CN108508703A - A kind of application method that ultraviolet LED image in metal etch shifts - Google Patents
A kind of application method that ultraviolet LED image in metal etch shifts Download PDFInfo
- Publication number
- CN108508703A CN108508703A CN201710102732.5A CN201710102732A CN108508703A CN 108508703 A CN108508703 A CN 108508703A CN 201710102732 A CN201710102732 A CN 201710102732A CN 108508703 A CN108508703 A CN 108508703A
- Authority
- CN
- China
- Prior art keywords
- ultraviolet led
- film
- metal etch
- application method
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The application method that the invention discloses a kind of ultraviolet LEDs in metal etch in image transfer, the ultraviolet LED are provided with 500 lamp beads, and lamp bead radially displays into circle, and the emission wavelength of lamp bead is 365 395 nanometers；The ultraviolet LED is used in metal etch on the exposure machine of image transfering process；For ultraviolet LED by the way of lamp postcooling, the service life of ultraviolet LED is that 8,000 10000 ultraviolet LED lamp list branch service lifes of the invention are more than 5 years, is more energy-saving and environmentally friendly, easy to disassemble, convenient for safeguarding, reduces and safeguards renewal cost, saves production cost；Illuminance is stablized, and improves exposure effect, further increases metal etch effect；Calorific value is small, and generate heat is only the 5%, energy saving 70% or more of prior art mercury fluorescent tube, and mercury fluorescent tube is far superior to from power consumption and maintenance and repair cost, has great market popularization value.
Description
Technical field
The present invention relates to metal etch technical field, specifically a kind of ultraviolet LED is in metal etch in image transfer
Application method.
Background technology
Metal etch refers to by exposure imaging process by the pattern transfer of product to metallic steel on piece, it would be desirable to etching
Region is protected, and the region that do not etch removes protective film and exposes metal part, then is corroded with chemical agent, is formed
Concave-convex half quarter or the molding finished product of hollow out；Electronics sheet parts are largely that fine etching is produced in aviation, machinery, chemical industry
Product, especially on manufacture of semiconductor, the even more indispensable technology of etching；In the prior art, the detailed process of production is etched
For：Incoming Quality Control, application, exposure, development, mends point, etching, striping, cleaning, drying, inspection, packaging at cleaning；Exposure therein
Process refers under illumination effect, by photoresist, that is, photoresist by the skill in the pattern transfer to substrate on mask plate
Art, main process are：The substrate surface with a layer photoresist film is irradiated to by mask plate with ultraviolet light first, is caused
The photoresist of exposure area chemically reacts；The photoetching of removal exposure area or unexposed area is dissolved by developing technique again
Glue makes the figure on mask plate be copied on photoresist film；It finally will be in pattern transfer to substrate using lithographic technique；Figure
The accuracy that shape replicates depends on light；The figure that need to be etched is transferred to two completely the same glue in such a way that light is painted first
On the piece film, or it is transferred on two completely the same glass films by way of photoetching；Then pass through the manually side of contraposition
The film is aligned by formula or machine alignment mode, then will be had been coated with photosensitive-ink or posted the steel disc of photosensitive dry film and be placed in the film
Between, it can be exposed after air-breathing；The steel disc corresponded to when exposure at film black is not photosensitive, the steel disc sense at corresponding film white
Polymerisation occurs for light, the ink or dry film at the photosensitive place of steel disc；Finally pass through developing machine, by photosensitive ink or dry film on steel disc
Not developed liquid dissolves, and not photosensitive ink or dry film is dissolved removal in developer solution, and the figure that need to be etched in this way passes through exposure
Light is transferred to steel disc up.
Exposure is under ultraviolet light, and photoinitiator absorbs luminous energy and resolves into free radical, and free radical causes again not to be polymerize
Monomer carries out polymerization crosslinking reaction, and the bodily form macromolecular structure insoluble in dilute alkaline soln is formed after reaction；Exposure is generally automatic
It is carried out in the exposure machine of face, present exposure machine is divided to air-cooled and two kinds of water cooling, exposure image matter according to the type of cooling difference of light source
Amount is in addition to the performance of dry film photoresist, the control of time, that is, light exposure of selection, the exposure of light source, the quality of photographic film
Deng being all an important factor for influencing exposal image-forming quality；When under-exposure, since monomer polymerization is not thorough, in developing process
In, glued membrane swelling softens, and lines are unintelligible, and color and luster dimness or even degumming, film warps in etching process, plating, or even de-
It falls；It when over-exposed, can cause to be difficult to develop, glued membrane embrittlement leaves the disadvantages such as residue glue；Exposure will generate the inclined of image line width
Difference, excessive exposure can make pattern line attenuate, and keep the lines of product thicker, according to the bright degree of dry film, image after development
Whether whether clear, image line width is consistent etc. to determine the time for exposure appropriate with original negative.
