CN108507498B - Micro-mirror monitoring method and device, illumination device and photoetching machine - Google Patents

Micro-mirror monitoring method and device, illumination device and photoetching machine Download PDF

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CN108507498B
CN108507498B CN201710115102.1A CN201710115102A CN108507498B CN 108507498 B CN108507498 B CN 108507498B CN 201710115102 A CN201710115102 A CN 201710115102A CN 108507498 B CN108507498 B CN 108507498B
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micromirror
angle
laser beams
light
reflected
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CN108507498A (en
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张一志
李玉龙
许琦欣
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Shanghai Micro Electronics Equipment Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

The invention provides a micromirror monitoring method and device, an illuminating device and a photoetching machine, wherein the method is used for monitoring the turnover angle and the surface type of a micromirror in real time and comprises the following steps: firstly, providing at least two parallel equidistant laser beams; then obtaining light spots formed on the photosensitive element after the two laser beams are reflected by the micro mirror and transmitted by the Fourier lens; then: measuring the position of the obtained light spot, and determining the turnover angle of the micromirror according to the position of the light spot; and measuring to obtain the distance between the light spots generated by the two laser beams, and determining the surface type change of the micromirror according to the change of the distance between the light spots.

Description

Micro-mirror monitoring method and device, illumination device and photoetching machine
Technical Field
The invention relates to the field of pupil illumination, in particular to a micro-mirror monitoring method and device, an illumination device and a photoetching machine.
Background
Referring to fig. 1, where 1 is an incident laser, 2 is a micromirror, and when the micromirror is used to adjust any pupil illumination, the micromirror 2 needs to be flipped by a certain angle in order to generate a target pupil, and after the flipping, the actual flipping angle of the micromirror 2 needs to be measured on line.
Therefore, when the micro-mirror is used for any pupil illumination, the turnover angle and the surface type of the micro-mirror need to be monitored and measured on line in real time.
Disclosure of Invention
The invention aims to solve the technical problem of how to perform online real-time monitoring and measurement on the turnover angle and the surface type of a micromirror.
In order to solve the technical problem, the invention provides a micromirror monitoring method for monitoring the flip angle and the surface type of a micromirror in real time, comprising:
firstly, providing at least two parallel equidistant laser beams;
then obtaining light spots formed on the photosensitive element after the two laser beams are reflected by the micro mirror and transmitted by the Fourier lens;
then:
measuring the position of the obtained light spot, and determining the turnover angle of the micromirror according to the position of the light spot;
and measuring to obtain the distance between the light spots generated by the two laser beams, and determining the surface type change of the micromirror according to the change of the distance between the light spots.
Optionally, when the turning angle of the micromirror is determined, the turning angle of the current micromirror is determined according to a relationship between the turning angle of the micromirror and the position of the light spot, which is obtained by calculating the following steps:
firstly, calculating to obtain a normal vector of the micromirror after turning around X, Y;
obtaining the relation between the incident light and the reflected light of the micromirror, and further obtaining the vector relation between the turnover angle of the micromirror and the reflected light;
and obtaining the relation between the position of the light spot and the overturning angle of the micromirror based on the space position relation between the photosensitive element and the Fourier lens.
Optionally, when the normal vector after the inversion is obtained through calculation:
the initial normal position is expressed in unit vectors as:
Figure BDA0001235423810000021
wherein n isox、noy、nozIs a coefficient of a unit vector, and is,
Figure BDA0001235423810000022
is a unit vector;
assuming that the angle alpha is rotated around the X direction, and the angle beta is rotated around the Z direction;
making the unit vector of the normal line after the plane mirror is turned over as follows:
Figure BDA0001235423810000023
obtaining:
nx＝noxcosβ-(noycosα-nozsinα)sinβ
ny＝noxsinβ+(noycosα-nozsinα)cosβ
nz＝noysinα+nozcosα
optionally, when the relationship between the incident light and the reflected light of the micromirror is obtained:
let the incident ray normal vector be:
normal vector of reflected light ray is
Figure BDA0001235423810000025
The normal unit vector of the micromirror is
Figure BDA0001235423810000026
Vector equation according to the emission law:
Figure BDA0001235423810000027
then the vector of the reflected rays is:
order:
then there are:
A′x＝Ax-2nx(Axnx+Ayny+Aznz)
A′y＝Ay-2ny(Axnx+Ayny+Aznz)
A′z＝Az-2nz(Axnx+Ayny+Aznz)
optionally, when determining the surface shape change of the micromirror according to the change of the spot pitch, the change is determined by the following relationship:
Figure BDA0001235423810000033
wherein D is0Is the initial spacing of the two laser beams; δ d is the distance variation of the two laser beams after being reflected by the micromirror, θ is the incident angle of the two laser beams, and L is the reflection optical path after being reflected by the micromirror; kappapreFor a predetermined micromirror curvature,. kappapostIs the measured micromirror curvature.
