CN108493135A - Silicon slice rotating device and silicon chip sorting machine - Google Patents
Silicon slice rotating device and silicon chip sorting machine Download PDFInfo
- Publication number
- CN108493135A CN108493135A CN201810365086.6A CN201810365086A CN108493135A CN 108493135 A CN108493135 A CN 108493135A CN 201810365086 A CN201810365086 A CN 201810365086A CN 108493135 A CN108493135 A CN 108493135A
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- silicon
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 144
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 144
- 239000010703 silicon Substances 0.000 title claims abstract description 144
- 238000001179 sorption measurement Methods 0.000 claims abstract description 7
- 230000003028 elevating effect Effects 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims description 37
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003116 impacting effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
This application discloses a kind of silicon slice rotating device and silicon chip sorting machines, belong to silicon chip sorting technology field.The silicon slice rotating device includes rotary driving part, lifts driving portion and rotating platform, wherein：The adsorption hole for adsorbing silicon chip is provided on rotating platform；Rotary driving part is connect with rotating platform, and rotary driving part drives rotating platform to rotate in the horizontal direction；Lifting driving portion drives rotary driving part and rotating platform to carry out elevating movement simultaneously.The application promotes rotating platform to jack up silicon chip using rotary driving part, using rotary driving part driving rotating platform rotation to drive silicon slice rotating, reach and not only avoided rotating platform to the influence of silicon chip in transmission, has also achieved the effect rotated automatically for treating rotation silicon chip.
Description
Technical field
The invention belongs to silicon chip sorting technology field, it is related to a kind of silicon slice rotating device and silicon chip sorting machine.
Background technology
On silicon chip sorting machine, if it is decided that the arranged direction of the silicon chip of conveying is incorrect, then needs to revolve silicon chip
Turn, for example is rotated by 90 ° or 180 degree etc..
At present typically by the way of the silicon chip for manually rotating conveying, but since silicon chip is more fragile, using people
The mode of work manual rotation silicon chip, not only efficiency is slow, but also uneven can lead to die crack because manually exerting a force.Therefore it needs to carry
For a kind of scheme rotated automatically to the silicon chip of conveying.
Invention content
In order to solve in the related technology because manually rotate conveying silicon chip when, inefficiency and be easy can because manually applying
Power uneven the problem of leading to die crack, the present invention provides a kind of silicon slice rotating device and silicon chip sorting machines.Particular technique
Scheme is as follows：
In a first aspect, a kind of silicon slice rotating device is provided, including rotary driving part, lifting driving portion and rotating platform,
Wherein：The adsorption hole for adsorbing silicon chip is provided on rotating platform；Rotary driving part is connect with rotating platform, rotary driving part
Rotating platform is driven to rotate in the horizontal direction；Lifting driving portion drives rotary driving part and rotating platform to carry out lifting fortune simultaneously
It is dynamic.
By the way that rotary driving part, lifting driving portion and rotating platform is arranged, when needing to rotate the silicon chip of transmission,
First with rotary driving part promoted rotating platform to jack up silicon chip, then utilize rotary driving part driving rotating platform rotation with
Silicon slice rotating is driven, has reached and has not only avoided rotating platform to the influence of silicon chip in transmission, also achieves and treats rotation silicon chip
Automatically the effect rotated.
Optionally, which further includes mounting bracket, and rotary driving part is slidably mounted on mounting bracket, and lifting is driven
Dynamic portion drives rotary driving part to be slided up and down along first group of guide rail being arranged on mounting bracket.
By the way that rotary driving part to be slidably mounted on mounting bracket, rotary driving part lifting is driven convenient for lifting driving portion,
Save the driving force of lifting driving.
Optionally, which further includes horizontal drive part and is horizontally installed on the driving end of horizontal drive part
Sliding part, mounting bracket lower slide are mounted on sliding part, and horizontal drive part drives mounting bracket to be slided on sliding part.
By the way that horizontal drive part is arranged, the rotating platform on the laterally driven mounting bracket of horizontal drive part is utilized, it is ensured that
When silicon chip is not located at the surface of rotating platform initial position, rotating platform can also be laterally moved to by horizontal drive part
The underface of silicon chip is to accept silicon chip；It is mounted on sliding part additionally by the lateral sliding part of setting, and by mounting bracket, in profit
When mounting bracket laterally driven with horizontal drive part, the driving force of horizontal drive part is saved.
