CN108495464A - A kind of composition method for wiring board layout - Google Patents
A kind of composition method for wiring board layout Download PDFInfo
- Publication number
- CN108495464A CN108495464A CN201810261913.7A CN201810261913A CN108495464A CN 108495464 A CN108495464 A CN 108495464A CN 201810261913 A CN201810261913 A CN 201810261913A CN 108495464 A CN108495464 A CN 108495464A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- circuit board
- board group
- group
- transversely arranged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a kind of composition methods for wiring board layout, follow the steps below：Step 1：The length and width of required wiring board is designed in the requirement provided according to client；Step 2：Required wiring board will be designed and be overlapped arrangement up and down according to the horizontal direction of length, form transversely arranged circuit board group, it is designed out required wiring board in the side of transversely arranged circuit board group and from left to right carries out longitudinal arrangement, longitudinal arrangement circuit board group is formed, and the bottom of the longitudinal arrangement circuit board group is higher than the bottom of transversely arranged circuit board group；Step 3, by after arrangement transversely arranged circuit board group and longitudinal arrangement circuit board group rotate and 180 ° and be buckled to, form the monoblock wiring board typesetting pattern after merging；Step 4：The surrounding of monoblock wiring board after typesetting draws out plating silk-screen side, forms rectangular monoblock typesetting, completes the typesetting of wiring board layout.Effectively raising stock utilization reduction waste reduces cost.
Description
Technical field
The present invention relates to wiring board typesetting system fields, are specifically related to a kind of composition method for wiring board layout.
Background technology
Currently, wiring board as electronic industry basic components by extensive every field；PCB copper-clad plates (plate) and not
Break as market conditions appreciate, the purchase plate payment for goods period shortens, and plate material (material) directly occupies PCB circuit board industry cost
Most major part, low to wiring board company overall cost high profit is that strike property is extremely strong to circuit industry, and cost of labor is also continuously increased,
Man efficiency, which is not caught up with etc., causes wiring board development difficult, while being at present that the most commonly used is along the side spelled in design typesetting
Formula carries out typesetting, but the type-setting mode tastes the waste material and leftover pieces that will produce aniseed, causes the waste of material, increases
The expense of entire wiring board.
Invention content
In order to overcome the disadvantages of the above prior art, the object of the present invention is to provide a kind of raising stock utilizations to reduce wave
Expense reduces cost, reduces the slow composition method for wiring board layout of the excessive production efficiency of production PNL plates.
In order to achieve the above objectives, the present invention uses following technical scheme, a kind of composition method for wiring board layout to press
It is carried out according to following steps：
Step 1：The length and width of required wiring board is designed in the requirement provided according to client；
Step 2：Required wiring board will be designed and be overlapped arrangement up and down according to the horizontal direction of length, formed horizontal
To arrangement circuit board group, it is designed out required wiring board in the side of transversely arranged circuit board group and from left to right carries out longitudinal direction
Arrangement forms longitudinal arrangement circuit board group, and the bottom of the longitudinal arrangement circuit board group is higher than transversely arranged circuit board group
Bottom；
Step 3, by after arrangement transversely arranged circuit board group and longitudinal arrangement circuit board group rotate 180 ° and to fall
Button forms the monoblock wiring board typesetting pattern after merging；
Step 4：The surrounding of monoblock wiring board after typesetting draws out plating silk-screen side, forms rectangular monoblock row
Version completes the typesetting of wiring board layout.
In after transversely arranged circuit board group and longitudinal arrangement circuit board group rotate 180 ° and are buckled in the step 3
The region that portion is formed is garbage area.
It is equipped with laterally molding between wiring board in the transversely arranged circuit board group and divides version spacing, longitudinal row
It is equipped with longitudinal molding between wiring board in column line board group and divides version spacing.
Required wiring board in the transversely arranged circuit board group is formed by stacking for 3 layers, the longitudinal arrangement circuit
Required wiring board in board group is 2 layers and is arranged side by side.
The length and width of the required wiring board are 546X622mm, and the width on plating silk-screen side is 13.4mm.
It is 2.0mm that the lateral molding point version spacing and longitudinal molding, which divide version spacing all,.
The beneficial effects of the invention are as follows：The example edition designed by method in this can effectively improve the utilization rate of material,
Reducing waste reduces cost, improves the production efficiency of production PNL plates.
