CN108507556B - Method and device for correcting and adjusting non-uniform quality factors of gyro harmonic oscillators with cylindrical shells - Google Patents
Method and device for correcting and adjusting non-uniform quality factors of gyro harmonic oscillators with cylindrical shells Download PDFInfo
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Abstract
The invention provides a method and a device for correcting and adjusting non-uniform quality factors of a gyroscope harmonic oscillator of a cylindrical shell, wherein first damping lines and second damping lines of the harmonic oscillator are determined, each first damping line is a connecting line of a first circumferential point and the axis of the harmonic oscillator, each second damping line is a connecting line of a second circumferential point and the axis of the harmonic oscillator, and each first circumferential point and each second circumferential point are points on the outer edge of the harmonic oscillator when the quality factors of the harmonic oscillator respectively take a maximum value and a minimum value along with the distribution of the circumference; piezoelectric materials with different sizes are respectively pasted on each first damping line and each second damping line, so that the difference between the maximum value and the minimum value of the quality factor of the harmonic oscillator pasted with the piezoelectric materials with different sizes is smaller than a first preset value; therefore, the piezoelectric materials with different sizes are pasted at proper positions through the influence of the piezoelectric materials with different sizes on different damping characteristics of the harmonic oscillator, and the purpose of reducing the non-uniform degree of the quality factor of the harmonic oscillator is achieved.
Description
Technical Field
The invention relates to the technical field of solid vibration gyroscopes, in particular to a method and a device for correcting and adjusting non-uniform quality factors of gyroscope harmonic oscillators of a cylindrical shell.
Background
The solid fluctuation gyro is a gyro utilizing the Goldfish force principle and has the characteristics of high precision, small volume, good impact resistance and the like. The cylindrical shell vibrating gyroscope is one kind of solid fluctuation gyroscope, and the harmonic oscillator has the advantages of simple structure, low processing cost, high precision and the like, so that the cylindrical shell vibrating gyroscope has great market potential.
The cylindrical shell harmonic oscillator is a core device of the cylindrical shell vibration gyro, and the quality of the cylindrical shell harmonic oscillator directly determines the performance of the gyro. However, the material of the cylindrical shell resonator has a certain non-uniformity, and the material is a typical thin-wall shell part, and the processing difficulty is large, so that the quality of the resonator is difficult to guarantee. The processing error and the material nonuniformity mainly bring quality defects such as frequency cracking, uneven quality factor and the like to the harmonic oscillator, the uneven quality factor shows that the quality factor of the harmonic oscillator is unevenly distributed along with the circumference, and when the uneven degree of the quality factor is too high, the stable vibration state of the cylindrical shell vibration gyro is influenced, and finally the zero offset drift of the gyro is caused.
The excitation electrode of the resonator is usually made of a piezoelectric material, which is a material with high damping characteristics, however, the piezoelectric material is usually adhered to the resonator in the same size and uniformly distributed manner, and the adhering manner in the same size and uniformly distributed manner can greatly reduce the quality factor value of the resonator, but cannot change the degree of the non-uniform quality factor of the resonator, that is, the current resonator does not utilize the high damping characteristics of the piezoelectric material to adjust the degree of the non-uniform quality factor of the resonator.
Disclosure of Invention
In order to overcome the problems or at least partially solve the problems, the invention provides a method and a device for trimming non-uniformity of quality factors of gyro harmonic oscillators of cylindrical shells.
According to one aspect of the invention, a method for trimming the unevenness of quality factors of gyro harmonic oscillators with cylindrical shells is provided, which comprises the following steps: determining first damping lines and second damping lines on the harmonic oscillator, wherein each first damping line is a connecting line of a first circumferential point and the center of the harmonic oscillator, each second damping line is a connecting line of a second circumferential point and the axis of the harmonic oscillator, each first circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes the maximum value along with the distribution of the circumference, each second circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes the minimum value along with the distribution of the circumference, and the circumference is the circumference where the outer edge of the harmonic oscillator is located; piezoelectric materials with different sizes are respectively pasted along each first damping line and each second damping line on the harmonic oscillator, so that the difference between the maximum value and the minimum value of the quality factor of the harmonic oscillator pasted with the piezoelectric materials with different sizes is smaller than a first preset value.
