CN108504297A - Protective film and film laminated body - Google Patents
Protective film and film laminated body Download PDFInfo
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- CN108504297A CN108504297A CN201810153696.XA CN201810153696A CN108504297A CN 108504297 A CN108504297 A CN 108504297A CN 201810153696 A CN201810153696 A CN 201810153696A CN 108504297 A CN108504297 A CN 108504297A
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- film
- resin
- layer
- face
- protective film
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/16—Optical coatings produced by application to, or surface treatment of, optical elements having an anti-static effect, e.g. electrically conducting coatings
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
Abstract
Problem of the present invention is that providing for optical applications, even if do not have the antistatic layer based on antistatic agent has excellent antistripping static behaviour being contacted with ITO layer, while there is the protective film and film laminated body of high fissility.Protective film (1) involved by one embodiment of the present invention has：Have the first face (2a) and is present in the resin film (2) in the second face (2b) of its opposite side and overlaps the adhesive layer (3) on the first face (2a) of resin film (2).The surface roughness Ra in the second face (2b) of resin film (2) is 1.5nm or more.The release band electricity of the resin film generated by stripping again after making the second face (2b) be contacted with ITO layer is 30kV or less.
Description
Technical field
The present invention relates to protective films and film laminated body.
Background technology
In order to manufacture the optical devices such as liquid crystal display, touch panel, transparent optical film is used sometimes.In order to protect light
Film is learned, is also provided with protective film sometimes.That is, usually using film laminated body made of optical film and protective film stacking.Film laminated body
Sometimes also have the transparency conducting layers such as the ITO layer for becoming transparent electrode in an optical device on optical film.
Film laminated body is taken care of as rolls sometimes, therefore, in the outer surface of the transparency conducting layer of volume inner membrance laminated body
On the outer surface for overlapping the protective film for being present in its lower layer side.When manufacturing optical device, in the case of solving uncoiling, film laminated body
The outer surface of transparency conducting layer removed from the outer surface of the protective film of lower layer side.When the stripping occurs, transparency conducting layer with
Separation of charge is generated between protective film, the outer surface of transparency conducting layer and the outer surface of protective film are easy electrification.If electrically conducting transparent
Layer and protective film become a part for optical device with the state charged, then easily cause optical device and break down.In addition, thin
Micro- impurity is easy to be adsorbed to film laminated body because of electrostatic, can make the quality deterioration of optical device.
Such electrification in order to prevent, document 1 is middle (with reference to Japanese Patent No. 4137551) to be proposed on the surface of protective film
Upper antistatic layer of the setting containing antistatic agent.Inhibit the electrification between ITO layer and protective film as a result,.
Invention content
The subject that the invention solves
However, in the technology that document 1 is recorded, the indispensable antistatic agent and for this to be arranged for antistatic layer
The process of antistatic layer be it is necessary, it is therefore, not only bothersome during fabrication but also spend prodigious cost.
Even if it is an object of the present invention to provide not having the antistatic layer based on antistatic agent, though with electrically conducting transparent
The protective film for being also difficult to charge and the film laminated body for having the protective film are removed again after layer overlapping.
Means for solving the problems
Protective film involved by one embodiment of the present invention has：Have the first face and is present in the second face of its opposite side
Resin film and overlap adhesive layer on the first face of above-mentioned resin film.The rough surface in the second face of above-mentioned resin film
Degree Ra is 1.5nm or more.The release band of the resin film generated by stripping again after making above-mentioned second face be contacted with ITO layer
Electricity is 30kV or less.
Film laminated body involved by one embodiment of the present invention has said protection film and overlaps on above-mentioned adhesive layer
Optical film.
The effect of invention
According to one method of the present invention, it can obtain even if not having the antistatic layer based on antistatic agent, even if
The protective film for being also difficult to charge and the film laminated body for having the protective film are removed after Chong Die with transparency conducting layer again.
Description of the drawings
Fig. 1 is the sectional view for showing the protective film involved by an embodiment of the invention.
Fig. 2A is the sectional view for showing the film laminated body involved by the other embodiment of the present invention, and Fig. 2 B are to show this hair
The sectional view of film laminated body involved by bright other embodiment.