Description of the drawings
Fig. 1 is the typesetting master drawing after typesetting in the present invention；
In figure：1. transversely arranged circuit board group；2. longitudinal arrangement circuit board group；3. silk-screen side is electroplated；4. garbage area；5. vertical
Divide version spacing to molding；6. laterally molding divides version spacing.
Specific implementation mode
The present invention is described in detail below with reference to the accompanying drawings and embodiments.
In the description of the present invention, it is to be understood that, term "center", "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on ... shown in the drawings
Orientation or positional relationship is merely for convenience of description of the present invention and simplification of the description, do not indicate or imply the indicated device or
Element must have a particular orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
Term " first ", " second " are used for description purposes only, be not understood to indicate or imply relative importance or
Implicitly indicate the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can be expressed or imply
Ground includes one or more this feature；In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or
It is more than two.
Embodiment 1
A kind of composition method for wiring board layout as described in Figure 1, follows the steps below：
Step 1：The length and width of required wiring board is designed in the requirement provided according to client；
Step 2：Required wiring board will be designed and be overlapped arrangement up and down according to the horizontal direction of length, formed horizontal
To arrangement circuit board group 1, it is designed out required wiring board in the side of transversely arranged circuit board group 1 and is from left to right indulged
To arrangement, longitudinal arrangement circuit board group 2 is formed, and the bottom of the longitudinal arrangement circuit board group 2 is higher than transversely arranged circuit
The bottom of board group 1；
Step 3, by after arrangement transversely arranged circuit board group 1 and longitudinal arrangement circuit board group 2 rotate 180 ° and to fall
Button forms the monoblock wiring board typesetting pattern after merging；
Step 4：The surrounding of monoblock wiring board after typesetting draws out plating silk-screen side 3, forms rectangular monoblock row
Version completes the typesetting of wiring board layout.
Further, 180 ° of transversely arranged circuit board group 1 and the rotation of longitudinal arrangement circuit board group 2 are gone forward side by side in the step 3
The region that middle part is formed after row is buckled to is garbage area 4, and ensures that the gap after being buckled between each wiring board keeps equal；
It is equipped with laterally molding between wiring board in the transversely arranged circuit board group 1 and divides version spacing 6, the longitudinal direction
It is equipped with longitudinal molding between wiring board in arrangement circuit board group 2 and divides version spacing 5.The spacing between each wiring board is protected simultaneously
Hold equal, it is 2.0mm that such as laterally molding point version spacing 6 and longitudinal molding, which divide version spacing 5 all,
Required wiring board in the transversely arranged circuit board group 1 is formed by stacking for 3 layers, the longitudinal arrangement circuit
Required wiring board in board group 2 is 2 layers and is arranged side by side.
The length and width of the required wiring board are 314X87.5mm, and the width on plating silk-screen side 3 is 13.4mm.
Specifically during design, current aniseed material specification length and width are divided into following several：
1092X1245mm, 1041X1245mm, 940X1245mm and, the specification of the selected big material of the present embodiment is
The length and width of 602X520mm, the required wiring board of selected design are 314X87.5mm, during design, first by institute
The wiring board needed carries out three stackings and adds, and it is 2.0mm to be kept for the distance between every layer, then perpendicular in the side of the wiring board of superposition
In line row 2 open wiring board, and the upper end for ensureing three sandwich circuit boards of superposition and the end for 2 wiring boards being vertically arranged keep phase
It is flat, the example edition of formation is then subjected to 180 ° of rotations, the example edition of postrotational example edition and design is buckled to, and ensures to fall
Then example edition consistency from top to bottom after button, the example edition for forming a completion are surrounded by the plating silk that width is 13.4mm in example edition
Side 3 is printed, completes entire example edition typesetting, the length and width of example edition after the completion match with the size of the big plate of material of offer, meet and set
The requirement of meter, while the garbage area 4 of the entire space of a whole page only has the waste material that length and width are 140X50mm in the middle part of entire example edition, it is effective to increase
The utilization rate of entire aniseed, reduces waste material, improves the efficiency of production, saved resource, waste material is avoided excessively to cause to provide
The waste in source.
Above example is only to the present invention for example, do not constitute the limitation to protection scope of the present invention,
Within the same or analogous design of the every and present invention all belongs to the scope of protection of the present invention.