Wherein, confirm first damping line and second damping line on the harmonic oscillator, include: cracking and adjusting the frequency of the harmonic oscillator to be below a second preset value; acquiring a distribution curve of the quality factors of the harmonic oscillators along with the circumference; determining each first circumferential point corresponding to the maximum value of the quality factor of the harmonic oscillator and each second circumferential point corresponding to the minimum value of the quality factor of the harmonic oscillator according to the distribution curve; and a connecting line of each first circumferential point and the center of the harmonic oscillator is used as a first damping line, and a connecting line of each second circumferential point and the center of the harmonic oscillator is used as a second damping line.
The method for acquiring the distribution curve of the quality factors of the harmonic oscillators along with the circumference comprises the following steps: driving the harmonic oscillator to rotate around the center of the harmonic oscillator, applying an excitation signal to the outer edge of the harmonic oscillator every time the harmonic oscillator rotates by a preset angle, and acquiring the quality factor of the harmonic oscillator corresponding to each excitation point according to the excitation signal; and acquiring a distribution curve of the quality factors of the harmonic oscillators along with the circumference according to the quality factor of the harmonic oscillator corresponding to each excitation point.
The method for acquiring the quality factor of the harmonic oscillator corresponding to each excitation point according to the excitation signal comprises the following steps: acquiring an amplitude-frequency response curve of the harmonic oscillator corresponding to each excitation point according to the excitation signal; and acquiring the quality factor of the harmonic oscillator corresponding to each excitation point according to the amplitude-frequency response curve of the harmonic oscillator corresponding to each excitation point.
Wherein, paste the piezoelectric material of different sizes respectively along every first damping line and every second damping line on the harmonic oscillator, include: determining a first size of the piezoelectric material attached to each first damper wire and a second size of the piezoelectric material attached to each second damper wire; respectively pasting piezoelectric materials with a first size on each first damping line, wherein for the first piezoelectric materials pasted on any one first damping line, one end of each first piezoelectric material is in contact with the outer edge of each harmonic oscillator, and the length direction of each first piezoelectric material is parallel to any one first damping line; and respectively pasting the piezoelectric materials with the second size on each second damping line, wherein for the second piezoelectric materials pasted on any one second damping line, one end of each second piezoelectric material is in contact with the outer edge of each harmonic oscillator, and the length direction of each second piezoelectric material is parallel to any one second damping line.
Wherein determining a first size of the piezoelectric material attached to each first damper wire and a second size of the piezoelectric material attached to each second damper wire comprises: setting the initial preset size of the piezoelectric material as a second size; reducing the length value in the second size on the second size according to a third preset value, and taking the size with the reduced length value as a test size; acquiring a difference value between the maximum value and the minimum value of the quality factor of the harmonic oscillator after the piezoelectric material with the test size is pasted on each first damping line and the piezoelectric material with the second size is pasted on each second damping line, and taking the difference value as a test difference value; if the test difference value is smaller than the first preset value, taking the test size as a first size; if the test difference value is not smaller than the first preset value, the length value in the test size is reduced on the test size according to the third preset value to update the test size, the updated test difference value is obtained again according to the updated test size, and the updated test difference value is compared with the first preset value until the first size is obtained.
In another aspect of the present invention, a device for adjusting quality factor non-uniformity of a gyro harmonic oscillator with a cylindrical shell is provided, which includes: at least one processor; and at least one memory communicatively coupled to the processor, wherein: the memory stores program instructions executable by the processor, which invokes the program instructions to perform the methods described above.
In yet another aspect of the invention, a computer program product is provided, the computer program product comprising a computer program stored on a non-transitory computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform the method described above.
In yet another aspect of the present invention, a non-transitory computer-readable storage medium is provided, which stores a computer program that causes a computer to perform the above-described method.
