CN108538733A - Sensor package coating unit and the sensor package manufactured using it - Google Patents
Sensor package coating unit and the sensor package manufactured using it Download PDFInfo
- Publication number
- CN108538733A CN108538733A CN201810171683.5A CN201810171683A CN108538733A CN 108538733 A CN108538733 A CN 108538733A CN 201810171683 A CN201810171683 A CN 201810171683A CN 108538733 A CN108538733 A CN 108538733A
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- packaging part
- coating
- sensor package
- resin
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- 238000000576 coating method Methods 0.000 title claims abstract description 145
- 239000011248 coating agent Substances 0.000 title claims abstract description 144
- 238000004806 packaging method and process Methods 0.000 claims abstract description 120
- 229920005989 resin Polymers 0.000 claims abstract description 118
- 239000011347 resin Substances 0.000 claims abstract description 118
- 239000000945 filler Substances 0.000 claims abstract description 60
- 238000009434 installation Methods 0.000 claims abstract description 25
- 238000005538 encapsulation Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 230000005489 elastic deformation Effects 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 13
- 239000000758 substrate Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005057 finger movement Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
A kind of sensor package coating unit of offer of the present invention and the sensor package for utilizing it to manufacture, which is characterized in that including：Upper mold is formed with resin filling slot open downwards, and is filled with resin filler in the resin filling slot below；Lower mold, is combined with the upper mold, and installation fixing groove open upwards is formed with above；And film portion, the resin filling slot is sealed between the upper mold and lower mold by being configured at, and there is coating；Wherein, the resin filler applies heat and pressure to the film portion, also, by the coating transfer to being mounted on the first sensor packaging part of the installation fixing groove.
Description
Technical field
The sensor package manufactured the present invention relates to sensor package coating unit and using it, more specifically,
The phenomenon that by preventing misalignment or coating from luming, forms the sensor package coating of the coating with uniform thickness
Device and the sensor package manufactured using it.
Background technology
Semiconductor chip as the integrated circuit being made of semiconductor is setting substantially of using in electronic equipment of various
It is standby, pass through the series of process of such as chip on board (COB), wafer-level packaging part (WLP) and flat-four-side packaging part (QFP) etc
To be packaged.
Above-mentioned semiconductor chip is used as the fingerprint sensor in the electronic equipments such as mobile terminal, PDA, tablet computer.And
And in recent years, fingerprint sensor is had increasing need for as input equipment technology.
Fingerprint sensor can be manufactured to include peripheral components or the modular type sensor package of structure, therefore can be with
It is effectively mounted on various electronic equipments.Sensor package with above-mentioned fingerprint sensor is divided into capacitance according to type
Formula, optical profile type, ultrasonic type, heat-sensitive type and noncontacting proximity sensor packaging part etc..In recent years, it is excellent that sensitivity is widely used
It is different, the variation of anti-external environment it is relatively strong and with the capacitance type sensor packaging part of electronic equipment excellent compatibility.
The sensor packaging part is provided with coating and makes from outer protection fingerprint sensor.Wherein, existing sensor envelope
Included coating is arranged by spraying method or method for printing screen on the top of sensor package in piece installing.
However, the problem of this spraying method or method for printing screen, is, and during compo, the face of coating
According to mixed proportion or external environmental factor (temperature, humidity etc.) deviation occurs for color.
If in addition, by spraying method or method for printing screen come the top of sensor package formed coating when,
The marginal portion of coating may there is a phenomenon where coating to lump.
Due to above-mentioned problem, exist in the state of have adhesive linkage between sensor package and coating, to bonding
Layer is heated the method for engaging sensor package with coating, but the manufacturing process of sensor package in this case
It is complicated and there are problems that due to adhesive linkage and the thickness of sensor package thickens.
Invention content
The present invention proposes that the object of the present invention is to provide one kind is logical to solve aforementioned problem of the prior art
It spends the phenomenon that preventing misalignment or coating from luming to come, the sensor package for forming the coating with uniform thickness is filled with coating
The sensor package set and manufactured using it.
In order to solve the above-mentioned technical problem, one embodiment of the invention provides a kind of sensor package coating unit,
It is characterised in that it includes：Upper mold is formed with resin filling slot open downwards, and is filled out in the resin filling slot below
Filled with resin filler；Lower mold, is combined with the upper mold, and installation fixing groove open upwards is formed with above；And
Film portion seals the resin filling slot by being configured between the upper mold and lower mold, and has coating；Wherein,
The resin filler applies heat and pressure to the film portion, also, the coating transfer is described to being mounted on
On the first sensor packaging part for installing fixing groove.