Optionally, above-mentioned sliding part is leading screw, and the lower part of mounting bracket is provided with through-hole, and leading screw passes through through-hole and both ends are distinguished
Be fixed on in the driving end of horizontal drive part and fixed mounting plate.
By the way that through-hole is arranged in the bottom end of mounting bracket, to coordinate with leading screw, the driving of mounting bracket is carried for horizontal drive part
The structure design for saving driving force has been supplied to reduce manufacturing cost since conventional sliding rail and sliding block need not be configured.
Optionally, which further includes the first mounting plate and the second mounting plate, and the second mounting plate passes through first
Group sliding block be slidably mounted on the first mounting plate guide rail setting up and down, lifting driving portion drive the second mounting plate along guide rail into
Row slides up and down；Rotary driving part is slidably mounted on mounting bracket, and the transverse direction of the second mounting plate is mounted on by the first sliding block
On sliding rail.
By the second mounting plate being slided up and down on the first mounting plate and rotary driving part is slided up and down and is mounted on
On mounting bracket so that lifting driving portion can drive rotating platform to carry out elevating movement under the support of the second mounting plate.
Optionally, above-mentioned rotary driving part includes rotary drive, the first installation side plate, the second installation side plate and top plate,
First installation side plate and the second installation side plate are oppositely arranged, and rotary drive is fixedly mounted on top plate and below top plate,
The driving end of rotary drive connects rotating platform；First installation side plate is mounted on the first side plate of mounting bracket by the second sliding block
In first vertical rails, the second installation side plate is mounted on by third sliding block in the second vertical rails of the second side plate of mounting bracket；
The upper end of the third side plate of mounting bracket is fixedly connected with top plate, and third side plate is mounted on the second peace by the first sliding block
In the horizontal slide rail of loading board.
By the way that the first installation side plate and the second installation side plate, and the vertical cunning being arranged in two installation side plates is arranged
Rail, so that it is fixed above and below mounting bracket, ensure that the lifting of rotary drive is realized.
Optionally, above-mentioned lifting driving portion includes lifting motor, eccentric wheel, drive block and link block, wherein：Lifting motor
Driving end on eccentric wheel is installed, eccentric wheel is rotatablely connected with drive block lower end, the of drive block upper end and conveying link block
One end connects, and the second end of link block is fixedly connected with the second mounting plate of conveying, and lifting motor is by conveying eccentric wheel drive the
Two mounting plates and the rotary driving part on the second mounting plate are lifted.
Pass through above-mentioned design so that lifting driving portion has been changed to lateral switch to the side vertically driven from vertically directly driving
Formula reduces the occupancy of vertical direction spatial structure.
Optionally, the shape of above-mentioned rotating platform is circle.
By the way that rotating platform is shaped to circle, it can make rotating platform when rotated, avoid to transmission belt
Interference.
Second aspect, additionally provides a kind of silicon chip sorting machine, including the conveying device of conveying silicon chip and first aspect and
The silicon slice rotating device provided in the various optional realization methods of first aspect.
By the way that rotary driving part, lifting driving portion and rotating platform is arranged, the silicon chip for needing to convey conveying device into
When row rotation, rotating platform is promoted to detach silicon chip from conveying device using rotary driving part, is driven using rotary driving part
Dynamic rotating platform rotation has reached the influence for being not only avoided that rotating platform to silicon chip in transmission to drive silicon slice rotating, also real
The effect rotated automatically for treating rotation silicon chip is showed.
Optionally, above-mentioned conveying device includes at least two conveyer belts of parallel synchronous conveying, and silicon slice rotating device is located at
Lower section between two conveyer belts.
By the lower position being set to silicon slice rotating device between two conveyer belts, to ensure do not carrying out silicon chip
It avoids impacting silicon chip or conveyer belt when rotation.
It should be understood that above general description and following detailed description is merely exemplary, this can not be limited
Invention.
Description of the drawings
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the present invention
Example, and be used to explain the principle of the present invention together with specification.
