CN108489477A - A kind of tiny signal pick-up circuit for silicon micromechanical gyroscope - Google Patents
A kind of tiny signal pick-up circuit for silicon micromechanical gyroscope Download PDFInfo
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- CN108489477A CN108489477A CN201711456057.2A CN201711456057A CN108489477A CN 108489477 A CN108489477 A CN 108489477A CN 201711456057 A CN201711456057 A CN 201711456057A CN 108489477 A CN108489477 A CN 108489477A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5776—Signal processing not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
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Abstract
The invention discloses a kind of tiny signal pick-up circuit for silicon micromechanical gyroscope, including the first technotron, the second technotron, first resistor, second resistance, 3rd resistor, the 4th resistance, the first capacitance, the second capacitances.The circuit uses integration realization of semiconductor, the ultra-low noise performance of circuit is realized using low noise N-type JFET techniques, circuit is only made of 8 elements, has simple in structure, small, low in energy consumption, high reliability relative to traditional MEMS sensor detection circuit.Convenient for gyroscope sensing element Two-level ensemble, by by gyroscope sensing element and tiny signal pick-up circuit be encapsulated into a ground wire encirclement closed environment in, to can further improve the noiseproof feature and electromagnetic shielding capability of system.The present invention realizes bandpass filtering in circuit, has filtered out the interference of sensitive structure, has improved accuracy of detection.
Description
Technical field
The invention belongs to the fields MEMS, are related to the design of silicon micro mechanical sensor interface circuit, are related specifically to a kind of use
In silicon micromechanical gyroscope tiny signal pick-up circuit and its with the low noise of gyroscope sensor interface part and anti-dry
Disturb processing method.
Background technology
Silicon micromechanical gyroscope has many advantages, such as small, simple in structure, high sensitivity, is all had in dual-use market
Preferable application prospect.In the design of silicon micromechanical gyroscope system, the interface portion of gyroscope sensing element and processing circuit
The design divided is particularly critical.Traditional silicon micro mechanical sensor interface circuit is connected realization by discrete component on pcb board, not only
Volume is big, resolution ratio is low, and stability is poor, reliability is low, and the advantage of silicon micro mechanical sensor is made to have a greatly reduced quality.It is domestic current
Do not have also and silicon micro-gyroscope sensitive structure and processing circuit are subjected to single chip integrated ability, generally using pcb board grade
Integrated and MCM Two-level ensembles method, both integrated approaches are compared with the noise bigger that single-chip integration introduces, so sensor is small
What signal deteching circuit first had to solve is exactly Low-noise Design Technology, in addition to will be to the mechanical noise and system of sensitive structure
Ambient noise has other than stronger immunity, and circuit itself is also required to have lower noise coefficient.
The current most common small signal pickup circuit chip of sensor is realized by the method for high frequency modulated, will be sensed
The tiny signal of device output is modulated to high band, and the Low-Frequency Mechanical noise of sensor and thermal noise is avoided to do small-signal
It disturbs, the tiny signal of sensor output filters final output signal to be detected after high band is amplified, then by demodulation.
Although this method can also realize the detection to sensor small-signal, circuit structure is complicated, and high frequency carrier is needed to send out
The circuit module of multiple complexity such as raw device, amplifier, demodulator filter.In addition, the Comparison between detecting methods of this high frequency modulated are suitable
Together in open loop accelerometer tiny signal detection, and the silicon micromechanical gyroscope for being worked using Coriolis effect come
Say, due to high-frequency carrier generator be difficult to it is synchronous with the resonant frequency of gyroscope gauge outfit, so accuracy of detection can be by the very day of one's doom
System.In addition, this modulation /demodulation detection method need give mechanical body apply high-frequency switching signal, be readily incorporated switching noise and
Electronics coupled.
Invention content
The present invention proposes a kind of tiny signal pick-up circuit design scheme and its and top for silicon micromechanical gyroscope
The low noise and anti-interference processing method of spiral shell instrument sensor interface part.The system of traditional discrete component scheme can be overcome
The shortcomings of volume is big, resolution ratio is low, stability is poor, reliability is low, poor anti jamming capability, with the small signal of common MEMS sensor
Detection circuit is compared, and simple in structure, low in energy consumption, low-noise characteristic is easily realized.