Specific implementation mode
Hereinafter, being illustrated to an embodiment of the invention.It should be noted that hereinafter, optical film refers to being used for
Make the general name of the film of the purposes of light transmission, reflection or reflection-absorption.The example of optical film include flat-panel monitor optical film,
Antireflection film, alignment films, polarizing coating and phase difference film.
Protective film 1 involved by present embodiment has：Have the first face 2a and is present in the second face 2b of its opposite side
Resin film 2 and overlap adhesive layer 3 on the first face 2a of resin film 2.The rough surface of second face 2b of resin film 2
Degree Ra is 1.5nm or more.The release band of the resin film 2 generated by stripping again after making the second face 2b be contacted with ITO layer
Electricity is 30kV or less.
Film laminated body 5 involved by present embodiment has protective film 1 and overlaps on the adhesive layer 3 of the protective film 1
Optical film 4.Film laminated body 5 further can have electrically conducting transparent on the surface with 1 opposite side of protective film of optical film 4
Layer 6.The film laminated body 5 (51) for not having transparency conducting layer 6 can also be made first, next in the light of film laminated body 5 (51)
It learns and transparency conducting layer 6 is set on film 4, to make the film laminated body 5 (52) for having transparency conducting layer 6.
In the present embodiment, it is the such characteristics of 30kV or less that protective film 1, which has release band electricity, therefore, even if will
Protective film 1 is removed again after the transparency conducting layers 6 such as protective film 1 and ITO layer are Chong Die, it is also difficult to separation of charge occur.Thus, for example will
Have the winding of film laminated body 5 of transparency conducting layer 6 and after forming volume, then when solving uncoiling, even if by the electrically conducting transparent of film laminated body 5
Layer 6 is removed from the second face 2b of the resin film 2 in the protective film 1 of lower layer side, also difficult between transparency conducting layer 6 and protective film 1
Separation of charge occurs.Therefore, even if not having the antistatic layer based on antistatic agent, even if by protective film 1 and electrically conducting transparent
It is removed again after 6 overlapping of layer, it is also difficult to charge.Thus, it is possible to which the quality of product etc. is inhibited to reduce.
Low release band electricity can be 1.5nm or more by the surface roughness Ra of the second face 2b of resin film 2 come real
It is existing.If the surface roughness Ra of the second face 2b is 1.5nm or more, even if the second face 2b of resin film 2 connects with transparency conducting layer 6
It touches, contact area also becomes smaller.Therefore, when the volume for unlocking the film laminated body 5 (52) for having transparency conducting layer 6, even if
Transparency conducting layer 6 is removed from the second face 2b of resin film 2, electrostatic yield along with this also becomes smaller.Surface roughness Ra
Occurrence can suitably be adjusted according to material of resin film 2 etc. so that release band electricity be 30kV or less.
In addition, if the surface roughness Ra of the second face 2b is 1.5nm or more, the adhesion of the second face 2b is suppressed.Cause
This, is easy to remove transparency conducting layer 6 from the second face 2b.In addition, by with the film laminated body 5 for not having transparency conducting layer 6
(51) it is formed and is rolled up, in the case of the second face 2b that optical film 4 is directly overlapped in resin film 2, when solving uncoiling, is also easy optics
Film 4 is removed from the second face 2b.
It should be noted that being overlapped in advance except electricity about release band electricity, such as by the second face 2b of resin film 2
ITO layer, and with pressure 40gf/cm2(about 3.9KPa) is crimped, thereafter, in the ring of 25 DEG C ± 3 DEG C of temperature, humidity 55 ± 5%
Placed under border after five minutes, next with peeling rate 300mm/ minutes, second face 2b of 90 ° of the peel angle by resin film 2 from
ITO layer is removed, and the surface potential of the resin film 2 generated at this time is measured by potential measurement device, thus obtains release band electricity.
Such as PET film is produced on by sputtering method for ITO layer in this case, thickness is such as 20nm.
The surface roughness Ra of second face 2b of resin film 2 is JIS B0601：The arithmetic average height of 2001 defineds.
Scanning probe microscopy that surface roughness Ra is manufactured using such as Seiko Instruments Co., Ltd. measures.
Further the composition of the protective film 1 involved by present embodiment is described in detail.