Fig. 1 is the structural schematic diagram of the silicon chip sorting machine provided in the application section Example；
Fig. 2 is the structural schematic diagram of the silicon slice rotating device provided in the application section Example；
Fig. 3 is the front schematic view of the first mounting plate provided in the application one embodiment；
Fig. 4 is the front schematic view of the second mounting plate provided in the application one embodiment；
Fig. 5 A are the front scheme of installation of the rotary driving part provided in the application one embodiment；
Fig. 5 B are the back side scheme of installation for the rotary driving part that Fig. 5 A are provided；
Fig. 6 is the scheme of installation of the lifting driving portion provided in the application one embodiment.
Wherein, reference numeral is as follows：
10, conveying device；11, conveyer belt；20, silicon slice rotating device；21, rotary driving part；211, rotary drive；
212, the first installation side plate；213, the second installation side plate；214, top plate；215, the second sliding block；216, third sliding block；22, it lifts
Driving portion；221, lifting motor；222, eccentric wheel；223, drive block；224, link block；23, rotating platform；24, mounting bracket；
241, the first side plate；242, the second side plate；243, third side plate；25, horizontal drive part；26, leading screw；27, fixed mounting plate；
28, the first mounting plate；281, first group of sliding block；282, guide rail；29, the second mounting plate；291, the first sliding block；292, laterally sliding
Rail.
Specific implementation mode
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent and the consistent all embodiments of the present invention.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects being described in detail in claims, of the invention.
Silicon chip is during sorting, it usually needs by silicon slice rotating to predetermined direction, in order to subsequent detection and sieve
Choosing.Silicon chip is rotated frequently with mode manually at present, but silicon chip is more fragile, the mode manually rotated is easy to cause
Die crack.
In view of this, this application provides a kind of silicon chip sorting machine, a kind of silicon slice rotating is increased in the silicon chip sorting machine
Silicon slice rotating to predetermined direction can be avoided the manually rotation to silicon chip by device, the silicon slice rotating device.It ties below
Fig. 1 to Fig. 6 is closed silicon chip sorting machine and silicon slice rotating device is illustrated.
Fig. 1 is the structural schematic diagram of the silicon chip sorting machine provided in the application section Example, which includes
Conveying device 10 and silicon slice rotating device 20.
Here conveying device 10 is used to convey silicon chip, what silicon slice rotating device 20 was used to convey on rotationally conveying device 10
Silicon chip, for example, relative to conveying direction, silicon slice rotating device 20 is by 90 °, 180 ° or 270 ° of the silicon slice rotating of conveying.
In one possible implementation, conveying device 10 at least may include two conveyer belts of parallel synchronous conveying
11, silicon slice rotating device 20 is located at the lower section between two conveyer belts 11, in this way, silicon slice rotating device 20 is not carrying out silicon chip
It avoids impacting silicon chip or conveyer belt 11 when rotation.
It will be apparent that in order to realize that driving, conveying device 10 further include the driving portion for driving two conveyer belts 11 to convey,
Such as driving motor and driving wheel etc., due to driving the mechanical structure of two 11 synchronous transports of conveyer belt to belong to this using driving portion
The technology that field technology personnel can realize just repeats no more in the present embodiment.
In addition, silicon chip sorting machine can also include other than comprising above-mentioned conveying device 10 and silicon slice rotating device 20
To at least one detection device that silicon chip is detected, such as to the detection device that the appearance dirt of silicon chip is detected, such as
The detection device being detected split to the hidden of silicon chip, such as to detection device etc. that the appearance breakage of silicon chip is detected.
In order to realize that the automatic sorting of silicon chip, silicon chip sorting machine can also include control module, control module can pass through
PLC programming realize, with control the running of each device of silicon chip sorting machine, and can also realize the picture that detection device is taken into
Row analyzing processing.
For the ease of the operation of operating personnel, silicon chip sorting machine can also include display screen, which can show
Show the testing result or separation results of each silicon chip.
Further, display screen can also be to touch screen, and one can be shown by control module on the touch screen
A little operational controls generate corresponding operational order, such as booting, pause, pass through operating personnel to the contact action of operational controls
Machine, the detection function for opening certain detection device, the detection function for closing certain detection device, the rotation for opening silicon slice rotating device 20
Function, the rotation function etc. for closing silicon slice rotating device 20.
Optionally, silicon chip sorting machine can also include and show physical operations that screen and control module are used cooperatively by
Key carries out physical manipulation by operating personnel, generates corresponding operational order.
