CN108495466A - A kind of electronic hardware processing method - Google Patents

A kind of electronic hardware processing method Download PDF

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Publication number
CN108495466A
CN108495466A CN201810286131.9A CN201810286131A CN108495466A CN 108495466 A CN108495466 A CN 108495466A CN 201810286131 A CN201810286131 A CN 201810286131A CN 108495466 A CN108495466 A CN 108495466A
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CN
China
Prior art keywords
electronic hardware
parts
processing method
laminate
high temperature
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Withdrawn
Application number
CN201810286131.9A
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Chinese (zh)
Inventor
王玉环
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Nanan Chuangpei Electronic Technology Co Ltd
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Nanan Chuangpei Electronic Technology Co Ltd
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Filing date
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Application filed by Nanan Chuangpei Electronic Technology Co Ltd filed Critical Nanan Chuangpei Electronic Technology Co Ltd
Priority to CN201810286131.9A priority Critical patent/CN108495466A/en
Publication of CN108495466A publication Critical patent/CN108495466A/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The invention discloses a kind of electronic hardware processing method, S1：It is drilled on the second laminate with the rotating speed of 300 500r/min by drilling machine and forms hole, the second laminate is bonded and the first lamina surface by binder, make hole formation corresponding recesses structure, then drilled in respective slot with the rotating speed of 200 300r/min by drilling machine, becomes through-hole；S2：It is laid with isolation film in the second lamina surface, and in interior filling filler in through-hole, then laying depth is 0.5 1.0mm, the high temperature silicon film that high temperature resistant degree is 200 300 degrees Celsius, hot-pressing processing is carried out using the first laminate of hot-press equipment pair, the second laminate, isolation film and high temperature silicon film, after cooling 30 50min, removal high temperature silicon film, isolation film and filler form the doubling plate with groove structure；S3：It is etched by etching solution in a face logicalnot circuit graph area of doubling plate.Process velocity of the present invention is fast, and producing efficiency is high, cost-effective, and doubling plate, which bonds, to be consolidated, and service life is long, electronic hardware efficient work.