In one embodiment of this invention, the width w1 in the film portion can be formed wider than the upper mold and lower die
The width w2 of tool.
In one embodiment of this invention, it could be formed with to the first sensor in the bottom surface of the installation fixing groove
Packaging part carries out installing fixed multiple suckings.
In one embodiment of this invention, the film portion, including：Film layer passes through the pressurization of the resin filler
Carry out elastic deformation；And coating, it is set to below the film layer and is transferred to the first sensor packaging part；Wherein,
The film layer and coating can be by release processing.
In one embodiment of this invention, the height h of the installation fixing groove can be formed as being equal to or higher than described the
The thickness of one sensor package.
In one embodiment of this invention, according to the thickness of the first sensor packaging part can selectivity adjusting fill out
It fills in the loading of the resin filler of the resin filling slot.
In one embodiment of this invention, the film portion is configured to, in the film portion entirely through described
The pressurization of resin filler and in the state of the upper surface of being tightly attached to the first sensor packaging part, by the coating transfer to institute
State the upper surface of first sensor packaging part.
In one embodiment of this invention, it can be set along the perimeter of the resin filling slot below the upper mold
It is equipped with sealing.
In one embodiment of this invention, the upper mold can be heated to be and put into described in the resin filling slot
The temperature of resin filler compares lower temperature.
In one embodiment of this invention, it can be passed to being mounted on block-like described the first of the installation fixing groove
The encapsulation part of sensor packaging part carries out ladder processing.
In one embodiment of this invention, the coating can be transferred to the upper surface of described encapsulation part and side.
In one embodiment of this invention, being formed with the block-like first sensor packaging part of the coating can lead to
It crosses Cutting Process and is manufactured into multiple second sensor packaging parts.
Another embodiment of the present invention provides a kind of sensor package coating unit, which is characterized in that including：Upper mold
Tool, is formed with flat pressurized plane below；Lower mold, is combined with the upper mold, and tree open upwards is formed with above
Fat filling slot, and it is filled with resin filler in the resin filling slot；Release film portion seals the resin filling slot and upper
Face is equipped with first sensor packaging part；And film portion, it is configured between the upper mold and lower mold and there is coating；Its
In, the resin filler applies heat and pressure to the first sensor packaging part, and by the coating transfer to institute
State the upper surface of first sensor packaging part.
One embodiment of the invention provides a kind of sensor package manufactured with coating unit by sensor package.
Sensor package according to the present invention coating unit and sensor package for manufacture using it are with as follows
Effect：
According to the present invention, there is uniform thickness with the sensor package that coating unit manufactures by sensor package
Coating.Therefore, in fingerprint recognition, uniform sensing sensitivity can all be provided in any position of sensor package.
Also, the coating knot of coating does not occur for the sensor package manufactured with coating unit by sensor package
The problem of the phenomenon that block and misalignment etc..
According to the present invention, since sensor package is not provided with individual adhesive linkage, so the thickness of sensor package
Degree can be minimized.
The present invention effect be not limited to said effect, and be understood to include can be from detailed description of the invention or hair
The institute of the structure inference of the present invention recorded in bright protection domain is effective.
Description of the drawings
Fig. 1 is the schematic diagram for the first sensor packaging part for showing an embodiment according to the present invention.
Fig. 2 is the signal of the manufacturing process for the second sensor packaging part for briefly showing an embodiment according to the present invention
Figure.
Fig. 3 is the stereogram for the sensor package coating unit for showing an embodiment according to the present invention.
Fig. 4 shows the exploded perspective view of the sensor package coating unit of an embodiment according to the present invention.
Fig. 5 is the diagrammatic cross-section for the sensor package coating unit for showing an embodiment according to the present invention.
Fig. 6 is the signal for the process for showing that film layer is detached from the sensor package of an embodiment according to the present invention
Figure.
Fig. 7 is the diagrammatic cross-section for showing sensor package coating unit according to another embodiment of the present invention.
Fig. 8 is the artwork of the manufacturing process for the second sensor packaging part for showing an embodiment according to the present invention.
Fig. 9 is the schematic diagram for the second sensor packaging part for showing an embodiment according to the present invention.