Claims (6)
1. a kind of composition method for wiring board layout, which is characterized in that follow the steps below：
Step 1：The length and width of required wiring board is designed in the requirement provided according to client；
Step 2：Required wiring board will be designed and be overlapped arrangement up and down according to the horizontal direction of length, form laterally row
Column line board group (1) is designed out required wiring board in the side of transversely arranged circuit board group (1) and is from left to right indulged
To arrangement, longitudinal arrangement circuit board group (2) is formed, and the bottom of the longitudinal arrangement circuit board group (2) is higher than transversely arranged
The bottom of circuit board group (1)；
Step 3, by after arrangement transversely arranged circuit board group (1) and longitudinal arrangement circuit board group (2) rotate 180 ° and to fall
Button forms the monoblock wiring board typesetting pattern after merging；
Step 4：The surrounding of monoblock wiring board after typesetting draws out plating silk-screen side (3), forms rectangular monoblock row
Version completes the typesetting of wiring board layout.
2. a kind of composition method for wiring board layout according to claim 1, which is characterized in that in the step 3
The region that middle part is formed after transversely arranged circuit board group (1) and longitudinal arrangement circuit board group (2) rotate 180 ° and be buckled to is
Garbage area (4).
3. a kind of composition method for wiring board layout according to claim 1, which is characterized in that the lateral row
It is equipped with laterally molding between wiring board in column line board group (1) and divides version spacing (6), the longitudinal arrangement circuit board group (2)
In wiring board between be equipped with longitudinal molding and divide version spacing (5).
4. a kind of composition method for wiring board layout according to claim 1, which is characterized in that the transverse direction
Required wiring board in arrangement circuit board group (1) is 3 layers and is formed by stacking, required in the longitudinal arrangement circuit board group (2)
Wiring board is 2 layers and is arranged side by side.
5. a kind of composition method for wiring board layout according to claims 1 or 4, which is characterized in that described
Required wiring board length and width be 546X622mm, plating silk-screen side (3) width be 13.4mm.
6. a kind of composition method for wiring board layout according to claim 3, which is characterized in that the transverse direction
It is 2.0mm that molding point version spacing (6) and longitudinal molding, which divide version spacing (5) all,.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810261913.7A CN108495464A (en) | 2018-03-28 | 2018-03-28 | A kind of composition method for wiring board layout |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810261913.7A CN108495464A (en) | 2018-03-28 | 2018-03-28 | A kind of composition method for wiring board layout |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108495464A true CN108495464A (en) | 2018-09-04 |
Family
ID=63316885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810261913.7A Pending CN108495464A (en) | 2018-03-28 | 2018-03-28 | A kind of composition method for wiring board layout |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108495464A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113408237A (en) * | 2021-06-24 | 2021-09-17 | 奥士康科技股份有限公司 | Fancy typesetting method for improving cutting utilization rate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036484A (en) * | 2010-09-30 | 2011-04-27 | 北大方正集团有限公司 | Typesetting method and device of circuit board and circuit board template |
| CN103152988A (en) * | 2013-02-22 | 2013-06-12 | 胜宏科技（惠州）股份有限公司 | Method for improving board utilization ratio during fabrication of PCB (Printed Circuit Board) |
| CN203482492U (en) * | 2013-09-29 | 2014-03-12 | 胜宏科技（惠州）股份有限公司 | Substrate for improving typesetting utilization rate of circuit board |
| CN206506781U (en) * | 2017-03-01 | 2017-09-19 | 奥士康精密电路（惠州）有限公司 | Three-back-shaped typesetting circuit board in a kind of PNL |
-
2018
- 2018-03-28 CN CN201810261913.7A patent/CN108495464A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036484A (en) * | 2010-09-30 | 2011-04-27 | 北大方正集团有限公司 | Typesetting method and device of circuit board and circuit board template |
| CN103152988A (en) * | 2013-02-22 | 2013-06-12 | 胜宏科技（惠州）股份有限公司 | Method for improving board utilization ratio during fabrication of PCB (Printed Circuit Board) |
| CN203482492U (en) * | 2013-09-29 | 2014-03-12 | 胜宏科技（惠州）股份有限公司 | Substrate for improving typesetting utilization rate of circuit board |
| CN206506781U (en) * | 2017-03-01 | 2017-09-19 | 奥士康精密电路（惠州）有限公司 | Three-back-shaped typesetting circuit board in a kind of PNL |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113408237A (en) * | 2021-06-24 | 2021-09-17 | 奥士康科技股份有限公司 | Fancy typesetting method for improving cutting utilization rate |
| CN113408237B (en) * | 2021-06-24 | 2023-08-18 | 奥士康科技股份有限公司 | Fancy typesetting method for improving utilization rate of cut materials |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180904 |
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| RJ01 | Rejection of invention patent application after publication |