Description

A kind of electronic hardware processing method
Technical field
The present invention relates to electronic hardware technical field more particularly to a kind of electronic hardware processing methods.
Background technology
Printed circuit board is almost the basis of any electronic product, is appeared in almost each electronic equipment, generally Come, if having electronic component in some equipment, they are installed on the PCB of different sizes.In addition to solid Outside fixed various components, the main function of PCB is to provide the connection circuit between every component.Increasingly with electronic equipment Complexity, the component needed is more and more, and circuit and the component arrangement of PCB surface are also more and more intensive, for wanting for pcb board Ask also higher and higher.
Through retrieval, Chinese patent Authorization Notice No. is that CN104735929A discloses a kind of circuit board processing method and sets It is standby, include the formation first line figure on the first face of the first conductive base, if the first face is the hair side of the first conductive base, First line figure is based on plating conductive material in the first face and being formed；The second circuit is formed on the second face of the second conductive base Figure, if the second face is the hair side of the second conductive base, first line figure is based on plating conductive material in the second face and being formed；It will Prepreg presses between the first face of the first conductive base and the second face of the second conductive base to form the first board set； To the third facet etch of the first conductive base in the first board set to expose first line figure, in the first board set The fourth face of two conductive bases is etched to expose the second line pattern.
Existing electronic hardware processing method has the following disadvantages：The processing method process is cumbersome, and processing efficiency is low, Bonding is unstable between multilayer circuit board obtained, and doubling plate is easily separated after work long hours are heated, and electronic component is caused to contact It is bad, influence electronic equipment normal operation.
Invention content
The purpose of the present invention is to provide a kind of electronic hardware processing method, have that process velocity is fast, and producing efficiency is high, section The advantages of about cost, doubling plate, which bonds, to be consolidated, and service life is long, and electronic equipment can work normally, it is numerous to solve production method Trivial, processing is slow, and producing efficiency is low, and bonding is unstable between multilayer circuit board obtained, and doubling plate is easy after work long hours are heated Separation, the problem of leading to electronic component poor contact, influence electronic equipment normal operation.
A kind of electronic hardware processing method according to the ... of the embodiment of the present invention, includes the following steps：
S1：It is drilled on the second laminate with the rotating speed of 300-500r/min by drilling machine and forms hole, pass through binder Second laminate is bonded in the first lamina surface, makes hole formation corresponding recesses structure, then by drilling machine with 200-300r/ The rotating speed of min drills in respective slot, becomes through-hole；
S2：It is laid with isolation film in the second lamina surface, and in interior filling filler in through-hole, then laying depth is 0.5- 1.0mm, the high temperature silicon film that high temperature resistant degree is 200-300 DEG C, using the first laminate of hot-press equipment pair, the second laminate, isolation film And high temperature silicon film carries out hot-pressing processing, after cooling down 30-50min, removal high temperature silicon film, isolation film and filler are formed Doubling plate with through-hole structure；
S3：It is etched by etching solution in a face logicalnot circuit graph area of doubling plate, etched thickness is the 30- of copper coin 35%, one floor resin is set in a face line pattern area of doubling plate, presses outer copper foil in resin surface, and in outer layer copper coin Upper processing outer-layer circuit figure；
S4：Electronic component to be welded is inserted into the through-hole of the double-deck plate surface and marshalling, using soldering iron and Tin silk needs welding position to be subjected to so that movable electronic component to be welded and fixed on doubling plate circuit board reverse side, Complete the processing of this electronic hardware.
On the basis of said program, in the S1, before drilling, the first laminate and the second laminate are removed by hairbrush The dust and sundries on surface.
On the basis of said program, the binder includes the raw material of following parts by weight：10-15 parts of alkyl acrylate, 20-25 parts of acrylic acid, 10-20 parts of methyl methacrylate.
On the basis of said program, the filler is one kind in glass fibre, plastics.
On the basis of said program, it is 20-270 DEG C of heat pressing forming machines that the hot-press equipment, which selects temperature control,.
On the basis of said program, the etching solution is alkaline etching liquid.
On the basis of said program, the isolation film is one in polyethylene terephthalate, polyethylene and polypropylene Kind or a variety of mixtures.
On the basis of said program, the high temperature resistant temperature of the isolation film is 250-350 DEG C.
On the basis of said program, the alkaline etching liquid includes the raw material of following parts by weight：5-15 parts of ammonium chloride, carbonic acid 10-20 parts of hydrogen ammonium, 20-30 parts of water, 20-30 parts of copper chloride.
On the basis of said program, the resin is bisphenol A type epoxy resin.
The present invention has an advantageous effect in that compared with prior art：
By the way that the first laminate and the second laminate substep are drilled so that through-hole can prevent on two laminates in correspondence with each other Through-hole there is the phenomenon that entanglement, make pre-bonded processing by two laminates of binder pair, make its adhesion efficiency improve 10- 20%, while acroleic acid binding agent high temperature resistant so that circuit board works long hours adstante febre, and binder remains activity, protects It holds two-ply and is in tacky state always, filler and high-temperature silica gel are separated with through-hole using isolation film, hot pressing can be prevented Adhesive sheet material or high-temperature silica gel material penetrate into through-hole in journey, it is ensured that through-hole function integrity improves the yield rate of product 20-30%, while the recyclable reuse of high temperature silicon film save production cost 15-25%；Alkaline etching liquid etching efficiency Height, stability is good, easy to control so that process time shortens 10-15%；Therefore, process velocity of the present invention is fast, and producing efficiency is high, Cost-effective, doubling plate, which bonds, to be consolidated, and service life is long, electronic hardware efficient work.