Figure 10 is the manufacture with block-like first sensor packaging part shown according to another embodiment of the present invention
The schematic diagram of journey.
Figure 11 is to briefly show the manufacturing process of second sensor packaging part according to another embodiment of the present invention to show
It is intended to.
Symbol description
10、10':First sensor packaging part 20,20':Second sensor packaging part
100、100':Upper mold 101,203:Resin filling slot
120、210:Resin input port 200,200':Lower mold
201:Fixing groove 202 is installed:Sucking
300:Film portion 310:Film layer
320:Coating 400:Release film portion
1000、1100:Sensor package coating unit F:Resin filler
Specific implementation mode
The present invention is more fully described below with reference to accompanying drawings, wherein exemplary embodiment of the present invention quilt in the accompanying drawings
It shows.However, the present invention can realize in many different forms, and it should not be construed as limited to the reality illustrated at this
Apply example.In the accompanying drawings, in order to illustrate simplicity, the part unrelated with description is omitted, and identical label indicates phase always
Same element.
Throughout the specification, certain a part with another part phase " connection " when, not only including " being directly connected to " the case where,
Further include having the case where other elements " being indirectly connected with " in centre.Also, works as and be expressed as certain part " comprising " structural element
When, it unless there are especially opposite record, does not otherwise indicate that and excludes other structures element, but indicate to further comprise other knots
Structure element.
Before the present invention will be described, in order to illustrate the present invention, incited somebody to action by sensor package coating unit
Sensor package before coating transfer to the upper surface of sensor package is known as first sensor packaging part, and passes through biography
Sensor package after the upper surface of coating transfer to sensor package is known as second by sensor packaging part with coating unit
Sensor package.
The embodiment that the present invention is more fully described below with reference to accompanying drawings.
Fig. 1 is the schematic diagram for the first sensor packaging part for showing an embodiment according to the present invention.
Referring to Fig.1, first sensor packaging part 10 includes substrate 1, sensor portion 2 and encapsulation part 3.
Aforesaid substrate 1 is the substrate that can be transmission telecommunications number information.That is, substrate 1 can be printed circuit board (PCB) or
Flexible printed circuit board (FPCB).
Also, sensor portion 2 is set on substrate 1 and the top of sensor portion 2 is provided with detecting part 4.
Detecting part 4 senses the biological information of such as finger print information.
Detecting part 4 can have sensor pixel.Above-mentioned sensor pixel can have it is variously-shaped, for example, sensor pixel can
With with the sensing region of array morphologic arrangement.
Also, sensor portion 2 can be capacitive fingerprint sensor, and detecting part 4 can be formed with user's finger
Capacitance.In this case, each pixel of detecting part 4 forms capacitance relative to the finger of user.Above-mentioned detecting part 4 passes through survey
The size for measuring capacitance is come, and the capacitance difference in the fingerprint on respective pixel top according to user's finger can be measured.
Therefore, whether the finger of the sensing of sensor portion 2 user is close or the capacitance caused by the finger movement of user becomes
Change, and senses the finger print of contact or the user being closely spaced.
Also, sensor portion 2 can have the function of the life of fingerprint sensing and pointer operation function for sensing fingerprint
Object measures track pad (BTP).In addition, sensor portion 2 can have finger whether close or user hand of the detection according to user
Refer to mobile input information or static capacity, and the pointer of such as cursor etc. is carried out based on the movement by mobile pointer operation
Function.
The configuration of above-mentioned detecting part 4 is only exemplary, and detecting part 4 is not limited to have matching for above-mentioned sensor pixel
It sets, but can configure otherwise.
In addition, encapsulation part 3 is set on substrate 1 to cover sensor element 2.Above-mentioned encapsulation part 3 covers substrate 1 and sensing
Device portion 2 is to protect various electronic units.Encapsulation part 3 can be made of epoxy molding material, but not limited to this.
In addition, sensor portion 2 may be electrically connected to substrate 1.Sensor portion 2 and substrate 1 can be electrically connected by various modes
It connects, but is illustrated for being electrically connected sensor portion 2 and substrate 1 by closing line 5 below.
Sensor portion 2 and substrate 1 can be electrically connected by closing line 5.Here, closing line 5 by the electrode of sensor portion 2 with
The electrode of substrate 1 is electrically connected.Above-mentioned closing line 5 can be packaged the covering of portion 3.
