CN108471044A - A kind of C-mount encapsulation semiconductor laser integrated optical fiber coupling cooling device - Google Patents
A kind of C-mount encapsulation semiconductor laser integrated optical fiber coupling cooling device Download PDFInfo
- Publication number
- CN108471044A CN108471044A CN201810531411.1A CN201810531411A CN108471044A CN 108471044 A CN108471044 A CN 108471044A CN 201810531411 A CN201810531411 A CN 201810531411A CN 108471044 A CN108471044 A CN 108471044A
- Authority
- CN
- China
- Prior art keywords
- semiconductor laser
- positioning plate
- shell
- tube socket
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 64
- 238000001816 cooling Methods 0.000 title claims abstract description 35
- 238000005538 encapsulation Methods 0.000 title claims abstract description 20
- 239000013307 optical fiber Substances 0.000 title claims abstract description 16
- 238000010168 coupling process Methods 0.000 title abstract description 7
- 230000008878 coupling Effects 0.000 title abstract description 6
- 238000005859 coupling reaction Methods 0.000 title abstract description 6
- 238000009434 installation Methods 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000002194 synthesizing effect Effects 0.000 abstract description 2
- 238000005192 partition Methods 0.000 description 7
- 239000002826 coolant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
Abstract
A kind of C mount encapsulation semiconductor laser integrated optical fiber coupling cooling device, including shell, tube socket and positioning plate, tube socket and positioning plate setting are inside the shell, tube socket is separated into independent single tube seat by joint-cutting, and one C mount of installation encapsulates semiconductor laser on each single tube seat, and tube socket is fixed on positioning plate, temperature-sensitive element is provided on positioning plate, positioning plate is fixed on heat sink, and heat sink is fixed on shell, and the positioning plate is isolated with shell.The device independently insulate each semiconductor laser fixed set cooling, divides each C mount encapsulation semiconductor devices, realizes laser series-fed, so that servo power supply is made more convenient, the laser output power for synthesizing light beam can higher；It can individually, easily replace wherein any one semiconductor laser；The cooling volume for effectively reducing integrated device, improves refrigerating efficiency.
Description
Technical field
The present invention relates to cooling devices when a kind of encapsulation semiconductor laser integrated optical fiber coupling for C-mount, belong to
In semiconductor laser multiple beam coupling technique field
Background technology
More high power laser exports in order to obtain, needs the semiconductor laser by multiple separation to integrate, makes its light
Shu Hecheng.Semiconductor laser will produce a large amount of heat in operation, these heats can be such that laser output power substantially reduces,
Output beam quality is deteriorated, and therefore, it is necessary to be removed heat by freezing.
Fig. 1 is that 7 C-mount encapsulation semiconductor devices integrate schematic diagram, and it is fixed that semiconductor laser 1 is fixed on by tube socket
On the plate 2 of position, fiber coupler optical fiber output laser is added at light beam delivery outlet 5.Semiconductor laser 1 really needs at work
The only positioning plate 2 to be cooled down, and the area of positioning plate 2 accounts for the half less than entire coupled apparatus.C-mount encapsulates semiconductor
The direction of the mounting hole of device is identical as Laser output direction, since the height of the Z-direction of 450 speculum 4 of shell 6 and plane wants high
In the height of semiconductor laser 1, and speculum be sticked to on outer casing base, therefore, once semiconductor laser 1 and anti-
It penetrates mirror 4 to fix, rethinks and take down semiconductor laser and be just not easy.It will be whole if semiconductor laser output power declines meeting
A light beam integrated device is destroyed.
Need to add many optical devices in the building-up process of light beam, can also retain necessary light path space, it is all this
It can all take up space a bit, they do not generate heat and need not cool down yet, if they and semiconductor laser integrated
Cooling can increase heat dissipation area, and especially when requiring semiconductor laser to be operated in room temperature or less, this problem is more prominent.
Chinese patent literature CN103178439A discloses one kind《Lightweight high power semiconductor lasers integrating device》,
Include babinet and case lid.Wherein box house designs one layer of partition board, is furnished with cooling energy converter installation position among partition board upper surface
It sets, equipped with card slot for fixed cooling energy converter, the upper surface for being close to cooling energy converter is furnished with semiconductor laser storehouse installation position
It sets, cooling energy converter and the fastening of semiconductor laser storehouse, is introduced equipped with cooling fluid pipeline below cooling transducer position partition board
Mouthful, and it is furnished with cooling fluid pipeline outlet below partition board on rear side of babinet, equipped with electricity above partition board on rear side of babinet
Pole installation site is furnished with shaping eyeglass installation site and diaphragm fixed position on box house first half partition board, and equipped with card
Slot fixes shaping eyeglass and diaphragm, has light-emitting window above cabinet front partition board.Above-mentioned apparatus is used for semiconductor laser storehouse,
Also known as bar item is equipped with multiple semiconductor laser light emitting bodies in the above, and power supply can only be in parallel, once there is illuminator to go wrong
Affect overall output power, semiconductor laser storehouse can only integrally be changed, and be heat is taken away with coolant liquid (
Can only use coolant liquid).
