CN108527744B - 基于微流芯片的可控纳米材料合成反应器 - Google Patents

基于微流芯片的可控纳米材料合成反应器 Download PDF

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CN108527744B
CN108527744B CN201710134012.7A CN201710134012A CN108527744B CN 108527744 B CN108527744 B CN 108527744B CN 201710134012 A CN201710134012 A CN 201710134012A CN 108527744 B CN108527744 B CN 108527744B
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pdms
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CN108527744A (zh
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刘国华
殷然
张姗
李逸君
方欢
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Nankai University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/003Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor characterised by the choice of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/16Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/34Component parts, details or accessories; Auxiliary operations
    • B29C41/38Moulds, cores or other substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/756Microarticles, nanoarticles

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  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
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Abstract

本发明主要研究了微流控技术在纳米合成领域的应用,本项目介绍的是为得到大小可控的纳米颗粒,利用微流沟道的独特物理特性,通过改变微流沟道的形态设计使反应液的有效混合,从而能够以更高的效率合成纳米粒子,实现纳米材料的可控合成的反应器。以纳米银颗粒的合成为例,对不同的反应溶液浓度及比例合成的纳米材料进行吸收光谱分析和TEM分析表明,该银纳米颗粒的平均直径可由反应试剂浓度控制。

Description

基于微流芯片的可控纳米材料合成反应器
技术领域
本发明实现了微流控技术在纳米合成领域的应用,介绍的是为得到大小可控的纳米颗粒,利用微流沟道的独特物理特性,通过改变微流沟道的物理特性使反应液的有效混合,从而能够以更高的效率合成纳米粒子,实现纳米材料的可控合成的反应器。以纳米银颗粒的合成为例,对不同的反应溶液浓度及比例合成的纳米材料进行吸收光谱分析和TEM分析表明,该银纳米颗粒的平均直径可由反应试剂浓度控制。属于贵金属纳米合成领域。
背景技术
金属纳米材料在很多领域都有应用,其中银纳米材料既具有金属材料的一些共性,又具有其本身的一些特性(如很强的抗菌性能)。而铁原子极易被还原,用化学还原法可将银盐中的银离子还原为银原子,从而制备出银纳米粒子。采用不同的还原剂和修饰剂可以合成粒径大小不同的银纳米。
微流控(Microfluidics)指的是使用尺寸为数十到数百微米的微管道,处理或操纵微小流体(体积为纳升到阿升)的系统所涉及的科学和技术,是一门涉及化学、流体物理、微电子、新材料、生物学和生物医学工程的新兴交叉学科。因为具有微型化、集成化等特征,微流控装置通常被称为微流控芯片,也被称为芯片实验室和微全分析系统(micro-TotalAnalytical System)。微流控的早期概念可以追溯到19世纪70年代采用光刻技术在硅片上制作的气相色谱仪,而后又发展为微流控毛细管电泳仪和微反应器等。
发明内容
本产品使用LPKF ProtoMat H100刻板机对有机玻璃的表面进行图样的加工,下模具的四边比中间高0.2毫米,使得下模具表面可以覆盖一层0.2毫米厚的PDMS。下模具一侧有3个输入孔,另一侧为1个输出孔。直径为0.6毫米的小孔用于插入注射器针管,与外导管相连接;上模具的四边比中间高2毫米,中间的凸起对应于微流沟道的内尺寸,沟道末端四个凸起与下模具的4个小孔对应。采用了浇铸成型的加工工艺,该工艺具有制作方法简单、制作成本低、制作周期短等特点,同时能够满足实验所要求的实验精度。
附图说明
图1是微流沟道实物图
图2是微流沟道PMMA下模具
图3是微流沟道PMMA上模具
具体实施方式
具体制作流程如下:
(1)取PDMS与固化剂以12∶1的比例混合,在干净的烧杯中充分搅拌。
(2)将得到的混合液放在真空泵中抽空气,等待混合液中的气泡消失,直至混合物变为无色透明,这是为了防止在做PDMS沟道时因为气泡导致制作沟道的质量不好。
(3)在PMMA下基底和微流沟道模具上涂上一层混合物,并用玻璃片抹平;然后将涂抹混合液的模板放在真空泵中抽空气,排除气泡。
(4)将基底和模具放置在干燥器中干燥,约30分钟后拿出基底,此时基底上的PDMS还有一定的粘度,约60分钟后拿出模具,此时模具上的PDMS已经固化成型。
(5)用微型钻头将基底的4个小孔中的多余PDMS去除,以防止多余的PDMS堵塞微流沟道。将PDMS从微流沟道的模具中脱模,注意脱模过程中要防止PDMS破裂,然后将其放置在基底的PDMS上,并对准位置,使微流沟道与下基底粘合在一起。用液态PDMS对其做密封处理后放回烘干箱,加热20分钟,PDMS微流沟道得以制作完成。