For example, when sensor portion 2 is fingerprint sensor, closing line 5 sends drive signal to the finger of user.Also,
Sensor portion 2 receives the finger print information of the user's finger in response to the drive signal transmitted from closing line 5.Here, closing line 5 can
To be gold thread, but not limited to this.
In this way, by sensor package with coating unit 1000 (with reference to Fig. 3), first sensor packaging part 10 can be made
It makes to be formed with the second sensor packaging part 20 of coating 320 (referring to Fig. 9) (referring to Fig. 9).
Fig. 2 is the signal of the manufacturing process for the second sensor packaging part for briefly showing an embodiment according to the present invention
Figure, Fig. 3 is the stereogram for the sensor package coating unit for showing an embodiment according to the present invention, and Fig. 4 shows basis
The exploded perspective view of the sensor package coating unit of one embodiment of the invention, Fig. 5 are to show according to the present invention one
The diagrammatic cross-section of the sensor package coating unit of embodiment, Fig. 6 are to show that film layer is real from according to the present invention one
Apply the schematic diagram of the process of the sensor package separation of example.
As shown in Figures 2 to 6, sensor package coating unit 1000 includes upper mold 100, lower mold 200 and applies
Film portion 300.
Resin filling slot 101 is formed with below upper mold 100.Above-mentioned resin filling slot 101 is open downwards.By
This, resin filler F is in the state of being filled in resin filling slot 101, the film portion of the lower part to being configured at upper mold 100
300 pressurize.
Here, pressure needed for film portion 300 and being mounted on the first sensor packaging part 10 of lower mold 200
Thickness etc., can selectivity adjusting be filled in resin filling slot 101 resin filler F loading.
Above-mentioned resin filler F can be epoxy resin.At this point, resin filler F is not limited to epoxy resin, and can
To use any resin material for film portion 300 of pressurizeing.
Above-mentioned resin filler F can be put to resin filling by the resin input port 120 for being arranged in upper mold 100
Slot 101.At this point, resin filler F is filled into while being heated to predetermined temperature in resin filling slot 101.
Also, the holding of upper mold 100 is heated to predetermined temperature or higher state.Therefore, upper mold 100 prevents from filling
In the rapid curing of the resin filler F of resin filling slot 101.It is filled out at this point, the temperature of upper mold 100 is preferably formed as being less than
The temperature in the resin filler F of resin filling slot 101 is filled, to be transferred to first sensor packaging part 10 in coating 320
The upper surface of it is upper after, solidified resin filler F.
Also, sealing can be further provided with along the periphery of resin filling slot 101 below upper mold 100
(not shown).
Above-mentioned sealing prevents resin filler F from leaking into the outside of upper mold 100.That is, in upper mold 100 and lower mold
In the state that 200 are bonded to each other, sealing be thoroughly blocked between upper mold portion 100 and film portion 300 it is issuable it is small between
Gap.Therefore, it can prevent the resin filler F for being filled in resin filling slot 101 from leaking into outside upper mold 100 by sealing
Portion.
In addition, lower mold 200 is arranged in the lower part of upper mold 100.Above-mentioned lower mold 200 and upper mold 100 are in a pair simultaneously
It is combined with upper mold 100.Lower mold 200 together fixes film portion 300 with upper mold 100.
Installation fixing groove 201 is formed on the upper surface of above-mentioned lower mold 200.Above-mentioned installation fixing groove 201 have to
The form of upper opening.
Also, it is formed with multiple suction holes 202 in the bottom surface of installation fixing groove 201.Above-mentioned sucking 202 do not shake it is solid
First sensor packaging part 10 of the Dingan County mounted in installation fixing groove 201.That is, sucking 202 is connected to suction unit (figure
In be not shown), from there through the suction force generated from suction unit come be fixedly mounted on installation fixing groove 201 first sensor
Packaging part 10.
Wherein, multiple suckings 202 can be arranged in installation fixing groove 201.Therefore, sucking 202 can be installed on
First sensor packaging part 10 is independently fixed to installation admittedly by the size for installing the first sensor packaging part 10 of fixing groove 201
Determine slot 201.At this point, suction unit can provide suction force to all multiple suckings 202, and can be only selectively one
A little suckings 202 provide suction force.For example, suction unit controlled according to the size selectivity of first sensor packaging part 10 it is every
The suction force of a sucking 202.
The height h of above-mentioned installation fixing groove 201 can be formed as the thickness equal to or higher than first sensor packaging part 10.
