CN108511111A - A kind of transparent conductive substrate and conductor connecting structure and preparation method thereof - Google Patents
A kind of transparent conductive substrate and conductor connecting structure and preparation method thereof Download PDFInfo
- Publication number
- CN108511111A CN108511111A CN201810211356.8A CN201810211356A CN108511111A CN 108511111 A CN108511111 A CN 108511111A CN 201810211356 A CN201810211356 A CN 201810211356A CN 108511111 A CN108511111 A CN 108511111A
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- Prior art keywords
- transparent conductive
- conductive substrate
- powder
- connecting structure
- metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
Abstract
The present invention relates to electrically-conductive backing plate technical fields, more particularly to a kind of transparent conductive substrate and conductor connecting structure, including transparent conductive substrate, conducting wire and conductive layer, the transparent conductive substrate is crystal glass sheet, the conductive layer is mixed and is then made by toasting by 68 parts of metal-powders, 0.1 2 parts of glass powders and 0.5 2 parts of resin solvents, and the conducting wire is closely connect by the conductive layer with the transparent conductive substrate.The conductive layer of above structure uses metal-powder, glass powder and resin solvent and is made, conductive layer is merged with transparent conductive substrate, and then transparent conductive substrate is allowed to become strong with connecting position of wires firmness, conducting wire will not be caused to be detached from transparent conductive substrate in assembling process, to improve the yields of product.In addition, the invention also discloses a kind of preparation methods of above-mentioned transparent conductive substrate and conductor connecting structure.
Description
Technical field
The present invention relates to electrically-conductive backing plate technical field more particularly to a kind of transparent conductive substrate and conductor connecting structure and its
Preparation method.
Background technology
The material can be made both to have after deposition layer of transparent conductive film in transparent substrates (such as glass, plastics) to lead
Electrically, while light can be made to penetrate again, thus there is good application performance.Such as electro-conductive glass main application field at present
There is flat liquid crystal to show (LCD), electroluminance display (ELD), electroluminescent colored display (ECD), solar cell transparent electrode etc..
In addition, the exploitation of the transparent conductive film of flexible substrate makes its potential use be expanded to manufacture luminescent device, plastics liquid
Crystal display, foldable solar energy battery and as thermal insulation material for vinyl house, glass bonding film etc..
Currently, existing transparent conductive substrate and conductor connecting structure are that this is made：Crystal glass is got out, so
The silver paste being stirred is coated on by screen painting on crystal glass afterwards, conducting wire is binded by dispenser on crystal glass,
Then transparent conductive substrate and conductor connecting structure are placed into sintering furnace and are sintered 6-8 hours, electrically conducting transparent base is finally made
Plate and conductor connecting structure.However such structure has the following problems：Since existing silver paste is attached on crystal glass,
In this way so that transparent conductive substrate and connecting position of wires firmness be not strong, it is easy in assembling process so that conducting wire is detached from transparent lead
Electric substrate, to cause many defective products.
Invention content
It is an object of the present invention to：In view of the deficiencies of the prior art, a kind of transparent conductive substrate and conducting wire are provided
Connection structure, the connection structure make transparent conductive substrate become strong with connecting position of wires firmness, will not be led in assembling process
Conducting wire is caused to be detached from transparent conductive substrate, to improve the yields of product.
To achieve the goals above, the present invention adopts the following technical scheme that：
A kind of transparent conductive substrate and conductor connecting structure, including transparent conductive substrate, conducting wire and conductive layer are described transparent
Electrically-conductive backing plate is crystal glass sheet, and the conductive layer is by 6-8 parts of metal-powders, 0.1-2 parts of glass powders and 0.5-2 parts of resins
Then solvent is mixed to be made by toasting, the conducting wire is closely connected by the conductive layer and the transparent conductive substrate
It connects.
The conductive layer is made by 7 parts of metal-powders, 1 part of glass powder and 1 part of resin solvent.
The metal-powder is mixed and is made by the silver paste of 70-80% and the copper powder of 20-30%.
The conductive layer of above structure uses metal-powder, glass powder and resin solvent and is made so that conductive layer energy
It is merged with transparent conductive substrate, and then transparent conductive substrate is allowed to become strong with connecting position of wires firmness, in assembling process
In will not cause conducting wire be detached from transparent conductive substrate, to improve the yields of product.
It is another object of the present invention to additionally provide a kind of above-mentioned transparent conductive substrate and conductor connecting structure
Preparation method includes the following steps：
A, electrocondution slurry is prepared first, and the electrocondution slurry is mixed by metal-powder, glass powder and resin solvent
It stirs；
B, above-mentioned electrocondution slurry is filled into syringe, then puts syringe to glue machine equipment, while by manually will be saturating
Bright electrically-conductive backing plate is placed on the corresponding position under halftone, is then had good positioning conducting wire and electrically conducting transparent by the auxiliary body of dispenser
Substrate, finally by electrocondution slurry dispensing in the junction of conducting wire and transparent conductive substrate, while dispenser is also to electrically conducting transparent base
Plate film printing；
C, above-mentioned dispensing product is put into oven, so that it is toasted 1 hour or more at a temperature of more than 400 DEG C, finally makes
Obtain transparent conductive substrate and conductor connecting structure.