The invention provides a method and a device for correcting and adjusting non-uniform quality factors of a gyroscope harmonic oscillator of a cylindrical shell, wherein first damping lines and second damping lines of the harmonic oscillator are determined, each first damping line is a connecting line of a first circumferential point and the axis of the harmonic oscillator, each second damping line is a connecting line of a second circumferential point and the axis of the harmonic oscillator, each first circumferential point is a point on the outer edge of the harmonic oscillator when the quality factor of the harmonic oscillator takes a maximum value along with the distribution of the circumference, and each second circumferential point is a point on the outer edge of the harmonic oscillator when the quality factor of the harmonic oscillator takes a minimum value along with the distribution of the circumference; piezoelectric materials with different sizes are respectively pasted on each first damping line and each second damping line, so that the difference between the maximum value and the minimum value of the quality factor of the harmonic oscillator pasted with the piezoelectric materials with different sizes is smaller than a first preset value; therefore, the piezoelectric materials with different sizes are pasted at proper positions through the influence of the piezoelectric materials with different sizes on different damping characteristics of the harmonic oscillator, and the purpose of reducing the non-uniform degree of the quality factor of the harmonic oscillator is achieved.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic diagram of a method for trimming quality factors of cylindrical shell gyroscope harmonic oscillators in a non-uniform manner according to an embodiment of the invention;
fig. 2 is a schematic diagram of a first damping line and a second damping line within a quarter of a circumference of a harmonic oscillator according to an embodiment of the present invention;
fig. 3 is a distribution curve of quality factors of harmonic oscillators according to an embodiment of the invention along a circumference;
fig. 4 is a schematic diagram illustrating a manner of attaching the piezoelectric material of the resonator according to the embodiment of the present invention;
fig. 5 is a graph comparing quality factors before and after trimming a harmonic oscillator with a circumferential distribution curve according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In an embodiment of the present invention, referring to fig. 1, there is provided a method for adjusting quality factor non-uniformity of a gyro harmonic oscillator with a cylindrical shell, including: s11, determining first damping lines and second damping lines on the harmonic oscillator, wherein each first damping line is a connecting line between a first circumferential point and the center of the harmonic oscillator, each second damping line is a connecting line between a second circumferential point and the axis of the harmonic oscillator, each first circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes the maximum value along with the distribution of the circumference, each second circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes the minimum value along with the distribution of the circumference, and the circumference is the circumference where the outer edge of the harmonic oscillator is located; and S12, respectively pasting piezoelectric materials with different sizes along each first damping line and each second damping line on the harmonic oscillator, so that the difference between the maximum value and the minimum value of the quality factor of the harmonic oscillator pasted with the piezoelectric materials with different sizes is smaller than a first preset value.
Specifically, the piezoelectric material is a material with bidirectional reversible conversion property between electric energy and mechanical energy, the damping characteristic of the piezoelectric material integrates multiple energy loss mechanisms, the piezoelectric material deforms under the action of an external force F, if the piezoelectric material is in an open circuit state, electric charges are collected on the surface of the piezoelectric material, and the conversion from the mechanical energy to the electric energy is realized, so that the energy loss is caused; when the conductive network exists, the electric charge generated by the piezoelectric material due to the piezoelectric effect is converted into heat energy under the action of the impedance of the conductive loop; therefore, the piezoelectric material converts the mechanical energy of vibration into electric energy or heat energy due to the piezoelectric effect, which finally results in energy dissipation and generates a certain damping. Most studies believe that the dissipation pathway of energy is primarily due to several of the following: (1) the piezoelectric effect converts the vibration mechanical energy into electric energy, and then the electric energy is converted into joule heat in a certain conductive network to be consumed, so that the mechanical energy is converted into heat energy finally; (2) in the mechanical vibration process, the viscoelastic action and mutual friction among piezoelectric material molecules convert the vibration kinetic energy into heat energy; (3) the dielectric loss of the piezoelectric material also causes a certain amount of energy loss. Since the efficiency of a piezoelectric material in converting mechanical energy into electrical or thermal energy is related to the size of the piezoelectric material, the amount of damping generated by the piezoelectric material is related to the size of the piezoelectric material, and the damping affects the quality factor.
The uneven difference degree of the quality factors of the harmonic oscillators can be represented by the difference between the maximum value and the minimum value of the quality factor along with the distribution of the circumference, for a harmonic oscillator with frequency splitting satisfying the condition, the maximum value and the minimum value of the quality factor can appear once in the range of one quarter of the circumference of the quality factor along with the distribution of the circumference, the included angle between the point on the circumference corresponding to the maximum value and the minimum value and the connecting line of the circle center is 45 degrees, for the two axes with the included angle of 45 degrees, the damping line 1 and the damping line 2 are respectively shown in figure 2, and the corresponding quality factors of the two damping lines are respectively Q1And Q2(ii) a After piezoelectric materials with different sizes are pasted on the harmonic oscillator, additional damping is superposed on the harmonic oscillator, which is equivalent to introducing an equivalent damping line to the harmonic oscillator.
