CN108441125B - High-strength water-resistant adhesive for processing multilayer plywood - Google Patents
High-strength water-resistant adhesive for processing multilayer plywood Download PDFInfo
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- CN108441125B CN108441125B CN201810178096.9A CN201810178096A CN108441125B CN 108441125 B CN108441125 B CN 108441125B CN 201810178096 A CN201810178096 A CN 201810178096A CN 108441125 B CN108441125 B CN 108441125B
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- epoxy resin
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- molecular sieve
- adhesive
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Abstract
The invention discloses a high-strength water-resistant adhesive for processing a multilayer plywood, which relates to the technical field of adhesives and comprises the following components in parts by weight: 60-80 parts of water-based epoxy resin, 5-10 parts of polyoxyethylene, 5-10 parts of hydroxyethyl cellulose, 5-10 parts of activated clay, 5-10 parts of magnesium aluminum silicate, 1-5 parts of PEG-60 hydrogenated castor oil, 1-5 parts of 4A molecular sieve activated powder, 1-5 parts of N-hydroxyethyl acrylamide, 0.5-3 parts of sodium lauroyl glutamate and 0.5-3 parts of allyl glycidyl ether. According to the invention, the glutamic acid is used as the modifier to prepare the water-based epoxy resin, so that water is used as a solvent of the adhesive, and the problem of environmental pollution caused by volatilization of an organic solvent in the curing process of the adhesive due to insolubility of the conventional epoxy resin in water and the necessity of dissolving the conventional epoxy resin in the organic solvent is solved.
Description
The technical field is as follows:
the invention relates to the technical field of adhesives, in particular to a high-strength water-resistant adhesive for processing multilayer plywood.
Background art:
plywood, one of the common materials of furniture, one of the three large plates of artificial board, is a three-layer or multi-layer plate material made up by using wood segments and making them be cut into single plates or wood cubes and making them be sliced into thin wood, then using adhesive to make them be glued together, usually using odd number of layers of single plates and making the fibre directions of adjacent layers of single plates be mutually perpendicular and glued together. The multilayer plywood can contain partial bamboo or bamboo to completely replace wood, and also can contain forest zone residues or abandoned wood leftover materials, so that waste and bamboo with high growth speed can be effectively utilized, and the multilayer plywood has very important environmental protection significance for saving wood.
At present, the main factors influencing the use performance of the plywood are the components of the processing raw materials of the plywood, and more importantly, the use performance of the adhesive. The existing adhesive has the technical problems of low adhesive property and weak water resistance, and particularly, the adhesive property of the adhesive is rapidly reduced after the plywood absorbs moisture, so that the use quality of the plywood is influenced, and even the plywood is scrapped.
The invention content is as follows:
the invention aims to provide a high-strength water-resistant adhesive for processing multilayer plywood, which has high bonding strength and excellent water resistance.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
a high-strength water-resistant adhesive for processing a multilayer plywood comprises the following components in parts by weight:
60-80 parts of water-based epoxy resin, 5-10 parts of polyoxyethylene, 5-10 parts of hydroxyethyl cellulose, 5-10 parts of activated clay, 5-10 parts of magnesium aluminum silicate, 1-5 parts of PEG-60 hydrogenated castor oil, 1-5 parts of 4A molecular sieve activated powder, 1-5 parts of N-hydroxyethyl acrylamide, 0.5-3 parts of sodium lauroyl glutamate and 0.5-3 parts of allyl glycidyl ether;
the aqueous epoxy resin is prepared by modifying epoxy resin E-44 with glutamic acid, and the preparation method comprises the following steps: and adding the epoxy resin E-44, glutamic acid and octyl phenol polyoxyethylene ether into water, heating to a reflux state, keeping the temperature, stirring, reacting, and naturally cooling to room temperature after the reaction is finished to obtain the water-based epoxy resin with the solid content of 45-55%.
The mass ratio of the epoxy resin E-44 to the glutamic acid to the octyl phenol polyoxyethylene ether is 100:3-8: 1-5.
The molecular weight of the polyethylene oxide is 50-100 ten thousand.
The 4A molecular sieve activated powder is subjected to modification treatment, and the modification method comprises the following steps: dispersing 4A molecular sieve activated powder in absolute ethyl alcohol, soaking for 10-15min, adding acetyl tri-n-hexyl citrate, heating to a reflux state, keeping the temperature, stirring for 0.5-1h, adding hydrolyzed polymaleic anhydride, continuing to reflux, keeping the temperature, stirring for 15-30min, feeding the obtained mixture into a spray dryer, drying the obtained particles, and preparing the particles into micro powder by using an ultrafine grinder to obtain the modified molecular sieve micro powder.