Claims (1)

1.一种基于微流芯片的可控纳米材料合成反应器,即为得到大小可控的纳米颗粒,利用微流沟道的物理特性,实现纳米材料的可控合成的反应器,其特征包括:纳米颗粒合成的位置在微流沟道,可以通过控制反应物浓度调整合成产品的形态,合成反应器由上模具和下模具组成,下模具表面覆盖0.2mm的PDMS,一侧有3个输入孔,另一侧有1个输出孔,由直径0.6mm的针管与外导管相连,上模具的中间部分凸起对应于微流沟道的内尺寸,沟道末端的凸起对应于3个输入孔和1个输出孔,合成反应器采用了PDMS浇铸成型的的加工工艺,具体制作流程如下:
a.取PDMS与固化剂以12∶1的比例混合,在干净的烧杯中充分搅拌,
b.将PDMS混合液在真空干燥器中去除其中的气体,防止在制作PDMS沟道时因为气泡导致的结构缺陷,
c.在PMMA下基底和微流沟道模具上涂上一层PDMS混合液,抹平表面后将其放在真空干燥器中去除气泡,
d.将基底和模具放置在干燥器中干燥90分钟,使模具上的PDMS固化成型,
e.将基底上的4个小孔中的多余PDMS去除,防止堵塞微流沟道,将PDMS脱模后放置在基底的PDMS上,使微流沟道与下基底粘合在一起,用液态PDMS对其做密封处理后放回烘干箱,加热20分钟,PDMS微流沟道制作完成。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6409900B1 (en) * 1996-04-16 2002-06-25 Caliper Technologies Corp. Controlled fluid transport in microfabricated polymeric substrates
WO2006062312A1 (en) * 2004-12-09 2006-06-15 Biodigit Laboratories Corp. Lab-on-a-chip for an on-the-spot analysis and signal detection methods for the same
CN102218595A (zh) * 2011-01-14 2011-10-19 哈尔滨工业大学(威海) 一种微流芯片的制备方法
CN103447101A (zh) * 2013-07-23 2013-12-18 武汉友芝友医疗科技有限公司 一种微流芯片的制备方法
CN104324768A (zh) * 2014-10-24 2015-02-04 武汉纺织大学 一种微小三维结构沟道微流芯片的制备方法
CN104475177A (zh) * 2014-12-02 2015-04-01 武汉纺织大学 一种简易高键合强度聚合物微流芯片的制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6409900B1 (en) * 1996-04-16 2002-06-25 Caliper Technologies Corp. Controlled fluid transport in microfabricated polymeric substrates
WO2006062312A1 (en) * 2004-12-09 2006-06-15 Biodigit Laboratories Corp. Lab-on-a-chip for an on-the-spot analysis and signal detection methods for the same
CN102218595A (zh) * 2011-01-14 2011-10-19 哈尔滨工业大学(威海) 一种微流芯片的制备方法
CN103447101A (zh) * 2013-07-23 2013-12-18 武汉友芝友医疗科技有限公司 一种微流芯片的制备方法
CN104324768A (zh) * 2014-10-24 2015-02-04 武汉纺织大学 一种微小三维结构沟道微流芯片的制备方法
CN104475177A (zh) * 2014-12-02 2015-04-01 武汉纺织大学 一种简易高键合强度聚合物微流芯片的制备方法

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