As long as the thickness of the resin film 2 of protective film 1 is not in such as 30 μm or more and 250 μm or less of range, but not
It is limited to this.
The coating 22 that resin film 2 has such as substrate layer 21 and is present on substrate layer 21.The appearance of coating 22
Face is the second face 2b.In this case, the surface roughness Ra of the outer surface of coating 22 is 1.5nm or more.In other words, resin
The surface roughness Ra of second face 2b of film 2 is 1.5nm or more, is realized by coating 22.
Substrate layer 21 is preferably made by transparent resin.Specifically, substrate layer 21 is by being selected from poly terephthalic acid second
Polyester based polymers, the diacetyl such as diol ester (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT)
The cellulose-based polymer such as cellulose, triacetyl cellulose and makrolon based polymer, poly- (methyl) alkyl acrylate
At least one of acrylic acid series polymeric compounds resin is waited to make.Particularly, substrate layer 21 is preferably made by polyester based polymer
Make, is more preferably made by polyethylene terephthalate.Substrate layer 21 can obtain the film stretching made by resin
Stretched film.
Substrate layer 21 is preferably free of low molecular weight compositions or the content of the low molecular weight compositions in substrate layer 21 is few.It is this
In the case of, low molecular weight compositions are suppressed from the exudation in substrate layer 21, it is possible thereby to maintain the transparency of protective film 1.It needs
It is noted that low molecular weight compositions refer to the monomer and oligomer for example originating from the raw material for the resin for constituting substrate layer 21.Separately
Outside, the low molecular weight compositions of substrate layer 21, specifically molecular weight be 1000 ingredients below based on DMF (N, N- dimethyl
Formamide) extracted amount be preferably 2.0mg/m2Below.The extracted amount example of 1000 ingredient below of molecular weight in substrate layer 21
It can such as measure and obtain as follows.First, substrate layer 21 is heated 10 minutes at 150 DEG C.Thereafter, base is cleaned with DMF 10ml
The amount of the low molecular weight compositions in liquid chromatogram measuring DMF is used in combination in the surface of material layer 21.By the measured value divided by substrate layer 21
Unit overlook observation area, and resulting value is set as extracted amount.It should be noted that the low molecular weight compositions of substrate layer 21, tool
Molecular weight is that the extracted amount based on DMF (N,N-dimethylformamide) of 1000 ingredients below is more preferably 0.2mg/ for body
m2Below.
It is excellent in order to keep content of the substrate layer 21 without the low molecular weight compositions in low molecular weight compositions or substrate layer 21 few
When being selected in manufacture substrate layer 21, the amount of the low molecular weight compositions in raw material is set to reduce by purifying the raw material of substrate layer 21.
Substrate layer 21 can include various additives, such as antioxidant, heat-resisting stabilizing agent, ultra-violet absorber, filling
Material etc..
Coating 22 preferably comprises resin component.About resin component, containing selected from such as polyethylene terephthalate
The polyester resin such as ester (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), diacetyl cellulose,
The propylene such as the cellulose-based polymer such as triacetyl cellulose and makrolon based polymer, poly- (methyl) alkyl acrylate
At least one of sour based polymer ingredient.Particularly, resin component preferably comprises polyester resin, if containing poly terephthalic acid
Glycol ester is then more preferable.
Coating 22 preferably comprises inorganic filler.Inorganic filler can adjust outer surface, the i.e. resin film 2 of coating 22
The surface roughness Ra of second face 2b, it is thereby achieved that the surface roughness Ra of the second face 2b is 1.5nm or more.It is inorganic to fill out
The average grain diameter of material is preferably in the range of 30nm or more and 300nm or less.As long as average grain diameter is 50nm or more, can suppress
The excessive reduction of the surface roughness Ra of second face 2b, if average grain diameter be 300nm hereinafter, can suppress the saturating of resin film 2
Bright property reduces.Average grain diameter is more preferably in the range of 50nm or more and 200nm or less.It should be noted that inorganic filler
Average grain diameter is that the arithmetic of obtained from the size distribution measured by laser diffraction/scattering method is calculated, volume reference is put down
Equal diameter.