Invention content
The present invention couples deficiency existing for cooling technology for existing C-mount encapsulation semiconductor laser integrated optical fibers,
A kind of effective cooling volume for reducing integrated device is provided, the C-mount encapsulation semiconductor lasers for improving refrigerating efficiency are integrated
Fiber coupling cooling device.
The C-mount encapsulation semiconductor laser integrated optical fibers of the present invention couple cooling device, using following technical scheme：
Inside the shell, tube socket passes through joint-cutting point for the device, including shell, tube socket and positioning plate, tube socket and positioning plate setting
It is divided into independent single tube seat, one C-mount of installation encapsulates semiconductor laser on each single tube seat, and tube socket is fixed on positioning plate
On, positioning plate is fixed on heat sink, and heat sink is fixed on the shell.
Joint-cutting on the tube socket is more than 0.2mm, independent to ensure to insulate after each semiconductor laser is fixed.
Insulating heat-conductive thin layer is set between the tube socket and positioning plate.
(not contacting) is isolated with shell in the positioning plate.
It is provided with temperature-sensitive element on the positioning plate, with thermometric.
Thermal insulation board is set between the heat sink and shell.
It is provided with cooling element on the heat sink.
Above-mentioned apparatus is that heat passes to heat on heat sink by heating surface export by tube socket, positioning plate, radiated
Heat dissipation on plate can be air-cooled by diversified forms, such as cooling element, the cooling fin of bigger, added with coolant liquid radiator all
It can be with that is, radiating mode does not have limitation.Due to being the combination of single illuminator, only there are one illuminators for a device, this
The single luminous power of device is higher than the single illuminator power in semiconductor laser storehouse, beam shaping is easy.
The present invention independently insulate each semiconductor laser fixed set cooling, divides each C-mount encapsulation semiconductor
Device realizes laser series-fed, so that servo power supply is made more convenient, the laser output power for synthesizing light beam can be more
It is high；It can individually, easily replace wherein any one semiconductor laser；The cooling volume for effectively reducing integrated device, carries
High refrigerating efficiency.
Description of the drawings
Fig. 1 is the integrated light path schematic diagram of seven C-mount encapsulation semiconductor devices.
Fig. 2 is the structural schematic diagram of C-mount encapsulation semiconductor laser integrated optical fiber coupling cooling device of the present invention.
Fig. 3 is A-A sectional views in Fig. 2.
In figure：1. semiconductor laser, 2. positioning plates, 3. spherical reflectors, 4. 45 ° of plane speculums, the output of 5. light beams
Mouthful, 6. shells, 7. tube sockets, 8. thermal insulation boards, 9. heat sinks, 10. upper covers.
Specific implementation mode
The C-mount encapsulation semiconductor laser integrated optical fibers of the present invention couple cooling device, conveniently can individually dismantle half
Conductor laser, structure are as shown in Figure 3.Including 45 ° of shell 6, tube socket 7, positioning plate 2, spherical reflector 3 and plane speculums
4.45 ° of tube socket 7, positioning plate 2, spherical reflector 3 and plane speculums 4 are arranged in shell 6, and the side of shell 6 is provided with
Light beam delivery outlet 5.Light beam delivery outlet 5 is on the reflection direction of spherical reflector 3.Tube socket 7 is separated into independent by slot
Single tube seat, one C-mount of installation encapsulates semiconductor laser 1 on each single tube seat, each semiconductor laser 1 corresponds to one
The light beam of semiconductor laser 1 is reflected by 45 ° of speculums 4 of plane on spherical reflector 3 by 45 ° of speculums 4 of a plane,
Again by after 3 boundling of spherical reflector by light beam delivery outlet 5.Tube socket 7 is fixed on positioning plate 2, is set between tube socket 7 and positioning plate 2
Set insulating heat-conductive thin layer.Temperature-sensitive element hole is offered on positioning plate 2, to install temperature-sensitive element to thermometric.Positioning plate 2 is fixed on
On heat sink 9, cooling element can be set on heat sink 9.Heat sink 9 is fixed on shell 6, such as Fig. 3, heat sink 9 and shell 6 it
Between be arranged thermal insulation board 8, three compress be connected and fixed.
