CN108527042B

CN108527042B - Clamping platform deck and machine tool for processing thin wafer

Info

Publication number: CN108527042B
Application number: CN201810294068.3A
Authority: CN
Inventors: 韩赛
Original assignee: Quanzhou Taishang Investment Zone Rongyi Technology Co Ltd
Current assignee: NANTONG SUNWRITER MACHINERY Co.,Ltd.
Priority date: 2018-04-03
Filing date: 2018-04-03
Publication date: 2019-12-13
Anticipated expiration: 2038-04-03
Also published as: CN108527042A

Abstract

The invention discloses a clamping carrying platform for processing a thin wafer, which comprises a tank body, wherein magnetorheological fluid is arranged in the tank body, an excitation device for driving the magnetorheological fluid to be solidified or reset to be in a fluid state is arranged at the bottom of the tank body, a paper conveying mechanism is arranged on the tank body, a single paper sheet is periodically supplied to the inner side of the tank body by the paper conveying mechanism, the paper sheet floats on the liquid level of the magnetorheological fluid, a paper extracting mechanism is arranged on the other side, far away from the paper conveying mechanism, of the tank body, and when a wafer to be processed is placed on the paper sheet, the paper extracting mechanism extracts the paper sheet so that the paper sheet is extracted from the space between the wafer and the liquid level of the magnetorheological. The invention provides a clamping carrying platform for processing a sheet wafer, which can fix a functional wafer without a wafer carrier, and has the advantages of high strength of the functional wafer, low fragment rate in the processing process and high qualification rate of a final product.

Description

clamping platform deck and machine tool for processing thin wafer

Technical Field

The invention relates to the technical field of wafer processing, in particular to a clamping carrying platform and a machine tool for processing a wafer.

Background

The sheet wafer, especially the sheet wafer with a thickness less than 5mm, often needs to be temporarily bonded on a wafer carrier during the processing process, so as to improve the strength of the functional wafer, so as to facilitate the processing treatment, such as thinning, polishing, etching, cutting, etc., and finally, the functional wafer is separated from the wafer carrier to complete the processing of the functional wafer.

It can be seen that, although the technical problem that the wafer is not strong enough and is fragile in the prior art can be solved, the carrier wafer is additionally added, so that the working procedures are increased, the production efficiency is reduced, and the carrier wafer is more made of engineering plastic plates and is directly scrapped after the functional wafer is cut, so that the carrier wafer obviously causes the increase of the processing cost as a disposable consumable product, and is not beneficial to the popularization of large-scale production.

in addition, there is a carrier wafer which can be recycled many times in the prior art, but the functional wafer in the prior art often uses a cleaning agent in the process of removing bonding glue and other processes, so the number of times of use of the carrier wafer which can be used many times is also greatly limited, and the problem of high processing cost is also existed.

Disclosure of Invention

The present invention is directed to solve at least some of the problems of the related art: the clamping carrying platform for processing the sheet wafer can fix the functional wafer without a wafer carrier, and the functional wafer has high strength, low fragment rate in the processing process and high qualification rate of a final product.

The present invention is directed to solve at least the second technical problem in the related art to some extent: provided is a machine tool for processing a wafer sheet, which is used exclusively for processing a wafer, and which has a low wafer chipping rate during processing and a high yield of a final product.

therefore, an object of the present invention is to provide a clamping platform for processing a thin wafer, including a tank, in which a magnetorheological fluid is disposed, an excitation device for driving the magnetorheological fluid to solidify or to return to a fluid state is disposed at the bottom of the tank, a paper feeding mechanism is disposed on the tank, the paper feeding mechanism periodically supplies a single piece of paper to the tank, the paper floats on the liquid level of the magnetorheological fluid, and a paper extracting mechanism is disposed on the tank on the other side away from the paper feeding mechanism, and when a wafer to be processed is placed on the paper, the paper extracting mechanism extracts the paper to enable the paper to be extracted from between the wafer and the liquid level of the magnetorheological fluid. The wafer and the magnetorheological fluid can be removed through the paper sheet, so that the wafer floats on the liquid surface of the magnetorheological fluid by utilizing the surface tension of the magnetorheological fluid, meanwhile, the liquid surface of the magnetorheological fluid is concave to form a groove due to the weight of the wafer, and the wafer is just limited in the groove when the magnetorheological fluid is solidified under the action of the magnetic field of the exciting device, so that the solidified magnetorheological fluid can well support the wafer, the wafer can be thinned and processed, and the wafer can be taken out through the sucking disc after the magnetic field is removed, so that the wafer does not need to be additionally arranged on a slide glass in the whole process, paper is only consumed in the whole process, extra disposable consumables do not exist, and the processing cost is low.