Inorganic filler preferably comprises silicon dioxide granule.The example of silicon dioxide granule includes preparing spherical SiO 2 and hollow
Silica.Inorganic filler can also contain the ingredient other than silicon dioxide granule.The example of ingredient other than silicon dioxide granule
Attached bag includes zirconium oxide and titanium dioxide.
Coating 22 can also contain various additives as needed, such as antioxidant, heat-resisting stabilizing agent, ultraviolet light are inhaled
Receive agent etc..
Coating 22 can contain antistatic agent, can not also contain.The example of antistatic agent include selected from surfactant,
At least one of conductive carbon and metal powder.If coating 22 contains antistatic agent, resin film 2 can be further suppressed
Electrification.However, in the present embodiment, even if coating 22 can inhibit the electrification of resin film 2 if being free of antistatic agent.
Coating 22 can be made by suitable method.For example, by the way that the quilts such as resin component, inorganic filler will be made
The resin combination that the ingredient of coating 22 is dissolved or dispersed in solvent and prepares is coated on substrate layer 21 and is allowed to drying, can
To make coating 22.About the coating of resin combination, suitable side such as rolling method, spin-coating method, dip coating can be used
Method.
The thickness of substrate layer 21 is in such as 30 μm or more and 250 μm or less of range.The thickness of coating 22 is for example
In 0.010 μm of average thickness or more and 0.2 μm or less of range.It should be noted that average thickness is to utilize spectrophotometer
Measure reflectance spectrum, and the average film thickness being calculated by its measured value.
It should be noted that in Fig. 1, resin film 2 has the layer for being separated into substrate layer 21 and coating 22, but resin film
2 can also be the simple layer for not being separated into substrate layer 21 and coating 22.Simple layer refers to the layer there is no clear interface.This
In the case of kind, resin film 2 is preferably made by transparent resin.In addition, resin film 2 can also be adjusted by containing inorganic filler
Save the surface roughness Ra of the second face 2b.
In addition, in present embodiment, substrate layer 21 is simple layer, but substrate layer 21 can also be made of multiple layers.
Adhesive layer 3 can for example be formed by well known adhesive.The thickness of adhesive layer 3 is at such as 5 μm or more and 30 μm or less
In the range of.As adhesive, such as acrylic adhesive, elastomeric adhesive, synthetic rubber system adhesive can be enumerated, but
It's not limited to that.
Adhesive layer 3 can be made by suitable method.For example, by the way that adhesive and addition as needed will be made
The binder solution that agent is dissolved or dispersed in solvent and prepares is coated on the first face 2a of above-mentioned resin film 2 and is allowed to dry
It is dry, adhesive layer 3 can be made.Thus, it is possible to obtain the resin film 2 for having the first face 2a and the second face 2b and overlapping
The protective film 1 of adhesive layer 3 on the first face 2a of resin film 2.
It is 0.5% characteristic below that protective film 1, which preferably has the haze change amount after being heated 30 minutes at 150 DEG C,.This
In the case of kind, even if protective film 1 is difficult to decrease if heated transparent.Therefore, it is easy to carry out the outer of the optical film 4 of film laminated body 5
See inspection Check.In addition, by using film laminated body 5 come when making the optical device for having optical film 4, appearance inspection Check is also easy
Protective film 1 is overlapped in the state of optical film 4 and directly carries out.
By inhibiting low molecular weight compositions etc. to be oozed out from substrate layer 21, above-mentioned haze change amount may be implemented.Especially
Ground, by covering substrate layer 21 with coating 22, can inhibit low point if resin film 2 has substrate layer 21 and coating 22
Son amount ingredient etc. is oozed out from substrate layer 21, therefore, it is possible to inhibit the mist degree of the protective film 1 when heating to reduce.In addition, even if base
Content of the material layer 21 without low molecular weight compositions or the low molecular weight compositions in substrate layer 21 is low, can also inhibit from substrate layer 21
Middle exudation.
It should be noted that about haze change amount, it can be according to JIS K7136：2000, the electric color work of use such as Japan
The NDH4000 of industry Co., Ltd. manufacture, to the haze value before heat treatment and the mist degree after heating 30 minutes at 150 DEG C
Value is measured, and finds out their difference by gained measurement result to calculate.
Then, the composition of the film laminated body 5 involved by one embodiment of the present invention is concretely demonstrated.