Specific implementation mode
For that can further appreciate that feature, technological means and the concrete function reached of the present invention, below with specific implementation Mode is described in further detail the present invention.
Embodiment 1
A kind of electronic hardware processing method is present embodiments provided, is as follows：
S1：It is drilled on the second laminate with the rotating speed of 300r/min by drilling machine and forms hole, by binder by Two laminates are bonded in the first lamina surface, make hole formation corresponding recesses structure, then by drilling machine with the rotating speed of 200r/min It drills in respective slot, becomes through-hole；
S2：It is laid with isolation film in the second lamina surface, and in interior filling filler in through-hole, then laying depth is 0.5mm, high temperature resistant degree are 200 DEG C of high temperature silicon film, using the first laminate of hot-press equipment pair, the second laminate, isolation film and High temperature silicon film carries out hot-pressing processing, and after cooling 30min, removal high temperature silicon film, isolation film and filler, being formed has through-hole The doubling plate of structure；
S3：It being etched by etching solution in a face logicalnot circuit graph area of doubling plate, etched thickness is the 30% of copper coin, One floor resin is set in a face line pattern area of doubling plate, presses outer copper foil in resin surface, and add on outer layer copper coin Work outer-layer circuit figure；
S4：Electronic component to be welded is inserted into the through-hole of the double-deck plate surface and marshalling, using soldering iron and Tin silk needs welding position to be subjected to so that movable electronic component to be welded and fixed on doubling plate circuit board reverse side, Complete the processing of this electronic hardware.
Wherein, in S1, before drilling, by hairbrush remove the dust of the first laminate and the second lamina surface with it is miscellaneous Object, binder include the raw material of following parts by weight：10 parts of alkyl acrylate, 20 parts of acrylic acid, 10 parts of methyl methacrylate, Filler is glass fibre, and it is 20 DEG C of heat pressing forming machines that hot-press equipment, which selects temperature control, and etching solution is alkaline etching liquid, isolation film For polyethylene terephthalate, polyethylene and polyacrylic mixture, mixing ratio 2:1:1, the high temperature resistant temperature of isolation film It is 250, DEG C, alkaline etching liquid includes the raw material of following parts by weight：5 parts of ammonium chloride, 10 parts of ammonium hydrogen carbonate, 20 parts of water, copper chloride 20 parts, resin is bisphenol A type epoxy resin.
Embodiment 2
A kind of electronic hardware processing method is present embodiments provided, is as follows：
S1：It is drilled on the second laminate with the rotating speed of 500r/min by drilling machine and forms hole, by binder by Two laminates are bonded in the first lamina surface, make hole formation corresponding recesses structure, then by drilling machine with the rotating speed of 300r/min It drills in respective slot, becomes through-hole；
S2：It is laid with isolation film in the second lamina surface, and in interior filling filler in through-hole, then laying depth is 1.0mm, high temperature resistant degree are 300 DEG C of high temperature silicon film, using the first laminate of hot-press equipment pair, the second laminate, isolation film and High temperature silicon film carries out hot-pressing processing, and after cooling 50min, removal high temperature silicon film, isolation film and filler, being formed has through-hole The doubling plate of structure；
S3：It being etched by etching solution in a face logicalnot circuit graph area of doubling plate, etched thickness is the 35% of copper coin, One floor resin is set in a face line pattern area of doubling plate, presses outer copper foil in resin surface, and add on outer layer copper coin Work outer-layer circuit figure；
S4：Electronic component to be welded is inserted into the through-hole of the double-deck plate surface and marshalling, using soldering iron and Tin silk needs welding position to be subjected to so that movable electronic component to be welded and fixed on doubling plate circuit board reverse side, Complete the processing of this electronic hardware.
Wherein, in S1, before drilling, by hairbrush remove the dust of the first laminate and the second lamina surface with it is miscellaneous Object, binder include the raw material of following parts by weight：15 parts of alkyl acrylate, 25 parts of acrylic acid, 20 parts of methyl methacrylate, Filler is plastics, and it is 270 DEG C of heat pressing forming machines that hot-press equipment, which selects temperature control, and etching solution is alkaline etching liquid, and isolation film is The mixture of polyethylene terephthalate, polyethylene, mixing ratio 1:2, the high temperature resistant temperature of isolation film is 350 DEG C, alkali Property etching solution includes the raw material of following parts by weight：15 parts of ammonium chloride, 20 parts of ammonium hydrogen carbonate, 30 parts of water, 30 parts of copper chloride, resin are Bisphenol A type epoxy resin.
Embodiment 3
A kind of electronic hardware processing method is present embodiments provided, is as follows：
S1：It is drilled on the second laminate with the rotating speed of 400r/min by drilling machine and forms hole, by binder by Two laminates are bonded in the first lamina surface, make hole formation corresponding recesses structure, then by drilling machine with the rotating speed of 250r/min It drills in respective slot, becomes through-hole；
S2：It is laid with isolation film in the second lamina surface, and in interior filling filler in through-hole, then laying depth is 0.75mm, high temperature resistant degree are 250 DEG C of high temperature silicon film, using the first laminate of hot-press equipment pair, the second laminate, isolation film and High temperature silicon film carries out hot-pressing processing, and after cooling 40min, removal high temperature silicon film, isolation film and filler, being formed has through-hole The doubling plate of structure；
S3：It being etched by etching solution in a face logicalnot circuit graph area of doubling plate, etched thickness is the 32% of copper coin, One floor resin is set in a face line pattern area of doubling plate, presses outer copper foil in resin surface, and add on outer layer copper coin Work outer-layer circuit figure；
S4：Electronic component to be welded is inserted into the through-hole of the double-deck plate surface and marshalling, using soldering iron and Tin silk needs welding position to be subjected to so that movable electronic component to be welded and fixed on doubling plate circuit board reverse side, Complete the processing of this electronic hardware.