When above-mentioned apparatus makes, C-mount is encapsulated to the light column of 1 output beam fast axis direction of semiconductor laser first
Mirror is compressed, and semiconductor laser 1 is screwed on tube socket 7, and the angle of semiconductor laser 1 is fixed on tube socket 7
It designs by optical multi-beam convergence principle, after angle and sharp processing molding, is manufactured by fixed form trepanning and positioning plate 2 solid
It is fixed.Then, tube socket 7 is cut into independent single tube seat one by one, each single tube seat fixes a semiconductor laser.Tube socket 7
Joint-cutting require to be more than 0.2mm, it is independent to ensure to insulate after each semiconductor laser 1 is fixed.Tube socket 7 and positioning plate 2 it
Between insulating heat-conductive thin layer is set, three is fixed by screws in together, and felt pad is added on screw, ensures that screw and tube socket are exhausted
Edge.Thermal insulation board 8 and the bottom surface of shell 6 are provided with the hole more than positioning plate 2 so that positioning plate 2 is kept apart with shell 6, is not in contact with each other
With thermal insulation, 6 open end upper cover 10 of shell covers, and screw is used in combination to fasten.
Shell 6 is made using that can cut down material, and heat conductivility is poor, not only ensure that its rugged performance, but also can be when electrode is installed
Facilitate realization glass solder, moreover it is possible to which noise spectra of semiconductor lasers has insulation effect.Can cut down is a kind of metal material of iron class, thermal conductivity
Can be poor, mainly its coefficient of thermal expansion and glass is close, in this way when adding electrode on shell 6, between electrode and shell 6
Gap can be filled by the glass of thawing or glass solder
The device of the invention, by the independent insulation fixed set cooling of each semiconductor laser 1, semiconductor laser 1 is consolidated
Determine direction and change 90 ° by tube socket 7, therefore can individually, easily replace wherein any one semiconductor laser, without
It is such with the prior art, if the decline of semiconductor laser output power can destroy entire light beam integrated device.With partly leading
Its price of the raising of body laser production level can constantly decline, but the making of shell 6 will not so reduce its value, due to half
Conductor laser cannot be replaced and discard the principle that entire device runs counter to saving and recycling.Since semiconductor laser is each
It is self-insulating independent, thus can realize the series-fed of semiconductor laser, so that servo power supply is made more convenient, synthesizes light beam
Laser output power can higher.There is no any area that need not be cooled down to occupy cooling surface, low-temperature receiver input face-heat dissipation in design
The area of plate 9 is more much bigger than semiconductor laser heating area, and each intermediate thermal conductivity device (positioning plate 2, tube socket 7) inputs
Low-temperature receiver area is both greater than the area of heat-transfer area, therefore, high cooling efficiency.
Claims (7)
1. a kind of C-mount encapsulation semiconductor laser integrated optical fiber couples cooling device, including shell, tube socket and positioning plate,
It is characterized in that tube socket and positioning plate setting are inside the shell, tube socket is separated into independent single tube seat by joint-cutting, on each single tube seat
One C-mount of installation encapsulates semiconductor laser, and tube socket is fixed on positioning plate, and positioning plate is fixed on heat sink, heat dissipation
Plate is fixed on the shell.
2. C-mount encapsulation semiconductor laser integrated optical fiber according to claim 1 couples cooling device, feature
It is that the joint-cutting on the tube socket is more than 0.2mm.
3. C-mount encapsulation semiconductor laser integrated optical fiber according to claim 1 couples cooling device, feature
It is that insulating heat-conductive thin layer is set between the tube socket and positioning plate.
4. C-mount encapsulation semiconductor laser integrated optical fiber according to claim 1 couples cooling device, feature
It is that the positioning plate is isolated with shell.
5. C-mount encapsulation semiconductor laser integrated optical fiber according to claim 1 couples cooling device, feature
It is to be provided with temperature-sensitive element on the positioning plate.
6. C-mount encapsulation semiconductor laser integrated optical fiber according to claim 1 couples cooling device, feature
It is that thermal insulation board is set between the heat sink and shell.