Assuming that the angle between the equivalent damping line and the damping line 1 is θ, the equivalent damping line will generate cos2 θ component on the damping line 1 and sin2 θ component on the damping line 2. The additional damping thus redistributes the damping on the harmonic oscillator and the quality factor of the damping lines 1 and 2 will also change. From the above analysis, if the equivalent damping line has a certain angle with the damping line 1, the two damping lines will be changed at the same timeThe quality factor (Q) value corresponding to the line, if the equivalent damping line coincides with the damping line 1, the Q value corresponding to the damping line 1 will change, but the Q value corresponding to the damping line 2 will not change, and in the same way, when the equivalent damping line coincides with the damping line 2, only the Q value corresponding to the damping line 2 will change, and the Q value corresponding to the damping line 1 will not be affected. When the Q value corresponding to one damping line is changed, the Q value corresponding to the other damping line is kept unchanged, and the quality factor nonuniformity of the harmonic oscillator can be adjusted more efficiently. Suppose Q value Q corresponding to damping line 22Q value Q larger than that of damping wire 11Then, the quality factor nonuniformity of the harmonic oscillator can be modified by adding damping to the damping line 2 or reducing the damping of the damping line 1. Therefore, if the quality factor nonuniformity of the harmonic oscillator is to be adjusted more efficiently, the equivalent damping line must be overlapped with the damping line 1 or the damping line 2 of the harmonic oscillator.
In this embodiment, a first damping line and a second damping line of the resonator are determined, where each first damping line is a connection line between a first circumferential point and an axis of the resonator, each second damping line is a connection line between a second circumferential point and the axis of the resonator, each first circumferential point is a point on an outer edge of the resonator when a quality factor of the resonator takes a maximum value along with the distribution of the circumference, and each second circumferential point is a point on the outer edge of the resonator when the quality factor of the resonator takes a minimum value along with the distribution of the circumference; piezoelectric materials with different sizes are respectively pasted on each first damping line and each second damping line, so that the difference between the maximum value and the minimum value of the quality factor of the harmonic oscillator pasted with the piezoelectric materials with different sizes is smaller than a first preset value (for example 100).
In the embodiment, the piezoelectric materials with different sizes are adhered at proper positions through the influence of the piezoelectric materials with different sizes on different damping characteristics of the harmonic oscillator, so that the aim of reducing the non-uniform degree of the quality factor of the harmonic oscillator is fulfilled.
Based on the above embodiments, determining the first damping line and the second damping line on the harmonic oscillator includes: cracking and adjusting the frequency of the harmonic oscillator to be below a second preset value; acquiring a distribution curve of the quality factors of the harmonic oscillators along with the circumference; determining each first circumferential point corresponding to the maximum value of the quality factor of the harmonic oscillator and each second circumferential point corresponding to the minimum value of the quality factor of the harmonic oscillator according to the distribution curve; and a connecting line of each first circumferential point and the center of the harmonic oscillator is used as a first damping line, and a connecting line of each second circumferential point and the center of the harmonic oscillator is used as a second damping line.
Specifically, for a harmonic oscillator whose frequency cracking satisfies the condition, that is, the size of the frequency cracking is smaller than a certain preset value (e.g., 0.04HZ in this embodiment), within a quarter of a circumference of the distribution of the quality factors along with the circumference, a maximum value and a minimum value of the quality factors occur once, an included angle between a point on the circumference corresponding to the maximum value and the minimum value and a line of the center of a circle is 45 °, a maximum value and a minimum value of the quartic quality factors occur over the entire circumference, an included angle between two adjacent lines is 90 ° for the line of the circumference corresponding to the maximum value and the center of a circle, an included angle between two adjacent lines is 90 ° for the line of the circumference corresponding to the minimum value and the center of a circle, and in order to reduce the test amount, the distribution of the quality factors along with the circumference on the quarter of the circumference is only tested, FIG. 3 is a graph of the distribution of the figure of merit, measured over a quarter of a circle and fitted, over the circle, where the figure of merit assumes a maximum Q2The corresponding minimum damping line (i.e. the first damping line of the quarter circle) and the quality factor take the minimum value Q1The corresponding maximum damping line (i.e. the second damping line of the quarter circle) is determined, and then four first damping lines and four second damping lines on the whole circle are determined according to the minimum damping line and the maximum damping line respectively.