Film laminated body 5 (51) has above-mentioned protective film 1 and overlaps the optical film 4 on the adhesive layer 3 of protective film 1.
That is, film laminated body 5 is sequentially laminated with optical film 4, adhesive layer 3, resin film 2.In addition, the second face of the resin film 2 in protective film 1
The surface roughness Ra of 2b is 1.5nm or more.Therefore, film laminated body 5 (51) is not even if having based on the antistatic of antistatic agent
Layer, even if being removed again after Chong Die with the transparency conducting layers such as ITO layer, it is also difficult to charge.
Optical film 4 can be simple layer, can also have multiple layers.The material of optical film 4 can be set according to the optics of manufacture
Standby performance is suitably selected.When optical film 4 is simple layer, optical film 4 is such as hyaline membrane.Hyaline membrane can be by such as polyester
Resin makes.
It, can be at least one of surface of simple layer formed by above-mentioned resin when optical film 4 has multiple layers
Layer of the stacking with various functions as needed.
Optical film 4 can have such as hyaline membrane and at least one hard conating Chong Die with hyaline membrane.For example, as schemed
Shown in 2A, optical film 4 has hard conating 41, hyaline membrane 42 and hard conating 43, and they are carried out in the order from 1 side of protective film
Stacking.Optical film 4 can also have hard conating and hyaline membrane, and they are laminated in the order from protective film side.Optics
Film 4 can also have hyaline membrane and hard conating, and they are laminated in the order from protective film side.
Hard conating preferably has hardness more higher than hyaline membrane.The mechanical strength of optical film 4 improves as a result,.Hard conating
Pencil hardness is preferably H or more, then more preferable if 2H or more.
Hard conating is preferably formed by the composition containing reactive gel-type resin.In this case, wet type can be passed through
Membrane formation process forms hard conating.Therefore, it compared with the case where forming hard conating by the dry types membrane formation process such as vapour deposition method, can improve
The productivity of optical film 4, moreover it is possible to reduce the manufacturing cost of optical film 4.It is as reactive gel-type resin, it is preferable to use for example hot
At least one of thermosetting resin and ionizing radiation curing type resin.
As thermosetting resin, phenolic resin, urea resin, diallyl phthalate resin, melamine tree can be enumerated
Fat, unsaturated polyester resin, polyurethane resin, epoxy resin, amino-alkyd resin, silicones, polyorganosiloxane resin etc..Combination
Object can also promote containing crosslinking agent, polymerization initiator, curing agent, solidification as needed while containing thermosetting resin
Into agent, solvent etc..By the way that the composition for containing such thermosetting resin to be applied on such as hyaline membrane, next by the heat
Thermosetting resin composition heats and carries out heat cure, can form hyaline membrane.About the coating of composition, such as roller coating can be used
The suitable method such as method, spin-coating method, dip coating.
As ionizing radiation curing type resin, it is preferable to use the resin with acrylic ester functional group.As with third
The resin of olefin(e) acid Zhi Xi functional groups can be enumerated oligomeric such as (methyl) acrylate of the lower polyfunctional compound of molecular weight
Object, prepolymer etc..As above-mentioned polyfunctional compound, can enumerate polyester resin, polyether resin, acrylic resin, epoxy resin,
Polyurethane resin, alkyd resin, spiral shell acetal resin, polybutadiene, polymercaptan-polyenoid resin, polyalcohol etc..Contain ionization
The composition of radiation cure type resin preferably further contains reactive diluent.As reactive diluent, (first can be enumerated
Base) simple functions such as ethyl acrylate, (methyl) ethylhexyl acrylate, styrene, methyl styrene, n-vinyl pyrrolidone
Monomer；And trimethylolpropane tris (methyl) acrylate, hexylene glycol (methyl) acrylate, tripropylene glycol two (methyl) third
Olefin(e) acid ester, diethylene glycol two (methyl) acrylate, pentaerythrite three (methyl) acrylate, dipentaerythritol six (methyl) third
The polyfunctional monomer of olefin(e) acid ester, 1,6-hexylene glycols two (methyl) acrylate, neopentyl glycol two (methyl) acrylate.