Technical scheme is as follows：
A kind of tiny signal pick-up circuit for silicon micromechanical gyroscope, including the first technotron are provided, the
Two technotrons, first resistor, second resistance, 3rd resistor, the 4th resistance, the first capacitance, the second capacitance；
The grid of first technotron receives the current signal of mechanical gyroscope output, and connects electricity through first resistor
Source cathode, source electrode connect power cathode, and for the first capacitance connection between grid and drain electrode, drain electrode is used as signal output end；
The second capacitance, drain electrode connection positive pole are connected between the grid and source electrode of second technotron, source electrode connects
Connect the drain electrode of the first technotron；
3rd resistor and the 4th resistance are connected between power supply positive and negative electrode, and second resistance one end connects 3rd resistor and the
The common point of four resistance, the other end connect the grid of the second technotron.
Preferably, first technotron and the second technotron use low noise N-type JFET technique systems
Make.
Preferably, tiny signal pick-up circuit is fabricated to chip and carries out multi-chip module with mechanical gyroscope sensing element
(MCM) Two-level ensemble encapsulates, and the support shaft of sensing element accesses DC voltage.
Preferably, the chip that tiny signal pick-up circuit makes is bonded in mechanical gyroscope sensing element with epoxy resin
On the heat resistant glass of upper layer, tiny signal pick-up circuit input terminal is placed in the capacitance detecting pole plate apart from mechanical gyroscope sensing element
The nearest place of pressure welding point is directly connected to mechanical gyroscope sensing element by pressure welding silk.
Preferably, the metal cover board of the shell of Two-level ensemble encapsulation is connected with the ground plane of shell substrate, makes mechanical top
The closed environment that spiral shell instrument sensing element is surrounded with tiny signal pick-up circuit chip package to ground wire.
Preferably, the intermediate-frequency gain of tiny signal pick-up circuit isWherein,gm1
For the mutual conductance of the first technotron, r01The output resistance of first technotron, r02It is defeated for the second technotron
Go out resistance.
Preferably, the transfer function of tiny signal pick-up circuit is：
Wherein, C1For the capacitance of the first capacitance, C2For the capacitance of the second capacitance, R2For the resistance value of second resistance, gm1
For the mutual conductance of the first technotron, gm2For the mutual conductance of the second technotron,r01First junction type
The output resistance of field-effect tube, r02For the second technotron output resistance.
The present invention compared with the existing technology the advantages of：
(1) present invention compared with the small signal detecting method of common high frequency modulated, the biggest advantage is to it is simple in structure,
It is low in energy consumption, it is suitable for the small signal detection of silicon micromechanical gyroscope.
(2) device that uses of the present invention only includes technotron, resistance and capacitance, therefore compact, convenient for
Gyroscope sensing element Two-level ensemble, by the way that gyroscope sensing element and tiny signal pick-up circuit are encapsulated into a ground wire packet
In the closed environment enclosed, to can further improve the noiseproof feature and electromagnetic shielding capability of system.
(3) present invention realizes bandpass filtering in circuit simultaneously, has filtered out the interference of sensitive structure, improves detection essence
Degree.
(4) present invention need not apply high-frequency carrier signal to mechanical body, only need to add a DC voltage, make mechanical master
Body is maintained at a fixed DC voltage value, to make the interference signal for being coupled to detection electrode be eliminated, obtains ultralow
Noise level simplifies circuit structure, reduces circuit power consumption.
Description of the drawings
Fig. 1 is a kind of structure chart for silicon micromechanical gyroscope tiny signal pick-up circuit of the invention；
Fig. 2 is the frequency characteristic of tiny signal pick-up circuit of the present invention；
Fig. 3 is tiny signal pick-up circuit of the present invention and silicon micromechanical gyroscope sensing element equivalent circuit diagram；
Fig. 4 is the section that tiny signal pick-up circuit of the present invention is connect with silicon micromechanical gyroscope sensing element Two-level ensemble
Figure.
Specific implementation mode
For a clearer understanding of the present invention, below in conjunction with attached drawing, the present invention is described in further detail.
In conjunction with Fig. 1, for the circuit structure diagram of the present invention, it is by two technotrons 1,2, two capacitances 3,4, four
Resistance 5,6,7,8, totally 8 components composition.Technotron J1 is small picking up signal device and the low-noise amplifier
Amplifier tube.Technotron J2 is the load pipe of amplifier.Resistance R1 provides direct current biasing point to small picking up signal device J1,
In order to avoid signal passes through this resistance decrement, it is necessary to assure the resistance value of R1 will be far longer than the impedance value of input end capacitor.