Exposing Lamp in the prior art mostly uses greatly capillary water silver fluorescent tube, and exposure machine is divided into upper and lower surface root fluorescent tube, every
5000W, this light source have the following disadvantages in practice：Power is big, power consumption is more, is calculated by every lamp 5000W, one
The luminous general power of platform exposure machine is 10000KWW, it is meant that needs 10 degree of electricity per hour；Spectral region is wide, mercury capillary lighting tube
Optical wavelength it is very big from infrared light to ultraviolet light span, and the wavelength of our common photoresists actual needs is 365-395 μ
m；Calorific value is big, and the film for being easy to be used in image transfer occurs frequent flexible and causes geometric deformation；Luminous quantity is unstable,
Mourning subtracts soon, and with the increase of usage time, luminous quantity declines quickly, and common service life is 10 days or so；Use cost is high,
Other than the power consumption of itself, it is very high to be replaced as frequently as fluorescent tube use cost, and 1 month 1 machine usually requires to replace 6 tubes,
By the every 1000 yuan of calculating of market price, the lamp consumption cost of an exposure machine monthly is about 6000 yuan, this is produced into product
Prodigious ratio is accounted in this；The maintenance of fluorescent tube is extremely difficult because mercury vapor lamp can be produced when lighting with a large amount of heat, in order to
This heat and the influence to production process are reduced, device fabrication factory is usually radiated with high wind or ice water, radiated with wind
There are two disadvantage one be that noise is big, second is that the clean level of workplace is difficult to ensure；Often fluorescent tube is soaked with water-cooled
In the ice water for entering flowing, light is to penetrate out from flowing water, and the power of light is big by water quality impact, and fluorescent tube is when lighting
The high fever of generation easily makes water generate precipitation, and the precipitation of generation is wrapped seriously affects the effect of light in fluorescent tube periphery, then influences to expose
Light effect.
Invention content
The purpose of the present invention is to provide a kind of at low cost, environmental protection and energy saving, service life is long, illuminance is stable, safeguards letter
Application method of the ultraviolet LED single, calorific value is small in metal etch in image transfer, to solve to propose in above-mentioned background technology
The problem of.
To achieve the above object, the present invention provides the following technical solutions：
A kind of application method that ultraviolet LED image in metal etch shifts, the ultraviolet LED are provided with 500 lamps
Pearl, lamp bead radially display into circle, and the emission wavelength of lamp bead is 365-395 nanometers；The ultraviolet LED is used in metal erosion
In quarter on the exposure machine of image transfering process.
As a further solution of the present invention：For the ultraviolet LED by the way of lamp postcooling, ultraviolet LED uses the longevity
Life is 8000-10000 times.
As further scheme of the invention：The method of the metal etch includes the following steps：
1) cleaning frame member glass and polyester film：It opens exposure machine and uses vapour with alcohol cleaning frame member glass and polyester film
The oil cleaning film；
2) piece Guan Yuan is true according to the verification for carrying out related content with the film with the model of work order, version date and designer
Recognize, handoff operations employee makees after confirming qualification；Prelocalization operator's self-test film is exposed, according to the model with work order, version day
Phase and designer reaffirm the correctness of the film；
3) start exposure machine：Using water cooling exposure machine, exposure machine fluorescent tube ultraviolet LED opens main power source electric brake, opens exposure
Machine starting switch, subsequently enters interface, is opened by system；Check exposure index setting it is required numerically；
4) self-test：First item inspection beats series to exposing product for the first time, after development under fluorescent light, by poor visualization part
It ticks, and is compareed with the work film, the bad part of the film is modified；
5) it is exposed process：Frame is opened, substrate is put into, vacuumizes, puts down frame locking, scrubbing brush catches up with gas, push-in to expose
It is exposed in ray machine；
6) exposure machine is closed, battery main switch is closed.
As further scheme of the invention：After closing battery main switch, the red film is cleaned.
As further scheme of the invention：It is produced in batches after first item inspection qualification, mother matrix service life is two
Year, not used do scraps processing within 2 years；Initial workpiece inspection is qualified within ± 0.01 with the error of pattern transfer.