In the case that ionizing radiation curing type resin is the photocurable resins such as ultraviolet curing resin, composition is preferred
Further contain Photoepolymerizationinitiater initiater.As Photoepolymerizationinitiater initiater, acetophenones, benzophenone, α-amyl oxime ester can be enumerated
(α-amyloxime ester), thioxanthene ketone class etc..Composition containing photocurable resin can contain Photoepolymerizationinitiater initiater
On the basis of also contain photosensitizer, alternatively, Photoepolymerizationinitiater initiater can also be replaced containing photosensitizer.As photosensitizer
Agent can enumerate n-butylamine, triethylamine, tri-n-butyl phosphine, thioxanthones etc..
By the way that such composition to be applied on such as hyaline membrane, the illumination such as ultraviolet light are next incident upon the photocuring
Type resin combination carries out photocuring, can form hard conating.About the coating of composition, such as rolling method, rotation can be used
The suitable method such as coating, dip coating.
The thickness of hard conating in such as 0.5 μm or more and 5.0 μm or less of range, but not limited to this, can be according to manufacture
Optical device suitably set.Hard conating can also contain suitable additive as needed.The example of additive includes inorganic
It is particle and organic system particle.
Optical film 4 can be formed by well known method.For example, the hyaline membrane of optical film 4 can be with the above-mentioned tree of formation
The substrate layer 21 of adipose membrane 2 or resin film 2 is made in the same manner.Next, according to the optical device of manufacture, by will for example
The material of hard conating is coated on hyaline membrane and is dried with appropriate method as described above, can make optical film 4.
Film laminated body 5 (51) is wound and forms volume, in volume by the outer surface of the optical film 4 of film laminated body 5 (51) with
Outer surface (the second face 2b) the overlapping keeping of protective film 1 can be easily by optical film 4 from the second of resin film 2 when solving uncoiling
Face 2b is removed.
Film laminated body 5 (52) preferably further has on the surface with 1 opposite side of said protection film of optical film 4
Bright conductive layer 6.In this case, the stripping generated by stripping again after making the second face 2b of resin film 2 be contacted with ITO layer
From carried charge for 30kV hereinafter, therefore, film laminated body 5 (52) can have height while with high antistripping static behaviour
Fissility.
In the case that the optical film 4 of film laminated body 5 (52) is such as simple layer, has protection in a face of optical film 4
Film 1 has transparency conducting layer 6 in another face of optical film 4.
As shown in Figure 2 B, the optical film 4 of film laminated body 5 (52) has multiple layers, and has hyaline membrane and overlap
When at least one hard conating, can have on the surface (that is, surface with 1 opposite side of protective film) in the outside of hard conating
Bright conductive layer 6.
Can also such as transparent electrode be made by transparency conducting layer 6.By the way that transparency conducting layer 6 is carried out pattern as needed
Change, can transparent electrode be made by transparency conducting layer 6.For example, by implementing etching process to transparency conducting layer 6, it can will be saturating
Bright conductor layer 6 patterns.
Transparency conducting layer 6 includes selected from such as ITO (tin indium oxide), AZO (zinc oxide aluminum), IZO (indium zinc oxide), ATO
One kind in metal oxides such as (antimony tin oxides).Transparency conducting layer 6 includes by such as ITO layer, AZO layer, IZO layers, ATO
Layer, the film of the metal oxides such as oxide of tin antimony, zinc, tin or the ultrathin membrane of the metals such as gold, silver, palladium, aluminium are formed
Layer.
It will be provided with the winding of film laminated body 5 of transparency conducting layer 6 and taken care of after formation volume, when solving uncoiling, even if film
The transparency conducting layer 6 of laminated body 5 is removed from the second face 2b of the resin film 2 of lower layer side, transparency conducting layer 6 and protective film 1 it
Between be also difficult to happen separation of charge.
Film laminated body 5 can be by by the adhesive layer 3 of said protection film 1 overlapping to optical film 4 and being allowed to crimp to be formed.
When film laminated body 5 has the transparency conducting layers 6 such as ITO layer, after can transparency conducting layer 6 being bonded to optical film 4, by protective film 1
Adhesive layer 3 be crimped to the surface with 6 opposite side of transparency conducting layer, alternatively, the adhesive layer 3 and light of protective film 1 can also be made
After the face bonding for learning film 4, then transparency conducting layer 6 is bonded etc. to another face of optical film 4.