The noiseless biasing being made of resistance R3, R4 and R2, direct current biasing point is provided to technotron J2.Capacitance C2 is for extending
The bandwidth of amplifier.C1 is both the feedback capacity that Miller capacitance is used as charge-sensitive amplifiers again.
It is the frequency characteristic of tiny signal pick-up circuit of the present invention in conjunction with Fig. 2, it is seen that the circuit has band logical special
Property.The transfer function of circuit is：
The intermediate-frequency gain of circuit isWherein, C1For the capacitance of capacitance C1, C2For the capacitance of capacitance C2
Value, R2For the resistance value of resistance R2, gm1For the mutual conductance of technotron J1, gm2For the mutual conductance of technotron J2,r01The output resistance of technotron J1, r02For technotron J2 output resistances.
It is tiny signal pick-up circuit of the present invention and silicon micromechanical gyroscope sensing element equivalent circuit diagram in conjunction with Fig. 3.Figure
In 9 mechanical bodies for representing gyroscope sensing element, Vdrive represents the driving voltage for being applied to gyroscope sensing element, 10 generations
The capacitance detecting pole plate of table gyroscope sensing element, Cp represent total parasitic capacitance of detection circuit input terminal, and R1, C1 and amplifier are used
In equivalent tiny signal pick-up circuit of the present invention.It, can be by the design to circuit parameter very since the circuit has bandpass characteristics
Good inhibition low-frequency noise, therefore circuit need not modulate the signal to high band and be amplified, and eliminate modulation, demodulation, filtering
Deng complicated processing links, so circuit need not apply high-frequency carrier signal to mechanical body 9, a DC voltage only need to be added
VB, the support axis connection DC voltage of mechanical gyroscope makes mechanical body be maintained at a fixed DC voltage value, to make
The interference signal for being coupled to detection electrode 10 is eliminated, and is obtained ultra-low noise level, is simplified circuit structure, reduce circuit
Power consumption.
It is that tiny signal pick-up circuit of the present invention is connect with silicon micromechanical gyroscope sensing element Two-level ensemble in conjunction with Fig. 4
Sectional view.Tiny signal pick-up circuit chip 14 carries out MCM Two-level ensemble encapsulation with gyroscope sensing element 16.Common two
Secondary integration packaging is will to wait for that integrated circuit naked core is respectively placed in respective position in MCM shells, mutual between naked core
It was connected on the ceramic substrate of MCM shells and carries out wiring connection.Circuit naked core 14 is bonded in quick by the present invention with epoxy resin
On the upper layer heat resistant glass 11 of sensing unit, the input terminal of circuit is placed in the capacitance detecting pole plate pressure welding point 17 of distance sensitive element most
Close place, circuit are directly connected to sensing element by pressure welding silk 15, and ghost effect and substrate cloth on shell substrate are avoided
The interference for the small capacitance signal that line exports gyro sensitive element.In addition, when Two-level ensemble shell designs, by Two-level ensemble
The metal cover board of shell connects with the ground plane of shell substrate, thus by gyroscope sensing element and tiny signal pick-up circuit
It is encapsulated into the closed environment of ground wire encirclement, to can further improve the noiseproof feature and electromagnetic shielding energy of system
Power.
The above, best specific implementation mode only of the invention, but scope of protection of the present invention is not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, the change or replacement that can be readily occurred in,
It should be covered by the protection scope of the present invention.
The content that description in the present invention is not described in detail belongs to the known technology of professional and technical personnel in the field.
Claims (7)
1. a kind of tiny signal pick-up circuit for silicon micromechanical gyroscope, it is characterised in that：Including the first junction field
It manages (J1), the second technotron (J2), first resistor (R1), second resistance (R2), 3rd resistor (R3), the 4th resistance
(R4), the first capacitance (C1), the second capacitance (C2)；
The grid of first technotron (J1) receives the current signal of mechanical gyroscope output, and even through first resistor (R1)
Power cathode is connect, source electrode connects power cathode, and the first capacitance (C1) is connected between grid and drain electrode, and drain electrode is exported as signal
End；
The second capacitance (C2), drain electrode connection positive pole, source are connected between the grid and source electrode of second technotron (J2)
Pole connects the drain electrode of the first technotron (J1)；
3rd resistor (R3) and the 4th resistance (R4) are connected between power supply positive and negative electrode, and the one end second resistance (R2) connects third
The common point of resistance (R3) and the 4th resistance (R4), the other end connect the grid of the second technotron (J2).