The mass ratio of the 4A molecular sieve activated powder to the acetyl tri-n-hexyl citrate to the hydrolyzed polymaleic anhydride is 15-25:3-8: 1-5.
The high-strength water-resistant adhesive for processing the multilayer plywood also comprises 5-10 parts of bonding auxiliary agent.
The bonding auxiliary agent is prepared by taking sepiolite fiber powder as a base material, and the preparation method comprises the following steps: heating the sepiolite fiber powder to the temperature of 135-plus-one (145 ℃), stirring at the temperature, adding trimethylolpropane triglycidyl ether, stirring at the temperature of 135-plus-one (145 ℃) for 15-30min, naturally cooling, adding polytetrahydrofuran ether glycol when the temperature is reduced to the temperature of 100-plus-one (110 ℃), stirring at the temperature of 100-plus-one (110 ℃) for 0.5-1h, and finally cooling to room temperature at the cooling speed of 5-10 ℃/min to obtain the bonding auxiliary agent.
The mass ratio of the sepiolite fiber powder to the trimethylolpropane triglycidyl ether to the polytetrahydrofuran ether glycol is 15-25:3-8: 1-5.
The invention has the beneficial effects that:
(1) according to the invention, the glutamic acid is used as the modifier to prepare the water-based epoxy resin, so that water is used as a solvent of the adhesive, and the problem of environmental pollution caused by volatilization of an organic solvent in the curing process of the adhesive due to insolubility of the conventional epoxy resin in water and the necessity of dissolving the conventional epoxy resin in the organic solvent is avoided;
(2) by adding the bonding auxiliary agent, the adhesive property of the prepared adhesive is further improved, and the using amount of the adhesive is reduced; the bonding auxiliary agent takes sepiolite fiber powder as a base material, and gives the sepiolite fiber good adhesive property through three-dimensional surface modification of trimethylolpropane triglycidyl ether and polytetrahydrofuran ether glycol, and improves the water resistance of the prepared adhesive;
(3) according to the invention, acetyl tri-n-hexyl citrate and hydrolyzed polymaleic anhydride are used as modifiers, and the filling performance of the 4A molecular sieve activated powder as a filler is enhanced by modifying the three-dimensional surface of the activated powder, so that the water resistance of the adhesive is improved.
The specific implementation mode is as follows:
in order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Example 1
Preparing an adhesive: prepared by fully mixing 65g of waterborne epoxy resin, 5g of polyoxyethylene, 5g of hydroxyethyl cellulose, 10g of activated clay, 5g of magnesium aluminum silicate, 2g of PEG-60 hydrogenated castor oil, 2g of 4A molecular sieve activated powder, 2g N-hydroxyethyl acrylamide, 0.5g of sodium lauroyl glutamate and 0.5g of allyl glycidyl ether.
Preparation of the waterborne epoxy resin: 100g of epoxy resin E-44, 4g of glutamic acid and 2g of octyl phenol polyoxyethylene ether are added into water, heated to a reflux state, kept warm and stirred for reaction, and naturally cooled to room temperature after the reaction is finished, so that the water-based epoxy resin with the solid content of 45-55% is obtained.
Wherein the molecular weight of the polyethylene oxide is 50-100 ten thousand.
Example 2
Preparing an adhesive: prepared by fully mixing 80g of waterborne epoxy resin, 8g of polyoxyethylene, 5g of hydroxyethyl cellulose, 10g of activated clay, 5g of magnesium aluminum silicate, 3g of PEG-60 hydrogenated castor oil, 2g of 4A molecular sieve activated powder, 3g N-hydroxyethyl acrylamide, 0.5g of sodium lauroyl glutamate and 0.5g of allyl glycidyl ether.
Preparation of the waterborne epoxy resin: 100g of epoxy resin E-44, 4g of glutamic acid and 2g of octyl phenol polyoxyethylene ether are added into water, heated to a reflux state, kept warm and stirred for reaction, and naturally cooled to room temperature after the reaction is finished, so that the water-based epoxy resin with the solid content of 45-55% is obtained.
Wherein the molecular weight of the polyethylene oxide is 50-100 ten thousand.
Example 3
Preparing an adhesive: prepared by fully mixing 80g of waterborne epoxy resin, 8g of polyoxyethylene, 5g of hydroxyethyl cellulose, 10g of activated clay, 5g of magnesium aluminum silicate, 3g of PEG-60 hydrogenated castor oil, 2g of 4A molecular sieve activated powder, 3g N-hydroxyethyl acrylamide, 0.5g of sodium lauroyl glutamate and 0.5g of allyl glycidyl ether.