As further scheme of the invention：It exposes series and requires to be 5-10 grades, every half an hour/time beat series and examine
Other technological parameter accordances are looked into, do primary record per hour；Examine surface whether there is or not white point, scratch the defects of.
As further scheme of the invention：In the step 1), film cleaning：30-35/times, the film is two-sided every
Secondary cleaning 2 times, wheat membrane cleans 1 time, and keeps a record；Material cleans：Every plank is clear by dust-binding machine before specialities exposure
Clean, dust-binding machine is cleaned out in time using front and back.
As further scheme of the invention：, it is specified that it is front to have the film of word in the step 2), and downward,
The upper left of the front film, in, bottom right examine 3 points, dislocation≤0.005mm.
As further scheme of the invention：In the step 5), vacuumized conditions are -0.08MPa to -0.10MPa；
Exposure room environment temperature is 25 ± 5 DEG C, relative humidity 40-60%.
Compared with prior art, the beneficial effects of the invention are as follows：The ultraviolet LED lamp list branch service life of the present invention is more than five
Year, it is more energy-saving and environmentally friendly, it is easy to disassemble, it convenient for safeguarding, reduces and safeguards renewal cost, save production cost；Illuminance is stablized,
Exposure effect is improved, metal etch effect is further increased；Calorific value is small, and generate heat is only prior art mercury fluorescent tube
5%, energy saving 70% or more, from power consumption and maintenance and repair cost be far superior to mercury fluorescent tube, have great market
Promotional value.
Specific implementation mode
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
In the embodiment of the present invention, a kind of application method that ultraviolet LED image in metal etch shifts is described ultraviolet
LED is provided with 500 lamp beads, and lamp bead radially displays into circle, and the emission wavelength of lamp bead is 365-395 nanometers；The purple
Outer LED is used in metal etch on the exposure machine of image transfering process, and ultraviolet LED uses the longevity by the way of lamp postcooling
Life is 8000-10000 times.
The method of the metal etch includes the following steps：
1) cleaning frame member glass and polyester film：It opens exposure machine and uses vapour with alcohol cleaning frame member glass and polyester film
The oil cleaning film；
2) piece Guan Yuan is true according to the verification for carrying out related content with the film with the model of work order, version date and designer
Recognize, handoff operations employee makees after confirming qualification；Prelocalization operator's self-test film is exposed, according to the model with work order, version day
Phase and designer reaffirm the correctness of the film；
3) start exposure machine：Using water cooling exposure machine, exposure machine fluorescent tube ultraviolet LED opens main power source electric brake, opens exposure
Machine starting switch, subsequently enters interface, is opened by system；Check exposure index setting it is required numerically；
4) self-test：First item inspection beats series to exposing product for the first time, after development under fluorescent light, by poor visualization part
It ticks, and is compareed with the work film, the bad part of the film is modified；
5) it is exposed process：Frame is opened, substrate is put into, vacuumizes, puts down frame locking, scrubbing brush catches up with gas, push-in to expose
It is exposed in ray machine；
6) exposure machine is closed, battery main switch is closed.
It should be noted in operation：After closing battery main switch, the red film is cleaned；First item inspection is qualified
After produced in batches, mother matrix service life be 2 years, not used do scraps processing within 2 years；Initial workpiece inspection, with pattern transfer
Error be qualified within ± 0.01；It exposes series and requires to be 5-10 grades, every half an hour/time beat series and check other works
Skill parameter accordance, does primary record per hour；Examine surface whether there is or not white point, scratch the defects of.
In the step 1), film cleaning：30-35/times, the two-sided each cleaning of the film 2 times, wheat membrane cleans 1 time, and
It keeps a record；Material cleans：Every plank is cleaned by dust-binding machine before specialities exposure, and dust-binding machine is dry using front and back timely cleaning
Only；, it is specified that it is front to have the film of word in the step 2), and downward, the upper left of the front film, in, bottom right examine at 3 points,
Dislocation≤0.005mm；In the step 5), vacuumized conditions are -0.08MPa to -0.10MPa；Exposure room environment temperature is 25
± 5 DEG C, relative humidity 40-60%.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Profit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiment being appreciated that.
Claims (9)
1. a kind of application method of ultraviolet LED in metal etch in image transfer, which is characterized in that the ultraviolet LED setting
There are 500 lamp beads, lamp bead radially to display into circle, the emission wavelength of lamp bead is 365-395 nanometers；The ultraviolet LED fortune
With in metal etch on the exposure machine of image transfering process.