Therefore, film portion 300 is being pacified in the state that flexible deformation occurs within a predetermined range by the pressurization of resin filler F
The upper surface of first sensor packaging part 10 loaded on installation fixing groove 201 forms uniform coating 320.
In addition, film portion 300 includes film layer 310 and coating 320.At this point, film layer 310 can be being capable of predetermined elasticity
The film of deformation.
Also, coating 320 is arranged below film layer 310.Film portion with above-mentioned film layer 310 and coating 320
300 can be manufactured by individual coating process.
Wherein, the width w1 in film portion 300 is formed wider than the width w2 of upper mold 100 and lower mold 200.
This is the edge in order in the manufacturing process in film portion 300, prevent from being present in the form of caking coating 320
Coating 320 is transferred to first sensor packaging part 10.Therefore, the coating 320 with uniform thickness can be transferred to the first biography
The upper surface of sensor packaging part 10.
As noted previously, as the coating 320 in the upper surface of first sensor packaging part 10 is arranged with uniform thickness, institute
In fingerprint recognition, uniform sensing sensitivity is capable of providing at any position in sensor package.Therefore
Sensor package correctly identifies fingerprint.
Also, the coating 320 below film layer 310, which is arranged, can be formed as single-layer or multi-layer.Above-mentioned coating 320
It is configured to color or transparent.Certainly, coating 320 can be with the various forms of such as gloss coating or matt coating etc.
It is formed.
To manufacturing second sensor packaging part 20 by the sensor packaging part coating unit 1000 (with reference to Fig. 8)
Process is described as follows：First, by 10 position of first sensor packaging part in the installation fixing groove 201 of lower mold 200.
Then, suction unit provides suction force to sucking 202 and is fixedly installed in the first sensing of installation fixing groove 201
Device packaging part 10.
Then, film portion 300 is moved between upper mold 100 and lower mold 200.At this point, being arranged in film portion 300
Coating 320 is configured as facing lower mold 200, to be transferred to the upper surface of first sensor packaging part 10.
Then, upper mold 100 and lower mold 200 is made to combine.At this point, being configured between upper mold 100 and lower mold 200
Film portion 300 is fixed by upper mold 100 and lower mold 200.
Then, the resin filler F that would be heated to predetermined temperature is put into resin input port 120.In this way, putting into tree
Resin filler F in fat input port 120 is filled into resin filling slot 101.Wherein, the resin filling slot of downward evolution
101 are sealed by film portion 300, and thus resin filler F can be filled in resin filling 101.
Then, the resin filler F being filled into resin filling slot 101 with predetermined amount of resin adds film portion 300
It presses and the coating 320 for being arranged in 310 lower part of film layer is transferred to the upper surface of first sensor packaging part 10.
That is, resin filler F applies heat and pressure to film portion 300 and coating in 300 lower part of film portion will be arranged
320 are transferred to the upper surface of first sensor packaging part 10.
Here, film portion 300 is elastically deformed within a predetermined range by the pressurization of resin filler F.Film portion 300
It is whole be uniformly tightly attached to 10 states above of first sensor packaging part under, realize the transfer of coating 320.It therefore, can be with
Uniform coating 320 is formed in the upper surface of first sensor packaging part 10.
As described above, film portion 300 is configured to flexible deformation within a predetermined range and coating 320 is transferred to the first sensing
The upper surface of device packaging part 10, even if being thus installed on the thickness of the first sensor packaging part 10 of installation fixing groove 201 in the presence of poor
It is different (thin or thick), uniform coating 320 can also be formed in the upper surface of first sensor packaging part 10.Here, installation fixing groove
The 201 highly preferred thickness be formed as equal to or higher than first sensor packaging part 10.
As described above, the resin filler F that coating 320 is transferred to first sensor packaging part 10 is gradually cured.
Here, the width w1 in film portion 300 of the configuration between upper mold 100 and lower mold 200 is formed wider than upper mold
The width w2 of tool 100 and lower mold 200, and the coating 320 for being present in the edge of coating 320 in the form of caking is prevented to be transferred to
First sensor packaging part 10.Thus, it is possible to form the coating with uniform thickness in the upper surface of first sensor packaging part 10
320。
Then, upper mold 100 and lower mold 200 are detached.
At this point, the film layer 310 and coating 320 in film portion 300 be by release processing, therefore can be encapsulated from second sensor
Part 20 can be easily separated film layer 310.
