CN108485823A - A kind of solar silicon wafers cleaning solution - Google Patents
A kind of solar silicon wafers cleaning solution Download PDFInfo
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- CN108485823A CN108485823A CN201810464640.6A CN201810464640A CN108485823A CN 108485823 A CN108485823 A CN 108485823A CN 201810464640 A CN201810464640 A CN 201810464640A CN 108485823 A CN108485823 A CN 108485823A
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- silicon wafers
- cleaning solution
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/22—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aromatic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/046—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/10—Carbonates ; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2006—Monohydric alcohols
- C11D3/201—Monohydric alcohols linear
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3707—Polyethers, e.g. polyalkyleneoxides
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Abstract
The invention discloses a kind of solar silicon wafers cleaning solutions, including：Citric acid, neopelex, potassium carbonate, triethylenetetraaminehexaacetic acid, polyethylene glycol, ethyl alcohol, triethanolamine, ammonium fluoride and pure water, parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：20 35 parts of 4 12 parts of citric acid, 5 14 parts of neopelex, 6 12 parts of potassium carbonate, 13 19 parts of triethylenetetraaminehexaacetic acid, 20 29 parts of polyethylene glycol, 20 28 parts of ethyl alcohol, 13 19 parts of triethanolamine, 11 18 parts of ammonium fluoride and pure water.By the above-mentioned means, solar silicon wafers cleaning solution provided by the invention, soil removal efficiency is strong, effectively improves the clean rate of Wafer Cleaning.
Description
Technical field
The present invention relates to silicon chip fields, more particularly to a kind of solar silicon wafers cleaning solution.
Background technology
With the development of society, today of energy crisis getting worse, develops and uses new energy increasingly by people
Concern, the advantages that solar energy is pollution-free, renewable, without region due to its, increasingly have been favored by people, solar energy
The development of industry is getting faster.And along with the maturation of solar photovoltaic industry, the use of silicon chip is also more and more.
Cleaning be silicon chip one of production process, cleaning it is clean whether have prodigious shadow to the performance of silicon chip
It rings.The main purpose of cleaning remaining cutting abrasive material, metal ion and is referred to wash the grains of sand generated in cutting process
Line etc. makes silicon chip surface reach the technical indicators such as corrosion-free, non-oxidation, noresidue.The silicon chip cleaning liquid used on existing market
There is a problem of cleaning performance difference, is badly in need of solving as a result,.
Invention content
The invention mainly solves the technical problem of providing a kind of solar silicon wafers cleaning solutions, and soil removal efficiency is strong, effectively improves
The clean rate of Wafer Cleaning.
In order to solve the above technical problems, one aspect of the present invention is：A kind of solar silicon wafers cleaning is provided
Liquid, including：Citric acid, neopelex, potassium carbonate, triethylenetetraaminehexaacetic acid, polyethylene glycol, ethyl alcohol, three hydroxyls
Ethylamine, ammonium fluoride and pure water, parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：4-12 parts of citric acid, ten
5-14 parts of dialkyl benzene sulfonic acids sodium, 6-12 parts of potassium carbonate, 13-19 parts of triethylenetetraaminehexaacetic acid, 20-29 parts of polyethylene glycol,
20-35 parts of 20-28 parts of ethyl alcohol, 13-19 parts of triethanolamine, 11-18 parts of ammonium fluoride and pure water.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：Lemon
4 parts of lemon acid, 5 parts of neopelex, 6 parts of potassium carbonate, 13 parts of triethylenetetraaminehexaacetic acid, 20 parts of polyethylene glycol, second
20 parts of 20 parts of alcohol, 13 parts of triethanolamine, 11 parts of ammonium fluoride and pure water.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：Lemon
5 parts of lemon acid, 6 parts of neopelex, 7 parts of potassium carbonate, 14 parts of triethylenetetraaminehexaacetic acid, 22 parts of polyethylene glycol, second
23 parts of 21 parts of alcohol, 14 parts of triethanolamine, 12 parts of ammonium fluoride and pure water.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：Lemon
6 parts of lemon acid, 7 parts of neopelex, 8 parts of potassium carbonate, 15 parts of triethylenetetraaminehexaacetic acid, 23 parts of polyethylene glycol, second
26 parts of 22 parts of alcohol, 16 parts of triethanolamine, 14 parts of ammonium fluoride and pure water.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：Lemon
7 parts of lemon acid, 8 parts of neopelex, 9 parts of potassium carbonate, 16 parts of triethylenetetraaminehexaacetic acid, 25 parts of polyethylene glycol, second
28 parts of 23 parts of alcohol, 17 parts of triethanolamine, 16 parts of ammonium fluoride and pure water.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：Lemon
8 parts of lemon acid, 9 parts of neopelex, 12 parts of potassium carbonate, 18 parts of triethylenetetraaminehexaacetic acid, 26 parts of polyethylene glycol, second
30 parts of 25 parts of alcohol, 18 parts of triethanolamine, 17 parts of ammonium fluoride and pure water.