According to an example of the invention, the paper conveying mechanism comprises a driving roller set and a cutter assembly for cutting off paper, the driving roller set clamps strip-shaped paper and drives the strip-shaped paper to move along the length direction of the driving roller set, the cutter assembly is arranged on the groove body and is positioned between the driving roller set and the groove body, the strip-shaped paper is cut by the cutter assembly to form a plurality of sheet-shaped paper pieces, and each paper piece sequentially floats on the liquid level of the magnetorheological fluid in the groove body.

According to an example of the invention, the slot body is provided with a nozzle, the nozzle is positioned at one side of the cutter assembly close to the inner cavity of the slot body, and the paper sheets cut by the cutter assembly float on the liquid level of the magnetorheological fluid after being sprayed by the nozzle. The nozzle wets the paper sheet, so that bubbles between the wafer and the magnetorheological fluid can be eliminated more favorably when the paper sheet is pulled away, and when liquid sprayed by the nozzle is liquid bonding glue, the bonding glue remained between the magnetorheological fluid and the wafer after the paper sheet is pulled away is solidified, so that the firmness of the wafer can be further improved.

According to an example of the invention, a guide plate is arranged in the tank body, the guide plate is fixed with the tank body, the upper end surface of the guide plate is arranged adjacent to the liquid level of the magnetorheological fluid, and the paper sheet slides into the tank body through the upper end surface of the guide plate. The guide plate can enable the paper sheet to well float on the surface layer of the magnetorheological fluid, and the paper sheet is prevented from being immersed in the magnetorheological fluid due to single-side inclination.

according to one example of the invention, the paper extraction mechanism comprises a roller, the roller is arranged above the groove body, the lower part of the roller is abutted against paper sheets floating on the magnetorheological fluid, and the roller rotates around the axial direction of the roller and drives the paper sheets to move in the horizontal direction relative to the wafer so that the paper sheets are separated from the wafer. The roller drives the paper sheet to be drawn out through the static friction force between the roller and the paper sheet.

According to one example of the invention, a scraper is arranged on the groove body and close to the roller, and the front end of the scraper abuts against the outer circumferential surface of the roller under the action of self-reset elasticity. The residual magnetorheological fluid and other foreign particles on the roller can be removed by the scraper.

According to an example of the invention, a notch is arranged on the side wall of the tank body close to the roller, the magnetorheological fluid in the tank body overflows to the outside of the tank body through the notch, an overflow groove is arranged on the outer side wall of the tank body and below the notch, and a screen is arranged in the overflow groove and used for placing the waste paper sheet falling into the overflow groove through the notch. The magnetorheological fluid and the waste paper sheets can be separated by a screen.

According to an example of the invention, the screen is an arc-shaped plate, a plurality of strip-shaped through holes are arranged on the arc-shaped plate at intervals along the width direction of the arc-shaped plate, the upper end of the arc-shaped plate is positioned below the notch, the lower end of the arc-shaped plate extends along the length direction of the arc-shaped plate to be connected with the inner wall of the overflow groove, and the position of the upper surface of the arc-shaped plate, which is close to the lower end, and the inner side wall of the overflow groove form a placement groove with an upward opening direction, so that waste paper sheets falling into the overflow groove.

therefore, another object of the present invention is to provide a machine tool for processing a thin wafer, which includes a machine tool stage and the above-mentioned chucking stage, wherein the chucking stage is detachably mounted on the machine tool stage, and a grinding disc is provided above the chucking stage, the grinding disc being mounted on the machine tool drive shaft and rotating and moving along with the machine tool drive shaft.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

The technical scheme has the following advantages or beneficial effects: firstly, can be fine eliminate the bubble between wafer and the magnetorheological suspensions liquid level through the scraps of paper, avoid magnetorheological suspensions to receive the magnetic field effect solidification after, remaining bubble makes the wafer crooked cracked, secondly, replace conventional slide glass through magnetorheological suspensions, not only practice thrift the cost, improved production efficiency, and avoided the process of separating the bonding of wafer, consequently the slide glass of prior art and wafer bonding back separation bonding mode is more convenient, and finally, can realize automated production through defeated paper mechanism and paper extraction mechanism, therefore efficient, the precision is good.