In order to realize that the rotation of the silicon chip conveyed to conveying device 10, the structure of silicon slice rotating device 20 refer to
Shown in Fig. 2, which includes at least rotary driving part 21, lifting driving portion 22 and rotating platform 23, wherein：Rotation
Turn to be provided with the adsorption hole for adsorbing silicon chip on platform 23；Rotary driving part 21 is connect with rotating platform 23, rotary driving part
21 drive rotating platforms 23 rotate in the horizontal direction；Lifting driving portion 22 drives rotary driving part 21 and rotating platform 23 simultaneously
Carry out elevating movement.
By the way that rotary driving part 21, lifting driving portion 22 and rotating platform 23 is arranged, carried out needing the silicon chip to transmission
When rotation, rotating platform 23 is promoted to jack up silicon chip first with rotary driving part 21, then rotary driving part 21 is utilized to drive
Rotating platform 23 is rotated to drive silicon slice rotating, has reached the influence for not only avoiding rotating platform 23 to silicon chip in transmission, also real
The effect rotated automatically for treating rotation silicon chip is showed.
In one possible implementation, silicon slice rotating device 20 is additionally provided with takes out with the matching used vacuum of adsorption hole
Device is taken, to realize the adsorption function of adsorption hole.
Optionally, the shape of above-mentioned rotating platform 23 can be circle, ellipse, polygon etc..In order to make rotating platform
23 when rotated, avoids the interference to transmission belt, and rotating platform 23 is shaped to circle in the embodiment of the present application.
In actual implementation, the influence in order to avoid rotating platform 23 when jacking silicon chip to silicon chip, 23 table of rotating platform
Face could be provided as buffering material or elastic material, such as rubber or flexible plastic etc., not to 23 surface of rotating platform in the application
Material be defined.
In order to support rotating platform 23, which can also include mounting bracket 24, rotation driving
Portion 21 is slidably mounted on mounting bracket 24, and lifting driving portion 22 drives first that rotary driving part 21 is arranged on mounting bracket 24
Group guide rail slides up and down.In this way, by the way that rotary driving part 21 is slidably mounted on mounting bracket 24, convenient for lifting driving portion
22 drive rotary driving part 21 to lift, and save the driving force of lifting driving.
In some realization applications, silicon chip to be rotated may be not on the surface of rotating platform 23, in order to
It realizes rotation to silicon chip, silicon slice rotating device 20 can be arranged to move in the horizontal direction, or being arranged to can be with
It is moved on the conveying direction of silicon chip.
In one possible implementation, which can also include horizontal drive part 25 and laterally set
The sliding part at the driving end of horizontal drive part 25 is set, 24 lower slide of mounting bracket is mounted on sliding part, horizontal drive part 25
Mounting bracket 24 is driven to be slided on sliding part.In this way, by the way that horizontal drive part 25 is arranged, it is laterally driven using horizontal drive part 25
Rotating platform 23 on mounting bracket 24, it is ensured that, can also when silicon chip is not located at the surface of 23 initial position of rotating platform
Rotating platform 23 is laterally moved into the underface of silicon chip to accept silicon chip by horizontal drive part 25；Laterally additionally by setting
Sliding part, and by mounting bracket 24 be mounted on sliding part on, using horizontal drive 25 laterally driven mounting bracket 24 of part when, save
The driving force of horizontal drive part 25.
For example, above-mentioned sliding part can be leading screw 26 can pacify at this point, in order to coordinate leading screw 26 to realize sliding
Shelve 24 lower part setting through-hole, leading screw 26 passes through through-hole and both ends to be separately fixed at and the driving end of horizontal drive part 25 and consolidate
In Dingan County's loading board 27.That is, two opposite through-holes are arranged in the lower part of mounting bracket 24, leading screw 26 passes through two through-holes,
One end of leading screw 26 is fixed in fixed mounting plate 27, and the other end is fixed on the driving end of horizontal drive part 25.
In this way, by the bottom end of mounting bracket 24 be arranged through-hole, with leading screw 26 coordinate, be horizontal drive part 25 to installation
The structure design that the driving of frame 24 provides saving driving force reduces system due to that need not configure conventional sliding rail and sliding block
Cause this.