2. application method of the ultraviolet LED according to claim 1 in metal etch in image transfer, which is characterized in that
For the ultraviolet LED by the way of lamp postcooling, the service life of ultraviolet LED is 8000-10000 times.
3. application method of the ultraviolet LED according to claim 1 in metal etch in image transfer, which is characterized in that
The method of the metal etch includes the following steps：
1) cleaning frame member glass and polyester film：Exposure machine is opened, it is clear with gasoline with alcohol cleaning frame member glass and polyester film
The clean film；
2) piece Guan Yuan confirms according to the verification for carrying out related content with the model of work order, version date and designer and the film, really
Handoff operations employee makees after recognizing qualification；Prelocalization operator's self-test film is exposed, according to the model of work order, version date and setting
Meter people reaffirms the correctness of the film；
3) start exposure machine：Using water cooling exposure machine, exposure machine fluorescent tube ultraviolet LED opens main power source electric brake, opens exposure machine and opens
Dynamic switch, subsequently enters interface, is opened by system；Check exposure index setting it is required numerically；
4) self-test：First item inspection beats series to exposing product for the first time, after development under fluorescent light, poor visualization part is ticked,
And compareed with the work film, the bad part of the film is modified；
5) it is exposed process：Frame is opened, substrate is put into, vacuumizes, puts down frame locking, scrubbing brush catches up with gas, is pushed into exposure machine
In be exposed；
6) exposure machine is closed, battery main switch is closed.
4. application method of the ultraviolet LED according to claim 3 in metal etch in image transfer, which is characterized in that
After closing battery main switch, the red film is cleaned.
5. application method of the ultraviolet LED according to claim 3 in metal etch in image transfer, which is characterized in that
It is produced in batches after first item inspection qualification, mother matrix service life is 2 years, and not used do scraps processing within 2 years；Initial workpiece is examined
It looks into, is qualified within ± 0.01 with the error of pattern transfer.
6. application method of the ultraviolet LED according to claim 3 in metal etch in image transfer, which is characterized in that
It exposes series and requires to be 5-10 grade, every half an hour/time beat series and check other technological parameter accordances, do per hour once
Record；Examine surface whether there is or not white point, scratch the defects of.
7. application method of the ultraviolet LED according to claim 3 in metal etch in image transfer, which is characterized in that
In the step 1), film cleaning：30-35/times, the two-sided each cleaning of the film 2 times, wheat membrane cleans 1 time, and keeps a record；
Material cleans：Every plank is cleaned by dust-binding machine before specialities exposure, and dust-binding machine is cleaned out in time using front and back.
8. application method of the ultraviolet LED according to claim 3 in metal etch in image transfer, which is characterized in that
, it is specified that it is front to have the film of word in the step 2), and downward, the upper left of the front film, in, bottom right examine at 3 points, it is wrong
Position≤0.005mm.
9. application method of the ultraviolet LED according to claim 3 in metal etch in image transfer, which is characterized in that
In the step 5), vacuumized conditions are -0.08MPa to -0.10MPa；Exposure room environment temperature is 25 ± 5 DEG C, relative humidity
For 40-60%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710102732.5A CN108508703A (en) | 2017-02-24 | 2017-02-24 | A kind of application method that ultraviolet LED image in metal etch shifts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710102732.5A CN108508703A (en) | 2017-02-24 | 2017-02-24 | A kind of application method that ultraviolet LED image in metal etch shifts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108508703A true CN108508703A (en) | 2018-09-07 |
Family
ID=63372729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710102732.5A Pending CN108508703A (en) | 2017-02-24 | 2017-02-24 | A kind of application method that ultraviolet LED image in metal etch shifts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108508703A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201122230Y (en) * | 2007-12-05 | 2008-09-24 | 福州高意光学有限公司 | Ultraviolet exposure machine |