The preparation process of the electrocondution slurry is as follows：It is first put into solvent to be stirred using homogenizer with resin, stir
The time is mixed in 1 hour, glass powder is placed into and is stirred, 2 hours of mixing time, metal-powder is placed into and is stirred
It mixes, 6 hours of mixing time, is put into three-roll grinder after stirred and rolls, until resin solvent, metal-powder and glass powder
Completely until fusion.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Specific implementation mode
The present invention and advantage are described in detail with reference to embodiment, but embodiments of the present invention are unlimited
In this.
Embodiment 1
As shown in Figure 1, a kind of transparent conductive substrate and conductor connecting structure, including transparent conductive substrate 1, conducting wire 2 and lead
Electric layer 3, the transparent conductive substrate 1 be crystal glass sheet, the conductive layer 3 by 6 parts of metal-powders, 0.1 part of glass powder with
And 0.5 part of resin solvent is mixed and is then made by toasting, 0.2 micron of metal-powder size, glass powder size 0.2 is micro-
Rice, the conducting wire 2 are closely connect by the conductive layer 3 with the transparent conductive substrate 1.
The metal-powder is mixed by 70% silver paste and 30% copper powder and is made.
Embodiment 2
As shown in Figure 1, as different from Example 1, the conductive layer 3 of the present embodiment is by 8 parts of metal-powders, 2 parts of glass powders
Body and 2 parts of resin solvents are mixed and are then made by toasting, and 5 microns of metal-powder size, glass powder size 3 is micro-
Rice, the metal-powder are mixed by 80% silver paste and 20% copper powder and are made.
Embodiment 3
As shown in Figure 1, as different from Example 1, the conductive layer 3 of the present embodiment is by 7 parts of metal-powders, 1 part of glass powder
Body and 1 part of resin solvent are mixed and are then made by toasting, and 3 microns of metal-powder size, glass powder size 2 is micro-
Rice, the metal-powder are mixed by 75% silver paste and 25% copper powder and are made.
Embodiment 4
As shown in Figure 1, as different from Example 1, the conductive layer 3 of the present embodiment is by 6.5 parts of metal-powders, 0.5 part of glass
Glass powder and 1.5 parts of resin solvents are mixed and are then made by toasting, and 4 microns of metal-powder size, glass powder is big
2.5 microns small, the metal-powder is mixed by 78% silver paste and 22% copper powder and is made.
It is obtained by experiment, the metal-powder of embodiment 1-4, each parameter combination of glass powder and resin solvent
Realize that conductive layer is closely merged with transparent conductive substrate well, to greatly reinforce transparent conductive substrate and lead
Line junction firmness so that the case where present invention will not cause conducting wire to be detached from transparent conductive substrate in assembling process goes out
It is existing, to improve the yields of product.
Embodiment 5
A kind of preparation method of the transparent conductive substrate and conductor connecting structure of embodiment 1-4, includes the following steps：
A, electrocondution slurry is prepared first, and the electrocondution slurry is mixed by metal-powder, glass powder and resin solvent
It stirs；
B, above-mentioned electrocondution slurry is filled into syringe, then puts syringe to glue machine equipment, while by manually will be saturating
Bright electrically-conductive backing plate is placed on the corresponding position under halftone, is then had good positioning conducting wire and electrically conducting transparent by the auxiliary body of dispenser
Substrate, finally by electrocondution slurry dispensing in the junction of conducting wire and transparent conductive substrate, while dispenser is also to electrically conducting transparent base
Plate film printing；
C, above-mentioned dispensing product is put into oven, so that it is toasted 1 hour or more at a temperature of more than 400 DEG C, finally makes
Obtain transparent conductive substrate and conductor connecting structure.
The preparation process of the electrocondution slurry is as follows：It is first put into solvent to be stirred using homogenizer with resin, stir
The time is mixed in 1 hour, glass powder is placed into and is stirred, 2 hours of mixing time, metal-powder is placed into and is stirred
It mixes, 6 hours of mixing time, is put into three-roll grinder after stirred and rolls, until resin solvent, metal-powder and glass powder
Completely until fusion.