Protective film 1 involved by present embodiment can be suitably employed in protection and be used for manufacturing the light such as touch panel display
The optical film 4 for learning equipment, can also be suitably used as in such as panel of LCD, plasma display device, Organic Electricity
The protective film when conveying of the optical devices such as electroluminescent display etc. for protection.In addition, the film layer involved by present embodiment
Stack 5 can similarly be suitably employed in protection and be used for manufacturing the optical films 4 of the optical devices such as touch panel display, can be with
It is suitably used as the optical device such as panel of LCD, plasma display device, display of organic electroluminescence.
Embodiment
Hereinafter, specific embodiments of the present invention are shown to illustrate, but the present invention is not limited to these embodiments.
(1) making of protective film
As the substrate layer of resin film, prepare the polyester film recorded in " type of polyester film " in table 1.In addition, preparing
Filler (spherical shape two containing polyethylene terephthalate and with average grain diameter shown in " grain size of filler " in table 1
Silica) resin solution.After above-mentioned resin solution is coated on polyester film (substrate layer), be allowed to dry and in substrate layer
The upper coating for forming average thickness and being 0.1 μm, obtains resin film.It should be noted that the filer content such as table 1 in coating
In " filer content in coating " it is described.Next, prepare the adhesive containing butyl acrylate, acrylic acid and solvent,
After being coated with the adhesive on the surface with coating opposite side of resin film, it is allowed to drying, to be formed on substrate layer
The adhesive layer that thickness is 10 μm.Thus protective film is obtained.
According to JIS B0601, measuring machine (Seiko Instruments Co. Ltd. system models SPA300HV+ is used
3800N (scanning probe microscopy)) measure gained Examples 1 to 5 and comparative example 1~2 resin film the second face surface it is thick
Rugosity Ra, and be recorded in " Ra values " column of table 1.
It should be noted that " type of polyester film " recorded in table 1 is as described below.
A：(Dongli Ltd.'s system, 125QTM3, thickness are 50 μm to polyethylene terephthalate film, are carried by DMF
The molecular weight taken is that the amount of 1000 low molecular weight compositions below is 0.2~2.0mmg/m2Below)
B：Polyethylene terephthalate film (Mitsubishi Plastics Inc's system, T100, thickness containing low molecular weight compositions
Degree is 125 μm, is 2.0mmg/m by the amount that the DMF molecular weight extracted is 1000 low molecular weight compositions below2More than)
(2) it evaluates
(2-1) release band electricity
The examination of protection film production the width 150mm, length 300mm of the Examples 1 to 5 and comparative examples 1~2 that made by (1)
After testing piece, the ITO layer of the width 300mm for removing electricity in advance, length 500mm, 125 μm of thickness is conformed to (in 125 μm of PET of thickness
Film surface carries out ITO layer obtained by sputtering processing with thickness 20nm), with pressure 40gf/cm2(about 3.9KPa) is crimped.Its
Afterwards, it is placed 5 minutes in the environment of 25 DEG C ± 3 DEG C of temperature, humidity 55 ± 5%.Next, with 90 ° of peel angle, peeling rate
300mm/ minutes modes remove resin film from ITO layer.The current potential on the test film surface generated at this time is filled by potential measurement
It sets (Kasuga Electric K. K. model KSD-2000) to be measured, obtains the release band electricity of resin film.
(2-2) adhesion inhibiting properties
Protection film production width 100mm, length 100mm by the Examples 1 to 5 and comparative example 1~2 that are made by (1)
Test film after, by each test film with pressure 5kg/cm2(about 0.5MPa) is crimped to the PET film that Co., Ltd.'s manufacture is spun by Japan
The surface sides PET of A4100 (with adhesive layer opposite side).Thereafter, the tacky state of 2 films that observation has crimped, evaluation whether there is or not
The generation of adhesion.
A：Film is unbonded each other, does not stick together
B：Film is bonded to each other, and adhesion has occurred
(2-3) haze change amount
Measure the haze value of protective film.Next, protective film is heated 30 minutes at 150 DEG C, survey again immediately after
Determine haze value.It measures with JIS K7136：It is carried out on the basis of 2000.Haze change amount is calculated by the result.