| KR20120029062A (en) * | 2010-09-16 | 2012-03-26 | 엘지이노텍 주식회사 | Photolithography apparatus |
| CN202498536U (en) * | 2012-02-07 | 2012-10-24 | 深圳市深联电路有限公司 | Auxiliary tool box for PCB exposure |
| CN203705818U (en) * | 2013-08-15 | 2014-07-09 | 深圳市汉普芯电子有限公司 | Novel energy-saving exposure curing machine |
| CN103994357A (en) * | 2014-06-06 | 2014-08-20 | 兰卫国 | Ultra-violet LED face light source for PCB exposure machine |
| CN104620177A (en) * | 2012-08-27 | 2015-05-13 | 麦克德米德印刷方案股份有限公司 | Method of improving print performance in flexographic printing plates |
| CN105321938A (en) * | 2014-07-11 | 2016-02-10 | 弘凯光电(深圳)有限公司 | LED light-emitting device |
| CN105886133A (en) * | 2016-06-01 | 2016-08-24 | 深圳市松柏实业发展有限公司 | Flame-retardant negative film cleanser |
| CN106226989A (en) * | 2016-09-28 | 2016-12-14 | 合肥翰博星辰高新材料有限公司 | Half tone printing down technique |
-
2017
- 2017-02-24 CN CN201710102732.5A patent/CN108508703A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201122230Y (en) * | 2007-12-05 | 2008-09-24 | 福州高意光学有限公司 | Ultraviolet exposure machine |
| KR20120029062A (en) * | 2010-09-16 | 2012-03-26 | 엘지이노텍 주식회사 | Photolithography apparatus |
| CN202498536U (en) * | 2012-02-07 | 2012-10-24 | 深圳市深联电路有限公司 | Auxiliary tool box for PCB exposure |
| CN104620177A (en) * | 2012-08-27 | 2015-05-13 | 麦克德米德印刷方案股份有限公司 | Method of improving print performance in flexographic printing plates |
| CN203705818U (en) * | 2013-08-15 | 2014-07-09 | 深圳市汉普芯电子有限公司 | Novel energy-saving exposure curing machine |
| CN103994357A (en) * | 2014-06-06 | 2014-08-20 | 兰卫国 | Ultra-violet LED face light source for PCB exposure machine |
| CN105321938A (en) * | 2014-07-11 | 2016-02-10 | 弘凯光电(深圳)有限公司 | LED light-emitting device |
| CN105886133A (en) * | 2016-06-01 | 2016-08-24 | 深圳市松柏实业发展有限公司 | Flame-retardant negative film cleanser |
| CN106226989A (en) * | 2016-09-28 | 2016-12-14 | 合肥翰博星辰高新材料有限公司 | Half tone printing down technique |
Non-Patent Citations (1)
| Title |
|---|
| 吴文明等: "《平板显示器的制造与测试》", 30 September 2012 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6087050A (en) | Radiation sensitive composition and color filter | |
| TWI422971B (en) | Negative photosensitive resin composition | |
| TW527656B (en) | Manufacturing method of photomask, manufacturing method of semi-finished photomask and regenerating method of photomask | |
| CN1645253B (en) | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board | |
| US20070292804A1 (en) | Photosensitive Resin Composition and Photosensitive Dry Film by the Use Thereof | |
| WO2016008384A1 (en) | Photosensitive composition containing oxime-ester photoinitiator and application thereof | |
| TWI534538B (en) | Negative photosensitive resin composition | |
| CN104710868A (en) | Etching-resistant photosensitive protection printing ink | |
| KR20050076753A (en) | Radiation sensitive resin composition for forming spacer, spacer and its forming method, and liquid crystal display device | |
| CN101382731B (en) | Method for repairing black spot like defect on mask plate special for IC | |
| CN114286498B (en) | PCB preparation method and PCB | |
| CN108508703A (en) | A kind of application method that ultraviolet LED image in metal etch shifts | |
| KR20070070472A (en) | Photosensitive resin composition and black matrix thereof | |
| KR100671107B1 (en) | Photosensitive resin composition and black matrix thereof | |
| CN108205240B (en) | Photosensitive resin composition with high photosensitivity and excellent hole masking performance and application thereof | |
| CN102692813B (en) | Manufacturing method of optical mask, image transferring method and manufacturing method of display device | |
| KR20100063540A (en) | Negative photosensitive resin composition | |
| JPH11142639A (en) | Production of black matrix and color filter and color filter | |
| CN116339075A (en) | Copper mesh positive photoresist etching method | |
| CN110676156A (en) | Photoetching semiconductor processing technology | |
| TWI576654B (en) | Photomask blank and photomask | |
| JPH10293397A (en) | Radiation sensitive composition for color filter | |
| CN114280832B (en) | Preparation method of LCD and TP integrated color liquid crystal display screen | |
| JP2001343734A (en) | Photomask and method for producing the same, and photomask material and photosensitive transfer material for the photomask material | |
| JPH10206623A (en) | Color filter and manufacture thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180907 |