Wherein, in S1, before drilling, by hairbrush remove the dust of the first laminate and the second lamina surface with it is miscellaneous Object, binder include the raw material of following parts by weight：12 parts of alkyl acrylate, 22 parts of acrylic acid, 15 parts of methyl methacrylate, Filler is glass fibre, and it is 145 DEG C of heat pressing forming machines that hot-press equipment, which selects temperature control, and etching solution is alkaline etching liquid, isolation The high temperature resistant temperature of film polypropylene, isolation film is 300 DEG C, and alkaline etching liquid includes the raw material of following parts by weight：10 parts of ammonium chloride, 15 parts of ammonium hydrogen carbonate, 25 parts of water, 25 parts of copper chloride, resin is bisphenol A type epoxy resin.
Embodiment 4
A kind of electronic hardware processing method is present embodiments provided, is as follows：
S1：It is drilled on the second laminate with the rotating speed of 350r/min by drilling machine and forms hole, by binder by Two laminates are bonded in the first lamina surface, make hole formation corresponding recesses structure, then by drilling machine with the rotating speed of 225r/min It drills in respective slot, becomes through-hole；
S2：It is laid with isolation film in the second lamina surface, and in interior filling filler in through-hole, then laying depth is 0.6mm, high temperature resistant degree are 225 DEG C of high temperature silicon film, using the first laminate of hot-press equipment pair, the second laminate, isolation film and High temperature silicon film carries out hot-pressing processing, and after cooling 35min, removal high temperature silicon film, isolation film and filler, being formed has through-hole The doubling plate of structure；
S3：It being etched by etching solution in a face logicalnot circuit graph area of doubling plate, etched thickness is the 31% of copper coin, One floor resin is set in a face line pattern area of doubling plate, presses outer copper foil in resin surface, and add on outer layer copper coin Work outer-layer circuit figure；
S4：Electronic component to be welded is inserted into the through-hole of the double-deck plate surface and marshalling, using soldering iron and Tin silk needs welding position to be subjected to so that movable electronic component to be welded and fixed on doubling plate circuit board reverse side, Complete the processing of this electronic hardware.
Wherein, in S1, before drilling, by hairbrush remove the dust of the first laminate and the second lamina surface with it is miscellaneous Object, binder include the raw material of following parts by weight：11 parts of alkyl acrylate, 21 parts of acrylic acid, 12 parts of methyl methacrylate, Filler is plastics, and it is 82 DEG C of heat pressing forming machines that hot-press equipment, which selects temperature control, and etching solution is alkaline etching liquid, and isolation film is poly- Ethylene terephthalate, polyacrylic mixture, mixing ratio 2:1, the high temperature resistant temperature of isolation film is 275 DEG C, alkalinity Etching solution includes the raw material of following parts by weight：7 parts of ammonium chloride, 12 parts of ammonium hydrogen carbonate, 22 parts of water, 22 parts of copper chloride, resin is double Phenol A type epoxy resin.
Embodiment 5
A kind of electronic hardware processing method is present embodiments provided, is as follows：
S1：It is drilled on the second laminate with the rotating speed of 450r/min by drilling machine and forms hole, by binder by Two laminates are bonded in the first lamina surface, make hole formation corresponding recesses structure, then by drilling machine with the rotating speed of 275r/min It drills in respective slot, becomes through-hole；
S2：It is laid with isolation film in the second lamina surface, and in interior filling filler in through-hole, then laying depth is 0.85mm, high temperature resistant degree are 275 DEG C of high temperature silicon film, using the first laminate of hot-press equipment pair, the second laminate, isolation film and High temperature silicon film carries out hot-pressing processing, and after cooling 45min, removal high temperature silicon film, isolation film and filler, being formed has through-hole The doubling plate of structure；
S3：It being etched by etching solution in a face logicalnot circuit graph area of doubling plate, etched thickness is the 33% of copper coin, One floor resin is set in a face line pattern area of doubling plate, presses outer copper foil in resin surface, and add on outer layer copper coin Work outer-layer circuit figure；
S4：Electronic component to be welded is inserted into the through-hole of the double-deck plate surface and marshalling, using soldering iron and Tin silk needs welding position to be subjected to so that movable electronic component to be welded and fixed on doubling plate circuit board reverse side, Complete the processing of this electronic hardware.
Wherein, in S1, before drilling, by hairbrush remove the dust of the first laminate and the second lamina surface with it is miscellaneous Object, binder include the raw material of following parts by weight：13 parts of alkyl acrylate, 23 parts of acrylic acid, 17 parts of methyl methacrylate, Filler is glass fibre, and it is 207 DEG C of heat pressing forming machines that hot-press equipment, which selects temperature control, and etching solution is alkaline etching liquid, isolation Film is polyethylene terephthalate, polyethylene and polyacrylic mixture, mixing ratio 2:3:1, the high temperature resistant of isolation film Temperature is 325 DEG C, and alkaline etching liquid includes the raw material of following parts by weight：12 parts of ammonium chloride, 17 parts of ammonium hydrogen carbonate, 27 parts of water, chlorine Change 27 parts of copper, resin is bisphenol A type epoxy resin.
Reference examples
By in the present invention using electronic hardware made from the processing method of above-mentioned five experimental examples as experimental group, with common side Electronic hardware made from method as a control group, tests process time, yield rate, peel strength, test result is as follows table institute respectively Show：
In conclusion electronic hardware produced by the present invention is compared to electronic hardware made from commonsense method, process time contracting Short 33-47%, yield rate improve 4-8%, and peel strength improves 1.7-2.3 times, therefore processing efficiency higher of the present invention, Doubling plate bonding is more preferable, and working life is longer, has dissemination.
Place is not described in detail by the present invention, is the known technology of those skilled in the art.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace And modification, the scope of the present invention is defined by the appended.

