CN108527744A - 基于微流芯片的可控纳米材料合成反应器 - Google Patents

基于微流芯片的可控纳米材料合成反应器 Download PDF

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CN108527744A
CN108527744A CN201710134012.7A CN201710134012A CN108527744A CN 108527744 A CN108527744 A CN 108527744A CN 201710134012 A CN201710134012 A CN 201710134012A CN 108527744 A CN108527744 A CN 108527744A
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pdms
nano
raceway groove
mold
substrate
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CN108527744B (zh
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刘国华
殷然
张姗
李逸君
方欢
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Nankai University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/003—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/34—Component parts, details or accessories; Auxiliary operations
    • B29C41/38—Moulds, cores or other substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Crystallography & Structural Chemistry (AREA)
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Abstract

本发明主要研究了微流控技术在纳米合成领域的应用，本项目介绍的是为得到大小可控的纳米颗粒，利用微流沟道的独特物理特性，通过改变微流沟道的形态设计使反应液的有效混合，从而能够以更高的效率合成纳米粒子，实现纳米材料的可控合成的反应器。以纳米银颗粒的合成为例，对不同的反应溶液浓度及比例合成的纳米材料进行吸收光谱分析和TEM分析表明，该银纳米颗粒的平均直径可由反应试剂浓度控制。

Description

基于微流芯片的可控纳米材料合成反应器
技术领域
本发明实现了微流控技术在纳米合成领域的应用，介绍的是为得到大小可控的纳米颗粒，利用微流沟道的独特物理特性，通过改变微流沟道的物理特性使反应液的有效混合，从而能够以更高的效率合成纳米粒子，实现纳米材料的可控合成的反应器。以纳米银颗粒的合成为例，对不同的反应溶液浓度及比例合成的纳米材料进行吸收光谱分析和TEM分析表明，该银纳米颗粒的平均直径可由反应试剂浓度控制。属于贵金属纳米合成领域。
背景技术
金属纳米材料在很多领域都有应用，其中银纳米材料既具有金属材料的一些共性，又具有其本身的一些特性(如很强的抗菌性能)。而铁原子极易被还原，用化学还原法可将银盐中的银离子还原为银原子，从而制备出银纳米粒子。采用不同的还原剂和修饰剂可以合成粒径大小不同的银纳米。
微流控(Microfluidics)指的是使用尺寸为数十到数百微米的微管道，处理或操纵微小流体(体积为纳升到阿升)的系统所涉及的科学和技术，是一门涉及化学、流体物理、微电子、新材料、生物学和生物医学工程的新兴交叉学科。因为具有微型化、集成化等特征，微流控装置通常被称为微流控芯片，也被称为芯片实验室和微全分析系统(micro-TotalAnalytical System)。微流控的早期概念可以追溯到19世纪70年代采用光刻技术在硅片上制作的气相色谱仪，而后又发展为微流控毛细管电泳仪和微反应器等。
发明内容
本产品使用LPKF ProtoMat H100刻板机对有机玻璃的表面进行图样的加工，下模具的四边比中间高0.2毫米，使得下模具表面可以覆盖一层0.2毫米厚的PDMS。下模具一侧有3个输入孔，另一侧为1个输出孔。直径为0.6毫米的小孔用于插入注射器针管，与外导管相连接；上模具的四边比中间高2毫米，中间的凸起对应于微流沟道的内尺寸，沟道末端四个凸起与下模具的4个小孔对应。采用了浇铸成型的加工工艺，该工艺具有制作方法简单、制作成本低、制作周期短等特点，同时能够满足实验所要求的实验精度。
附图说明
图1是微流沟道实物图
图2是微流沟道PMMA下模具
图3是微流沟道PMMA上模具
具体实施方式
具体制作流程如下：
(1)取PDMS与固化剂以12∶1的比例混合，在干净的烧杯中充分搅拌。
(2)将得到的混合液放在真空泵中抽空气，等待混合液中的气泡消失，直至混合物变为无色透明，这是为了防止在做PDMS沟道时因为气泡导致制作沟道的质量不好。
(3)在PMMA下基底和微流沟道模具上涂上一层混合物，并用玻璃片抹平；然后将涂抹混合液的模板放在真空泵中抽空气，排除气泡。
(4)将基底和模具放置在干燥器中干燥，约30分钟后拿出基底，此时基底上的PDMS还有一定的粘度，约60分钟后拿出模具，此时模具上的PDMS已经固化成型。
(5)用微型钻头将基底的4个小孔中的多余PDMS去除，以防止多余的PDMS堵塞微流沟道。将PDMS从微流沟道的模具中脱模，注意脱模过程中要防止PDMS破裂，然后将其放置在基底的PDMS上，并对准位置，使微流沟道与下基底粘合在一起。用液态PDMS对其做密封处理后放回烘干箱，加热20分钟，PDMS微流沟道得以制作完成。

