computer CPU heat abstractor, its characterized in that: the device comprises a rectangular base plate (1), two square mounting blocks (2) are symmetrically arranged on two sides of the base plate (1), a rectangular base (3) is arranged above the base plate (1) and between the two mounting blocks (2), a limiting groove (4) is formed in each of the two mounting blocks (2), a spring (5) is sleeved in each of the limiting grooves (4), one end part of each spring (5) is connected with the limiting groove (4), the other end part of each spring is arranged on a movable clamping block (7), the upper end and the lower end of one side of each movable clamping block (7) are connected with a horizontal cross rod (8) extending out of the mounting block (2), a vertical connecting plate (9) is connected between the two horizontal cross rods (8), clamping grooves (11) matched with the two movable clamping blocks (7) are formed in two sides of the base (3), and the two movable clamping blocks (7) are respectively linearly moved in the two clamping grooves (11) by pressing and pulling the handles (10); the base (3) is provided with a square radiating body (12), the radiating body (12) is sequentially provided with a mounting plate (13), a dustproof filter screen (14) and a radiating fan (15) from bottom to top, the bottom end of the mounting plate (13) is provided with a cooling pipe (16) for cooling the mounting plate, and two ends of the cooling pipe (16) are connected with radiating pieces (17) arranged on two sides of the radiating body (12); the heat-conducting device is characterized in that a heat-conducting base (18) is arranged on the mounting plate (13), a radiating pipe (19) is arranged at the bottom end of the heat-conducting base (18), a CPU mounting groove (20) for mounting a CPU of a computer is formed in the heat-conducting base (18), a water pump (21) is arranged on one side of the heat-conducting base (18), a cooling water tank (22) is connected to the other side of the heat-conducting base, and radiating fins (23) are arranged on two sides of the mounting plate (13).
2. The computer CPU heat sink of claim 1 wherein: one side of the heat dissipation body (12) is provided with a vent (24) communicated with the air flow of the mounting plate (13), the vent (24) is connected with a dustproof filter piece (25) through a connecting pipe, a primary filter screen (26), a carbon fiber filter screen (27) and a partition board (28) are sequentially arranged in the dustproof filter piece (25), and an air filter element (29) is arranged in the partition board (28).
3. The computer CPU heat sink as claimed in claim 1 or 2, wherein: the heat conduction base (18) is arranged to be round, and the radiating pipes (19) are arranged to be a plurality of concentric circles and encircle the bottom end of the heat conduction base (18).
4. A computer CPU heat sink as claimed in claim 3, wherein: an anti-slip pad (6) with anti-slip patterns is arranged between the movable clamping block (7) and the base (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810340952.6A CN108549474B (en) | 2018-04-17 | 2018-04-17 | Computer CPU heat abstractor |
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CN201810340952.6A CN108549474B (en) | 2018-04-17 | 2018-04-17 | Computer CPU heat abstractor |
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CN108549474A CN108549474A (en) | 2018-09-18 |
CN108549474B true CN108549474B (en) | 2023-09-19 |
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CN201810340952.6A Active CN108549474B (en) | 2018-04-17 | 2018-04-17 | Computer CPU heat abstractor |
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CN113504820B (en) * | 2021-07-06 | 2024-10-18 | 研华科技(中国)有限公司 | CPU heat dissipation device of industrial personal computer and use method |
Citations (5)
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KR20010069288A (en) * | 2001-03-02 | 2001-07-25 | 김형건 | Heat dissipating device for central processing unit |
KR20140049292A (en) * | 2012-10-17 | 2014-04-25 | 이광로 | Cooler device of filter evaporation style |
CN205507666U (en) * | 2015-12-21 | 2016-08-24 | 广西利泰电子技术有限公司 | Computer radiating device |
CN206788696U (en) * | 2017-03-22 | 2017-12-22 | 连江大农环保科技有限公司 | A kind of Evapotranspiration heat type computer motherboard |
CN208298102U (en) * | 2018-04-17 | 2018-12-28 | 钦州学院 | Heat radiator of computer CPU |
-
2018
- 2018-04-17 CN CN201810340952.6A patent/CN108549474B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010069288A (en) * | 2001-03-02 | 2001-07-25 | 김형건 | Heat dissipating device for central processing unit |
KR20140049292A (en) * | 2012-10-17 | 2014-04-25 | 이광로 | Cooler device of filter evaporation style |
CN205507666U (en) * | 2015-12-21 | 2016-08-24 | 广西利泰电子技术有限公司 | Computer radiating device |
CN206788696U (en) * | 2017-03-22 | 2017-12-22 | 连江大农环保科技有限公司 | A kind of Evapotranspiration heat type computer motherboard |
CN208298102U (en) * | 2018-04-17 | 2018-12-28 | 钦州学院 | Heat radiator of computer CPU |
Non-Patent Citations (2)
Title |
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中心机房计算机主机箱的散热设计与实现;祁桂兰;董洋溢;李煜;;制造业自动化(第12期);全文 * |
盛夏里的一席清凉大餐 暑期中高端散热器方案全攻略;木月;;大众硬件(第07期);全文 * |
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