Based on the above embodiment, obtaining a distribution curve of the quality factor of the harmonic oscillator along the circumference includes: driving the harmonic oscillator to rotate around the center of the harmonic oscillator, applying an excitation signal to the outer edge of the harmonic oscillator every time the harmonic oscillator rotates by a preset angle, and acquiring the quality factor of the harmonic oscillator corresponding to each excitation point according to the excitation signal; and acquiring a distribution curve of the quality factors of the harmonic oscillators along with the circumference according to the quality factor of the harmonic oscillator corresponding to each excitation point.
The method for acquiring the quality factor of the harmonic oscillator corresponding to each excitation point according to the excitation signal comprises the following steps: acquiring an amplitude-frequency response curve of the harmonic oscillator corresponding to each excitation point according to the excitation signal; and acquiring the quality factor of the harmonic oscillator corresponding to each excitation point according to the amplitude-frequency response curve of the harmonic oscillator corresponding to each excitation point.
Specifically, a sine sweep frequency signal can be used as an excitation signal to excite the harmonic oscillator, the sensor detects a vibration signal of the harmonic oscillator and analyzes the vibration signal to obtain an amplitude-frequency response curve of the harmonic oscillator, the stepping motor is used for controlling the rotary table to drive the harmonic oscillator to rotate, an amplitude-frequency response curve is measured and analyzed at intervals of a preset angle (for example, 5 degrees), and in order to reduce the test quantity, the harmonic oscillator is rotated around the axis of the harmonic oscillator from 0 degree to 90 degrees to obtain a series of amplitude-frequency response curves. And obtaining the quality factor according to the amplitude-frequency response curve, and obtaining the circumferential distribution curve of the quality factor of the harmonic oscillator according to the relation between the rotation angle and the quality factor.
Based on the above embodiment, the sticking of the piezoelectric materials with different sizes along each first damping line and each second damping line on the harmonic oscillator respectively includes: determining a first size of the piezoelectric material attached to each first damper wire and a second size of the piezoelectric material attached to each second damper wire; respectively pasting piezoelectric materials with a first size on each first damping line, wherein for the first piezoelectric materials pasted on any one first damping line, one end of each first piezoelectric material is in contact with the outer edge of each harmonic oscillator, and the length direction of each first piezoelectric material is parallel to any one first damping line; and respectively pasting the piezoelectric materials with the second size on each second damping line, wherein for the second piezoelectric materials pasted on any one second damping line, one end of each second piezoelectric material is in contact with the outer edge of each harmonic oscillator, and the length direction of each second piezoelectric material is parallel to any one second damping line.
Specifically, as shown in fig. 4, two sizes of piezoelectric materials are determined, wherein the piezoelectric material of the first size is pasted on the first damping line, the piezoelectric material of the second size is pasted on the second damping line, in order to enhance the trimming effect, one end of each piezoelectric material is pasted at a position contacting with the outer edge of the resonator, and the length direction of each piezoelectric material is parallel to the corresponding damping line.
Based on the above embodiments, determining a first size of the piezoelectric material attached to each first damper wire and a second size of the piezoelectric material attached to each second damper wire includes: setting the initial preset size of the piezoelectric material as a second size; reducing the length value in the second size on the second size according to a third preset value, and taking the size with the reduced length value as a test size; acquiring a difference value between the maximum value and the minimum value of the quality factor of the harmonic oscillator after the piezoelectric material with the test size is pasted on each first damping line and the piezoelectric material with the second size is pasted on each second damping line, and taking the difference value as a test difference value; if the test difference value is smaller than the first preset value, taking the test size as a first size; if the test difference value is not smaller than the first preset value, the length value in the test size is reduced on the test size according to the third preset value to update the test size, the updated test difference value is obtained again according to the updated test size, and the updated test difference value is compared with the first preset value until the first size is obtained.
Specifically, since the first damping line corresponds to the maximum value of the quality factor, and the second damping line corresponds to the minimum value of the quality factor, in order to make the quality factor of the harmonic oscillator more uniformly distributed along with the circumference, the size of the piezoelectric material adhered on the first damping line should be smaller than that of the piezoelectric material adhered on the second damping line, and under the condition that the width is not changed, the effect of changing the length of the piezoelectric material on trimming is better, in this embodiment, the length of the piezoelectric material adhered on the first damping line is gradually reduced according to a preset value by keeping the size (i.e. the second size) of the piezoelectric material adhered on the second damping line unchanged at an initial preset size, after each reduction of the length, the quality factor of the harmonic oscillator adhered with the piezoelectric material is retested along with the circumference until the difference between the maximum value and the minimum value of the quality factor of the harmonic oscillator is determined to be smaller than the first preset value, the size of the finally obtained piezoelectric material stuck on the first damper wire is taken as the first size.