Optionally, which can also include the first mounting plate 28 and the second mounting plate 29, the second installation
Plate 29 is slidably mounted on by first group of sliding block on the first mounting plate 28 guide rail setting up and down, lifting driving portion 22 driving second
Mounting plate 29 is slided up and down along guide rail 282, shown in Figure 3, is provided in the application one embodiment
The front schematic view of one mounting plate, is vertically provided with two guide rails, i.e. guide rail 282 on first mounting plate 28, on each guide rail
It is slidably fitted with sliding block, i.e. first group of sliding block 281.
Corresponding, rotary driving part 21 is slidably mounted on mounting bracket 24, and is mounted on the second installation by the first sliding block
It is shown in Figure 4 in the horizontal slide rail of plate 29, it is that the front of the second mounting plate provided in the application one embodiment shows
It is intended to, is horizontally arranged with a sliding rail, i.e. horizontal slide rail 292 on second mounting plate 29, is slided in first horizontal slide rail 292
There are one sliding block, i.e. the first sliding block 291, rotary driving parts 21 to be mounted on the second mounting plate 29 by the first sliding block 291 for installation
In horizontal slide rail 292.
The embodiment of the present application is driven by sliding up and down on the first mounting plate 28 and rotating the second mounting plate 29
Portion 21 slides up and down on mounting bracket 24 so that lifting driving portion 22 can drive rotating platform 23 in the second mounting plate 29
Support under carry out elevating movement.
It refers to shown in Fig. 5 A and Fig. 5 B, wherein Fig. 5 A are the rotary driving parts provided in the application one embodiment
Front scheme of installation, Fig. 5 B are the back side scheme of installation for the rotary driving part that Fig. 5 A are provided, and above-mentioned rotary driving part 21 wraps
Include rotary drive 211, the first installation side plate 212, the second installation side plate 213 and top plate 214, the first installation side plate 212 and
Two installation side plates 213 are oppositely arranged, and rotary drive 211 is fixedly mounted on top plate 214 and positioned at 214 lower section of top plate, rotation
The driving end of actuator 211 connects rotating platform 23；First installation side plate 212 is mounted on mounting bracket 24 by the second sliding block 215
In first vertical rails of the first side plate 241, the second installation side plate 213 is mounted on mounting bracket 24 second by third sliding block 216
In second vertical rails of side plate 242.Here the first vertical rails and the second vertical rails are arranged in parallel, and in general, the
The height of two sliding blocks 215 and third sliding block 216 is kept in the same horizontal line.
Here, rotary drive 211 can be electric rotating machine or other can realize the driving rotated in horizontal direction.
Here the first side plate 241 of mounting bracket 24 and the second side plate 242 are two relatively vertically arranged side plates, for reality
The transverse shifting of existing mounting bracket 24, mounting bracket 24 further include one and distinguish adjacent the with the first side plate 241 and the second side plate 242
The upper end of three side plates 243, the third side plate 243 of mounting bracket 24 is fixedly connected with top plate 214, the third side plate 243 of mounting bracket 24
It is mounted on the cross slide way on the second mounting plate 29 by the first sliding block 291.
By the way that the first installation side plate 212 and the second installation side plate 213 is arranged, and it is arranged in two installation side plates vertical
Sliding rail ensure that the lifting of rotary drive 211 is realized so that fixed in about 24 mounting bracket.
In actual implementation, the first side plate 241 of mounting bracket 24, third side plate 243 and the second side plate 242 are respectively positioned on top plate
214 lower section, and be typically sequentially to be fixedly mounted on three sides of top plate 214.
It is shown in Figure 6 in a kind of possible realization, it is the lifting driving provided in the application one embodiment
The scheme of installation in portion 22, the above-mentioned lifting driving portion 22 referred to may include lifting motor 221, eccentric wheel 222, drive block
223 and link block 224, wherein：Eccentric wheel 222, eccentric wheel 222 and drive block 223 are installed on the driving end of lifting motor 221
Lower end is rotatablely connected, and 223 upper end of drive block is connect with the first end of conveying link block 224, the second end of link block 224 and conveying
Second mounting plate 29 is fixedly connected, and lifting motor 221 drives the second mounting plate 29 and mounted on the by conveying eccentric wheel 222
Rotary driving part 21 on two mounting plates 29 is lifted.
Pass through above-mentioned design in the embodiment of the present application so that lifting driving portion 22 has been changed to lateral turn from vertical directly drive
For the mode vertically driven, reduce the occupancy of vertical direction spatial structure.