Preparation of the waterborne epoxy resin: 100g of epoxy resin E-44, 4g of glutamic acid and 2g of octyl phenol polyoxyethylene ether are added into water, heated to a reflux state, kept warm and stirred for reaction, and naturally cooled to room temperature after the reaction is finished, so that the water-based epoxy resin with the solid content of 45-55% is obtained.
Wherein the molecular weight of the polyethylene oxide is 50-100 ten thousand.
Modification of 4A molecular sieve activated powder: dispersing 25g of 4A molecular sieve activated powder in absolute ethyl alcohol, soaking for 15min, adding 5g of acetyl tri-n-hexyl citrate, heating to a reflux state, keeping the temperature and stirring for 1h, adding 2.5g of hydrolyzed polymaleic anhydride, continuing to reflux, keeping the temperature and stirring for 30min, feeding the obtained mixture into a spray dryer, drying the obtained particles, and preparing the particles into micro powder by using an ultrafine grinder to obtain the modified molecular sieve micro powder.
Example 4
Preparing an adhesive: prepared by fully mixing 80g of water-based epoxy resin, 8g of polyoxyethylene, 5g of hydroxyethyl cellulose, 10g of activated clay, 5g of magnesium aluminum silicate, 5g of bonding auxiliary agent, 3g of PEG-60 hydrogenated castor oil, 2g of 4A molecular sieve activated powder, 3g N-hydroxyethyl acrylamide, 0.5g of sodium lauroyl glutamate and 0.5g of allyl glycidyl ether.
Preparation of the waterborne epoxy resin: 100g of epoxy resin E-44, 4g of glutamic acid and 2g of octyl phenol polyoxyethylene ether are added into water, heated to a reflux state, kept warm and stirred for reaction, and naturally cooled to room temperature after the reaction is finished, so that the water-based epoxy resin with the solid content of 45-55% is obtained.
Wherein the molecular weight of the polyethylene oxide is 50-100 ten thousand.
Preparation of a bonding auxiliary agent: heating 20g of sepiolite fiber powder to 135-plus-145 ℃, preserving heat and stirring, adding 5g of trimethylolpropane triglycidyl ether, preserving heat and stirring for 30min at 135-plus-145 ℃, then naturally cooling, adding 3g of polytetrahydrofuran ether glycol when the temperature is reduced to 100-plus-110 ℃, preserving heat and stirring for 30min at 100-plus-110 ℃, and finally cooling to room temperature at the cooling speed of 5-10 ℃/min to obtain the bonding auxiliary agent.
Example 5
Preparing an adhesive: prepared by fully mixing 80g of water-based epoxy resin, 8g of polyoxyethylene, 5g of hydroxyethyl cellulose, 10g of activated clay, 5g of magnesium aluminum silicate, 5g of bonding auxiliary agent, 3g of PEG-60 hydrogenated castor oil, 2g of 4A molecular sieve activated powder, 3g N-hydroxyethyl acrylamide, 0.5g of sodium lauroyl glutamate and 0.5g of allyl glycidyl ether.
Preparation of the waterborne epoxy resin: 100g of epoxy resin E-44, 4g of glutamic acid and 2g of octyl phenol polyoxyethylene ether are added into water, heated to a reflux state, kept warm and stirred for reaction, and naturally cooled to room temperature after the reaction is finished, so that the water-based epoxy resin with the solid content of 45-55% is obtained.
Wherein the molecular weight of the polyethylene oxide is 50-100 ten thousand.
Preparation of a bonding auxiliary agent: heating 20g of sepiolite fiber powder to 135-plus-145 ℃, preserving heat and stirring, adding 5g of trimethylolpropane triglycidyl ether, preserving heat and stirring for 30min at 135-plus-145 ℃, then naturally cooling, adding 3g of polytetrahydrofuran ether glycol when the temperature is reduced to 100-plus-110 ℃, preserving heat and stirring for 30min at 100-plus-110 ℃, and finally cooling to room temperature at the cooling speed of 5-10 ℃/min to obtain the bonding auxiliary agent.
Modification of 4A molecular sieve activated powder: dispersing 25g of 4A molecular sieve activated powder in absolute ethyl alcohol, soaking for 15min, adding 5g of acetyl tri-n-hexyl citrate, heating to a reflux state, keeping the temperature and stirring for 1h, adding 2.5g of hydrolyzed polymaleic anhydride, continuing to reflux, keeping the temperature and stirring for 30min, feeding the obtained mixture into a spray dryer, drying the obtained particles, and preparing the particles into micro powder by using an ultrafine grinder to obtain the modified molecular sieve micro powder.
Comparative example 1
Based on example 2, glutamic acid was replaced with an equimolar amount of 2-aminoethanesulfonic acid in example 2.
Comparative example 2
The adhesive preparation is referred to patent CN201510988717.6 example 1.