Drawings

Fig. 1 is a schematic view of the structure of the machine tool of the present invention.

Fig. 2 is a partially enlarged view of the region "a" in fig. 1.

Figure 3 is a schematic view of the structure of the abrasive disc portion of the present application.

FIG. 4 is a schematic sectional view taken along the direction "B-B" in FIG. 3.

FIG. 5 is a schematic cross-sectional view taken in the direction "C-C" of FIG. 3.

The device comprises a groove body 1, a groove body 2, magnetorheological fluid 3, an excitation device 4, a paper sheet 5, a wafer 6, a driving roller group 7, a cutter component 8, a nozzle 9, a guide plate 10, a roller 11, a scraper 12, a notch 13, an overflow groove 14, an arc plate 15, a laying groove 16, a grinding disc 17, a machine tool driving shaft 18, a body 19, a mounting groove 20, a sub grinding block 21, a liquid supply groove 22, an arc surface 23, a liquid supply pipeline 24, a reflux groove 25, a main reflux channel 26, a positioning groove 27 and an adjusting cavity.

Detailed Description

reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

A machine tool for thin-plate wafer processing according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

The invention provides a machine tool for machining a thin wafer, which comprises a machine tool carrying platform and a clamping carrying platform, wherein the clamping carrying platform is detachably arranged on the machine tool carrying platform, a grinding disc 16 is arranged above the clamping carrying platform, and the grinding disc 16 is arranged on a machine tool driving shaft 17 and rotates along with the machine tool driving shaft 17.

The first embodiment is as follows:

Preferably, the clamping platform comprises a tank body 1, magnetorheological fluid 2 is arranged in the tank body 1, an excitation device 3 for driving the magnetorheological fluid 2 to solidify or reset to be in a fluid state is arranged at the bottom of the tank body 1, the excitation device 3 is a device for generating a magnetic field, the magnetorheological fluid 2 is solidified through the magnetic field, and when the excitation device 3 is powered off, the magnetorheological fluid 2 is reset to be in the fluid state. The wafer processing device is characterized in that a paper conveying mechanism is arranged on the tank body 1, a single paper sheet 4 is periodically supplied to the tank body 1 by the paper conveying mechanism, the paper sheet 4 floats on the liquid level of the magnetorheological fluid 2, a paper extracting mechanism is arranged on the other side, far away from the paper conveying mechanism, of the tank body 1, and when a wafer 5 to be processed is placed on the paper sheet 4, the paper extracting mechanism extracts the paper sheet 4 so that the paper sheet 4 is extracted from the space between the wafer 5 and the liquid level of the magnetorheological fluid 2.

Example two:

The general structure of the embodiment is the same, and the difference is that: the paper conveying mechanism comprises a driving roller set 6 and a cutter assembly 7 used for cutting off paper, the driving roller set 6 clamps the strip-shaped paper and drives the strip-shaped paper to move along the length direction of the paper, the cutter assembly 7 is arranged on the groove body 1 and is positioned between the driving roller set 6 and the groove body 1, the strip-shaped paper is cut by the cutter assembly 7 to form a plurality of flaky paper sheets 4, and the paper sheets 4 sequentially float on the liquid level of the magnetorheological fluid 2 in the groove body 1.

Specifically, the driving roller group 6 includes a driving roller and a driven roller, axes of the driving roller and the driven roller are parallel to each other, and a nip space for nipping paper is formed between the driving roller and the driven roller. The driving roller and the driven roller rotate around respective axes, and the driving roller and the driven roller are fixed on the groove body 1 through a bracket.

Preferably, the number of the drive roller and the driven roller may be plural.