The harmonic oscillator is modified by the method, the comparison graph of the quality factors before and after the harmonic oscillator is modified along with the distribution curve of the circumference is shown in fig. 5, and the quality factors of the harmonic oscillator after the harmonic oscillator is modified are distributed more uniformly along with the circumference, which shows that the non-uniform degree of the quality factors of the harmonic oscillator is effectively reduced.
As another embodiment of the present invention, there is provided a tuning apparatus for non-uniformity of quality factor of a gyro harmonic oscillator with a cylindrical shell, including: at least one processor; and at least one memory communicatively coupled to the processor, wherein: the memory stores program instructions executable by the processor, the processor calls the program instructions to perform the methods provided by the method embodiments, for example, including: determining first damping lines and second damping lines on the harmonic oscillator, wherein each first damping line is a connecting line of a first circumferential point and the center of the harmonic oscillator, each second damping line is a connecting line of a second circumferential point and the axis of the harmonic oscillator, each first circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes the maximum value along with the distribution of the circumference, each second circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes the minimum value along with the distribution of the circumference, and the circumference is the circumference where the outer edge of the harmonic oscillator is located; piezoelectric materials with different sizes are respectively pasted along each first damping line and each second damping line on the harmonic oscillator, so that the difference between the maximum value and the minimum value of the quality factor of the harmonic oscillator pasted with the piezoelectric materials with different sizes is smaller than a first preset value.
As yet another embodiment of the present invention, there is provided a computer program product comprising a computer program stored on a non-transitory computer-readable storage medium, the computer program comprising program instructions which, when executed by a computer, enable the computer to perform the methods provided by the above-described method embodiments, for example, including: determining first damping lines and second damping lines on the harmonic oscillator, wherein each first damping line is a connecting line of a first circumferential point and the center of the harmonic oscillator, each second damping line is a connecting line of a second circumferential point and the axis of the harmonic oscillator, each first circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes the maximum value along with the distribution of the circumference, each second circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes the minimum value along with the distribution of the circumference, and the circumference is the circumference where the outer edge of the harmonic oscillator is located; piezoelectric materials with different sizes are respectively pasted along each first damping line and each second damping line on the harmonic oscillator, so that the difference between the maximum value and the minimum value of the quality factor of the harmonic oscillator pasted with the piezoelectric materials with different sizes is smaller than a first preset value.
As yet another embodiment of the present invention, there is provided a non-transitory computer-readable storage medium storing a computer program that causes a computer to perform the methods provided by the above-described method embodiments, including, for example: determining first damping lines and second damping lines on the harmonic oscillator, wherein each first damping line is a connecting line of a first circumferential point and the center of the harmonic oscillator, each second damping line is a connecting line of a second circumferential point and the axis of the harmonic oscillator, each first circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes the maximum value along with the distribution of the circumference, each second circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes the minimum value along with the distribution of the circumference, and the circumference is the circumference where the outer edge of the harmonic oscillator is located; piezoelectric materials with different sizes are respectively pasted along each first damping line and each second damping line on the harmonic oscillator, so that the difference between the maximum value and the minimum value of the quality factor of the harmonic oscillator pasted with the piezoelectric materials with different sizes is smaller than a first preset value.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the method embodiments may be implemented by hardware related to computer program instructions, where the computer program may be stored in a computer readable storage medium, and when executed, the computer program performs the steps including the method embodiments; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.