The beneficial effects of the invention are as follows：A kind of solar silicon wafers cleaning solution that the present invention points out, soil removal efficiency is strong, effectively improves
The clean rate of Wafer Cleaning.
Specific implementation mode
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
All other embodiment that technical staff is obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment 1：Parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：4 parts of citric acid, detergent alkylate
5 parts of sodium sulfonate, 6 parts of potassium carbonate, 13 parts of triethylenetetraaminehexaacetic acid, 20 parts of polyethylene glycol, 20 parts of ethyl alcohol, triethanolamine 13
20 parts of part, 11 parts of ammonium fluoride and pure water.
Embodiment 2：Parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：5 parts of citric acid, detergent alkylate
6 parts of sodium sulfonate, 7 parts of potassium carbonate, 14 parts of triethylenetetraaminehexaacetic acid, 22 parts of polyethylene glycol, 21 parts of ethyl alcohol, triethanolamine 14
23 parts of part, 12 parts of ammonium fluoride and pure water.
Embodiment 3：Parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：6 parts of citric acid, detergent alkylate
7 parts of sodium sulfonate, 8 parts of potassium carbonate, 15 parts of triethylenetetraaminehexaacetic acid, 23 parts of polyethylene glycol, 22 parts of ethyl alcohol, triethanolamine 16
26 parts of part, 14 parts of ammonium fluoride and pure water.
Embodiment 4：Parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：7 parts of citric acid, detergent alkylate
8 parts of sodium sulfonate, 9 parts of potassium carbonate, 16 parts of triethylenetetraaminehexaacetic acid, 25 parts of polyethylene glycol, 23 parts of ethyl alcohol, triethanolamine 17
28 parts of part, 16 parts of ammonium fluoride and pure water.
Embodiment 5：Parts by weight shared by each ingredient in the solar silicon wafers cleaning solution：8 parts of citric acid, detergent alkylate
9 parts of sodium sulfonate, 12 parts of potassium carbonate, 18 parts of triethylenetetraaminehexaacetic acid, 26 parts of polyethylene glycol, 25 parts of ethyl alcohol, triethanolamine
30 parts of 18 parts, 17 parts of ammonium fluoride and pure water.
Test case：Cleaning Tachistoscope is carried out to embodiment 1-5, test result is shown in Table 1.
Table 1：
| Cleaning degree（%） | |
| Embodiment 1 | 99.2 |
| Embodiment 2 | 99.1 |
| Embodiment 3 | 99.6 |
| Embodiment 4 | 99.3 |
| Embodiment 5 | 99.5 |
| Existing product | 80.9 |
In conclusion a kind of solar silicon wafers cleaning solution that the present invention points out, soil removal efficiency is strong, effectively improves the cleaning of Wafer Cleaning
Rate.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (6)
1. a kind of solar silicon wafers cleaning solution, which is characterized in that including：Citric acid, neopelex, potassium carbonate, three
Six acetic acid of ethylene tetra, polyethylene glycol, ethyl alcohol, triethanolamine, ammonium fluoride and pure water, in the solar silicon wafers cleaning solution
Parts by weight shared by each ingredient：4-12 parts of citric acid, 5-14 parts of neopelex, 6-12 parts of potassium carbonate, triethylene
Four 13-19 parts of hexaacetic acids, 20-29 parts of polyethylene glycol, 20-28 parts of ethyl alcohol, 13-19 parts of triethanolamine, 11-18 parts of ammonium fluoride
With 20-35 parts of pure water.
