CN108520796B - 基底、柔性电子部件及柔性电子部件的制造方法 - Google Patents
基底、柔性电子部件及柔性电子部件的制造方法 Download PDFInfo
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- CN108520796B CN108520796B CN201810366336.8A CN201810366336A CN108520796B CN 108520796 B CN108520796 B CN 108520796B CN 201810366336 A CN201810366336 A CN 201810366336A CN 108520796 B CN108520796 B CN 108520796B
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- conducting wire
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- flexible electronic
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- 239000000758 substrate Substances 0.000 title claims abstract description 89
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 9
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 8
- 230000002411 adverse Effects 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/06—Extensible conductors or cables, e.g. self-coiling cords
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/008—Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing extensible conductors or cables
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810366336.8A CN108520796B (zh) | 2018-04-23 | 2018-04-23 | 基底、柔性电子部件及柔性电子部件的制造方法 |
Applications Claiming Priority (1)
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CN201810366336.8A CN108520796B (zh) | 2018-04-23 | 2018-04-23 | 基底、柔性电子部件及柔性电子部件的制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN108520796A CN108520796A (zh) | 2018-09-11 |
CN108520796B true CN108520796B (zh) | 2019-07-26 |
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CN201810366336.8A Active CN108520796B (zh) | 2018-04-23 | 2018-04-23 | 基底、柔性电子部件及柔性电子部件的制造方法 |
Country Status (1)
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CN (1) | CN108520796B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109346244B (zh) * | 2018-09-28 | 2020-02-21 | 深圳大学 | 一种制备可拉伸电子线材的方法 |
CN109341727B (zh) * | 2018-10-25 | 2021-11-02 | 北京机械设备研究所 | 一种柔性可拉伸式传感器 |
CN110987042A (zh) * | 2019-11-28 | 2020-04-10 | 杭州电子科技大学 | 一种柔性可拉伸传感器的制作方法 |
CN113450951A (zh) * | 2020-03-26 | 2021-09-28 | 深圳市柔宇科技有限公司 | 弹性连接件及其制备方法、弹性电子设备及其制备方法 |
CN112134006B (zh) * | 2020-08-11 | 2023-01-24 | 江苏鼎汇智能科技有限公司 | 一种折叠式天线 |
CN112134029A (zh) * | 2020-08-13 | 2020-12-25 | 江苏鼎汇智能科技有限公司 | 一种拱形可拉伸天线阵列馈电网络 |
CN113644414B (zh) * | 2021-07-08 | 2022-05-06 | 大连理工大学 | 天线装置及其制备方法、以及通信装置 |
CN114171497B (zh) * | 2021-11-30 | 2023-02-03 | 中国农业大学 | 可延展电子器件、柔性基底及其制作方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102010034718B4 (de) * | 2010-08-18 | 2017-11-30 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Dehnbares Substrat mit einer Kontaktstelle zwischen einem polymerbasierten elektrischen Leiter und einem weiteren elektrischen Leiter |
CN103137865B (zh) * | 2013-02-04 | 2016-02-24 | 清华大学 | 一种制备柔性可延展互连线的方法 |
CN106783745B (zh) * | 2016-12-19 | 2019-10-01 | 中国科学院半导体研究所 | 可延展柔性无机光电子器件及其制备方法 |
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2018
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CN108520796A (zh) | 2018-09-11 |
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CB03 | Change of inventor or designer information |
Inventor after: Feng Xue Inventor after: Zhao Qian Inventor after: Ma Yinji Inventor after: Liang Ziwei Inventor before: Feng Xue Inventor before: Zhao Qian Inventor before: Ma Yinji Inventor before: Liang Ziwei |
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CB03 | Change of inventor or designer information | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211208 Address after: 310018 room 701, building 6, Haituo business building, Hangzhou Economic and Technological Development Zone, Hangzhou, Zhejiang Province Patentee after: ZHEJIANG HEQING FLEXIBLE ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 100084 No. 1 Tsinghua Yuan, Beijing, Haidian District Patentee before: TSINGHUA University |
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TR01 | Transfer of patent right |