Optionally, after determining the flip angle of the micromirror, the method further includes:
and comparing the determined turning angle with a target angle, performing feedback control on the turning angle of the micromirror according to a comparison result, and correcting the turning angle of the micromirror.
The invention also provides a micromirror monitoring device adopting the micromirror monitoring method provided by the alternative scheme of the invention, which comprises a light source, a Fourier lens, a photosensitive element and a signal processing unit, wherein the light source provides at least two parallel equidistant laser beams to be incident on the micromirror, the two laser beams are reflected by the micromirror and transmitted by the Fourier lens to be formed on the photosensitive element, the signal processing unit obtains the position of a light spot on the photosensitive element and the distance between the light spots generated by the two laser beams, the overturning angle of the micromirror is further determined according to the position of the light spot, and the surface shape change of the micromirror is determined according to the change of the distance between the light spots.
Optionally, the photosensitive element is a CCD element.
The invention also provides an illumination system comprising the micromirror monitoring device provided by the optional aspect of the invention, which is characterized in that when the micromirror is used for adjusting any pupil illumination, the micromirror monitoring device measures the flip angle and the surface type of the micromirror in any pupil illumination on line, and corrects the flip angle of the micromirror according to the measured flip angle and surface type of the micromirror.
The invention also provides a photoetching machine comprising the illumination system provided by the alternative scheme of the invention.
The invention can realize the measurement and calibration of the turnover angle of the micromirror by measuring the positions of the light spots on the photosensitive element, and realize the real-time measurement of the curvature of the micromirror by calculating the change of the distance between the two light spots.
Drawings
FIG. 1 is a schematic diagram of the operation of a prior art micromirror array;
FIG. 2 is a schematic diagram of micromirror monitoring in pupil illumination according to an alternative embodiment of the invention;
FIG. 3 is a schematic diagram illustrating normal position calculation when the micromirror is flipped over according to an alternative embodiment of the present invention;
FIG. 4 is a schematic diagram of reflected ray calculation according to an alternative embodiment of the present invention;
FIG. 5 is a schematic illustration of a pitch change in an alternative embodiment of the invention.
Detailed Description
The method for monitoring micromirrors in pupil illumination provided by the present invention is described in detail below with reference to fig. 2 to 5, which are alternative embodiments of the present invention, and it is considered that those skilled in the art can make modifications and tints without departing from the spirit and scope of the present invention.
Referring to fig. 1, the idea of the present invention is to obtain the measurement of the flip angle and the profile of the micromirror by measuring the position and the distance of the light spots of the reflected light beam after irradiating the micromirror with a set of parallel laser beams with equal distance. Based on the thought, laser beam 1 shines on micromirror 2 by specific direction, micromirror 2 carries out the upset of X, Y two directions, the 5 directions of light beam after the laser beam 1 of incidence through the micromirror reflection after the upset of micromirror 2 will also change, the different directions of the different angle correspondence reflection light 3 of micromirror 2 upset, when reflection light 3 is incided on Fourier lens 4 by different directions, correspond the different positions of facula on photosensitive element 5, the theoretical calculation obtains the relation between the position of micromirror rotation angle and facula on photosensitive element 5, can reach the measurement purpose of micromirror rotation angle through measuring the position of facula on photosensitive element 5 when carrying out real-time measurement. The photosensitive element 5 may be a CCD element.
Based on the above, the present invention provides a micromirror monitoring method for monitoring the flip angle and the surface shape of the micromirror 2 in real time, comprising:
firstly, providing at least two parallel equidistant laser beams 1;
then obtaining light spots formed on the photosensitive element 5 after the two laser beams 1 are reflected by the micro mirror and transmitted by the Fourier lens;
then:
measuring the position of the light spot, and determining the turnover angle of the micromirror 2 according to the position of the light spot;
and measuring to obtain the distance between the light spots generated by the two laser beams 1, and determining the surface type change of the micro mirror 2 according to the change of the distance between the light spots.
Referring to fig. 3, when the turning angle of the micromirror is determined, the turning angle of the current micromirror is determined according to the relationship between the turning angle of the micromirror and the position of the light spot obtained by pre-calculation; the relationship is calculated by:
firstly, calculating to obtain a normal vector of the micromirror after turning around X, Y;
in a further alternative, when the normal vector after the inversion is obtained by calculation:
the initial normal position is expressed in unit vectors as:
wherein n isox、noy、nozIs a coefficient of a unit vector, and is,
Figure BDA0001235423810000052