Example 6
Adhesives were prepared according to examples 1-5 and comparative examples 1-2, and the same amount of adhesive was used for the gluing of the same batch of fir plywood, and the gluing strength and water resistance of the adhesive were measured as shown in table 1.
TABLE 1 bonding Strength and Water resistance of the Adhesives of the invention
| Group of | Bonding strength/MPa | The bonding strength/MPa after soaking in water for 3h at 65 DEG C |
| Example 1 | 2.17 | 1.86 |
| Example 2 | 2.25 | 1.93 |
| Example 3 | 2.46 | 2.21 |
| Example 4 | 2.58 | 2.45 |
| Example 5 | 2.89 | 2.73 |
| Comparative example 1 | 1.73 | 1.14 |
| Comparative example 2 | 1.58 | 1.02 |
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. The high-strength water-resistant adhesive for processing the multilayer plywood is characterized by comprising the following components in parts by weight:
60-80 parts of water-based epoxy resin, 5-10 parts of polyoxyethylene, 5-10 parts of hydroxyethyl cellulose, 5-10 parts of activated clay, 5-10 parts of magnesium aluminum silicate, 1-5 parts of PEG-60 hydrogenated castor oil, 1-5 parts of 4A molecular sieve activated powder, 1-5 parts of N-hydroxyethyl acrylamide, 0.5-3 parts of sodium lauroyl glutamate and 0.5-3 parts of allyl glycidyl ether;
the aqueous epoxy resin is prepared by modifying epoxy resin E-44 with glutamic acid, and the preparation method comprises the following steps: adding epoxy resin E-44, glutamic acid and octyl phenol polyoxyethylene ether into water, heating to a reflux state, preserving heat, stirring, reacting, and naturally cooling to room temperature after the reaction is finished to obtain the water-based epoxy resin with the solid content of 45-55%;
the 4A molecular sieve activated powder is subjected to modification treatment, and the modification method comprises the following steps: dispersing 4A molecular sieve activated powder in absolute ethyl alcohol, soaking for 10-15min, adding acetyl tri-n-hexyl citrate, heating to a reflux state, keeping the temperature, stirring for 0.5-1h, adding hydrolyzed polymaleic anhydride, continuing to reflux, keeping the temperature, stirring for 15-30min, feeding the obtained mixture into a spray dryer, drying the obtained particles, and preparing the particles into micro powder by using an ultrafine grinder to obtain the modified molecular sieve micro powder.
2. The high-strength water-resistant adhesive for processing multilayer plywood as claimed in claim 1, wherein: the mass ratio of the epoxy resin E-44 to the glutamic acid to the octyl phenol polyoxyethylene ether is 100:3-8: 1-5.
3. The high-strength water-resistant adhesive for processing multilayer plywood as claimed in claim 1, wherein: the molecular weight of the polyethylene oxide is 50-100 ten thousand.
4. The high-strength water-resistant adhesive for processing multilayer plywood as claimed in claim 1, wherein: the mass ratio of the 4A molecular sieve activated powder to the acetyl tri-n-hexyl citrate to the hydrolyzed polymaleic anhydride is 15-25:3-8: 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810178096.9A CN108441125B (en) | 2018-03-05 | 2018-03-05 | High-strength water-resistant adhesive for processing multilayer plywood |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810178096.9A CN108441125B (en) | 2018-03-05 | 2018-03-05 | High-strength water-resistant adhesive for processing multilayer plywood |
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| Publication Number | Publication Date |
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| CN108441125A CN108441125A (en) | 2018-08-24 |
| CN108441125B true CN108441125B (en) | 2020-09-08 |
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| CN201810178096.9A Expired - Fee Related CN108441125B (en) | 2018-03-05 | 2018-03-05 | High-strength water-resistant adhesive for processing multilayer plywood |
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Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10100220A1 (en) * | 2001-01-04 | 2002-07-11 | Basf Ag | Wood materials from wooden parts glued with polyisocyanates |
| US20060051587A1 (en) * | 2002-07-29 | 2006-03-09 | Toshiki Mori | Thermosetting resin composition and adhesive film |
| CN106590497A (en) * | 2016-12-21 | 2017-04-26 | 兰州科天环保节能科技有限公司 | Formaldehyde-free aqueous jointing agent and preparation method therefor |
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Effective date of registration: 20200812 Address after: 535000 Dashi Town Industrial Park, Qinbei District, Qinzhou City, Guangxi Zhuang Autonomous Region Applicant after: Qinzhou Xinli Wood Industry Co.,Ltd. Address before: 246100 No. 3, Jiangzhuang formation, Wang Yang village, Ma Miao Town, Huaining County, Anqing, Anhui Applicant before: Jiang Bing |
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