2. solar silicon wafers cleaning solution according to claim 1, which is characterized in that each in the solar silicon wafers cleaning solution
Parts by weight shared by ingredient：4 parts of citric acid, 5 parts of neopelex, 6 parts of potassium carbonate, triethylenetetraaminehexaacetic acid 13
Part, 20 parts of polyethylene glycol, 20 parts of ethyl alcohol, 13 parts of triethanolamine, 11 parts of ammonium fluoride and 20 parts of pure water.
3. solar silicon wafers cleaning solution according to claim 1, which is characterized in that each in the solar silicon wafers cleaning solution
Parts by weight shared by ingredient：5 parts of citric acid, 6 parts of neopelex, 7 parts of potassium carbonate, triethylenetetraaminehexaacetic acid 14
Part, 22 parts of polyethylene glycol, 21 parts of ethyl alcohol, 14 parts of triethanolamine, 12 parts of ammonium fluoride and 23 parts of pure water.
4. solar silicon wafers cleaning solution according to claim 1, which is characterized in that each in the solar silicon wafers cleaning solution
Parts by weight shared by ingredient：6 parts of citric acid, 7 parts of neopelex, 8 parts of potassium carbonate, triethylenetetraaminehexaacetic acid 15
Part, 23 parts of polyethylene glycol, 22 parts of ethyl alcohol, 16 parts of triethanolamine, 14 parts of ammonium fluoride and 26 parts of pure water.
5. solar silicon wafers cleaning solution according to claim 1, which is characterized in that each in the solar silicon wafers cleaning solution
Parts by weight shared by ingredient：7 parts of citric acid, 8 parts of neopelex, 9 parts of potassium carbonate, triethylenetetraaminehexaacetic acid 16
Part, 25 parts of polyethylene glycol, 23 parts of ethyl alcohol, 17 parts of triethanolamine, 16 parts of ammonium fluoride and 28 parts of pure water.
6. solar silicon wafers cleaning solution according to claim 1, which is characterized in that each in the solar silicon wafers cleaning solution
Parts by weight shared by ingredient：8 parts of citric acid, 9 parts of neopelex, 12 parts of potassium carbonate, triethylenetetraaminehexaacetic acid
30 parts of 18 parts, 26 parts of polyethylene glycol, 25 parts of ethyl alcohol, 18 parts of triethanolamine, 17 parts of ammonium fluoride and pure water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810464640.6A CN108485823A (en) | 2018-05-16 | 2018-05-16 | A kind of solar silicon wafers cleaning solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810464640.6A CN108485823A (en) | 2018-05-16 | 2018-05-16 | A kind of solar silicon wafers cleaning solution |
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| Publication Number | Publication Date |
|---|---|
| CN108485823A true CN108485823A (en) | 2018-09-04 |
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ID=63353947
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810464640.6A Withdrawn CN108485823A (en) | 2018-05-16 | 2018-05-16 | A kind of solar silicon wafers cleaning solution |
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| CN (1) | CN108485823A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109825380A (en) * | 2019-01-21 | 2019-05-31 | 安徽华顺半导体发展有限公司 | A kind of high-efficiency solar silicon chip cleaning liquid and its application method |
-
2018
- 2018-05-16 CN CN201810464640.6A patent/CN108485823A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109825380A (en) * | 2019-01-21 | 2019-05-31 | 安徽华顺半导体发展有限公司 | A kind of high-efficiency solar silicon chip cleaning liquid and its application method |
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180904 |