Then, in the state of removing the suction force of sucking 202, will have and be mounted on installation fixing groove 201
In coating 320 second sensor packaging part 20 from lower mold 200 detach.
Then, the resin filler F being hardened in resin filling slot 101 is detached from upper mold 100.At this point, due to resin
The medial surface of filling slot 101 can will be hardened in the resin filler F being hardened in resin filling slot 101 by release processing
It can be easily separated from resin filling slot 101.Certainly, the resin filler F of the solid state detached from upper mold 100 can heated
It puts into again in resin input port 120 later.
Then, it repeats the above process to continuously generate another second sensor packaging part 20.
As described above, it is different from existing sensor package, it is manufactured by sensor package coating unit 1000
Second sensor packaging part 20 without there is a phenomenon where the misalignment of coating or coating caking.
Also, company can be passed through by the second sensor packaging part 20 that sensor package coating unit 1000 manufactures
Continuous manufacturing process batch production.Therefore, the manufacturing time of second sensor packaging part 20 can be shortened.
Fig. 7 is the diagrammatic cross-section for showing sensor package coating unit according to another embodiment of the present invention,
The constituent element function having the same of being indicated by reference numeral identical with Fig. 1 to Fig. 6, therefore its detailed description will be omitted.
As shown in fig. 7, sensor package coating unit 1100 according to second embodiment is in lower mold 200' shapes
At there is resin filling slot 203.
The sensor packaging part with coating unit 1100 include upper mold 100', lower mold 200', film portion 300 and from
Type film portion 400.
Here, resin filling slot is not formed in upper mold 100'.It is formed with below above-mentioned upper mold 100' uniformly
The flat pressurized plane 102 in ground pressurization film portion 300.Therefore, it is transferred on first sensor packaging part 10 by pressurized plane 102
The coating 320 in face can have uniform flatness.
For example, being formed in upper mold in coating unit 1000 in sensor package according to above-mentioned first embodiment
100 resin filling slot 101 is filled with resin filler F.At this point, the resin filler F being filled in resin filling slot 101 is straight
It connects and film portion 300 pressurize and coating 320 is transferred to the upper surface of first sensor packaging part 10.
In sensor package as described above in coating unit 1000, resin filler F can be by 320 turns of coating
It is cured in print to 10 process above of first sensor packaging part.At this point, in the solidification process of resin filler F, it may
The flowing of resin filler F occurs, and the flowing of above-mentioned resin filler F can influence to be transferred on first sensor packaging part 10
The flatness of the coating 320 in face.
In contrast, it is arranged so as to set according to the sensor package coating unit 1100 of the second embodiment of Fig. 7
The not direct weighting film portions 300 fat filler F.That is, resin filler F, which is configured to pressurization, is installed on release film portion 400
Below first sensor packaging part 10 above.
As described above, the first sensor packaging part 10 being pressurized by resin filler F is to being configured thereon that the film in portion
Portion 300 is heated and is pressurizeed, and coating 320 is transferred to the upper surface of first sensor packaging part 10.
Even if generating the flowing of resin filler F in the solidification process of resin filler F, the sensor packaging part is used
The coating 320 being transferred to above first sensor packaging part 10 in coating unit 1100 is not also affected.
As described above, the flowing of resin filler F does not interfere with sensor package coating according to second embodiment
The flatness of coating 320 in device 1100, and coating 320 is carried out by the flat pressurized plane 102 of upper mold 100'
Pressurization, the flatness for the coating 320 being thus transferred to above first sensor packaging part 10 can be improved.
In particular, in the case where coating 320 is gloss coating, sensor package coating according to second embodiment
Device 1100 is encapsulated with the second sensor manufactured by sensor package according to first embodiment coating unit 1000
Part 20 is compared to the luster effect that can have the coating 320 further improved.
In addition, the resin filling slot 203 that the top for being formed with downward mold 200' in the upper surface of lower mold 200' opens.On
It states resin filling slot 203 and is filled with resin filler F.
As described above, the resin filler F being filled in resin filling slot 203 will be installed on above release film portion 400
First sensor packaging part 10 pressurizes to 300 side of film portion for being configured at 10 top of first sensor packaging part.
Here, the resin filling slot 203 that the top of mold 200' opens downwards is sealed by release film portion 400.It is above-mentioned from
Type film portion 400 prevents resin filler F from leaking into the outside of resin filling slot 203.That is, release film portion 400 is used as containment member.