In conclusion silicon chip sorting machine provided by the present application, by the way that rotary driving part, lifting driving portion and rotary flat is arranged
Platform, when needing the silicon chip conveyed to conveying device to rotate, using rotary driving part promoted rotating platform with by silicon chip from
It is detached in conveying device, using rotary driving part driving rotating platform rotation to drive silicon slice rotating, has reached and be not only avoided that
Influence of the rotating platform to silicon chip in transmission also achieves the effect rotated automatically for treating rotation silicon chip.In addition, by by silicon
Piece rotating device is set to the lower position between two conveyer belts, to ensure to avoid to silicon chip when not rotating silicon chip
Or conveyer belt impacts.
Silicon slice rotating device provided by the present application is being needed by the way that rotary driving part, lifting driving portion and rotating platform is arranged
When being rotated to the silicon chip of transmission, rotating platform is promoted to jack up silicon chip first with rotary driving part, then utilizes rotation
Turn driving portion driving rotating platform rotation to drive silicon slice rotating, reaches the shadow for not only avoiding rotating platform to silicon chip in transmission
It rings, also achieves the effect rotated automatically for treating rotation silicon chip.
In addition, silicon slice rotating device by be arranged horizontal drive part, using on the laterally driven mounting bracket of horizontal drive part
Rotating platform, it is ensured that when silicon chip is not located at the surface of rotating platform initial position, can also be incited somebody to action by horizontal drive part
Rotating platform laterally moves to the underface of silicon chip to accept silicon chip；Additionally by the lateral sliding part of setting, and by mounting bracket
On sliding part, in mounting bracket laterally driven using horizontal drive part, the driving force of horizontal drive part is saved.
It should be added that " first " mentioned in the embodiment of the present application, " second ", " third " etc. describe vocabulary,
It is merely for convenience of understanding to show the different objects or component that refer to, is not limited to the sequence of object or component.
Those skilled in the art will readily occur to its of the present invention after considering specification and putting into practice the invention invented here
Its embodiment.This application is intended to cover the present invention any variations, uses, or adaptations, these modifications, purposes or
Person's adaptive change follows the general principle of the present invention and includes the common knowledge in the art that the present invention does not invent
Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are by following
Claim is pointed out.
It should be understood that the invention is not limited in the precision architectures for being described above and being shown in the accompanying drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is limited only by the attached claims.
Claims (10)
1. a kind of silicon slice rotating device, which is characterized in that the silicon slice rotating device includes：Rotary driving part, lifting driving portion
And rotating platform, wherein：
The adsorption hole for adsorbing silicon chip is provided on the rotating platform；
The rotary driving part is connect with the rotating platform, and the rotary driving part drives the rotating platform in the horizontal direction
Upper rotation；
The lifting driving portion drives the rotary driving part and the rotating platform to carry out elevating movement simultaneously.
2. silicon slice rotating device according to claim 1, which is characterized in that the silicon slice rotating device further includes installation
Frame, the rotary driving part are slidably mounted on the mounting bracket, the lifting driving portion drive the rotary driving part along
First group of guide rail being arranged on the mounting bracket slides up and down.
3. silicon slice rotating device according to claim 2, which is characterized in that the silicon slice rotating device further includes horizontal drive
Moving part and the sliding part for driving end for being horizontally installed on the horizontal drive part, the mounting bracket lower slide are mounted on the cunning
In dynamic portion, the horizontal drive part drives the mounting bracket to be slided on the sliding part.
4. silicon slice rotating device according to claim 2, which is characterized in that the sliding part is leading screw, the mounting bracket
Lower part be provided with through-hole, the leading screw passes through the through-hole and both ends are separately fixed at the driving end with the horizontal drive part
In fixed mounting plate.
5. silicon slice rotating device according to claim 2, which is characterized in that the silicon slice rotating device further includes the first peace
Loading board and the second mounting plate, it is setting up and down that second mounting plate by first group of sliding block is slidably mounted on first mounting plate
Guide rail on, the lifting driving portion drives second mounting plate to be slided up and down along the guide rail；
The rotary driving part is slidably mounted on the mounting bracket, and is mounted on second mounting plate by the first sliding block
In horizontal slide rail.