7. C-mount encapsulation semiconductor laser integrated optical fiber according to claim 1 couples cooling device, feature
It is to be provided with cooling element on the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810531411.1A CN108471044A (en) | 2018-05-29 | 2018-05-29 | A kind of C-mount encapsulation semiconductor laser integrated optical fiber coupling cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810531411.1A CN108471044A (en) | 2018-05-29 | 2018-05-29 | A kind of C-mount encapsulation semiconductor laser integrated optical fiber coupling cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108471044A true CN108471044A (en) | 2018-08-31 |
Family
ID=63261636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810531411.1A Pending CN108471044A (en) | 2018-05-29 | 2018-05-29 | A kind of C-mount encapsulation semiconductor laser integrated optical fiber coupling cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108471044A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101188345A (en) * | 2007-11-30 | 2008-05-28 | 张丹心 | Semiconductor laser array and its making method |
| CN201199606Y (en) * | 2008-01-30 | 2009-02-25 | 深圳世纪晶源光子技术有限公司 | Packaging structure of semiconductor laser |
| CN102279446A (en) * | 2010-06-11 | 2011-12-14 | 北京中视中科光电技术有限公司 | Semiconductor laser fiber coupling module |
| CN202373843U (en) * | 2011-10-08 | 2012-08-08 | 于文兵 | Crystal holder for solid laser |
| CN103633560A (en) * | 2013-12-02 | 2014-03-12 | 中国电子科技集团公司第四十四研究所 | Multi-chip semiconductor laser |
| CN103715599A (en) * | 2013-12-17 | 2014-04-09 | 长春理工大学 | Multi-single tube beam-combination semiconductor laser packaging shell |
| CN204144672U (en) * | 2014-10-13 | 2015-02-04 | 武汉锐科光纤激光器技术有限责任公司 | Based on the tail optical fiber output semiconductor laser of array core chip COS |
| CN104836112A (en) * | 2015-04-17 | 2015-08-12 | 中国科学院苏州生物医学工程技术研究所 | Insulation and heat radiation device of single tube semiconductor laser cascade structure |
| TWM538272U (en) * | 2016-12-13 | 2017-03-11 | Leading Compound Semiconductor Co Ltd | Packaging structure of laser diode |
| CN206135193U (en) * | 2016-10-14 | 2017-04-26 | 广州基楚光电科技有限公司 | Durable laser instrument |
| US20180019569A1 (en) * | 2016-07-18 | 2018-01-18 | Luxnet Corporation | Optical transmitter with a heat dissipation structure |
| CN207409796U (en) * | 2017-11-24 | 2018-05-25 | 北京大族天成半导体技术有限公司 | Finely tune the structure of laser temperature |
-
2018
- 2018-05-29 CN CN201810531411.1A patent/CN108471044A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101188345A (en) * | 2007-11-30 | 2008-05-28 | 张丹心 | Semiconductor laser array and its making method |
| CN201199606Y (en) * | 2008-01-30 | 2009-02-25 | 深圳世纪晶源光子技术有限公司 | Packaging structure of semiconductor laser |
| CN102279446A (en) * | 2010-06-11 | 2011-12-14 | 北京中视中科光电技术有限公司 | Semiconductor laser fiber coupling module |
| CN202373843U (en) * | 2011-10-08 | 2012-08-08 | 于文兵 | Crystal holder for solid laser |
| CN103633560A (en) * | 2013-12-02 | 2014-03-12 | 中国电子科技集团公司第四十四研究所 | Multi-chip semiconductor laser |
| CN103715599A (en) * | 2013-12-17 | 2014-04-09 | 长春理工大学 | Multi-single tube beam-combination semiconductor laser packaging shell |
| CN204144672U (en) * | 2014-10-13 | 2015-02-04 | 武汉锐科光纤激光器技术有限责任公司 | Based on the tail optical fiber output semiconductor laser of array core chip COS |
| CN104836112A (en) * | 2015-04-17 | 2015-08-12 | 中国科学院苏州生物医学工程技术研究所 | Insulation and heat radiation device of single tube semiconductor laser cascade structure |
| US20180019569A1 (en) * | 2016-07-18 | 2018-01-18 | Luxnet Corporation | Optical transmitter with a heat dissipation structure |
| CN206135193U (en) * | 2016-10-14 | 2017-04-26 | 广州基楚光电科技有限公司 | Durable laser instrument |
| TWM538272U (en) * | 2016-12-13 | 2017-03-11 | Leading Compound Semiconductor Co Ltd | Packaging structure of laser diode |
| CN207409796U (en) * | 2017-11-24 | 2018-05-25 | 北京大族天成半导体技术有限公司 | Finely tune the structure of laser temperature |
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