2. being used for the tiny signal pick-up circuit of silicon micromechanical gyroscope as described in claim 1, it is characterised in that：Described
One technotron (J1) and the second technotron (J2) are made of low noise N-type JFET techniques.
3. being used for the tiny signal pick-up circuit of silicon micromechanical gyroscope as described in claim 1, it is characterised in that：Small letter
Number pick-up circuit is fabricated to chip and carries out the encapsulation of multi-chip module (MCM) Two-level ensemble with mechanical gyroscope sensing element, sensitive
The support shaft of element accesses DC voltage.
4. being used for the tiny signal pick-up circuit of silicon micromechanical gyroscope as claimed in claim 3, it is characterised in that：Small letter
The chip that number pick-up circuit makes is bonded in epoxy resin on the upper layer heat resistant glass (11) of mechanical gyroscope sensing element, micro-
It is nearest that small signal pickup circuit input terminal is placed in the capacitance detecting pole plate pressure welding point (17) apart from mechanical gyroscope sensing element
Place is directly connected to mechanical gyroscope sensing element by pressure welding silk (15).
5. being used for the tiny signal pick-up circuit of silicon micromechanical gyroscope as claimed in claim 3, it is characterised in that：It will be secondary
The metal cover board of the shell of integration packaging connects with the ground plane of shell substrate, makes mechanical gyroscope sensing element and tiny signal
The closed environment that pick-up circuit chip package is surrounded to ground wire.
6. being used for the tiny signal pick-up circuit of silicon micromechanical gyroscope as described in claim 1, it is characterised in that：Small letter
The intermediate-frequency gain of number pick-up circuit isWherein,gm1For the first technotron (J1)
Mutual conductance, r01The output resistance of first technotron (J1), r02For the second technotron (J2) output resistance.
7. being used for the tiny signal pick-up circuit of silicon micromechanical gyroscope as described in claim 1, which is characterized in that small letter
The transfer function of number pick-up circuit is：
Wherein, C1For the capacitance of the first capacitance (C1), C2For the capacitance of the second capacitance (C2), R2For second resistance (R2)
Resistance value, gm1For the mutual conductance of the first technotron (J1), gm2For the mutual conductance of the second technotron (J2),r01The output resistance of first technotron (J1), r02Electricity is exported for the second technotron (J2)
Resistance.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711456057.2A CN108489477B (en) | 2017-12-28 | 2017-12-28 | Micro signal pickup circuit for silicon micro mechanical gyroscope |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711456057.2A CN108489477B (en) | 2017-12-28 | 2017-12-28 | Micro signal pickup circuit for silicon micro mechanical gyroscope |
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| CN108489477B CN108489477B (en) | 2020-10-16 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101271125A (en) * | 2008-05-12 | 2008-09-24 | 清华大学 | Capacitance type micro-accelerometer |
| US20140251012A1 (en) * | 2013-03-07 | 2014-09-11 | Robert Bosch Gmbh | Pseudo-differential accelerometer with high electromagnetic interference rejection |
| CN106556717A (en) * | 2015-09-24 | 2017-04-05 | 祁艳 | A kind of highly sensitive accelerometer weak signal extraction circuit |
| CN106767362A (en) * | 2015-11-23 | 2017-05-31 | 史树元 | A kind of Transform Circuit for Displacement Capacitance Sensor |
-
2017
- 2017-12-28 CN CN201711456057.2A patent/CN108489477B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101271125A (en) * | 2008-05-12 | 2008-09-24 | 清华大学 | Capacitance type micro-accelerometer |
| US20140251012A1 (en) * | 2013-03-07 | 2014-09-11 | Robert Bosch Gmbh | Pseudo-differential accelerometer with high electromagnetic interference rejection |
| CN106556717A (en) * | 2015-09-24 | 2017-04-05 | 祁艳 | A kind of highly sensitive accelerometer weak signal extraction circuit |
| CN106767362A (en) * | 2015-11-23 | 2017-05-31 | 史树元 | A kind of Transform Circuit for Displacement Capacitance Sensor |
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| CN108489477B (en) | 2020-10-16 |
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