6. silicon slice rotating device according to claim 5, which is characterized in that the rotary driving part includes that rotation drives
Part, the first installation side plate, the second installation side plate and top plate, first installation side plate and the second installation side plate are oppositely arranged, institute
Rotary drive is stated to be fixedly mounted on the top plate and positioned at top plate lower section, the driving end connection of the rotary drive
The rotating platform；
First installation side plate is mounted on by the second sliding block in the first vertical rails of the first side plate of the mounting bracket, described
Second installation side plate is mounted on by third sliding block in the second vertical rails of the second side plate of the mounting bracket；
The upper end of the third side plate of the mounting bracket is fixedly connected with the top plate, and the third side plate passes through first sliding block
In the horizontal slide rail of second mounting plate.
7. silicon slice rotating device according to claim 5, which is characterized in that the lifting driving portion include lifting motor,
Eccentric wheel, drive block and link block, wherein：
The eccentric wheel is installed, the eccentric wheel connects with drive block lower end rotation on the driving end of the lifting motor
It connects, the drive block upper end is connect with the first end of conveying link block, second end and the second mounting plate of conveying of the link block
It is fixedly connected, the lifting motor drives second mounting plate and mounted on second mounting plate by conveying eccentric wheel
On the rotary driving part lifted.
8. according to any silicon slice rotating device in claim 1 to 7, which is characterized in that the shape of the rotating platform
For circle.
9. a kind of silicon chip sorting machine, which is characterized in that the silicon chip sorting machine includes conveying the conveying device of silicon chip and as weighed
Profit requires any silicon slice rotating device in 1 to 8.
10. silicon chip sorting machine according to claim 9, which is characterized in that the conveying device includes at least parallel synchronous
Two conveyer belts of conveying, lower section of the silicon slice rotating device between two conveyer belts.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810365086.6A CN108493135B (en) | 2018-04-23 | 2018-04-23 | Silicon wafer rotating device and silicon wafer sorting machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810365086.6A CN108493135B (en) | 2018-04-23 | 2018-04-23 | Silicon wafer rotating device and silicon wafer sorting machine |
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| CN108493135A true CN108493135A (en) | 2018-09-04 |
| CN108493135B CN108493135B (en) | 2024-01-05 |
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| CN201810365086.6A Active CN108493135B (en) | 2018-04-23 | 2018-04-23 | Silicon wafer rotating device and silicon wafer sorting machine |
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| KR20130005138A (en) * | 2011-07-05 | 2013-01-15 | 주식회사 에스엠이씨 | Double-arm type three step cassette lifting robot |
| CN103681968A (en) * | 2013-12-13 | 2014-03-26 | 无锡先导自动化设备股份有限公司 | Silicon wafer automatic insertion machine |
| CN106449509A (en) * | 2016-11-25 | 2017-02-22 | 江苏奥特维自动化科技有限公司 | Lifting and rotating device |
| US20170057018A1 (en) * | 2015-08-28 | 2017-03-02 | Chun-hao Li | Double-directional machining laser machine tool |
| CN208240623U (en) * | 2018-04-23 | 2018-12-14 | 无锡奥特维科技股份有限公司 | Silicon slice rotating device and silicon wafer sorting machine |
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2018
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001019595A (en) * | 1999-06-29 | 2001-01-23 | Sharp Corp | Rotary cooling member and crystal sheet-producing device using the same |
| CN101409245A (en) * | 2008-11-20 | 2009-04-15 | 陈百捷 | Automatic control silicon chip check system |
| KR20130005146A (en) * | 2011-07-05 | 2013-01-15 | 주식회사 에스엠이씨 | Single-arm type cassette lifting robot |
| KR20130005138A (en) * | 2011-07-05 | 2013-01-15 | 주식회사 에스엠이씨 | Double-arm type three step cassette lifting robot |
| CN103681968A (en) * | 2013-12-13 | 2014-03-26 | 无锡先导自动化设备股份有限公司 | Silicon wafer automatic insertion machine |
| US20170057018A1 (en) * | 2015-08-28 | 2017-03-02 | Chun-hao Li | Double-directional machining laser machine tool |
| CN106449509A (en) * | 2016-11-25 | 2017-02-22 | 江苏奥特维自动化科技有限公司 | Lifting and rotating device |
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|---|---|
| CN108493135B (en) | 2024-01-05 |
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