Above-mentioned release film portion 400 is configured to separation first sensor packaging part 10 and resin filler F so that operator can
Can be easily separated the second sensor encapsulation on first sensor packaging part 10 transferred with coating 320 from release film portion 400
Part 20.
As described above, in the state that upper mold 100' and lower mold 200' are bonded to each other, it is heated to the tree of predetermined temperature
Fat filler F is put to resin filling slot 203 and coating 320 is transferred to the upper surface of first sensor packaging part 10.
Specifically, the resin filler F for being heated to predetermined temperature is put into resin filling slot 203, and passed to first
First sensor packaging part 10 is heated while pressurization below sensor packaging part 10.By the of resin filler F heating
One sensor package 10 to coating 320 pressurize and coating 320 is transferred to the upper surface of first sensor packaging part 10.
Here, being provided with resin input port 210 in lower mold 200', thus resin filler F can put into resin and fill out
It fills in slot 203.Above-mentioned resin input port 210 can be arranged in each position of lower mold 200'.
Fig. 8 is the artwork of the manufacturing process for the second sensor packaging part for showing an embodiment according to the present invention, Fig. 9
For show an embodiment according to the present invention second sensor packaging part schematic diagram.
As shown in Figure 8 and Figure 9, the formation manufactured by sensor package coating unit 1000 and 1100 has coating
320 second sensor packaging part 20 can be single sensor package or can be block-like sensor envelope as shown in Figure 8
Piece installing.
Wherein, block-like sensor package is fabricated to single second sensor packaging part 20 by Cutting Process.
Figure 10 is the manufacture with block-like first sensor packaging part shown according to another embodiment of the present invention
The schematic diagram of journey, Figure 11 are the manufacturing process for briefly showing second sensor packaging part according to another embodiment of the present invention
Schematic diagram.The constituent element function having the same of being indicated by reference numeral identical with Fig. 1 to Fig. 9, therefore it will be omitted in detail
Thin description.
Referring to Fig.1 0, block-like first sensor packaging part 10 is according to the second sensor packaging part 20''s finally manufactured
Size is processed by ladder.Wherein, ladder processing can be the processing for encapsulation part 3.Above-mentioned first sensor packaging part 10
Ladder processing can be executed by NC, CNC and laser processing etc..
The above-mentioned first sensor packaging part 10' processed by ladder by sensor package coating unit 1000,
1100 could be formed with coating 320.
1 pair of process that coating 320 is formed on first sensor packaging part 10' illustrates referring to Fig.1.It first, will be by
The block-like first sensor packaging part 10' of ladder processing is installed in installation fixing groove 201 or release film portion 400.
Then, film portion 300 is moved between upper mold 100 and lower mold 200.
Then, the coating 320 in film portion 300 is transferred to first sensor packaging part 10'.At this point, coating 320 is transferred to
The upper surface of first sensor packaging part 10' being formed by bending and side.That is, coating 320 is transferred to the upper surface of encapsulation part 3 and passes through
The side for the encapsulation part 3 that ladder processing is exposed.
Then, the first sensor packaging part 10' for being formed with coating 320 is fabricated to single second sensing by Cutting Process
Device packaging part 20'.
Not only in the upper surface of encapsulation part 3 and on the side of encapsulation part 3, also formation applies above-mentioned second sensor packaging part 20'
Layer 320 so that durability, chemical resistance, resistance to makeup moral character and anti-finger printing of second sensor packaging part 20' etc. can obtain
Improve.
Above-mentioned second sensor packaging part 20,20' can be arranged in such as mobile phone, smart mobile phone, PDA, tablet electricity
In the electronic equipment of brain, laptop and portable recorder (MP3 player) etc..Above-mentioned second sensor packaging part 20,
20' can be with the biometric sensor packaging part for measuring biological information function, and but the invention is not restricted to this, can also
It is the sensor package with other function.
However, this is only preferred one embodiment of the present invention, the present invention is not limited to the embodiments.
The explanation of the above-mentioned present invention is only illustrative, as long as the ordinary skill people of the technical field of the invention
Member can understand in the case where not changing the technological thought or essential feature of the present invention, it is specific to be also deformed into other easily
Form.Therefore, embodiment described above is only in all respects illustrative, and however, it is not limited to this.For example, as single type
Each structure member illustrated can also disperse to be implemented, equally, also can be with using the structure member of dispersion illustrated
In conjunction with form implemented.