Claims (4)

1.基于微流芯片的可控纳米材料合成反应器，即为得到大小可控的纳米颗粒，利用微流沟道的独特物理特性，从而能够以更高的效率合成纳米粒子，实现纳米材料的可控合成的反应器，其特征在于：
a.纳米粒子合成的位置在微流沟道
b.可以通过控制反应物浓度调整合成产品的形态。
2.以纳米银颗粒的合成为例，对不同的反应溶液浓度及比例合成的纳米材料进行吸收光谱分析和AFM分析表明，该银纳米颗粒的平均直径可由反应试剂浓度控制。
3.根据权利要求1a所述微流沟道，特征在于：使用LPKF ProtoMat H100刻板机对有机玻璃的表面进行图样的加工，下模具的四边比中间高0.2毫米，使得下模具表面可以覆盖一层0.2毫米厚的PDMS。下模具一侧有3个输入孔，另一侧为1个输出孔，直径为0.6毫米的小孔用于插入注射器针管，与外导管相连接；上模具的四边比中间高2毫米，中间的凸起对应于微流沟道的内尺寸，沟道末端四个凸起与下模具的4个小孔对应。
4.根据权利要求1所述的基于微流芯片的可控纳米材料合成反应器，其特征在于采用了浇铸成型的加工工艺，具体制作流程如下：
a.取PDMS与固化剂以12∶1的比例混合，在干净的烧杯中充分搅拌
b.将得到的混合液放在真空泵中抽空气，等待混合液中的气泡消失，直至混合物变为无色透明，这是为了防止在做PDMS沟道时因为气泡导致制作沟道的质量不好
c.在PMMA下基底和微流沟道模具上涂上一层混合物，并用玻璃片抹平；然后将涂抹混合液的模板放在真空泵中抽空气，排除气泡
d.将基底和模具放置在干燥器中干燥，约30分钟后拿出基底，此时基底上的PDMS还有一定的粘度，约60分钟后拿出模具，此时模具上的PDMS已经固化成型
e.用微型钻头将基底的4个小孔中的多余PDMS去除，以防止多余的PDMS堵塞微流沟道。将PDMS从微流沟道的模具中脱模，注意脱模过程中要防止PDMS破裂，然后将其放置在基底的PDMS上，并对准位置，使微流沟道与下基底粘合在一起，用液态PDMS对其做密封处理后放回烘干箱，加热20分钟，PDMS微流沟道得以制作完成。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6409900B1 (en) * 1996-04-16 2002-06-25 Caliper Technologies Corp. Controlled fluid transport in microfabricated polymeric substrates
WO2006062312A1 (en) * 2004-12-09 2006-06-15 Biodigit Laboratories Corp. Lab-on-a-chip for an on-the-spot analysis and signal detection methods for the same
CN102218595A (zh) * 2011-01-14 2011-10-19 哈尔滨工业大学（威海） 一种微流芯片的制备方法
CN103447101A (zh) * 2013-07-23 2013-12-18 武汉友芝友医疗科技有限公司 一种微流芯片的制备方法
CN104324768A (zh) * 2014-10-24 2015-02-04 武汉纺织大学 一种微小三维结构沟道微流芯片的制备方法
CN104475177A (zh) * 2014-12-02 2015-04-01 武汉纺织大学 一种简易高键合强度聚合物微流芯片的制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6409900B1 (en) * 1996-04-16 2002-06-25 Caliper Technologies Corp. Controlled fluid transport in microfabricated polymeric substrates
WO2006062312A1 (en) * 2004-12-09 2006-06-15 Biodigit Laboratories Corp. Lab-on-a-chip for an on-the-spot analysis and signal detection methods for the same
CN102218595A (zh) * 2011-01-14 2011-10-19 哈尔滨工业大学（威海） 一种微流芯片的制备方法
CN103447101A (zh) * 2013-07-23 2013-12-18 武汉友芝友医疗科技有限公司 一种微流芯片的制备方法
CN104324768A (zh) * 2014-10-24 2015-02-04 武汉纺织大学 一种微小三维结构沟道微流芯片的制备方法
CN104475177A (zh) * 2014-12-02 2015-04-01 武汉纺织大学 一种简易高键合强度聚合物微流芯片的制备方法

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