Example three:

The structure is the same as the general structure of the second embodiment, and the difference is that: be equipped with nozzle 8 on the cell body 1, nozzle 8 is located one side that cutter unit spare 7 is close to the cell body 1 inner chamber, paper 4 that cutter unit spare 7 cut and form floats on the liquid level of magnetorheological suspensions 2 after spraying through nozzle 8. Specifically, cutter unit 7 include cutter and knife rest, the knife rest is fixed with cell body 1, be equipped with on the knife rest and be used for driving the actuating cylinder that drives that the cutter removed.

Preferably, the nozzles 8 emit a water mist for moistening the sheet 4.

Further, the nozzle 8 sprays bonding glue with liquid, and the wafer 5 and the solidified magnetorheological fluid 2 are bonded and adhered through the bonding glue.

Example four:

The three general structures are the same as the three general structures of the embodiment, and the differences are that: be equipped with deflector 9 in the cell body 1, deflector 9 is fixed with cell body 1, just the up end of deflector 9 sets up with magnetorheological suspensions 2's liquid level is adjacent, scraps of paper 4 slide in the cell body 1 through the up end of deflector 9.

the adjacent arrangement means that the upper end face of the guide plate 9 is close to the liquid level of the magnetorheological fluid 2. Specifically, the upper end surface of the guide plate 9 is flush with the liquid level of the magnetorheological fluid 2.

Example five:

The general structure of the embodiment is the same, and the difference is that: the paper extraction mechanism comprises a roller 10, the roller 10 is arranged above the groove body 1, the lower portion of the roller 10 is abutted to the paper sheet 4 floating on the magnetorheological fluid 2, the roller 10 rotates around the self axial direction and drives the paper sheet 4 to move along the horizontal direction relative to the wafer 5, and therefore the paper sheet 4 is separated from the wafer 5.

Preferably, the outer circumferential wall of the roller 10 is covered with a fluff layer, so that not only is the static friction force with the paper sheet 4 increased by the fluff layer and the paper sheet 4 is conveniently driven to be drawn away, but also the fluff layer has water absorption property and can absorb pollutants on the surface layer of the magnetorheological fluid 2.

Example six:

The structure is the same as the five general structures of the embodiment, and the difference is that: a scraper 11 is arranged at a position, close to the roller 10, on the groove body 1, and the front end of the scraper 11 is abutted against the outer circumferential surface of the roller 10 under the action of self-resetting elasticity. The scraper 11 is fixedly connected with the tank body 1 through a bracket.

Example seven:

The general structure of the embodiment is the same, and the difference is that: a notch 12 is arranged on the side wall of the tank body 1 close to the roller 10, the magnetorheological fluid 2 in the tank body 1 overflows out of the tank body 1 through the notch 12, an overflow groove 13 is arranged below the notch 12 on the outer side wall of the tank body 1, and a screen is arranged in the overflow groove 13 and used for placing the waste paper sheets 4 falling into the overflow groove 13 through the notch 12.

Example eight:

The structure is the same as the seventh general structure, and the difference is that: the screen cloth be the arc 14, be equipped with a plurality of bar through-holes along the width direction interval of arc 14 on the arc 14, the upper end of arc 14 is located the below of breach 12, and the lower extreme of arc 14 extends to and is connected with the inslot wall of overflow launder 13 along self length direction, and the position that the upper surface of arc 14 is close to the lower extreme constitutes a opening direction up with the inside wall of overflow launder 13 and puts groove 15 for shelve the abandonment scraps of paper 4 that falls into overflow launder 13 through breach 12. The magnetorheological fluid 2 refluxed and gathered by the overflow groove 13 can be recycled after being purified.

Example nine:

Preferably, the grinding disc 16 includes a disc-shaped body 18, a mounting groove 19 is disposed at a central position of a lower end surface of the body 18, a sub grinding block 20 is disposed in the mounting groove 19, a plurality of liquid supply tanks 21 are uniformly distributed on the lower end surface of the body 18 along a circumferential direction of the mounting groove 19 for accommodating mortar, and an inner side wall of an inner wall of each liquid supply tank 21, which is located in a direction opposite to a rotation direction of the body 18, is transitionally connected to the lower end surface of the body 18 through an arc surface 22. A mortar layer is formed between the lower end face of the body 18 and the upper end face of the wafer 5 through mortar, and the upper end face of the wafer 5 is ground through the mortar layer, so that thinning grinding of the wafer 5 can be well completed, and the grinding disc 16 and the wafer 5 are not in direct hard contact, so that the thin wafer 5 is prevented from being cracked due to impact force at the initial contact stage of the grinding disc 16 and the wafer 5.