The result of above-mentioned evaluation is shown in table 1 below.
[table 1]
Reference sign
1 protective film
2 resin films
The first faces 2a
The second faces 2b
3 adhesive layers
4 optical films
5 film laminated bodies
6 transparency conducting layers
Claims (7)
1. a kind of protective film, which is characterized in that it has：Have the first face and is present in the resin in the second face of its opposite side
Film and adhesive layer on first face of the resin film is overlapped,
The surface roughness Ra in second face of the resin film is 1.5nm or more,
The release band electricity of the resin film generated by stripping again after making second face be contacted with ITO layer be 30kV with
Under.
2. protective film according to claim 1, wherein the resin film has substrate layer and is present in the base material
Coating on layer,
The outer surface of the coating is second face.
3. protective film according to claim 2, wherein the coating contains polyester resin and inorganic filler.
4. protective film according to claim 3, wherein the grain size of the inorganic filler is in 30nm or more and 300nm or less
In the range of.
5. protective film according to any one of claims 1 to 4 has the mist degree after being heated 30 minutes at 150 DEG C
Variable quantity is 0.5% characteristic below.
6. a kind of film laminated body, has：Protective film according to any one of claims 1 to 5 and overlap the protection
Optical film on the adhesive layer of film.
7. film laminated body according to claim 6, wherein the surface with the protective film opposite side of the optical film
On have transparency conducting layer.
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| JP2017037681 | 2017-02-28 | ||
| JP2017-037681 | 2017-02-28 |
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| CN (1) | CN108504297A (en) |
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|---|---|---|---|---|
| TWI699424B (en) * | 2019-01-30 | 2020-07-21 | 南亞塑膠工業股份有限公司 | Release film of OCA optical glue and manufacturing method thereof |
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| WO2021200790A1 (en) | 2020-04-02 | 2021-10-07 | 株式会社クレハ | Multilayered film, method for producing same, and use thereof |
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| JP2001294826A (en) * | 2000-04-17 | 2001-10-23 | Teijin Ltd | Readily adherent film for optics and optical laminate using the same |
| CN103890700A (en) * | 2011-11-07 | 2014-06-25 | 王子控股株式会社 | Display device with capacitive touch panel, capacitive touch panel |
| CN103958157A (en) * | 2011-11-29 | 2014-07-30 | 东丽株式会社 | Surface protection film fabrication method and fabrication apparatus and surface protection film |
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| AU2003211430A1 (en) * | 2002-02-20 | 2003-09-09 | Denki Kagaku Kogyo Kabushiki Kaisha | Static electricity preventing method and method using the method |
| JP2008292655A (en) * | 2007-05-23 | 2008-12-04 | Sekisui Chem Co Ltd | Adhesive tape for photomask protection |
| JP6261181B2 (en) * | 2011-12-19 | 2018-01-17 | 日東電工株式会社 | Carrier film and laminate for transparent conductive film |
| JP2015174933A (en) * | 2014-03-17 | 2015-10-05 | 三菱樹脂株式会社 | Polyester film for surface protective film, and laminate |
| JP6433707B2 (en) * | 2014-07-28 | 2018-12-05 | 日東電工株式会社 | Transparent conductive laminate and method for producing the same, method for producing transparent conductive film, and method for producing transparent conductive film roll |
| JP6550973B2 (en) * | 2015-07-01 | 2019-07-31 | 東洋紡株式会社 | Oligomer precipitation prevention polyester film |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001294826A (en) * | 2000-04-17 | 2001-10-23 | Teijin Ltd | Readily adherent film for optics and optical laminate using the same |
| CN103890700A (en) * | 2011-11-07 | 2014-06-25 | 王子控股株式会社 | Display device with capacitive touch panel, capacitive touch panel |
| CN103958157A (en) * | 2011-11-29 | 2014-07-30 | 东丽株式会社 | Surface protection film fabrication method and fabrication apparatus and surface protection film |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI699424B (en) * | 2019-01-30 | 2020-07-21 | 南亞塑膠工業股份有限公司 | Release film of OCA optical glue and manufacturing method thereof |
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