is a unit vector;
assuming that the angle alpha is rotated around the X direction, and the angle beta is rotated around the Z direction;
making the unit vector of the normal line after the plane mirror is turned over as follows:
Figure BDA0001235423810000061
obtaining:
nx＝noxcosβ-(noycosα-nozsinα)sinβ
ny＝noxsinβ+(noycosα-nozsinα)cosβ
nz＝noysinα+nozcosα………(3)。
obtaining the relation between the incident light and the reflected light of the micromirror, and further obtaining the vector relation between the turnover angle of the micromirror and the reflected light;
referring to fig. 4, when the relationship between the incident light and the reflected light of the micromirror is obtained:
let the incident ray normal vector be:
Figure BDA0001235423810000062
normal vector of reflected light ray is
Figure BDA0001235423810000063
The normal unit vector of the micromirror is
Figure BDA0001235423810000064
Vector equation according to the emission law:
Figure BDA0001235423810000065
then the vector of the reflected rays is:
order:
then there are:
A'x＝Ax-2nx(Axnx+Ayny+Aznz)
A'y＝Ay-2ny(Axnx+Ayny+Aznz)
A'z＝Az-2nz(Axnx+Ayny+Aznz)……………(8)。
and obtaining the relation between the position of the light spot and the overturning angle of the micromirror based on the space position relation between the photosensitive element and the Fourier lens. Specifically, the relationship between the turning angles α and β of the micromirror 2 and the vector of the reflected light 3 reflected by the micromirror 2 is established in the first two steps, and the position of the light spot on the photosensitive element 5 can be obtained after the spatial positions of the fourier lens 4 and the photosensitive element 5 are defined, so that the relationship between the position of the light spot on the photosensitive element 5 and the turning angles α and β of the micromirror 2 is established, and the turning angle of the micromirror 2 can be measured by reading the position of the light spot on the photosensitive surface of the photosensitive element 5 when the turning angle of the micromirror 2 is measured and corrected.
In a preferred embodiment of the present invention, after determining the flip angle of the micromirror 2, the method further comprises:
and comparing the determined turning angle with a target angle, performing feedback control on the turning angle of the micromirror 2 according to a comparison result, and correcting the turning angle of the micromirror. Specifically, the measured difference between the actual turning angle and the target turning angle is used for feedback control of the micromirror 2, so that the turning angle of the micromirror 2 is formed for self-correction.
In an alternative aspect of the present invention, when determining the change in the profile of the micromirror according to the change in the spot pitch, the change is determined by the following relationship:
wherein D is0Is the initial spacing of the two laser beams; δ d is the distance variation of the two laser beams after being reflected by the micromirror, θ is the incident angle of the two laser beams, and L is the reflection optical path after being reflected by the micromirror; kappapreUnpredicted micromirror curvature, κpostIs the measured micromirror curvature.
To explain in detail, referring to fig. 5, two parallel laser beams 1 with equal spacing are irradiated onto the micromirror, the deformation of the micromirror will cause the variation of the spacing of the reflected light beam 3, and the initial spacing of the light beams is set as D0The distance change of the laser beam 3 after being reflected by the micro mirror 2 is D0+ δ d, the incident angle of the two parallel beams is θ, the reflection optical path is L, and the change of the micromirror profile when the change is small can be evaluated by the change of the curvature, the curvature of the micromirror is represented by κpreChange to kappapostThe above relationship between δ d and curvature change can be obtained from geometrical optics in the process.
The invention also provides a micromirror monitoring device adopting the micromirror monitoring method provided by the alternative scheme of the invention, which comprises a light source, a Fourier lens 4, a photosensitive element 5 and a signal processing unit, wherein the light source provides at least two parallel equidistant laser beams 1 to be incident to the micromirror 2, the two laser beams 1 are reflected by the micromirror 2 and transmitted by the Fourier lens 4 to be formed on the photosensitive element 5, the signal processing unit obtains the position of a light spot on the photosensitive element 5 and the distance between the light spots generated by the two laser beams 1, then the overturning angle of the micromirror 2 is determined according to the position of the light spot, and the surface shape change of the micromirror 2 is determined according to the change of the distance between the light spots. Wherein, the photosensitive element 5 can be selected as a CCD element.
The invention also provides an illumination system comprising the micromirror monitoring device provided by the alternative scheme of the invention, when the micromirror is used for adjusting any pupil illumination, the micromirror monitoring device measures the turnover angle and the surface type of the micromirror in any pupil illumination on line, and corrects the turnover angle of the micromirror according to the measured turnover angle and surface type of the micromirror.
The invention also provides a photoetching machine comprising the illumination system provided by the alternative scheme of the invention.
In summary, the invention can realize the calibration of the turnover angle of the micromirror by measuring the positions of the light spots on the photosensitive element, and realize the real-time measurement of the curvature of the micromirror by calculating the change of the distance between the two light spots.