The mortar mentioned above means a suspension of grinding particles, for example, a grinding fluid containing quartz sand particles. During the rotation of the body 18 relative to the wafer 5, the mortar in the liquid supply tank 21 is squeezed between the lower end surface of the body 18 and the upper end surface of the wafer 5 from the position of the arc surface 22 during the rotation of the body 18, so that a mortar layer is formed between the lower end surface of the body 18 and the upper end surface of the wafer 5, and finally, the grinding and thinning are completed through the friction between the mortar layer and the upper end surface of the wafer 5.

example ten:

The structure is the same as the nine-body structure of the embodiment, and the difference is that: the body 18 is provided with a liquid supply pipeline 23 corresponding to each liquid supply groove 19, and the liquid supply pipeline 23 is communicated with the liquid supply grooves 19. The supply line 23 communicates with an external mortar storage tank through an external hose so that the mortar in the storage tank is pumped into the supply tank 19.

Example eleven:

The structure is the same as the structure of the embodiment, and the difference is that: as shown in fig. 3, a backflow groove 24 is provided between any two adjacent liquid supply grooves 21 on the lower end surface of the body 18, an annular main backflow channel 25 is provided on the lower end surface of the body 18, and all backflow grooves 24 extend in the radial direction to communicate with the main backflow channel 25. The grinded mortar can be recycled through the backflow groove 24 and the main backflow channel 25, and the pressure of a mortar layer between the lower end face of the body 18 and the wafer 5 is dynamically balanced.

Example twelve:

The general structure is the same as that of the embodiment eleven, and the differences are that: a positioning groove 26 for controlling a gap between the lower end surface of the body 18 and the upper end surface of the wafer 5 is arranged at a position, close to the outer edge of the body 18, on the lower end surface of the body 18, and a pipeline for supplying a high-pressure medium to the positioning groove 26 is arranged in the body 18. The high-pressure medium in the positioning groove 26 can keep a certain gap between the body 18 of the grinding disc 16 and the upper end face of the wafer 5 all the time, the high-pressure medium can be high-pressure cooling liquid or compressed air, and is pumped into the positioning groove 26 through the booster pump, so that the high-pressure medium forms a gap between the upper end face of the wafer 5 and the lower end face of the body 18 of the grinding disc 16, the gap between the upper end face of the wafer 5 and the lower end face of the body 18 can be well adjusted by adjusting the pressure value of the high-pressure medium in the positioning groove 26, and the high-pressure medium plays a role in buffering at the initial stage of descending of the body 18, and the wafer 5 is prevented from being cracked due to the fact.

Example thirteen:

The structure is the same as the twelve general structures of the embodiment, and the difference is that: the sub-grinding block 20 is in sliding fit with the mounting groove 19, an adjusting cavity 27 is formed between the sub-grinding block 20 and the inner wall of the mounting groove 19 in a surrounding mode, and a pipeline communicated with the adjusting cavity 27 is arranged in the body 18. The upper end face of the wafer 5 is polished by pushing the sub grinding block 20 through the adjusting cavity 27, the adjusting cavity 27 can be communicated with an external metering pump through a control hose, the pressure value of the adjusting cavity 27 is adjusted through a controller, and the descending or ascending resetting control of the sub grinding block 20 is finally realized.

It should be noted that, in the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship indicated based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

various alterations and modifications will no doubt become apparent to those skilled in the art after having read the above description. Therefore, the appended claims should be construed to cover all such variations and modifications as fall within the true spirit and scope of the invention. Any and all equivalent ranges and contents within the scope of the claims should be considered to be within the intent and scope of the present invention.