Claims (10)

1. a kind of electronic hardware processing method, it is characterised in that：Include the following steps：
S1：It is drilled on the second laminate with the rotating speed of 300-500r/min by drilling machine and forms hole, by binder by Two laminates are bonded in the first lamina surface, make hole formation corresponding recesses structure, then by drilling machine with 200-300r/min's Rotating speed drills in respective slot, becomes through-hole；
S2：Be laid with isolation film in the second lamina surface, and in filling filler in through-hole, then laying depth be 0.5-1.0mm, The high temperature silicon film that high temperature resistant degree is 200-300 DEG C, using the first laminate of hot-press equipment pair, the second laminate, isolation film and height Warm silica gel piece carries out hot-pressing processing, after cooling 30-50min, removal high temperature silicon film, isolation film and filler, formed have it is logical The doubling plate of pore structure；
S3：It being etched by etching solution in a face logicalnot circuit graph area of doubling plate, etched thickness is the 30-35% of copper coin, One floor resin is set in a face line pattern area of doubling plate, presses outer copper foil in resin surface, and add on outer layer copper coin Work outer-layer circuit figure；
S4：Electronic component to be welded is inserted into the through-hole of the double-deck plate surface simultaneously marshalling, uses soldering iron and tin silk It needs welding position to be subjected to so that movable electronic component to be welded and fixed on doubling plate circuit board reverse side, completes The processing of this electronic hardware.
2. a kind of electronic hardware processing method according to claim 1, it is characterised in that：In the S1, in drilling Before, the dust and sundries of the first laminate and the second lamina surface are removed by hairbrush.
3. a kind of electronic hardware processing method according to claim 1, it is characterised in that：The binder includes following heavy Measure the raw material of part：10-15 parts of alkyl acrylate, 20-25 parts of acrylic acid, 10-20 parts of methyl methacrylate.
4. a kind of electronic hardware processing method according to claim 1, it is characterised in that：The filler is glass fibers One kind in dimension, plastics.
5. a kind of electronic hardware processing method according to claim 1, it is characterised in that：The hot-press equipment selects temperature control For 20-270 DEG C of heat pressing forming machines.
6. a kind of electronic hardware processing method according to claim 1, it is characterised in that：The etching solution is alkali etching Liquid.
7. a kind of electronic hardware processing method according to claim 1, it is characterised in that：The isolation film is polyethylene pair One or more mixtures in phthalic acid ester, polyethylene and polypropylene.
8. a kind of electronic hardware processing method according to claim 7, it is characterised in that：The high temperature resistant temperature of the isolation film Degree is 250-350 DEG C.
9. a kind of electronic hardware processing method according to claim 6, it is characterised in that：The alkaline etching liquid include with The raw material of lower parts by weight：5-15 parts of ammonium chloride, 10-20 parts of ammonium hydrogen carbonate, 20-30 parts of water, 20-30 parts of copper chloride.
10. a kind of electronic hardware processing method according to claim 1, it is characterised in that：The resin is bisphenol-A type ring Oxygen resin.
CN201810286131.9A 2018-03-30 2018-03-30 A kind of electronic hardware processing method Withdrawn CN108495466A (en)

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Application Number Priority Date Filing Date Title
CN201810286131.9A CN108495466A (en) 2018-03-30 2018-03-30 A kind of electronic hardware processing method

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102365006A (en) * 2011-10-20 2012-02-29 深圳市五株电路板有限公司 Processing method of multi-layer circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102365006A (en) * 2011-10-20 2012-02-29 深圳市五株电路板有限公司 Processing method of multi-layer circuit board

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
张怀武: "《现代印制电路原理与工艺》", 31 January 2010, 机械工业出版社 *
李兰亭: "《木材加工材料学》", 31 March 1992, 东北林业大学出版社 *

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