The scope of the present invention is indicated by the appended claims, and not by above-mentioned detailed description, and by
The meaning, range and its derived form for having altered or deforming of impartial concept of claims should be interpreted that and be included in this hair
In bright range.
Claims (14)
1. a kind of sensor package coating unit, which is characterized in that including：
Upper mold is formed with resin filling slot open downwards, and is filled filled with resin in the resin filling slot below
Agent；
Lower mold, is combined with the upper mold, and installation fixing groove open upwards is formed with above；And
Film portion seals the resin filling slot by being configured between the upper mold and lower mold, and has coating；
Wherein, the resin filler applies heat and pressure to the film portion, also, the coating transfer is solid to installing
Due on the first sensor packaging part of the installation fixing groove.
2. sensor package coating unit according to claim 1, which is characterized in that the width shape in the film portion
As being wider than the width of the upper mold and lower mold.
3. sensor package coating unit according to claim 1, which is characterized in that in the installation fixing groove
Bottom surface, which is formed with, to carry out the first sensor packaging part to install fixed multiple suckings.
4. sensor package coating unit according to claim 1, which is characterized in that
The film portion, including：
Film layer carries out elastic deformation by the pressurization of the resin filler；And
Coating is set to below the film layer and is transferred to the first sensor packaging part；
Wherein, the film layer and coating are by release processing.
5. sensor package coating unit according to claim 1, which is characterized in that the height of the installation fixing groove
Degree is formed as the thickness equal to or higher than the first sensor packaging part.
6. sensor package coating unit according to claim 5, which is characterized in that according to the first sensor
The adjusting of the thickness selectivity of packaging part is filled in the loading of the resin filler of the resin filling slot.
7. sensor package coating unit according to claim 1, which is characterized in that the entirety in the film portion
In the state that the upper surface of described first sensor packaging part is tightly attached in the pressurization of the resin filler, by the coating
It is transferred to the upper surface of described first sensor packaging part.
8. sensor package coating unit according to claim 1, which is characterized in that below the upper mold
The perimeter of the resin filling slot is provided with sealing.
9. sensor package coating unit according to claim 1, which is characterized in that the upper mold be heated to be with
It puts into the temperature of the resin filler of the resin filling slot and compares lower temperature.
10. sensor package coating unit according to claim 1, which is characterized in that described to being mounted on
The encapsulation part for installing the block-like first sensor packaging part of fixing groove carries out ladder processing.
11. sensor package coating unit according to claim 10, which is characterized in that the coating transfer to institute
State the upper surface of encapsulation part and side.
12. sensor package coating unit according to claim 1, which is characterized in that be formed with the coating
The block-like first sensor packaging part is manufactured into multiple second sensor packaging parts by Cutting Process.
13. a kind of sensor package coating unit, which is characterized in that including：
Upper mold is formed with flat pressurized plane below；
Lower mold, is combined with the upper mold, resin filling slot open upwards is formed with above, and fill in the resin
Slot is filled with resin filler；
Release film portion seals the resin filling slot and has first sensor packaging part installed above；And
Film portion is configured between the upper mold and lower mold and has coating；
Wherein, the resin filler applies heat and pressure to the first sensor packaging part, and the coating is turned
Print is the upper surface of to the first sensor packaging part.
14. a kind of sensor package, which is characterized in that pass through sensor according to any one of claim 1 to 13
Packaging part is manufactured with coating unit.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0027158 | 2017-03-02 | ||
| KR20170027158 | 2017-03-02 | ||
| KR10-2017-0044694 | 2017-04-06 | ||
| KR1020170044694A KR101981247B1 (en) | 2017-03-02 | 2017-04-06 | Coating apparatus for sensor package |
| KR10-2018-0015582 | 2018-02-08 | ||
| KR1020180015582A KR102089620B1 (en) | 2017-03-02 | 2018-02-08 | Coating apparatus for sensor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108538733A true CN108538733A (en) | 2018-09-14 |
| CN108538733B CN108538733B (en) | 2021-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810171683.5A Expired - Fee Related CN108538733B (en) | 2017-03-02 | 2018-03-01 | Coating device for sensor package and sensor package manufactured using same |
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| CN (1) | CN108538733B (en) |
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| CN111668166A (en) * | 2019-03-08 | 2020-09-15 | Tdk株式会社 | Assembly of laminated elements and method for manufacturing same |
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| CN108538733B (en) | 2021-06-11 |
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