Claims

1. a clamping carrying platform for processing a wafer is characterized in that: the magnetorheological fluid heating device comprises a tank body (1), wherein magnetorheological fluid (2) is arranged in the tank body (1), an excitation device (3) used for driving the magnetorheological fluid (2) to solidify or reset to be in a fluid state is arranged at the bottom of the tank body (1), a paper conveying mechanism is arranged on the tank body (1), a single paper sheet (4) is periodically supplied to the tank body (1) by the paper conveying mechanism, the paper sheet (4) floats on the liquid level of the magnetorheological fluid (2), a paper extracting mechanism is arranged on the other side, far away from the paper conveying mechanism, of the tank body (1), and when a wafer (5) to be processed is placed on the paper sheet (4), the paper extracting mechanism extracts the paper sheet (4) to enable the paper sheet (4) to be extracted from the liquid level of the wafer (5) and the magnetorheological fluid (2).

2. the chuck stage for wafer processing according to claim 1, wherein: paper feed mechanism include drive roller set (6) and cutter unit spare (7) that are used for cutting off the paper, the paper of drive roller set (6) centre gripping rectangular shape just orders about rectangular shape paper and removes along self length direction, cutter unit spare (7) are located on cell body (1) and are located between drive roller set (6) and cell body (1), rectangular shape paper is sheared through cutter unit spare (7) and is formed a plurality of flaky scraps of paper (4), and each scraps of paper (4) float on the liquid level of magnetorheological suspensions (2) in cell body (1) according to the preface.

3. The chuck stage for wafer processing according to claim 2, wherein: be equipped with nozzle (8) on cell body (1), nozzle (8) are located one side that cutter unit spare (7) are close to cell body (1) inner chamber, paper piece (4) that cutter unit spare (7) shearing formed float on the liquid level of magnetorheological suspensions (2) after nozzle (8) spray.

4. The chuck stage for wafer processing according to claim 3, wherein: be equipped with deflector (9) in cell body (1), deflector (9) are fixed with cell body (1), just the up end of deflector (9) sets up with the liquid level of magnetorheological suspensions (2) is adjacent, scraps of paper (4) slide in cell body (1) through the up end of deflector (9).

5. The chuck stage for wafer processing according to claim 1, wherein: the paper extraction mechanism comprises a roller (10), the roller (10) is arranged above the groove body (1), the lower portion of the roller (10) is abutted to paper sheets (4) floating on the magnetorheological fluid (2), the roller (10) rotates around the axial direction of the roller and drives the paper sheets (4) to move along the horizontal direction relative to the wafer (5), and therefore the paper sheets (4) are separated from the wafer (5).

6. the chuck stage for wafer processing according to claim 5, wherein: the scraper (11) is arranged at a position, close to the roller (10), on the groove body (1), and the front end of the scraper (11) is abutted against the outer circumferential surface of the roller (10) under the action of self-resetting elasticity.

7. The chuck stage for wafer processing according to claim 1, wherein: the side wall of the tank body (1) close to the roller (10) is provided with a notch (12), magnetorheological fluid (2) in the tank body (1) overflows to the outside of the tank body (1) through the notch (12), an overflow groove (13) is arranged below the notch (12) on the outer side wall of the tank body (1), and a screen is arranged in the overflow groove (13) and used for placing waste paper sheets (4) falling into the overflow groove (13) through the notch (12).

8. The clamp stage for wafer processing as recited in claim 7, wherein: the screen cloth be arc (14), arc (14) go up along the width direction interval of arc (14) and be equipped with a plurality of bar through-holes, the upper end of arc (14) is located the below of breach (12), the lower extreme of arc (14) extends to the inslot wall with overflow launder (13) along self length direction and is connected, and the upper surface of arc (14) is close to the position of lower extreme and constitutes an opening direction up with the inside wall of overflow launder (13) and shelve groove (15) for shelve waste scraps of paper (4) that fall into in overflow launder (13) through breach (12).

9. A machine tool for processing a wafer, characterized in that: the clamping device comprises a machine tool carrier and the clamping carrier as claimed in any one of claims 1 to 8, wherein the clamping carrier is detachably mounted on the machine tool carrier, a grinding disc (16) is arranged above the clamping carrier, and the grinding disc (16) is mounted on a machine tool driving shaft (17) and rotates along with the machine tool driving shaft (17).