Claims (7)

1. A micro-mirror monitoring method is used for monitoring the turnover angle and the surface type of a micro-mirror in real time, and is characterized in that: the method comprises the following steps:
firstly, providing at least two parallel laser beams;
then obtaining light spots formed on the photosensitive element after the two laser beams are reflected by the micro mirror and transmitted by the Fourier lens;
then:
measuring the position of the obtained light spot, and determining the turnover angle of the micromirror according to the position of the light spot;
measuring the distance between the light spots generated by the two laser beams, and determining the surface type change of the micromirror according to the change of the distance between the light spots;
when the laser beams are more than two, the distance between any two adjacent laser beams is equal;
when the turning angle of the micromirror is determined, the turning angle of the current micromirror is determined according to the relationship between the turning angle of the micromirror and the position of the light spot, which is obtained by calculation through the following steps:
firstly, calculating to obtain a normal vector of the micromirror after turning around X, Y;
obtaining the relation between the incident light and the reflected light of the micromirror, and further obtaining the vector relation between the turnover angle of the micromirror and the reflected light;
obtaining the relation between the position of a light spot and the overturning angle of the micromirror based on the spatial position relation between the photosensitive element and the Fourier lens;
when the surface shape change of the micromirror is determined according to the change of the light spot space, the change is determined by the following relation:
Figure FDA0002195729850000011
wherein D is0Is the initial spacing of the two laser beams; δ d is the distance variation of the two laser beams after being reflected by the micromirror, θ is the incident angle of the two laser beams, and L is the reflection optical path after being reflected by the micromirror; kappapreFor a predetermined micromirror curvature,. kappapostIs the measured micromirror curvature.
2. The micromirror monitoring method of claim 1, wherein: when the normal vector after turning is obtained through calculation:
the initial normal position is expressed in unit vectors as:
Figure FDA0002195729850000021
wherein n isox、noy、nozIs a coefficient of a unit vector, and is,
Figure FDA0002195729850000022
is a unit vector;
assuming that the angle alpha is rotated around the X direction, and the angle beta is rotated around the Z direction;
making the unit vector of the normal line after the plane mirror is turned over as follows:
Figure FDA0002195729850000023
obtaining:
nx＝noxcosβ-(noycosα-nozsinα)sinβ
ny＝noxsinβ+(noycosα-nozsinα)cosβ
nz＝noysinα+nozcosα；
when the relation between the incident light and the reflected light of the micromirror is obtained:
let the incident ray normal vector be:
Figure FDA0002195729850000024
normal vector of reflected light ray is
Figure FDA0002195729850000025
The normal unit vector of the micromirror is
Figure FDA0002195729850000026
Vector equation according to the emission law:
Figure FDA0002195729850000027
then the vector of the reflected rays is:
Figure FDA0002195729850000028
order:
Figure FDA0002195729850000029
then there are:
A'x＝Ax-2nx(Axnx+Ayny+Aznz)
A'y＝Ay-2ny(Axnx+Ayny+Aznz)
A'z＝Az-2nz(Axnx+Ayny+Aznz)。
3. the micromirror monitoring method of claim 1, wherein: after determining the flip angle of the micromirror, further comprising:
and comparing the determined turning angle with a target angle, performing feedback control on the turning angle of the micromirror according to a comparison result, and correcting the turning angle of the micromirror.
4. A micromirror monitoring device using the micromirror monitoring method according to any one of claims 1 to 3, comprising a light source, a fourier lens, a photosensitive element and a signal processing unit, wherein the light source provides at least two parallel laser beams to be incident on the micromirror, and when the number of the laser beams is more than two, the distance between any two adjacent laser beams is equal; two laser beams are reflected by the micro mirror and transmitted by the Fourier lens to be formed on the photosensitive element, the signal processing unit obtains the position of a light spot on the photosensitive element and the distance between the light spots generated by the two laser beams, the turning angle of the micro mirror is determined according to the position of the light spot, and the surface shape change of the micro mirror is determined according to the change of the distance between the light spots.
5. The micromirror monitoring device of claim 4, wherein the photosensitive element is a CCD element.
6. An illumination system comprising the micromirror monitoring device according to claim 4, wherein when the micromirror is used for adjusting any pupil illumination, the micromirror monitoring device measures the flip angle and the face shape of the micromirror in any pupil illumination on line and corrects the flip angle of the micromirror according to the measured flip angle and face shape of the micromirror.
7. A lithography machine comprising an illumination system as claimed in claim 6.
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