Finally, the description is as follows: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. A method for trimming non-uniform quality factors of gyro harmonic oscillators with cylindrical shells is characterized by comprising the following steps:
determining first damping lines and second damping lines on a harmonic oscillator, wherein each first damping line is a connecting line of a first circumferential point and the center of the harmonic oscillator, each second damping line is a connecting line of a second circumferential point and the axis of the harmonic oscillator, each first circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes a maximum value along with the distribution of the circumference, each second circumferential point is a point on the circumference corresponding to the harmonic oscillator when the quality factor of the harmonic oscillator takes a minimum value along with the distribution of the circumference, and the circumference is the circumference where the outer edge of the harmonic oscillator is located;
piezoelectric materials with different sizes are respectively pasted along each first damping line and each second damping line on the harmonic oscillator, so that the difference between the maximum value and the minimum value of the quality factor of the harmonic oscillator pasted with the piezoelectric materials with different sizes is smaller than a first preset value;
the determining a first damping line and a second damping line on a harmonic oscillator comprises:
cracking and adjusting the frequency of the harmonic oscillator to be below a second preset value;
obtaining a distribution curve of the quality factors of the harmonic oscillators along with the circumference;
determining each first circumferential point corresponding to the maximum value of the quality factor of the harmonic oscillator and each second circumferential point corresponding to the minimum value of the quality factor of the harmonic oscillator according to the distribution curve;
and taking a connecting line of each first circumferential point and the center of the harmonic oscillator as a first damping line, and taking a connecting line of each second circumferential point and the center of the harmonic oscillator as a second damping line.
2. The method according to claim 1, wherein the obtaining of the distribution curve of the quality factors of the harmonic oscillators along the circumference comprises:
driving the harmonic oscillator to rotate around the center of the harmonic oscillator, applying an excitation signal to the outer edge of the harmonic oscillator every time the harmonic oscillator rotates by a preset angle, and acquiring the quality factor of the harmonic oscillator corresponding to each excitation point according to the excitation signal;
and acquiring a distribution curve of the quality factors of the harmonic oscillators along with the circumference according to the quality factor of the harmonic oscillator corresponding to each excitation point.
3. The method according to claim 2, wherein the obtaining the quality factor of the harmonic oscillator corresponding to each excitation point according to the excitation signal comprises:
acquiring an amplitude-frequency response curve of the harmonic oscillator corresponding to each excitation point according to the excitation signal;
and acquiring the quality factor of the harmonic oscillator corresponding to each excitation point according to the amplitude-frequency response curve of the harmonic oscillator corresponding to each excitation point.
4. The method according to claim 1, wherein the attaching piezoelectric materials with different sizes along each first damping line and each second damping line on the harmonic oscillator respectively comprises:
determining a first size of the piezoelectric material attached to each first damper wire and a second size of the piezoelectric material attached to each second damper wire;
respectively pasting the piezoelectric materials with the first size on each first damping line, wherein for the first piezoelectric materials pasted on any one first damping line, one end of each first piezoelectric material is in contact with the outer edge of each harmonic oscillator, and the length direction of each first piezoelectric material is parallel to any one first damping line;
and respectively pasting the piezoelectric materials with the second size on each second damping line, wherein for the second piezoelectric materials pasted on any second damping line, one end of each second piezoelectric material is in contact with the outer edge of the harmonic oscillator, and the length direction of each second piezoelectric material is parallel to any second damping line.
5. The method of claim 4, wherein determining a first dimension of the piezoelectric material bonded to each first damper wire and a second dimension of the piezoelectric material bonded to each second damper wire comprises:
setting the initial preset size of the piezoelectric material as the second size;
reducing the length value in the second size according to a third preset value on the second size, and taking the size with the reduced length value as a test size;
acquiring a difference value between the maximum value and the minimum value of the quality factor of the harmonic oscillator after the piezoelectric material with the test size is pasted on each first damping line and the piezoelectric material with the second size is pasted on each second damping line, and taking the difference value as a test difference value;
if the test difference value is smaller than the first preset value, taking the test size as the first size;
if the test difference value is not smaller than the first preset value, reducing the length value in the test size according to the third preset value on the test size to update the test size, re-acquiring the updated test difference value according to the updated test size, and comparing the updated test difference value with the first preset value until the first size is acquired.
6. The utility model provides a nonuniform trimming device of cylindrical shell top harmonic oscillator figure of merit which characterized in that includes:
at least one processor; and at least one memory communicatively coupled to the processor, wherein:
the memory stores program instructions executable by the processor, the processor calling the program instructions to perform the method of any of claims 1 to 5.
7. A non-transitory computer-readable storage medium storing a computer program that causes a computer to perform the method according to any one of claims 1 to 5.
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| CN111536994B (en) * | 2020-04-29 | 2021-09-24 | 中国人民解放军国防科技大学 | Resonant micro gyroscope multi-mode cooperative control method and system and resonant micro gyroscope |
| CN113566844A (en) * | 2021-06-04 | 2021-10-29 | 上海航天控制技术研究所 | Harmonic oscillator kinetic parameter detection device based on interdigital electrode |
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