According to the disclosure and teachings of the above specification, those skilled in the art in the invention can also be to above-mentioned embodiment party
Formula is changed and is changed.Therefore, the invention is not limited in the above embodiments, and every those skilled in the art are in the present invention
On the basis of made any conspicuously improved, replacement or modification all belong to the scope of protection of the present invention.In addition, although
Some specific terms are used in this specification, these terms are merely for convenience of description, does not constitute and appoints to the present invention
What is limited.
Claims (5)
1. a kind of transparent conductive substrate and conductor connecting structure, it is characterised in that：Including transparent conductive substrate, conducting wire and conduction
Layer, the transparent conductive substrate be crystal glass sheet, the conductive layer by 6-8 parts of metal-powders, 0.1-2 parts of glass powders and
Then 0.5-2 parts of resin solvents are mixed to be made by toasting, the conducting wire passes through the conductive layer and the electrically conducting transparent
Substrates into intimate connects.
2. transparent conductive substrate according to claim 1 and conductor connecting structure, it is characterised in that：The conductive layer is by 7
Part metal-powder, 1 part of glass powder and 1 part of resin solvent are made.
3. transparent conductive substrate according to claim 1 and conductor connecting structure, it is characterised in that：The metal-powder by
The silver paste of 70-80% and the copper powder of 20-30%, which are mixed, to be made.
4. a kind of preparation method of claim 1-3 any one of them transparent conductive substrate and conductor connecting structure, feature
It is, includes the following steps：
A, electrocondution slurry is prepared first, and the electrocondution slurry is mixed by metal-powder, glass powder and resin solvent
It forms；
B, above-mentioned electrocondution slurry is filled into syringe, then puts syringe to glue machine equipment, while by manually being led transparent
Electric substrate is placed on the corresponding position under halftone, is then had good positioning conducting wire and electrically conducting transparent base by the auxiliary body of dispenser
Plate, finally by electrocondution slurry dispensing in the junction of conducting wire and transparent conductive substrate, while dispenser is also to transparent conductive substrate
Film printing；
C, above-mentioned dispensing product is put into oven, so that it is toasted at a temperature of more than 400 DEG C 1 hour or more, is finally made saturating
Bright electrically-conductive backing plate and conductor connecting structure.
5. the preparation method of transparent conductive substrate according to claim 4 and conductor connecting structure, which is characterized in that described
The preparation process of electrocondution slurry is as follows：It is first put into solvent to be stirred using homogenizer with resin, mixing time is small at 1
When, it places into glass powder and is stirred, 2 hours of mixing time, place into metal-powder and be stirred, mixing time 6
Hour, it is put into three-roll grinder after stirred and rolls, until resin solvent, metal-powder and glass powder merge completely.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810211356.8A CN108511111A (en) | 2018-03-14 | 2018-03-14 | A kind of transparent conductive substrate and conductor connecting structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810211356.8A CN108511111A (en) | 2018-03-14 | 2018-03-14 | A kind of transparent conductive substrate and conductor connecting structure and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN108511111A true CN108511111A (en) | 2018-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810211356.8A Pending CN108511111A (en) | 2018-03-14 | 2018-03-14 | A kind of transparent conductive substrate and conductor connecting structure and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86108870A (en) * | 1986-12-29 | 1988-07-20 | 华中师范大学 | Metal electrode preparation on nesa coating and wire bonds and the film |
| CN101442174A (en) * | 2008-12-02 | 2009-05-27 | 浙江大学 | Method for welding electric external down-lead on electrode of ITO conductive glass |
| CN104167472A (en) * | 2014-07-29 | 2014-11-26 | 河北汉盛光电科技有限公司 | Heterojunction solar energy battery and preparation method thereof |
| CN104715807A (en) * | 2013-12-17 | 2015-06-17 | 财团法人工业技术研究院 | Conductive adhesive composition and method for forming electrode |
| CN206951491U (en) * | 2017-04-13 | 2018-02-02 | 华蓥旗邦微电子有限公司 | A kind of electronic component point glue equipment |
-
2018
- 2018-03-14 CN CN201810211356.8A patent/CN108511111A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86108870A (en) * | 1986-12-29 | 1988-07-20 | 华中师范大学 | Metal electrode preparation on nesa coating and wire bonds and the film |
| CN101442174A (en) * | 2008-12-02 | 2009-05-27 | 浙江大学 | Method for welding electric external down-lead on electrode of ITO conductive glass |
| CN104715807A (en) * | 2013-12-17 | 2015-06-17 | 财团法人工业技术研究院 | Conductive adhesive composition and method for forming electrode |
| CN104167472A (en) * | 2014-07-29 | 2014-11-26 | 河北汉盛光电科技有限公司 | Heterojunction solar energy battery and preparation method thereof |
| CN206951491U (en) * | 2017-04-13 | 2018-02-02 | 华蓥旗邦微电子有限公司 | A kind of electronic component point glue equipment |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180907 |
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| RJ01 | Rejection of invention patent application after publication |